基于MEMS的非制冷红外探测器读出电路的设计

基于MEMS的非制冷红外探测器广泛用于军用和民用领域,其中作为探测器核心部件的焦平面探测阵列的读出电路等关键技术的研究至为重要.设计了一块240×320的焦平面探测阵列的读出电路,此电路能够抑制MEMS工艺的波动,减小探测器环境温度的影响.采用HHNEC 0.5 μm 工艺对此设计流片,其测试结果达到预期目标.芯片输出电压为1.5～3.5 V,每帧图像输出时间为16.32 ms,可以保证每秒61帧图像输出.     

中波碲镉汞红外偏振焦平面探测器的制备研究（特邀）

针对隐身等多类高价值目标精确探测与识别以及探测技术持续发展需求,为实现复杂战场环境下的高概率真假目标识别和高精度目标检测、定位、跟踪,开展复杂战场环境下隐身及微弱特征目标探测及抗干扰探测等技术研究意义重大,其中高集成度的焦平面型偏振红外探测器技术是其中一个重要方向。围绕集成式中波（MW）256×256碲镉汞红外偏振焦平面探测器的研制,介绍了偏振结构的设计、制备到偏振探测器的集成,以及偏振探测器性能的测试等方面的研究进展状况,设计加工出了亚波长金属光栅阵列,采用倒装互连的方式实现了偏振探测器的集成,并在MW 256×256碲镉汞焦平面器件上实现了红外偏振性能的测试和评估。     

InGaAs纳米线雪崩焦平面探测器发展研究

基于InGaAs纳米线的光电探测器,由于其优异的性能而受到广泛的关注和研究。综述了InGaAs纳米线光电探测器的探测机理、材料结构、器件性能和当前的研究现状。讨论了InGaAs纳米线雪崩焦平面探测器结构设计、纳米线材料精密生长、纳米线材料的界面与缺陷控制、纳米线雪崩焦平面器件制备工艺等关键技术。对发展高光子探测效率、低噪声、高增益InGaAs纳米线雪崩焦平面探测器的前景进行了展望。     

短波红外焦平面探测器及其应用进展

简要介绍短波红外焦平面阵列(SWIRFPA)的相关概念,从探测器材料、探测器制备工艺方面讲述国内外在短波红外焦平面探测器研究领域取得的进展,列举HgCdTe和InGaAs材料短波红外焦平面探测器产品,描述当前短波红外焦平面探测器的研究动向,最后列举了一些有代表性的短波红外焦平面阵列的应用.     

红外探测器发展需求

由于未来作战环境复杂,红外探测技术发展面临严峻挑战,而作为红外型武器的核心——红外探测器,正朝着高灵敏、宽谱段、高分辨率、低功耗、小型化和智能化的方向发展。通过回顾相关产业军民两用融合情况和红外探测技术发展历程,总结军事发展对探测器新的要求,以确立新一代探测器发展方向。在详细分析国外红外探测器发展历程和现状的基础上,重点介绍了国外红外焦平面探测器的最新研制情况和成果,包括非制冷红外探测器、制冷型红外探测器、红外双色探测器等,并总结强调第三代红外探测器需要在控制成本的同时不断提高和改进红外焦平面探测系统的性能。最后概述了智能化红外焦平面阵列的发展情况。     

空间大规模CMOS面阵焦平面拼接技术

为了提高空间遥感器的时间分辨率,采用更大规模的红外焦平面阵列和可见焦平面阵列是未来高时间分辨率空间遥感的发展趋势。目前,由于大规模阵列探测器受到CMOS工艺的限制,不能满足空间高时间分辨率发展的要求。为了满足大规模焦平面遥感应用的要求,提出了一种大规模阵列焦平面机械的拼接方法。该方法采用精密压电陶瓷电机,完成探测器焦平面的微米量级位置调整,并通过激光测距仪测量以及计算机平面拟合来确定探测器焦平面的空间位置,进而实现了大规模非连续CMOS焦平面阵列的机械式拼接。     

320×256 GaAs/AlGaAs长波红外量子阱焦平面探测器

量子阱红外探测器(Quantum well infrared photodetector, QWIP)已经经历了20多年的深入研究,各种QWIP器件,包括量子阱红外探测器焦平面阵列(FPA)的研制也已经相当成熟。但是在国内,受制于整体工业水平, QWIP焦平面阵列器件的研制仍然处于起步阶段。研制了基于GaAs/ AlxGa1-xAs 材料、峰值响应波长为9.9 m的长波320256 n型QWIP焦平面阵列器件,其像元中心距25 m, 光敏元面积为22 m22 m。GaAs衬底减薄后的QWIP焦平面阵列,与Si基CMOS读出电路(ROIC)通过铟柱倒焊互连,并且在65 K工作温度下进行了室温环境目标成像。该焦平面器件的规模和成像质量相比之前国内报道的结果都有较大提高。焦平面平均峰值探测率达1.51010 cmHz1/2/W。     

美国研制热电制冷短波长波双波段红外量子点光电探测器

目前,大部分短波红外和长波红外多光谱相机系统都是依靠不同的传感器进行各自波段的探测的。短波红外波段和长波红外波段一般分别采用InGaAs探测器和微测辐射热计探测器。这种双焦平面阵列结构中的两个焦平面必须并排     

以色列研制出用于中波红外成像的兆像元数字InSb探测器

自从20世纪90年代后期以来,以色列半导体器件公司研制并制造了各种各样的InSb二维焦平面阵列。这些焦平面阵列既有模拟形式的,也有数字形式的,其规格包括320×256、480×384和640×512等,各规格阵列的像元间距从15μm到30μm不等。它们已被用于许多红外系统及应用领域。为了满足人们对甚高分辨率中波红外探测器和系统的需要,该公司目前已研制出了一种像元数为1280×1024、像元尺寸为15μm的大规模二维InSb探     

美国弹道导弹防御系统的红外系统与技术的发展

红外传感器是弹道导弹防御系统可靠监视、探测、识别、瞄准与拦截目标的关键。过去二十几年中,美国的弹道导弹防御系统逐渐从构想成为现实,其中一个重要原因就是由于红外焦平面阵列技术的迅速发展,用于弹道导弹防御的红外传感器取得了突破性的进展。目前用于弹道导弹防御系统的红外传感器和动能拦截器红外导引头已从过去的基于红外探测器线列或较小规模的红外焦平面阵列(64×64)的系统发展到基于较大规模的凝视红外焦平面阵列的系统,红外传感器与拦截器红外导引头的性能有了很大的提高。但由于弹道导弹防御本身的复杂性,目前的导弹防御系统仅是初步的,为此,美国还在继续发展完善其弹道导弹防御系统,包括进一步发展更先进的红外焦平面阵列,改进红外探测跟踪系统与动能拦截弹红外导引头。综述了美国弹道导弹防御系统中红外系统与技术的发展现状与趋势。     

High-quality large-area MBE HgCdTe/Si

HgCdTe offers significant advantages over other similar semiconductors, which has made it the most widely utilized variable-gap material in infrared (IR) focal plane array (FPA) technology. HgCdTe hybrid FPAs consisting of two-dimensional detector arrays that are hybridized to Si readout circuits (ROIC) are the dominant technology for second-generation infrared systems. However, one of the main limitations of the HgCdTe materials system has been the size of lattice-matched bulk CdZnTe substrates, used for epitaxially grown HgCdTe, which have been limited to 30 cm² in production. This size limitation does not adequately support the increasing demand for larger FPA formats which now require sizes up to 2048×2048, and only a single die can be printed per wafer. Heteroepitaxial Si-based substrates offer a cost-effective technology that can be scaled to large wafer sizes and further offer a thermal-expansion-matched hybrid structure that is suitable for large format FPAs. This paper presents data on molecular-beam epitaxy (MBE)-grown HgCdTe/Si wafers with much improved materials characteristics than previously reported. We will present data on 4- and 6-in diameter HgCdTe both with extremely uniform composition and extremely low defects. Large-diameter HgCdTe/Si with nearly perfect compositional uniformity and ultra low defect density is essential for meeting the demanding specifications of large format FPAs.     

Inductively coupled plasma etching for large format HgCdTe focal plane array fabrication

Inductively coupled plasma (ICP) using hydrogen-based gas chemistry has been developed to meet requirements for deep HgCdTe mesa etching and shallow CdTe passivation etching in large format HgCdTe infrared focal plane array (FPA) fabrication. Large format 2048×2048, 20-μm unit-cell short wavelength infrared (SWIR) and 2560×512, 25-μm unit-cell midwavelength infrared (MWIR) double-layer heterojunction (DLHJ) p-on-n HgCdTe FPAs fabricated using ICP processing exhibit >99% pixel operability. The HgCdTe FPAs are grown by molecular beam epitaxy (MBE) on Si substrates with suitable buffer layers. Midwavelength infrared detectors fabricated from 4-in. MBE-grown HgCdTe/Si substrates using ICP for mesa delineation and CdTe passivation etching demonstrate measured spectral characteristics, RoA product, and quantum efficiency comparable to detectors fabricated using wet chemical processes. Mechanical samples prepared to examine physical characteristics of ICP reveal plasma with high energy and low ion angle distribution, which is necessary for fine definition, high-aspect ratio mesa etching with accurate replication of photolithographic mask dimensions.     

640×486 long-wavelength two-color GaAs/AlGaAs quantum wellinfrared photodetector (QWIP) focal plane array camera

We have designed and fabricated an optimized long-wavelength/very-long wavelength two-color quantum well infrared photodetector (QWIP) device structure. The device structure was grown on a 3-in semi-insulating GaAs substrate by molecular beam epitaxy (MBE). The wafer was processed into several 640×486 format monolithically integrated 8-9 and 14-15 μm two-color (or dual wavelength) QWIP focal plane arrays (FPAs). These FPAs were then hybridized to 640×486 silicon CMOS readout multiplexers. A thinned (i.e., substrate removed) FPA hybrid was integrated into a liquid helium cooled dewar for electrical and optical characterization and to demonstrate simultaneous two-color imagery. The 8-9 μm detectors in the FPA have shown background limited performance (BLIP) at 70 K operating temperature for 300 K background with f/2 cold stop. The 14-15 μm detectors of the FPA reaches BLIP at 40 K operating temperature under the same background conditions. In this paper we discuss the performance of this long-wavelength dualband QWIP FPA in terms of quantum efficiency, detectivity, noise equivalent temperature difference (NEΔT), uniformity, and operability     

Fabrication of high-performance large-format MWIR focal plane arrays from MBE-grown HgCdTe on 4″ silicon substrates

We have developed the capability to grow HgCdTe mid-wave infrared radiation double-layer heterojunctions (MWIR DLHJs) on 4″ Si wafers by molecular beam epitaxy (MBE), and fabricate devices from these wafers that are comparable to those produced by mature technologies. Test data show that the detectors, which range in cutoff wavelength over 4–7 μm, are comparable to the trendline performance of liquid phase epitaxy (LPE)-grown material. The spectral characteristics are similar, with a slight decrease in quantum efficiency attributable to the Si substrate. With respect to R₀A, the HgCdTe/Si devices are closer to the theoretical radiative-limit than LPE-grown detectors. Known defect densities in the material have been correlated to device performance through a simple model. Slight 1/f noise increases were measured in comparison to the LPE material, but the observed levels are not sufficient to significantly degrade focal plane array (FPA) performance. In addition to discrete detectors, two FPA formats were fabricated. 128×128 FPAs show MWIR sensitivity comparable to mature InSb technology, with pixel operability values in excess of 99%. A 640×480 FPA further demonstrates the high-sensitivity and high-operability capabilities of this material.     

Large Format AlInAs–InGaAs Quantum-Well Infrared Photodetector Focal Plane Array For Midwavelength Infrared Thermal Imaging

We report the first large format (640times512) AlInAs-InGaAs quantum-well infrared photodetector (QWIP) focal plane array (FPA), and investigate the characteristics of AlInAs-InGaAs QWIPs both at pixel and FPA level. The measurements on the detectors fabricated with molecular beam epitaxy grown epilayer structure including 30 InGaAs quantum wells (26 Aring thick, N_D=2times10¹⁸ cm^-3) yielded very promising characteristics. The detectors with lambda_p=4.2 mum and Deltalambda/lambda_p=25% displayed a background-limited performance temperature as high as 105 K with f/2 aperture. The noise equivalent temperature difference of the FPA is as low as 23 mK (f/1.5) at 105-K sensor temperature with 99.6% operability. These results are comparable to the best results reported for AlGaAs-InGaAs midwavelength infrared QWIPs showing the promise of this material system for completely lattice-matched multiband QWIP FPAs.     

Performance of molecular-beam epitaxy-grown midwave infrared HgCdTe detectors on four-inch Si substrates and the impact of defects

We are continuing development of the growth of midwave infrared (MWIR) HgCdTe by molecular-beam epitaxy (MBE) on 4-in. Si substrates and the fabrication of state-of-the-art detectors and focal plane arrays (FPAs). Array formats of up to 2048 × 2048 and unit cells as small as 20 μm have been made. We regularly measure response operability values in excess of 99% on these arrays. These values typically exceed expectations, with the number of outages corresponding to as-grown defect densities four times lower than what we measure. We have investigated this operability discrepancy and now can account for it. Comparisons of measured properties were used to establish trends between defect occurrence and pixel operability. These correlations show that a combination of defect removal and low-impact defects provide the explanation. Having this knowledge will allow for better operability predictions and assist in efforts to reduce defect impact on FPA performance.     

短波红外InGaAs焦平面研究进展

围绕新一代遥感探测仪器应用需求,中国科学院上海技术物理研究所在短波红外InGaAs焦平面探测器领域取得了一系列进展.通过低缺陷外延材料、焦平面芯片制备工艺和低噪声读出电路技术研究,研制实现了最大规模达2560×2048元的10μm中心距1～1.7μm InGaAs焦平面探测器,峰值探测率优于1.0×1013 cmHz1...     

论红外焦平面器件的串音

红外探测系统通常需要将探测器密集排列以增加它们的空间分辨率。在焦平面阵列中,当投射到某一特定探测器光敏面上的红外光子在另一个探测器中产生信号时,这种现象称为串音。串音可能会影响焦平面阵列的分辨率性能。在高性能光伏阵列中,串音的主要成分是光生载流子在焦平面阵列的相邻探测器之间的横向扩散。从基本概念入手,介绍了相关串音研究的发展情况以及对串音问题的理解和体会。     

利用LBIC技术对InGaAs平面结器件结区特性的研究

室温铟镓砷(InGaAs)焦平面技术在航天工业上的应用越来越广泛，铟镓砷(InGaAs)焦平面列阵中探测器的尺寸正不断减小，这使得常规工艺形成的光伏探测器，其有效光敏元面积扩大的问题越来越突出。本文利用激光诱导电流检测(LBIC)系统测试了平面结InGaAs(PIN)探测器芯片的光敏元，证实了有效光敏面扩大的存在。从实验结果看，掺杂离子的横向扩散和结区的侧向收集效应，是平面工艺形成的光伏器件光敏元面积扩大的主要因素，并利用得到的实验数据拟合求出了器件少子的扩散长度。     

Physical structure of molecular-beam epitaxy growth defects in HgCdTe and their impact on two-color detector performance

The flexible nature of molecular-beam epitaxy (MBE) growth is beneficial for HgCdTe infrared-detector design and allows for tailored growths at lower costs and larger focal-plane array (FPA) formats. Control of growth dynamics gives the MBE process a distinct advantage in the production of multicolor devices, although opportunities for device improvement still exist. Growth defects can inhibit pixel performance and reduce the operability in FPAs, so it is important to understand and evaluate their properties and impact on detector performance. The object of this paper is to understand and correlate the effects of macrodefects on two-color detector performance. We observed the location of single-crystal and polycrystalline regions on planar and cross-sectioned surfaces of two-color device structures when void defects were viewed by scanning electron microscopy (SEM). Compositional analysis via energy dispersive x-ray analysis (EDXA) of voids in the cross section showed elevated Te and reduced Hg when compared to defect-free growth areas. The second portion of this study examined the correlation of macrodefects with pixel operability and diode current-voltage (I–V) characteristics in mid-wavelength infrared (MWIR)/MWIR (M/M) and long wavelength infrared (LWIR)/LWIR (L/L) two-color devices. The probability of diode failure when a void is present is 98% for M/M and 100% for L/L. Voids in two-color detectors also impact diodes neighboring their location; the impact is higher for L/L detectors than M/M detectors. All void-containing diodes showed early breakdown in the I–V characteristics in one or both bands. High dislocation densities were observed surrounding voids; the high density spread further from the void for L/L detectors compared to M/M detectors.