共查询到10条相似文献,搜索用时 15 毫秒
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作为一种新型低温无铅焊料,Sn-Bi基低温无铅焊料具有较低的熔化温度以及优良的焊接性能,在电子封装领域有着广泛的应用。随着电子元器件向微型化方向的发展,对低温无铅焊料的性能提出了更高的要求。添加微量的合金元素及纳米颗粒可以改善焊料的组织性能,满足电子元器件发展的需求。系统介绍了Sn-Bi基低温无铅焊料的组成、结构以及焊接性能,综述了合金元素和纳米颗粒对Sn-Bi基低温无铅焊料组织性能的影响及作用机理,分析了在研制Sn-Bi基低温无铅焊料过程中存在的不足之处,并提出了相应的改进方法。最后对Sn-Bi基低温无铅焊料在发展中需要关注的问题进行了总结与展望。 相似文献
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Characterization of small-sized eutectic Sn-Bi solder bumps fabricated using electroplating 总被引:1,自引:0,他引:1
We studied the effects of the cooling rate during the reflow process on the microstructure of eutectic Sn-Bi solder bumps
of various sizes fabricated by electroplating. To fabricate eutectic Sn-Bi solder bumps of less than 50 μm in diameter, Sn-Bi
alloys were electroplated on Cu pads and reflowed at various cooling rates using the rapid thermal annealing system. The interior
microstructure of electroplated bumps showed a fine mixture of Sn-rich phases and Bi-rich phases regardless of the cooling
rate. Such an interior microstructure of electroplated bumps was quite different from the reported microstructure of vacuum-evaporated
bumps. Ball shear tests were performed to study the effects of the cooling rate on the shear strength of the solder bumps
and showed that the shear strength of the bumps increased with increasing cooling rate probably due to the reduced grain size.
Soft fractures inside the solder bump were observed during the ball shear test regardless of the cooling rate. 相似文献
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电子封装无铅化技术进展(续完) 总被引:10,自引:2,他引:8
1.1.2.2Bi对无铅焊料性能影响及Sn-Bi系 在无铅焊料中添加Bi,可以降低熔点,提高浸润性等.对于使用者来说,具有很大的吸引力. 相似文献
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无铅可焊性镀层及其在电子工业中的应用 总被引:4,自引:0,他引:4
在电子工业中 ,为消除铅的污染 ,探讨了各种替代Sn-Pb合金的无铅可焊性镀层。论述了电镀Sn -Zn、Sn-Ag、Sn-Bi合金的方法及其镀层的可焊性能。 相似文献
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Sn-Ag和Sn-Zn及Sn-Bi系无铅焊料 总被引:24,自引:5,他引:19
随着微电子组装技术的发展,研制新型的和实用的无铅焊料替代传统的Sn-Pb焊料已成为近年的研究热点。介绍了目前最常见的Sn-Ag、Sn-Zn和Sn-Bi为基体的无铅焊料并与传统的Sn-Pb焊料的性能进行了比较。 相似文献