A two-dimensional analytical subthreshold behavior model for short-channel AlGaAs/GaAs HFETs

Based on the minimum heteroface potential through an evanescent-mode analysis of two-dimensional potential distribution, the comprehensive and accurate expressions for the short-channel threshold voltage and subthreshold swing for self-aligned gated AlGaAs/GaAs HFETs are developed. It is found that the 2-D electron gas is strongly affected by the DIBL effect which will significantly influence the subthreshold behavior of the AlGaAs/GaAs HFETs. Besides the doping density, the thickness of the spacer and doped body can aggressively affect the short-channel subthreshold behavior comprising threshold voltage shift and subthreshold swing degradation. This model not only gives physical insights into the short-channel effects in HFETs but also offers basic designing guideline for the small-geometry AlGaAs/GaAs HFETs.     

High-transconductance p-channel AlGaAs/GaAs HFETs with low-energyberyllium and fluorine co-implantation self-alignment

The fabrication and electrical characteristics of p-channel AlGaAs/GaAs heterostructure FETs with self-aligned p⁺ source-drain regions formed by low-energy co-implantation of Be and F are reported. The devices utilize a sidewall-assisted refractory gate process and are fabricated on an undoped AlGaAs/GaAs heterostructure grown by MOVPE. Compared with Be implantation alone, the co-implantation of F⁺ at 8 keV with 2×10¹⁴ ions/cm² results in a 3× increase in the post-anneal Be concentration near the surface for a Be⁺ implantation at 15 keV with 4×10¹⁴ ions/cm². Co-implantation permits a low source resistance to be obtained with shallow p⁺ source-drain regions. Although short-channel effects must be further reduced at small gate lengths, the electrical characteristics are otherwise excellent and show a 77-K transconductance as high as 207 mS/mm for a 0.5-μm gate length     

High-electric-field effects and degradation of AlGaAs/GaAs power HFETs: a numerical study

This work presents a numerical study of high-field degradation and reliability issues of AlGaAs/GaAs power HFETs. A commercial two-dimensional drift–diffusion tool is used to investigate electric-field distributions, the effects of electron capture at the device surface under hot-carrier conditions, and the impact of drain recess scaling on such effects. Wherever experimental data are available for direct comparison, a good match is observed with our simulations. The main results of this study are (1) a validation of the hypothesis that attributes the main high-field degradation effects to electron capture over the gate–drain access region, and (2) design indications pointing out to the possibility of a reverse correlation between the gate–drain breakdown voltage and the device hot-carrier reliability.     

Electric-field-related reliability of AlGaAs/GaAs power HFETs: biasdependence and correlation with breakdown

This work shows experimental and simulated data of hot electron degradation of power AlGaAs/GaAs HFETs with different gate lengths and recess widths, and uses them to infer general indications on the bias and geometry dependence of the device high-field degradation, the meaningfulness of the breakdown voltage figure of merit from a reliability standpoint, and the physical phenomena taking place in the devices during the stress and leading to performance degradation. Possible formulations of a voltage-acceleration law for lifetime extrapolation are also tested     

High performance BCB-bridged AlGaAs/InGaAs power HFETs

A novel low-k benzocyclobutene (BCB) bridged and passivated layer for AlGaAs/InGaAs doped-channel power field effect transistors (FETs) with high reliability and linearity has been developed and characterized. In this study, we applied a low-k BCB-bridged interlayer to replace the conventional air-bridged process and the SiN/sub x/ passivation technology of the 1 mm-wide power device fabrication. This novel and easy technique demonstrates a low power gain degradation under a high input power swing, and exhibits an improved adjacent channel power ratio (ACPR) than those of the air-bridged one, due to its lower gate leakage current. The power gain degradation ratio of BCB-bridged devices under a high input power operation (P/sub in/ = 5 /spl sim/ 10 dBm) is 0.51 dB/dBm, and this value is 0.65 dB/dBm of the conventional air-bridged device. Furthermore, this novel technology has been qualified by using the 85-85 industrial specification (temperature = 85 C, humidity = 85%) for 500 h. These results demonstrate a robust doped-channel HFET power device with a BCB passivation and bridged technology of future power device applications.     

New aspects and mechanism of kink effect in InAlAs/InGaAs/InPinverted HFETs

The kink effect in InAlAs/InGaAs/InP composite channel heterojunction field effect transistors (HFETs) was investigated as a function of temperature and optical excitation. Drain source and gate current measurements show that above 325 K the kink effect disappears while the impact ionization process is still present. The kink at low temperatures is suppressed by illumination with photons of energy above 1 eV. These results prove that this parasitic effect is mainly related to the presence of traps in the top layers     

Electron mobility in a AlGaAs/GaAs/AlGaAs quantum well

An oscillatory dependence of the electron mobility on the quantum well (QW) thickness in a AlGaAs/GaAs/AlGaAs heterostructure with double-sided modulation doping has been observed experimentally. A steep decrease in mobility with increasing electron concentration in the QW is established. The conditions for an increase in mobility on introducing a thin barrier into the QW are determined. The first experimental observation of an increase in mobility by a factor of 1.3 in a QW of thickness L=26 nm upon introducing a thin (1–1.5 nm) AlAs barrier is reported.     

Ultra-submicrometer-gate AlGaAs/GaAs HEMTs

Ultra-submicrometer-gate AlGaAs/GaAs high-electron-mobility transistors (HEMTs) that have gate lengths ranging from 25 to 85 nm and were fabricated using electron-beam lithographic techniques on epitaxial wafers grown by molecular beam epitaxy are discussed. These devices show that velocity overshoot and short-gate geometry effects play an important role for the gate lengths less than 100 nm. The maximum intrinsic transconductance is 215 mS/mm, and the effective saturated electron velocity reaches 3×10⁷ cm/s for a 30-nm HEMT     

单量子阱GaAs/AlGaAs半导体激光器

本文介绍了用分子束外延法制作的梯度折射率分别限制式单量子阱GaAs/AlGaAs半导体激光器。该器件具有较低的阈值电流密度和单模运转特性,连续输出功率可达55mw。     

Improved model for kink effect in AlGaAs/InGaAs heterojunctionFET's

The kink effect in an AlGaAs/InGaAs HJFET has been investigated with regard to optical wavelength, temperature and gate voltage. The study reveals that the drain current value measured at the drain voltage lower than the kink voltage increases by irradiating white light onto the device, indicating the irradiation-induced kink effect recovery. The degree of the kink disappearance exhibited a significant optical wavelength dependence. We also found that the kink effect is suppressed either by increasing the temperature or by applying a high gate voltage where parallel conduction takes place. Based on these experimental results, we propose an improved model for the kink effect in an AlGaAs/InGaAs HJFET in which the kink effect is closely related to carrier trapping at the hole traps in the AlGaAs donor layer     

AlGaAs/GaAs/AlGaAs DHBT's for high-temperature stable circuits

High-temperature devices are required for a large number of industrial applications. In order to demonstrate the feasibility of a high temperature operating circuit on GaAs an operational amplifier was designed and fabricated. A corresponding technology for transistors and circuits for operation up to 300°C with AlGaAs/GaAs/AlGaAs DHBT's is presented. For the amplifier circuit an open loop gain of 49.5 dB at room temperature and 35.8 dB at 200°C was measured, which is in good agreement with the circuit simulation. High temperature stability has been proven by a storage test at 400°C over 1000 h for the ohmic contact metallization and 200 h for the transistors     

超亚微米栅AlGaAs/GaAs HEMT

在分子束外延生长的外延晶片上,用电子束刻蚀技术制作了超亚微米栅AlGaAs/GaAs高电子迁移率晶体管(HEMT),其栅长分布为25～85nm。该器件表明,速度过冲和短栅几何效应对栅长小于100nm的器件起着重要的作用。栅长为30nm的HEMT的最大本征跨导为215mS/mm,有效饱和电子速度可达3×10~7cm/s。     

GaAs/AlGaAs and InGaAs/AlGaAs MODFET inverter simulations

Although MODFET's have exhibited the fastest switching speed for any digital circuit technology, there is as yet no clear consensus on optimal inverter design rules. We therefore have developed a comprehensive MODFET device model that accurately accounts for such high gate bias effects as transconductance degradation and increased gate capacitance. The device model, which agrees with experimental devices fabricated in this laboratory, is used in the simulation of direct-coupled FET logic (DCFL) inverters with saturated resistor loads. Based on simulation results, the importance of large driver threshold voltage not only for small propagation delay times but for wide logic swings and noise margins is demonstrated. Furthermore, minimum delay times are found to occur at small supply voltages as seen experimentally. Both of these results are attributed to the reduction of detrimental high gate bias effects. The major effect of reducing the gate length on delay time is to decrease the load capacitance of the gate. Using 0.25-µm gates, delay times of 5 and 3.6 ps at 300 and 77 K, respectively, are predicted. Finally, the recently introduced In-GaAs/AlGaAs MODFET's are shown to have switching speeds superior to those of conventional GaAs/AlGaAs MODFET's.     

AlGaAs/GaAs/AlGaAs渐变异质结光致发光仿真研究

分析了AlGaAs/GaAs/AlGaAs渐变异质结的光致发光特性。根据理论及仿真结果,确定了GaAs发光的最优能带结构为双异质结P-AlGaAs/P-GaAs/P-AlGaAs或者N-AlGaAs/N-GaAs/ N-AlGaAs,并且异质结两边能带渐变。基于所选结构,研究了能带渐变及层宽对发光效率的影响。研究结果表明,外体区吸收层的能带渐变,且外体区激发层的能带不变,发光区域的载流子最多,发光能量值最大。激励光源的波长不同,各层有不同的最优宽度,为器件的整体优化提供了依据。AlGaAs/GaAs/AlGaAs渐变异质结的光致发光研究为高效率器件如太阳电池、发光二极管等的实用化设计、研制提供了有价值的参考。     

InGaAs／GaAs异质结构材料及器件应用

概述了ＩｎＧａＡｓ／ＧａＡｓ异质结构材料用于制作微波器件的优越性，叙述了材料的ＭＢＥ生长、输运特性和掺杂分布，以及用于制作Ｋｕ波段低噪声高增益ＨＦＥＴ的结果：栅长０．５μｍ，１２ＧＨｚ下噪声系数０．９３ｄＢ，相关增益９ｄＢ。     

Improved device linearity of AlGaAs/InGaAs HFETs by a second mesaetching

The conventional mesa isolation process in AlGaAs/InGaAs heterostructure FETs results in the gate contacting the exposed highly doped region at the mesa sidewalls, forming a parasitic gate leakage path. In this work, we suppress the gate leakage from the mesa-sidewall and enhance microwave power performance by performing an additional second mesa etching. The device gate leakage characteristics under high-input power swing are particularly investigated to reveal an improvement in device linearity, which is sensitive to the sidewall gate leakage. This modified device (M-HFETs) provides not only a higher linear RF output power but also a lower IM3 product than those characteristics in conventional HFETs     

AlGaAs/GaAs superlattice solar cells

A theoretical model is performed to study the viability of the AlGaAs/GaAs superlattice solar cell (SLSC). Using the Transfer Matrix Method, the conditions for resonant tunneling are established for a particular SL geometry with variably spaced quantum wells. The effective density of states and the absorption coefficient are calculated to determinate the J–V characteristic. Radiative, non‐radiative, and interface recombination were evaluated from a modeled SLSC, and their values were compared with a multiple quantum well solar cell of the same aluminum composition. A discussion about the conditions, where SLSC performance overcomes that of a multiple quantum well solar cell, is addressed. Copyright © 2011 John Wiley & Sons, Ltd.