New de-embedding structures for extracting the electrical parameters of a through-silicon-via pair

Two innovative de-embedding methods are proposed for extracting an electrical model for a throughsilicon -via(TSV) pair consisting of a ground-signal(GS) structure.In addition,based on microwave network theory, a new solution scheme is developed for dealing with multiple solutions of the transfer matrix during the process of de-embedding.A unique solution is determined based on the amplitude and the phase characteristic of S parameters. In the first de-embedding method,a typical "π" type model of the TSV pair is developed,which illustrates the need to allow for frequency dependence in the equivalent TSV pair Spice model.This de-embedding method is shown to be effective for extracting the electrical properties of the TSVs.The feasibility of a second de-embedding method is also investigated.     

Mechanical and tribological properties of interlayer films for the damascene-Cu chemical-mechanical planarization process

Chemical-mechanical planarization (CMP) has emerged as the most preferred method to achieve excellent global and local planarity in the damascene-Cu process. As the feature sizes shrink, understanding the fundamentals of CMP is critical for successful implementation of the CMP process in sub 0.35-μm technology. It is also important to understand the effects of mechanical and tribological properties of the interlayer films on the CMP process to conduct successful evaluation and implementation of these materials. In this paper, we present the mechanical and tribological properties of various interlayer films (SiO₂, SiC, low-k B, low-k C, Ta, and Cu) and discuss the CMP process of the films in an alumina-based Cu slurry. Mechanical properties were evaluated using a nanoindentation technique. A micro-CMP tester was used to study the fundamental aspects of the CMP process. The coefficient of friction (COF) was measured during the process and was found to decrease both with downward pressure and with platen rotation. An acoustic sensor, attached to the substrate carrier, was used to monitor the process, and the signal was recorded to examine the difference in polishing behavior of these films. The acoustic emission (AE) signal was found to increase with the increase in platen velocity and pressure. Effects of machine parameters on the polishing behavior of the interlayer films and the correlation of mechanical properties with tribological properties have been discussed.     

An Envelope Hammerstein Model for Power Amplifiers

In this paper, an envelope Hammerstein （EH） model is introduced to describe dynamic input -output characteristics of RF power amplifiers. In the modeling approach, we use a new truncation method and an established nonlinear time series method to determine model structure. Then, we discuss the process of model parameter extraction in detailed. Finally, a 2 W WCDMA power amplifier is measured to verify the performance of EH model, and good agreement between model output and measurement result shows our model can accurately predict output characteristic of the power amplifier.     

低磨料浓度的碱性铜抛光液平坦化性能的研究

A novel alkaline copper slurry that possesses a relatively high planarization performance is investigated under a low abrasive concentration.Based on the action mechanism of CMP,the feasibility of using one type of slurry in copper bulk elimination process and residual copper elimination process,with different process parameters,was analyzed.In addition,we investigated the regular change of abrasive concentration effect on copper and tantalum removal rate and within wafer non-uniformity(WIWNU) in CMP process.When the abrasive concentration is 3 wt%,in bulk elimination process,the copper removal rate achieves 6125 °/min,while WIWNU is 3.5%,simultaneously.In residual copper elimination process,the copper removal rate is approximately 2700°/min,while WIWNU is 2.8%.Nevertheless,the tantalum removal rate is 0 °/min,which indicates that barrier layer isn’t eliminated in residual copper elimination process.The planarization experimental results show that an excellent planarization performance is obtained with a relatively high copper removal rate in bulk elimination process.Meanwhile,after residual copper elimination process,the dishing value increased inconspicuously,in a controllable range,and the wafer surface roughness is only 0.326 nm(sq < 1 nm) after polishing.By comparison,the planarization performance and surface quality of alkaline slurry show almost no major differences with two kinds of commercial acid slurries after polishing.All experimental results are conducive to research and improvement of alkaline slurry in the future.     

一种单光子雪崩光电二极管主动淬火电路

We present a novel gated operation active quenching circuit （AQC）. In order to simulate the quenching circuit a complete SPICE model of a InGaAs SPAD is set up according to the I-V characteristic measurement resuits of the detector. The circuit integrated with a ROIC （readout integrated circuit） is fabricated in an CSMC 0.5 μm CMOS process and then hybrid packed with the detector. Chip measurement results show that the functionality of the circuit is correct and the performance is suitable for practical system applications.     

A Novel Method for Analyzing the Noise Characteristic of Solar Cells with En-In Model

In this paper, a novel method for analyzing the noise characteristic of solar cells with En-In model was studied. The En-In noise model in two-port network was introduced to study the low-frequency noise characteristic of solar cells. According to the relationship between the output noise power spectrum and the two noise parameters in En-In noise model of the solar cell, known as En and In, an accurate method for extracting the two noise parame- ters was proposed. At the same time, the measurement method for the both parameters from 1Hz to 10kHz was studied. After 1/f noise curve fitting and characteristic frequency of G-R noise extraction on the noise spectrums of a large amount of solar ceils, the analyzing results of spectrum compositions proved the validity and significance of the En-In noise model for noise analysis of solar cells. It also provided the essential theoretical and experimental basis for the further research on noise characteristic and reliability estimation of solar cells and PV modules.     

A KAD Network Evolution Model Based on Node Behavior

An evolution model of KAD Dynamic Model Network （KDMN） is proposed to study the reason of hot node and simulate the process of network evolution based on node behavior from a holistic perspective. First, some symbols and meanings are introduced to describe nodes relationship and network states at a time step. Second, some evolution rules for network are formulated when node behaviors of join, exit, routing table update, data retrieval and content index distribution happen with different contextual scene in KAD network. In addition, a lightweight simulator is designed to implement the KDMN model. Moreover, an example of how to use the simulator to simulate the network changes in order to observe the result is described in detail. Finally, the KDMN is applied to analyze the reason for the formation of hot nodes in the BT and eMule network in the experiment. The different evolution principles of local priority, global priority and hybrid random are adopted based on the provision of network protocol of BT and eMule. The result of this experiment demonstrates that there are some hot nodes exist in the KAD network. However, the principle of hybrid random can effectively alleviate the phenomenon that a node is widely linked with others compared with global and local priority.     

Data embedding based on pixel value differencing and modulus function using indeterminate equation

An effective data hiding method based on pixel value differencing(PVD) and modulus function(MF) PVD(MF-PVD) was proposed. MF-PVD method was derived by Wang et al in which the MF was employed to adjust the remainder of two pixels for data embedding and extraction. In the proposed method, a new remainder function in a more general form is defined by selecting proper parameters, in which an indeterminate equation is constructed and an optimal solution is applied to revise the pixels. This strategy leads to a significant image distortion reduction compared with the original method. The experiment reveals that, by preserving the original embedding capacity, the method provides better embedding efficiency than both MF-PVD and PVD methods.     

Electrochemical investigation of copper chemical mechanical planarization in alkaline slurry without an inhibitor

This work investigates the static corrosion and removal rates of copper as functions of H202 and FA/OIIconcentration, and uses DC electrochemical measurements such as open circuit potential （OCP）, Tafel ana- lysis, as well as cyclic voltammetry （CV） to study HaOa and FA/OIIdependent surface reactions of Cu coupon electrode in alkaline slurry without an inhibitor. An atomic force microscopy （AFM） technique is also used to measure the surface roughness and surface morphology of copper in static corrosion and polishing conditions. It is shown that 0.5 vol.% H202 should be the primary choice to achieve high material removal rate. The electro- chemical results reveal that the addition of FA/O II can dissolve partial oxide film to accelerate the electrochemical anodic reactions and make the oxide layer porous, so that the structurally weak oxide film can be easily removed by mechanical abrasion. The variation of surface roughness and morphology of copper under static conditions is consistent with and provides further support for the reaction mechanisms proposed in the context of DC electro- chemical measurements. In addition, in the presence of H202, 3 vol.% FA/O II may be significantly effective from a surface roughness perspective to obtain a relatively flat copper surface in chemical mechanical planarization （CMP） process.     

Research on unified recognition model and algorithm for multi-modal gestures

In gesture recognition,static gestures,dynamic gestures and trajectory gestures are collectively known as multi-modal gestures.To solve the existing problem in different recognition methods for different modal gestures,a unified recognition algorithm is proposed.The angle change data of the finger joints and the movement of the centroid of the hand were acquired respectively by data glove and Kinect.Through the preprocessing of the multi-source heterogeneous data,all hand gestures were considered as curves while solving hand shaking,and a uniform hand gesture recognition algorithm was established to calculate the Pearson correlation coefficient between hand gestures for gesture recognition.In this way,complex gesture recognition was transformed into the problem of a simple comparison of curves similarities.The main innovations:1) Aiming at solving the problem of multi-modal gesture recognition,an unified recognition model and a new algorithm is proposed;2) The Pearson correlation coefficient for the first time to construct the gesture similarity operator is improved.By testing 50 kinds of gestures,the experimental results showed that the method presented could cope with intricate gesture interaction with the 97.7% recognition rate.     

New copper seed-layer enhancement process metrology for advanced dual-damascene interconnects

The extendibility of the physical vapor deposition (PVD), seed-layer deposition process for future devices needs to be enhanced with electrochemical techniques. Developing analytical techniques for the plating bath is a particular challenge because bath ingredients are often proprietary and difficult to ascertain. The feasibility of using an ion chromatography for an electrochemical copper, seed-layer enhancement (SLE) process metrology is studied. It is shown that the ion-chromatography method can be used to precisely determine the composition dynamics in a copper SLE plating bath. The bath concentration dynamics are found to be significant in influencing the electroplated Cu film properties, i.e., the resistivity and surface roughness. An excellent correlation exists between the ion chromatograms and the electroplated Cu film properties, suggesting that the ion-chromatography method is a powerful method.     

印制电路板化学金漏镀浅析简

在化学镍金过程中会出现漏镀现象,文章讨论了漏镀产生的机理,采用正交实验法对影响漏镀的主要因素进行排列,同时,对于铜面与钯离子在进行置换反应时的电化学势能进行分析。结果表明,在调节活化钯相关参数的同时,反应中的电化学势能亦不容忽视。     

PCB化学镀镍漏镀现象分析

文章阐述了不同尺寸铜盘连接状况、掩蔽作用等对漏洞的影响,发现孤立的小铜盘（0．1mm）比大尺寸的铜盘（〉0．1mm）更易发生漏镀,即漏镀易发生在小尺寸铜盘上,主要的原因与置换钯的速率不同相关。至于因掩蔽引发的漏镀现象,主要与平衡电化学势作用相关。在活化过程中,电子转移主要决定了漏镀发生与否。     

新型液相/电化学原子力显微镜的研制及其应用研究

研制了一种新型液相/电化学原子力显微镜（EC-AFM）系统。该EC-AFM系统的探头部分以激光作为光源, 设计了独特的液相光路, 采用了一块透明的玻璃作为视窗, 同时作为探针座, 将微探针和样品完全浸没在液体中进行扫描检测。设计了完全开放式的电解池, 可方便地改变样品的液体环境, 对电化学反应进行操作和控制。此外, 采取了探针扫描的方式, 使得较大和较重样品的扫描检测得以实现。利用该EC-AFM系统, 以铁片为阴极, 铜片为阳极在硫酸铜溶液中进行了化学镀铜实验, 并对实验过程进行了实时观察, 获得了不同阶段的样品表面图像。实验结果表明, 自主研制的EC-AFM在溶液中可扫描获得理想的AFM图像, 分辨率达到纳米量级, 证实该系统可以直接观察电解液中固液界面的化学反应。     

化学镀厚铜故障的处理

化学镀厚铜不需要电镀设备和昂贵的阳极材料,沉铜后经防氧化处理即可进入图形转移工序,然后直接进行图形电镀,缩短了生产流程,有着非常广泛的应用。但由于化学镀厚铜沉积时间长,镀层较厚,在生产中如果参数控制不到住,容易出现镀层起皮和结合力差等问题。文中对某厂在化学镀厚铜过程中出现的一次孔口起皮故障进行了原因分析和跟踪,提出了预防出现类似问题的方法。     

Electroless nickel plating process model for plated-through-hole board manufacturing

In this paper, the electrochemical reaction mechanism is used to develop a mathematical model for an electroless nickel plating process of plated-through-hole board. The model is calibrated against experimental data and the result, which is in good agreement with measured data, applied for state estimation of the unobservable processes. The electrical, chemical, and board parameters are estimated from measurements that are standard in the nickel plating industry.     

Metal–Polymer Composite Interconnections for Ultra Fine-Pitch Wafer Level Packaging

The decrease in feature sizes of microelectronic devices has underlined the need for higher number of input-outputs (I/Os) in order to increase its functionality. This has spurred a great interest in developing electronic packages with fine and ultra fine pitches (20-100 mum). Most of the compliant interconnects that are currently being developed have inductance and resistance higher than desirable. This paper presents a novel low-temperature fabrication process that combines polymer structures with electroless copper plating to create low stress composite structures for extremely fine-pitch wafer level packages. Analytical models for these structures justify the stress reduction at the interfaces and superior reliability as integrated circuit (IC)-package interconnects. Low coefficient of thermal expansion (CTE) polyimide structures with ultra-low stress, high toughness, and strength were fabricated using plasma etching. The dry etching process was tuned to yield a wall angle above 80deg. The etching process also leads to roughened sidewalls for selective electroless copper plating on the sidewalls of polymer structures. This work also describes a selective electroless plating synthesis route to develop thin IC-package bonding interfaces with lead-free solder. Lead-free alloy films were deposited from aqueous plating solutions consisting of suitable metal salts and reducing agents at 45degC. The lead-free solder composition was controlled by altering the plating bath formulation. Solder film formed from the above approach was demonstrated to bond the metal-coated polymer interconnects with the copper pads on the substrate using a standard reflow process. Metal-coated polymer structures in conjunction with the thin solder bonding films can provide low-cost high-performance solutions for wafer-level packaging.     

Electroless plating of copper on AZ31 magnesium alloy substrates

Chemical surface preparation for copper film on magnesium alloy by both electroless plating and organic coatings was studied. Organic coating was made by immersing the samples into an organosilicon heat-resisting varnish. A subsequent metallization process verified the applicability of this method. In this method, the organic coating acted as an interlayer between the substrate and copper film. When the reaction started, copper deposited directly onto the interlayer surface. X-ray diffraction and SEM analysis were used to understand the composition and morphology of the interlayer and copper film. The copper film has a rather perfect crystalline structure. And the result of the cross-cut test indicates the adhesion between the substrate is good enough. The potentiodynamic polarization curves for corrosion studies of coated magnesium alloys were performed in a corrosive environment of 3.5 wt% NaCl at neutral pH 7. The result reveals that compared with the substrate, the corrosion resistance of the coated AZ31 magnesium alloys increases distinctly. Moreover, the copper film has perfectly antibacterial and decorative properties. The method proposed in this work is environmentally friendly: non-toxic chemicals are used. In addition, this provides a new concept for plating the metals, which are considered difficult to plate due to high reactivity.     

纯铜表面脉冲激光熔覆Ni60涂层的结构与性能研究

为了克服纯铜表面激光熔覆时热量难以积聚的困难,得到冶金结合良好的Ni60熔覆层,采用预热辅助脉冲激光熔覆的方法,在纯铜表面进行了Ni60合金粉末的熔覆实验,并建立了纯铜表面预热辅助脉冲激光熔覆过程的3维瞬态热弹塑性模型,对温度场及残余应力进行了仿真。预热温度达到573K时,Ni60熔覆层中裂痕完全消除;预热温度为673K时,激光熔覆的加工效率提升了2.2倍;预热辅助脉冲激光熔覆得到的Ni60熔覆层平均硬度达到800HV_0.2;常温下,Ni60熔覆层与ASTM52100钢相对耐磨性为4.45,摩擦系数约是铜和ASTM 52100钢的57%。结果表明,随着预热温度的升高,Ni60熔覆层中裂纹减少,激光熔覆效率提高;Ni60熔覆层有效地提高了表面硬度,减小了摩擦系数。通过预热辅助脉冲激光熔覆技术,在纯铜表面制备得到无裂纹、无气孔的Ni60熔覆层,可有效地提高铜基材的硬度与耐磨性。     

Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates

The “ligand induced electroless plating (LIEP) process” is a simple process to obtain localized metal plating onto flexible polymers such as poly(ethylene terephtalate) and polyvinylidene fluoride sheets. This generic and cost‐effective process, efficient on any common polymer surface, is based on the covalent grafting by the GraftFast process of a thin chelating polymer film, such as poly(acrylic acid), which can complex copper ions. The entrapped copper ions are then chemically reduced in situ and the resulting Cu⁰ species act as a seed layer for the electroless copper growth which, thus, starts inside the host polymer. The present work focuses on the application of the LIEP process to the patterning of localized metallic tracks via two simple lithographic methods. The first is based on a standard photolithography process using a positive photoresist masking to prevent the covalent grafting of PAA in designated areas of the polymer substrate. In the second, the patterning is performed by direct printing of the mask with a commercial laser printer. In both cases, the mask was lifted off before the copper electroless plating step, which provides ecological benefits, since only the amount of copper necessary for the metallic patterning is used.