利用二维PSD器件测量小角度的研究一种新型的自准直仪

文章中对二维PSD用于二维小角度测量的研制的原理方法和试验结果作了介绍,同时对二维PSD自准直仪的性能特点也有较详细的分析论述,也为小角度测量仪器的开发提出了一种崭新的方法.     

利用二维PSD器件测量小角度的研究 一种新型的自准直仪

文章中对二维PSD用于二维小角度测量的研制的原理方法和试验结果作了介绍 ,同时对二维PSD自准直仪的性能特点也有较详细的分析论述 ,也为小角度测量仪器的开发提出了一种崭新的方法。     

利用二维ＰＳＤ器件测量小角度的研究一种新型的自准直仪

文章中对二维ＰＳＤ用于二维小角度测量的研制的原理方法和试验结果作了介绍,同时对二维ＰＳＤ自准直仪的性能特点也有较详细的分析论述,也为小角度测量仪器的开发提出了一种崭新的方法。     

差动式多齿精密分度台的研制

应用差动原理，研制出一种用于高精度、小角度值分度及检测的实用装置－差动式多齿分度台。文中对该装置的锁紧机构和中齿盘工艺提出独特见解。     

高精度无导轨位移平台的结构设计

 为了使现阶段在各个机械相关领域中广泛使用的高精度位移平台性能更加完善,位移直线度、定位精度更高,制造成本更低,研制了高精度无导轨位移平台机构.该机构是根据平行四边形和比例杆运动原理研制出来的,除了能达到以上要求之外,且安装方便,体积小,养护简便,在有、无重力的条件下均能正常使用,既可应用于航天领域,也可以应用于其他要求的高精度位移系统中.     

一种大型设备多自由度自动对接方法

提出一种新颖的大型设备多自由度自动对接方法,该方法采用基于“三叉形”分划板的高精度CCD自准直仪来测量垂直与水平方向的二维小角度,采用单线阵CCD器件来测量轴向滚动、垂直、水平方向三自由度偏差,在嵌入式计算机的控制下通过测量这五个自由度偏差来调整设备姿态,直至对接完成。建立了五个自由度偏差的数据模型,并设计出包括CCD自准直仪、CCD接收处理装置、嵌入式计算机和执行机构的自动对接系统。该方法速度快、测量精度高,能实现大型设备的精确定位和自动对接,其角度测量精度为0.5″。     

微纳米三坐标测量机接触扫描探头稳定性分析(英文)

对微纳米三坐标测量机(CMM)高精度扫描探头的稳定性进行了分析.该扫描探头由带有球头的光纤探针、悬浮机构、二维角度传感器和微型迈克尔逊干涉仪4部分组成.光纤探针和悬浮片固定在一起,当光纤探针的球头受到触碰时,会带动悬浮机构的悬线发生形变,进而导致贴在悬浮片上的平面反射镜倾斜或在竖直方向上发生位移,前者由二维角度传感器进行感测,后者由微型迈克尔逊干涉仪进行感测.实验结果表明,环境温度的变化是影响探头稳定性的主要因素,探头中机械结构和部件对温度变化的敏感性要远远大于探头中光电器件对温度变化的敏感性.只要将探头放到一个恒温箱中,待恒温箱温度稳定4 h再开始测量,探头即可达到1 nm的分辨力和30nm的测量标准差.     

卧式重载高分辨力二维倾斜电动调整架设计

针对大型卧式菲索干涉仪检测大口径光学元件面形时的高分辨力二维倾斜调整问题,设计了一种卧式大负载二维倾斜电动调整架。设计中采用步进电机驱动、蜗轮蜗杆减速。滚动丝杠微调机构以及电子细分技术,实现了、倾角0．006”的高分辨力调整,并对关键件进行了静力学分析及实验分析,效果良好。     

平面镜多次反射的二维高精度小角度偏转测量

介绍了利用平面镜多次反射系统实现二维高精度小角度偏转测量的光学测量方法,构建了实验系统,针对系统的测量精度和测量范围与激光束在平面镜系统中反射次数的关系进行了研究,最后根据应用实例给出了具体的计算分析,研究结果表明,该方法具有结构简单、测量精度高的特点,当反射次数达到10次以上时,系统的测量精度将达到0.01",为亚角秒级高精度动态测量提供了一种新的研究方法.     

高精度二维自准直仪的研制

介绍了一种高精度二维自准直仪,它采用面阵CCD器件作为光电传感器,利用自准直原理实现了二维角度的测量,其测量范围为±300",精度为±0.2".     

用多齿分度台标定激光小角度干涉仪

提出一种用多齿分度台发生标准角直接标定激光小角度干涉仪的新方法。这种方法缩短了溯源链，显改善了不确定度。同时还提出正反测角差调整小角度干涉仪初始零位，从而现实可行地实现了初始零位的精确调整。用上述方法标定中国计量科学研究院新研制的激光小角度干涉仪，标定不确定度达到0．03″(k=2)。     

Nanomechanical properties of silicon surfaces nanostructured by excimer laser

Excimer laser irradiation at ambient temperature has been employed to produce nanostructured silicon surfaces. Nanoindentation was used to investigate the nanomechanical properties of the deformed surfaces as a function of laser parameters, such as the angle of incidence and number of laser pulses at a fixed laser fluence of 5 J cm⁻². A single-crystal silicon [311] surface was severely damaged by laser irradiation and became nanocrystalline with an enhanced porosity. The resulting laser-treated surface consisted of nanometer-sized particles. The pore size was controlled by adjusting the angle of incidence and the number of laser pulses, and varied from nanometers to microns. The extent of nanocrystallinity was large for the surfaces irradiated at a small angle of incidence and by a high number of pulses, as confirmed by x-ray diffraction and Raman spectroscopy. The angle of incidence had a stronger effect on the structure and nanomechanical properties than the number of laser pulses.     

微构件拉伸测试辅助引导对中测量系统设计

设计了一套微构件拉伸测试辅助引导对中测量系统,该系统以激光准直特性为基础并结合折反射定律,采用正交二维相机获得包含平移和角偏移的激光光点图像信息,建立了二维位移和二维角偏移与激光器成像点变化的数学模型。搭建了实验平台,依据该模型,利用MATLAB对获取图像进行处理获得需要调整的二维平移和角偏移参数变量。实验结果表明,该测量系统的二维角偏移分辨率可达到0.001°,重复性优于0.02°;二维位移分辨率可达到亚微米,重复性优于10μm。可为微构件拉伸测试中辅助引导对中提供调整参数并提高拉伸测试数据的准确性。     

Nanomechanical properties of silicon surfaces nanostructured by excimer laser

Abstract

Excimer laser irradiation at ambient temperature has been employed to produce nanostructured silicon surfaces. Nanoindentation was used to investigate the nanomechanical properties of the deformed surfaces as a function of laser parameters, such as the angle of incidence and number of laser pulses at a fixed laser fluence of 5 J cm^?2. A single-crystal silicon [311] surface was severely damaged by laser irradiation and became nanocrystalline with an enhanced porosity. The resulting laser-treated surface consisted of nanometer-sized particles. The pore size was controlled by adjusting the angle of incidence and the number of laser pulses, and varied from nanometers to microns. The extent of nanocrystallinity was large for the surfaces irradiated at a small angle of incidence and by a high number of pulses, as confirmed by x-ray diffraction and Raman spectroscopy. The angle of incidence had a stronger effect on the structure and nanomechanical properties than the number of laser pulses.     

激光跟踪仪测角误差的位移标定法

提出了激光跟踪仪测角误差的位移标定方法,通过在跟踪仪的切向位置上引入标准位移量,根据余弦定理对跟踪仪的角度码盘的误差进行标定.在小位移的情况下,跟踪仪角度的变化量很小,由此引入的非线性误差可以忽略,测角误差可以通过位移误差直接反映出来,当给定的标准位移测量不确定度已知时,其角度标定的不确定度可以直接估算出来.     

紧凑型多路激光合扩束平台技术研究

紧凑型高精度高可靠性多路激光合束与扩束结构的设计在工程应用中具有非常大的价值.在此背景下创造性地提出一种对基准平台进行分体式铸造,将短、中、长三波段多个激光器安装于长宽高分别为1 280 mm、990 mm、815 mm的舱内小空间及具备空间位置调整的紧凑型结构设计方案.对某型激光合扩束主体结构进行了设计,同时对部分重要部件进行了有限元静力学分析.在该平台中各路激光器沿激光出射方向的角度调整量均大于±30′,平台总质量为600 kg.该过渡基准平台系统在承载转台负载的前提下,其受力最大应变量为0.005mm.这表明该结构完全能够满足这种激光器的小空间合扩束及调整要求,该方法可以推广到其他光路合束结构设计中.     

多路激光跟踪干涉仪坐标测量系统的容错设计

介绍容错设计思想在由多路激光干涉仪构成的柔性坐标测量系统中的应用。由于采用了硬件冗余、软件冗余等技术，不但使该测量系统具有自我标定的能力，而且可恢复因测量过程中“丢光”现象而造成的干涉仪丢失的测量数据。并用三路单轴跟踪系统实现了二维坐标测量。     

斜床身数控车床X轴定位精度检测

为了更顺利地完成斜床身数控车床X轴定位精度的检测,通过总结大量的工作经验,介绍几种激光干涉仪光路调整方法,阐明利用角度镜配合激光干涉仪及其它镜组完成光路调整的原理及步骤。该方法很好地利用了干涉仪配备的调整附件的特性,解决了斜轴光路准直调整的难题。     

Intermittent process hybrid measurement system on the machining centre

This study introduces the development of a hybrid measurement system integrated on a machining centre to carry out the possible intermittent measurement of a workpiece. The developed hybrid measurement system principally consists of a MP10 touch trigger probe system, a circular triangulation laser probe system, and the measurement software. The touch trigger probe system was primarily used to measure the regular geometric features, whereas the circular triangulation laser probe system was adopted to inspect the freeform surface part of a test carrier with the help of the developed measurement software. An adjustment device consisting mainly of an adjustment unit, a joint unit, and an assembly unit, was designed and manufactured to minimize the cosine error caused by the assembly inaccuracy for the laser probe. The measuring uncertainty analysis experiments for both the touch trigger probe system and the non-contact laser probe system were investigated by using a calibrated standard sphere and the HP5529A laser interferometer system, respectively. The information in the whole measuring system – which comprised a personal computer, a CNC machining centre controller, a Renishaw MP10 touch probe system, and the controller of a Wolf & Back OTM3A20 circular triangulation laser probe system – was integrated technically. The measurement software was also developed to simulate the measuring path, prevent collision, and generate the corresponding measuring NC codes. The developed system can also be used to digitize the data points of a 3D small complex workpiece, such as a tooth model and an IC part. A carrier, combined with free form surface and regular geometric feature referred to in the ISO 10791-7 cutting test standard, was designed, manufactured and inspected in order to evaluate the performance of the developed hybrid measuring system. The measurement results of this carrier were verified through a CNC coordinate measuring machine, with satisfactory consistency. According to the measuring results, the developed hybrid measuring system was successfully and effectively used to carry out the intermittent measurement.     

Fast fabrication of silicon based microstructures using 355 nm UV laser

Abstract

In this study, a 355 nm UV Nd:YAG laser is used to process silicon wafers. In order to obtain microstructures with high aspect ratio, a dual prism optical system is set up to control the cutting linewidth of the UV laser beam. During the laser beam propagation through the prisms, the two prisms are rotated with the same angular velocity, which results in the focal spot of the laser beam moving in a circular path on the silicon substrates. When the laser beam moves relative to the holder (workstation), a laser cutting process can be carried out. With this laser system, the cutting linewidth is controllable ranging from 10 μm to 1 mm by adjusting the initial phase difference in the two prisms. The experimental results show that arbitrary shaped silicon based microstructures with high aspect ratio can be fabricated by this 355 nm UV laser system, and the aspect ratio over 10 can be obtained.