On Parallelepiped-Shaped Passbands for Multidimensional Nonseparable ${bf M}$th-Band Low-Pass Filters

The “shape” of the desired frequency passband is an important consideration in the design of nonseparable multidimensional ($M$ -D) filters in $M$-D multirate systems. For $M$-D ${bf M}$th-band filters, the passband shape should be chosen such that the ${bf M}$th-band constraint is satisfied. The most commonly used shape of the passband for $M$-D ${bf M}$ th-band low-pass filters is the so-called symmetric parallelepiped (SPD) ${rm SPD}(pi {bf M}^{- {rm T}})$ . In this paper, we consider the more general parallelepiped passband ${rm SPD}(pi {bf L} ^{rm T})$, and derive conditions on $ {bf L} $ such that the ${bf M}$ th-band constraint is satisfied. This result gives some flexibility in designing $M$-D ${bf M}$th-band filters with parallelepiped shapes other than the commonly used case of $ {bf L} = {bf M}^{- 1}$. We present design examples of 2-D ${bf M}$th-band filters to illustrate this flexibility in the choice of $ {bf L} $.      

Extraction of the Effective Mobility of $ hbox{In}_{0.53}hbox{Ga}_{0.47}hbox{As}$ MOSFETs

The extraction of the effective mobility on $hbox{In}_{0.53} hbox{Ga}_{0.47}hbox{As}$ metal–oxide–semiconductor field-effect transistors (MOSFETs) is studied and shown to be greater than 3600 $hbox{cm}^{2}/hbox{V} cdot hbox{s}$. The removal of $C_{rm it}$ response in the split $C$–$V$ measurement of these devices is crucial to the accurate analysis of these devices. Low-temperature split $C$–$V$ can be used to freeze out the $D_{rm it}$ response to the ac signal but maintain its effect on the free carrier density through the substrate potential. Simulations that match this low-temperature data can then be “warmed up” to room temperature and an accurate measure of $Q_{rm inv}$ is achieved. These results confirm the fundamental performance advantages of $hbox{In}_{0.53}hbox{Ga}_{0.47}hbox{As}$ MOSFETs.      

1580-V–40-$hbox{m}Omegacdot hbox{cm}^{2}$ Double-RESURF MOSFETs on 4H-SiC $(hbox{000}bar{hbox{1}})$

Double-reduced-surface-field (RESURF) MOSFETs with $hbox{N}_{2}hbox{O}$ -grown oxides have been fabricated on the 4H-SiC $(hbox{000} bar{hbox{1}})$ face. The double-RESURF structure is effective in reducing the drift resistance, as well as in increasing the breakdown voltage. In addition, by utilizing the 4H-SiC $(hbox{000}bar{hbox{1}})$ face, the channel mobility can be increased to over 30 $hbox{cm}^{2}/hbox{V}cdothbox{s}$, and hence, the channel resistance is decreased. As a result, the fabricated MOSFETs on 4H-SiC $( hbox{000}bar{hbox{1}})$ have demonstrated a high breakdown voltage $(V_{B})$ of 1580 V and a low on-resistance $(R_{rm ON})$ of 40 $hbox{m}Omega cdothbox{cm}^{2}$. The figure-of-merit $(V_{B}^{2}/R_{rm ON})$ of the fabricated device has reached 62 $hbox{MW/cm}^{2}$, which is the highest value among any lateral MOSFETs and is more than ten times higher than the “Si limit.”      

RF Power Measurements of InAlN/GaN Unstrained HEMTs on SiC Substrates at 10 GHz

Unstrained high-electron mobility transistors (HEMTs) were fabricated from InAlN/GaN on semi-insulating SiC substrates. The devices had 0.24-$muhbox{m}$ T-gates with a total width of $hbox{2} times hbox{150} muhbox{m}$. Final passivated performance values for these devices are $I_{max} = hbox{1279} hbox{mA/mm}$, $I_{rm DSS} = hbox{1182} hbox{mA/mm}$ , $R_{c} = hbox{0.43} Omega cdot hbox{mm}$, $rho_{s} = hbox{315} Omega/hbox{sq}$, $f_{T} = hbox{45} hbox{GHz}$, $f_{max({rm MAG})} = hbox{64} hbox{GHz}$, and $g_{m} = hbox{268} hbox{mS/mm}$. Continuous-wave power measurements at 10 GHz produced $P_{rm sat} = hbox{3.8} hbox{W/mm}$, $G_{t} = hbox{8.6} hbox{dB}$, and $hbox{PAE} = hbox{30}%$ at $V_{rm DS} = hbox{20} hbox{V}$ at 25% $I_{rm DSS}$ . To our knowledge, these are the first power measurements reported at 10 GHz for this material.      

A Fully Integrated 0.13- $mu$m CMOS 40-Gb/s Serial Link Transceiver

A fully integrated 40-Gb/s transceiver fabricated in a 0.13-$mu$m CMOS technology is presented. The receiver operates at a 20-GHz clock performing half-rate clock and data recovery. Despite the low ${rm f}_{rm T}$ of 70 GHz, the input sampler achieves 10-mV sensitivity using pulsed latches and inductive-peaking techniques. In order to minimize the feedback latency in the bang-bang controlled CDR loop, the proportional control is directly applied to the VCO, bypassing the charge pump and the loop filter. In addition, the phase detection logic operates at 20 GHz, eliminating the need for the deserializers for the early/late timing signals. The four clock phases for the half-rate CDR are generated by a quadrature LC-VCO with microstrip resonators. A linear equalizer that tunes the resistive loading of an inductively-peaked CML buffer can improve the eye opening by 20% while operating at 39 Gb/s. The prototype transceiver occupies 3.4$, times ,$2.9 mm$^{2}$ with power dissipation of 3.6 W from a 1.45-V supply. With the equalizer on, the transmit jitter of the 39-Gb/s 2$^{15}-1$ PRBS data is 1.85 ${rm ps}_{rm rms}$ over a WB-PBGA package, an 8-mm PCB trace, an on-board 2.4-mm connector, and a 1 m-long 2.4-mm coaxial cable. The recovered divided-by-16 clock jitter is 1.77 ${rm ps}_{rm rms}$ and the measured BER of the transceiver is less than $10^{- 14}$ .      

An Analytical Method to Extract the Physical Parameters of a Solar Cell From Four Points on the Illuminated $J{-}V$ Curve

For a variety of solar cells, it is shown that the single exponential $J{-}V$ model parameters, namely—ideality factor $eta$ , parasitic series resistance $R_{s}$, parasitic shunt resistance $R_{rm sh}$, dark current $J_{0}$, and photogenerated current $J_{rm ph}$ can be extracted simultaneously from just four simple measurements of the bias points corresponding to $V_{rm oc}$, $sim!hbox{0.6}V_{rm oc}$, $J_{rm sc}$, and $sim! hbox{0.6}J_{rm sc}$ on the illuminated $J{-}V$ curve, using closed-form expressions. The extraction method avoids the measurements of the peak power point and any $dJ/dV$ (i.e., slope). The method is based on the power law $J{-}V$ model proposed recently by us.      

A Biphase Modulator Circuit for Impulse Radio-UWB Applications

This letter presents a circuit to provide binary phase shift keying to ultra-wideband (UWB) impulse transmitters. The circuit is based on a Gilbert-cell multiplier and uses active on-chip balun and unbalanced-to-balanced converters for single-ended to single-ended operation. Detailed measurements of the circuit show a gain ripple of $pm 1~{rm dB}$ at an overall gain of $-2~{rm dB}$, an input reflection below $-12~{rm dB}$, an output reflection below $-18~{rm dB}$, a group delay variation below 6 ps and a $-1~{rm dB}$ input compression point of more than 1 dBm in both switching states over the full 3.1–10.6 GHz UWB frequency range. A time domain measurement verifies the switching operation using an FCC-compliant impulse generator. The circuit is fabricated in a $0.8~mu {rm m}$ Si/SiGe HBT technology, consumes 31.4 mA at a 3.2 V supply and has a size of $510 times 490~mu{rm m}^{2}$ , including pads. It can be used in UWB systems using pulse correlation reception or spectral spreading.      

Characterization and Modeling of RF-Performance $(f_{T})$ Fluctuation in MOSFETs

The fluctuation of RF performance (particularly for $f_{T}$ : cutoff frequency) in the transistors fabricated by 90-nm CMOS technology has been investigated. The modeling for $f_{T}$ fluctuation is well fitted with the measurement data within approximately 1% error. Low-$V_{t}$ transistors (fabricated by lower doping concentration in the channel) show higher $f_{T}$ fluctuation than normal transistors. Such a higher $f_{T}$ fluctuation results from $C_{rm gg}$ (total gate capacitance) variation rather than $g_{m}$ variation. More detailed analysis shows that $C_{rm gs} + C_{rm gb}$ (charges in the channel and the bulk) are predominant factors over $C_{rm gd}$ (charges in LDD/halo region) to determine $C_{rm gg}$ fluctuation.      

Performance Improvement of N-Type $hbox{TiO}_{x}$ Active-Channel TFTs Grown by Low-Temperature Plasma-Enhanced ALD

We report on performance improvement of $n$-type oxide–semiconductor thin-film transistors (TFTs) based on $hbox{TiO}_{x}$ active channels grown at 250 $^{circ}hbox{C}$ by plasma-enhanced atomic layer deposition. TFTs with as-grown $hbox{TiO}_{x}$ films exhibited the saturation mobility $(mu_{rm sat})$ as high as 3.2 $hbox{cm}^{2}/hbox{V}cdothbox{s}$ but suffered from the low on–off ratio $(I_{rm ON}/I_{rm OFF})$ of $hbox{2.0} times hbox{10}^{2}$. $hbox{N}_{2}hbox{O}$ plasma treatment was then attempted to improve $I_{rm ON}/I_{rm OFF}$. Upon treatment, the $hbox{TiO}_{x}$ TFTs exhibited $I_{rm ON}/I_{rm OFF}$ of $hbox{4.7} times hbox{10}^{5}$ and $mu_{rm sat}$ of 1.64 $hbox{cm}^{2}/hbox{V}cdothbox{s}$, showing a much improved performance balance and, thus, demonstrating their potentials for a wide variety of applications such as backplane technology in active-matrix displays and radio-frequency identification tags.      

A 5.75 to 44 Gb/s Quarter Rate CDR With Data Rate Selection in 90 nm Bulk CMOS

This paper presents a quarter-rate clock and data recovery (CDR) circuit for plesiochronous serial I/O-links. The 2$times$-oversampling phase-tracking CDR, implemented in 90$,$nm bulk CMOS technology, covers the whole range of data rates from 5.75 to 44 Gb/s realized in a single IC by the novel feature of a data rate selection logic. Input data are sampled with eight parallel differential master-slave flip-flops, where bandwidth enhancement techniques were necessary for 90 nm CMOS. Precise and low-jitter local clock phases are generated by an analog delay-locked loop. These clock phases are aligned to the incoming data by four parallel phase rotators. The phase-tracking loop of the CDR is realized as a digital delay-locked loop and is therefore immune against process tolerances. The CDR is able to track a maximum frequency deviation of ${pm }{hbox{615~ppm}}$ between incoming data and a local reference clock and fulfills the extended XAUI jitter tolerance mask. A bit error rate ${≪} hbox{10}^{-12}$ was verified up to 38 Gb/s using a 2$ ^{7} -$1 PRBS pattern. With a low power consumption per data rate of only 5.74 mW/(Gb/s) the CDR meets the specifications of the International Technology Roadmap for Semiconductors for 90$~$nm CMOS serial I/O-links at the maximal data rate of 44 Gb/s. The CDR occupies a chip area of 0.2 ${hbox{mm}}^{2}$ .      

$N times N$ Cyclic-Frequency Router With Improved Performance Based on Arrayed-Waveguide Grating

We have developed an $N times N$ cyclic-frequency router with improved performance by employing two types of modified configuration; a uniform-loss and cyclic-frequency (ULCF) arrayed-waveguide grating (AWG) and an interconnected multiple AWG. We have demonstrated a compact 50-GHz-spacing 64 $,times,$64 ULCF-AWG router with low and uniform insertion losses of 5.4–6.8 dB and frequency deviations from the grid of less than $pm {8}~{rm GHz}$. We have also demonstrated a 100-GHz-spacing 8$,times,$8 interconnected multiple-AWG router with a practical configuration, very low and uniform insertion losses of 2.3–3.4 dB, and frequency deviations from the grid of less than $pm {6}~{rm GHz}$. We discuss the suitable or realizable scale $N$ of the two types of routers by comparison with a conventional AWG router in terms of optical and dimensional performance and productivity.      

W-Band Active Down-Conversion Mixer in Bulk CMOS

A W-band (76–77 GHz) active down-conversion mixer has been demonstrated using low leakage (higher ${rm V}_{{rm T}}$) NMOS transistors of a 65-nm digital CMOS process with 6 metal levels. It achieves conversion gain of ${-}8$ dB at 76 GHz with a local oscillation power of 4 dBm (${sim-}2$ dBm after de-embedding the on-chip balun loss), and 3 dB bandwidth of 3 GHz. The SSB noise figures are 17.8–20 dB (11.3–13.5 dB after de-embedding on-chip input balun loss) between 76 and 77 GHz. ${rm IP}_{1{rm dB}}$ is ${-}6.5$ dBm and IIP3 is 2.5 dBm (${sim-}13$ and ${sim}-4$ dBm after de-embedding the on-chip balun loss). The mixer consumes 5 mA from a 1.2 V supply.      

Photosensitive Inverter and Ring Oscillator With Pseudodepletion Mode Load for LCD Applications

Photosensitive inverters and ring oscillators (ROs) with pseudodepletion mode loads (PDMLs) were integrated in LCD panels using conventional mass production processes. The delay time $(t_{rm pd})$ of five-stage ROs with PDML reduced from 204.3 $mu hbox{s}$ under dark to 16.3 $muhbox{s}$ under backlight illumination of 20 000 lx. The oscillation frequency exhibited a power-law dependence $(f_{rm osc} infty hbox{IL}^{gamma})$ on the backlight illuminance with the extracted fitting parameter $gamma = hbox{0.447}$ at room temperature.      

High-Temperature Microwave Performance of Submicron AlGaN/GaN HEMTs on SiC

The effect of temperature on the small-signal radio-frequency (RF) performance of submicron AlGaN/GaN high-electron-mobility transistors on SiC has been studied from room temperature (RT) up to 600 K. A relation between ambient and channel temperatures has been established by means of finite-element simulations. The thermal behavior of the intrinsic parameters $C_{rm gs}$, $C_{rm gd}$, $g_{m, {rm int}}$, and $g_{rm ds}$ has been extracted accurately from RF measurements by means of the small-signal equivalent circuit. Main dc parameters $(I_{D}, g_{m, {rm ext}})$ show reductions close to 50% between RT and 600 K, mainly due to the decrease in the electron mobility and drift velocity. In the same range, $f_{T}$ and $f_{max}$ suffer a 60% decrease due to the reduction in $g_{m, {rm ext}}$ and a slight increase of $C_{rm gs}$ and $C_{rm gd}$. An anomalous thermal evolution of $C_{rm gd}$ at low $I_{D}$ has been identified, which is indicative of the presence of traps.      

A $Delta{-}Sigma$ PLL-Based Spread-Spectrum Clock Generator With a Ditherless Fractional Topology

A triangular-modulated spread-spectrum clock generator using a$Delta{-}Sigma$-modulated fractional-$N$ phase-locked loop (PLL) is presented. The PLL employs a multiphase divider to implement the modulated fractional counter with increased $Delta{-}Sigma$ operation speed. In addition, the phase mismatching error in the phase-interpolated PLL with multiphase clocks can be randomized, and finer frequency resolution is achievable. With a frequency modulation of 33 kHz, the measured peak power reduction is more than 11.4 dB under a deviation of $pm$0.37%. Without spread-spectrum clocking, the PLL generates 2.4-GHz output with 18.82-ps peak-to-peak jitter. After spread-spectrum operation, the measured up-spread and down-spread jitter can achieve 52.59 and 56.79 ps, respectively. The chip occupies $950times850 {rm mu}{rm m}^{2}$ in 0.18-${rm mu}{rm m}$ CMOS process and consumes 36 mW.      

Endurance Reliability of Multilevel-Cell Flash Memory Using a $ hbox{ZrO}_{2}/hbox{Si}_{3}hbox{N}_{4}$ Dual Charge Storage Layer

The mechanisms of programming/erasing (P/E) and endurance degradation have been investigated for multilevel-cell (MLC) Flash memories using a $hbox{Si}_{3}hbox{N}_{4}$ (NROM) or a $hbox{ZrO}_{2}/hbox{Si}_{3}hbox{N}_{4}$ dual charge storage layer (DCSL). Threshold-voltage $(V_{rm th})$ -level disturbance is found to be the major endurance degradation factor of NROM-type MLCs, whereas separated charge storage and step-up potential wells give rise to a superior $V_{rm th}$ -level controllability for DCSL MLCs. The programmed $V_{rm th}$ levels of DCSL MLCs are controlled by the spatial charge distribution, as well as the charge storage capacity of each storage layer, rather than the charge injection. As a result, DCSL MLCs show negligible $V_{rm th}$-level offsets ($ ≪ $ 0.2 V) that are maintained throughout the $hbox{10}^{5}$ P/E cycles, demonstrating significantly improved endurance reliability compared to NROM-type MLCs.      

Impacts of $hbox{N}_{2}$ and $hbox{NH}_{3}$ Plasma Surface Treatments on High-Performance LTPS-TFT With High-$kappa$ Gate Dielectric

Low-temperature polycrystalline-silicon thin-film transistors (LTPS-TFTs) with high- $kappa$ gate dielectrics and plasma surface treatments are demonstrated for the first time. Significant field-effect mobility $mu_{rm FE}$ improvements of $sim$86.0% and 112.5% are observed for LTPS-TFTs with $hbox{HfO}_{2}$ gate dielectric after $hbox{N}_{2}$ and $ hbox{NH}_{3}$ plasma surface treatments, respectively. In addition, the $hbox{N}_{2}$ and $ hbox{NH}_{3}$ plasma surface treatments can also reduce surface roughness scattering to enhance the field-effect mobility $mu_{rm FE}$ at high gate bias voltage $V_{G}$, resulting in 217.0% and 219.6% improvements in driving current, respectively. As a result, high-performance LTPS-TFT with low threshold voltage $V_{rm TH} sim hbox{0.33} hbox{V}$, excellent subthreshold swing S.S. $sim$0.156 V/decade, and high field-effect mobility $mu_{rm FE} sim hbox{62.02} hbox{cm}^{2}/hbox{V} cdot hbox{s}$ would be suitable for the application of system-on-panel.      

Q-Band pHEMT and mHEMT Subharmonic Gilbert Upconversion Mixers

This letter makes a comparison between Q-band 0.15 $mu{rm m}$ pseudomorphic high electron mobility transistor (pHEMT) and metamorphic high electron mobility transistor (mHEMT) stacked-LO subharmonic upconversion mixers in terms of gain, isolation and linearity. In general, a 0.15 $mu{rm m}$ mHEMT device has a higher transconductance and cutoff frequency than a 0.15 $mu{rm m}$ pHEMT does. Thus, the conversion gain of the mHEMT is higher than that of the pHEMT in the active Gilbert mixer design. The Q-band stacked-LO subharmonic upconversion mixers using the pHEMT and mHEMT technologies have conversion gain of $-$7.1 dB and $-$0.2 dB, respectively. The pHEMT upconversion mixer has an ${rm OIP}_{3}$ of $-$12 dBm and an ${rm OP}_{1 {rm dB}}$ of $-$24 dBm, while the mHEMT one shows a 4 dB improvement on linearity for the difference between the ${rm OIP}_{3}$ and ${rm OP}_{1 {rm dB}}$. Both the chip sizes are the same at 1.3 mm $times$ 0.9 mm.      

A 67 dBm $OIP_{3}$ Multistacked Junction Varactor

A multistacked varactor is presented for ultra-linear tunable radio frequency applications. The varactor elements are applied in anti-series configuration and are characterized by an “exponential” $C$- $V _{R}$ relationship. Third-order intermodulation ($IM_{3}$) is cancelled through proper harmonic loading of the terminals of the anti-series configuration. Multiple stacking is used to further increase the power handling and to minimize the remaining fifth-order distortion. The measured output intercept point ($OIP_{3}$ ) at 2 GHz is $ > 67~{rm dBm}$ for modulated signals up to 10 MHz bandwidth, while providing a capacitance tuning ratio of 3:1 with an average quality factor of 40 and maximum control voltage of 10 V.      

High-Performance Metal/High-$k$ n- and p-MOSFETs With Top-Cut Dual Stress Liners Using Gate-Last Damascene Process on (100) Substrates

Newly proposed mobility-booster technologies are demonstrated for metal/high- $k$ gate-stack n- and pMOSFETs. The process combination of top-cut SiN dual stress liners and damascene gates remarkably enhances local channel stress particularly for shorter gate lengths in comparison with a conventional gate-first process. Dummy gate removal in the damascene gate process induces high channel stress, because of the elimination of reaction force from the dummy gate. PFETs with top-cut compressive stress liners and embedded SiGe source/drains are performed by using atomic layer deposition TiN/$ hbox{HfO}_{2}$ gate stacks with $T_{rm inv} = hbox{1.4} hbox{nm}$ on (100) substrates. On the other hand, nFETs with top-cut tensile stress liners are obtained by using $hbox{HfSi}_{x}/hbox{HfO}_{2}$ gate stacks with $T_{rm inv} = hbox{1.4} hbox{nm}$. High-performance n- and pFETs are achieved with $I_{rm on} = hbox{1300}$ and 1000 $muhbox{A}/muhbox{m} hbox{at} I_{rm off} = hbox{100} hbox{nA}/mu hbox{m}$, $V_{rm dd} = hbox{1.0} hbox{V}$, and a gate length of 40 nm, respectively.