硅基双极低噪声放大器的能量注入损伤与机理

针对Si基双极型低噪声放大器(LNA),用脉冲调制150MHz射频信号在其输入端进行了能量注入实验,研究结果表明Si基LNA的噪声系数和增益特性都足注人能最的敏感参数.样品解削和电路仿真显示能量作用使LNA内部晶体管出现基极/发射极金属化损伤,基极金.半接触电阻增大导致了LNA噪声系数增大,而Si基双极器件hFE随时间正向漂移损伤模式使LNA增益随注入能量的增加而增大.研究表明,由于能量作用下损伤效应的复杂性,以往可靠性研究中单纯采用增益的变化来衡量器件与电路的损伤效应的方法是不全面的.     

外接元件对双极晶体管电磁脉冲损伤的影响

本文研究了外接电阻和外接电压源在电磁脉冲对双极晶体管注入过程中的影响。研究表明：基极外接电阻Rb的增大使器件的烧毁时间略有减小;在注入电压幅度较低时,基极外接电压源Vbe的增大有助于器件的损伤,当注入电压幅度足够高时,器件发生PIN结构击穿,基极外接电压源Vbe对器件损伤的影响变小;发射极外接电阻Re的增大能够明显降低注入脉冲加在器件上的电压降,从而提高器件的耐受性。外接电路元件对双极晶体管损伤的影响,归根结底都是对构成器件发生电流模式二次击穿的条件的影响。     

SiGe HBT低噪声放大器的设计与制造

该文设计和制作了一款单片集成硅锗异质结双极晶体管(SiGe HBT)低噪声放大器(LNA)。由于放大器采用复合型电阻负反馈结构,所以可灵活调整不同反馈电阻,同时获得合适的偏置、良好的端口匹配和低的噪声系数。基于0.35 m Si CMOS平面工艺制定了放大器单芯片集成的工艺流程。为了进一步降低放大器的噪声系数,在制作放大器中SiGe器件时,采用钛硅合金(TiSi2)来减小晶体管基极电阻。由于没有使用占片面积大的螺旋电感,最终研制出的SiGe HBT LNA芯片面积仅为0.282 mm2。测试结果表明,在工作频带0.2-1.2 GHz内,LNA噪声系数低至2.5 dB,增益高达26.7 dB,输入输出端口反射系数分别小于-7.4 dB和-10 dB。     

精细的几何图形改进微波双极晶体管的性能

休利特—派卡公司采用精细的几何图形制出了亚微米发射极条,制出了频率高、增益大而又保持噪声低的 HXTR6101器件,其性能是在4千兆赫下,增益为9.0～9.5分贝,典型噪声系数为2.3～2.7分贝。休利特—派卡公司的这种技术,包括离子注入、局部氧化、计算机辅助设计以及自对准工艺。采用制造精细图形的关键工艺—离子注入和自对准技术,在二氧化硅层上同时制做发射极和基极接触窗口。自对准技术可消除最苛刻的对准和硅双极晶体管中的二个主要噪声源:基极扩展电阻中的热噪声和跨越发射极和基极结注入电流中的散粒噪声。作者宣称,要提高这种器件的增益,必须把集电极—基极结电容和集电极—基极键合区     

混合模式电应力损伤对SiGe HBT器件1/f噪声特性的影响研究

研究了混合模式应力损伤对SiGe HBT器件直流电性能的影响,对比了混合模式损伤前后器件1/f噪声特性的变化。结果表明,在SiGe HBT器件中,混合模式损伤在Si/SiO₂界面产生界面态缺陷P_b,导致小注入下基极电流增加;H原子对多晶硅晶界悬挂键的钝化作用引起中等注入区基极电流减小,导致电流增益增强。混合模式损伤缺陷位于硅禁带宽度内本征费米能级附近,虽然使基区SRH复合电流增加,却不会改变器件的低频噪声特性。     

SiGe HBT60Coγ射线辐照效应及退火特性

研究了国产SiGe异质结双极晶体管(HBT)60Co γ射线100Gy(Si)～10kGy(Si)总剂量辐照后的辐照效应及辐照后的退火特性.测试了辐照及退火后的直流电参数.实验结果显示,辐照后基极电流(Ib)明显增大,而集电极电流(Ic)基本不变,表明Ib的增加是电流增益退化的主要原因.退火结果表现为电流增益(β=Ic/Ib)继续衰降,表明SiGe HBT具有"后损伤"效应.对其机理进行了探讨,结果表明其主要原因是室温退火中界面态继续增长引起的.     

SiGe HBT 60Co γ射线辐照效应及退火特性

研究了国产SiGe异质结双极晶体管(HBT)60Co γ射线100Gy(Si)～10kGy(Si)总剂量辐照后的辐照效应及辐照后的退火特性.测试了辐照及退火后的直流电参数.实验结果显示,辐照后基极电流(Ib)明显增大,而集电极电流(Ic)基本不变,表明Ib的增加是电流增益退化的主要原因.退火结果表现为电流增益(β=Ic/Ib)继续衰降,表明SiGe HBT具有"后损伤"效应.对其机理进行了探讨,结果表明其主要原因是室温退火中界面态继续增长引起的.     

一种新型的高增益超宽带低噪声放大器

文中提出了一种采用增益提高技术的超宽带低噪声放大器(LNA)。为了通过提高电路的输出阻抗,进而实现改善电路增益的目的,该LNA包含了两级共射共基放大器电路,并在共基晶体管基极引入电感。基于0.13μm SiGe BiCMOS工艺对其进行设计,实现了超宽的31GHz~42GHz的工作频率,增益为20.1dB~30.7dB,噪声系数为1.19dB~1.31dB,并且在1.8V单电源电压供电情况下,消耗的功耗为13.2mW。     

双极晶体管发射极电阻的提取方法及应用研究

以双多晶自对准互补双极器件中NPN双极晶体管为例,阐述了发射极电阻提取的基本原理和数学方法。在大电流情况下,NPN管的基极电流偏离理想电流是发射极串联电阻效应引起的。该提取方法综合考虑了辐照过程中NPN管的电流增益退化特性,分析了总剂量辐照效应对NPN管的损伤机理和模式。该提取方法适用于多晶硅发射极器件,也适用于SiGe HBT器件。     

SiGe HBT 60Co γ辐照总剂量效应

测量了SiGe HBT直流增益在60Coγ辐照过程中随剂量及器件电流注入水平的变化。实验结果显示在累计辐照剂量超过5 000 Gy(Si)后,器件电流增益变化与辐照剂量存在线性反比关系,且增益损伤系数与器件电流注入水平有关;器件在受到总剂量为2.78×104Gy(Si)辐照后,器件静态基极电流Ib、集电极电流Ic、静态直流增益及最大振荡频率fmax出现不同程度退化;但器件其他电参数如截止频率fT、交流增益|H21|及结电容(CCBO)与辐照前相比未出现显著退化。利用MEDICI数值模拟分析了SiGe HBT参数退化机理。     

Silicon Bipolar LNAs in the X and Ku Bands

Two fully integrated silicon bipolar LNAs at 8 and 12 GHz are presented. Both circuits provide simultaneous noise and input impedance matching. Resonant loads, designed for 50-Ω output matching, are also included. Moreover, the noise and input impedance self-matching trend of the cascode topology in the X and Ku bands was also explored and the design of integrated spiral inductors was discussed. From an on-wafer test, the 8 and the 12-GHz LNAs exhibit a power gain of 11.5 and 8 dB and a noise figure of 2.6 and 4.7 dB, respectively. This performance was achieved with bias currents as low as 4 mA for each circuit. The two LNAs were fabricated in a 46-GHz-f _T pure bipolar technology.     

Measurement and comparison of 1/f noise and g-r noise in siliconhomojunction and III-V heterojunction bipolar transistors

This paper experimentally determines and compares the 1/f noise and the g-r noise, as components of the base noise current spectral density, in Si homojunction and III-V heterojunction bipolar transistors (HBTs) in common-emitter configuration. The noise spectra for each of these devices are obtained as functions of the base bias current (I_B), and the 1/f noise has been found to depend on I_B as I_B^γ, where γ~1.8 for the silicon BJT's and InP/InGaAs HBT's with high current gains (β~50), and γ~1.1 for the AlGaAs/GaAs HBTs with low current gains (4<β<12). The nearly constant current gain and the near square-law and inverse-square emitter area dependence of 1/f noise in silicon devices are indicative of the dominant base bulk recombination nature of this noise. The 1/f noise in the InP based HBTs has been found to be lowest among all the devices we have tested, and its origin is suggested to be the base bulk recombination as in the Si devices. For the AlGaAs/GaAs HBTs, the low current gain and the near unity value of γ, arise most likely due to the combined effects of surface, bulk, and depletion region recombinations and the base-to-emitter injection. The dependence of the 1/f noise on the base current density in the devices tested in this work, and those tested by others are compared to find out which HBT's have achieved the lowest level of 1/f noise     

A model for the computer-aided noise analysis of broad-banded bipolar circuits

A model suitable for the prediction of equivalent input noise voltage, equivalent input noise current, and noise figure of narrow geometry integrated bipolar devices is presented. The bipolar model accounts for flicker phenomena and the low frequency current gain attenuation commonly observed at very low and at very high injection levels. Moreover, a first-order approximation to the dependence of intrinsic base resistance on transistor current level is analytically incorporated. Experimental results are offered and compared with analytical estimates gleaned from a computer program written to output pertinent noise performance data for frequencies below the beta-cutoff frequency of a transistor.     

The Comparative Performance of FET and Bipolar Transistors at VHF

The relative performance of FET and bipolar transistors 200 MHz AGC amplifiers in a TV tuner is discussed. It is concluded that both junction and insulated gate FET's have better overload capability than the bipolar transistor though they have a lower stable gain. The noise figure of the IG FET increases less rapidly with AGC than does the noise figure of the bipolar transistor. The performance of all three semiconductor devices is compared with that of a popular vacuum tube (6DS4) in its tuner.     

110-120-GHz monolithic low-noise amplifiers

The authors discuss the development of 110-120-GHz monolithic low-noise amplifiers (LNAs) using 0.1-mm pseudomorphic AlGaAs/InGaAs/GaAs low-noise HEMT technology. Two 2-stage LNAs have been designed, fabricated, and tested. The first amplifier demonstrates a gain of 12 dB at 112 to 115 GHz with a noise figure of 6.3 dB when biased for high gain, and a noise figure of 5.5 dB is achieved with an associated gain of 10 dB at 113 GHz when biased for low-noise figure. The other amplifier has a measured small-signal gain of 19.6 dB at 110 GHz with a noise figure of 3.9 dB. A noise figure of 3.4 dB with 15.6-dB associated gain was obtained at 113 GHz. The authors state that the small-signal gain and noise figure performance for the second LNA are the best results ever achieved for a two-stage HEMT amplifier at this frequency band     

A Compact, ESD-Protected, SiGe BiCMOS LNA for Ultra-Wideband Applications

Two 3.65-mW, ESD-protected, BiCMOS ultra-wideband low-noise amplifiers (LNAs) for operation up to 10 GHz are presented. These common-base LNAs achieve significant savings in die area over more widely used cascoded common-emitter LNAs because they do not use an LC input matching network. A design with a shunt peaked load achieves a high S₂₁ (17-19 dB) and low noise figure (NF) (4-5 dB) across the band. A resistively loaded design exhibits a lower S₂₁ (15-16 dB) and higher NF (4.5-6 dB), but also utilizes 20% less silicon area. Both LNAs achieve a 1.5 kV ESD protection level and an acceptable S₁₁ (<-10 dB) across the band. Current source noise reduction is critical in common base topologies. Therefore, detailed noise analyses of MOS- and HBT-based current sources are provided     

SiGe HBT X-Band LNAs for Ultra-Low-Noise Cryogenic Receivers

We report results on the cryogenic operation of two different monolithic X-band silicon-germanium (SiGe) heterojunction bipolar transistor low noise amplifiers (LNAs) implemented in a commercially-available 130 nm SiGe BiCMOS platform. These SiGe LNAs exhibit a dramatic reduction in noise temperature with cooling, yielding of less than 21 K (0.3 dB noise figure) across X-band at a 15 K operating temperature. To the authors' knowledge, these SiGe LNAs exhibit the lowest broadband noise of any Si-based LNA reported to date.     

Silicon-on-insulator bipolar transistors

Thin-film lateral n-p-n bipolar transistors (BJT) have been fabricated in moving melt zone recrystallized silicon on a 0.5-µm silicon dioxide substrate thermally grown on bulk silicon. Current-voltage characteristics of devices with different base widths (5 and 10 µm) have been analyzed. The use of a metal gate over oxide covering the base region has allowed the devices to be operated as n-channel MOSFET's as well thus surface effects on device characteristics have been investigated under varying gate-bias voltages. Maximum dc current gain values of 2.5 were achieved with a 5-µm base width and values around 0.5 with a 10-µm base width. Higher gain values were impeded by onset of high-level injection which occurred at low currents because of light base doping of these devices.