共查询到19条相似文献,搜索用时 149 毫秒
1.
微小型化是红外焦平面探测器发展的必然趋势,微小型化将使目前焦平面阵列存在的占空比小、光能利用率低的问题体现的更加明显,针对这一状况,提出一种利用分子间引力的光胶技术将矩形孔径球面微透镜阵列集成于红外焦平面之中。采用几何光学理论分析了微透镜阵列的聚能效应,设计并制作"栅线"和"方孔"双对准标记,采用衍射光栅同轴对准方法使两种器件的对准精度达到0.1μm。对集成前后红外焦平面阵列性能进行测试,发现响应率提高了近40%,探测率提高了约20%,红外焦平面的噪声从758.89μV下降到668.23μV。最终得到结论:光胶法用于两种器件的集成具有耐温性好、变形小、强度高等优点,集成后红外焦平面的探测性能显著提高,有利于探测器微小型化发展。 相似文献
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针对红外焦平面阵列自身存在的占空比小、光能利用率低的问题,提出利用光胶技术将方形孔径球面微透镜阵列与红外焦平面集成。从理论角度分析了微透镜阵列集成的聚能效应。设计"栅线"和"十字"双对准标记,采用衍射光栅同轴对准方法实现器件的对准。经过对集成前后红外焦平面性能进行对比,发现响应率提高了近40%,探测率提高了约20%,红外焦平面的噪声从758.89μV下降到668.23μV。最终得到结论:光胶法用于两种器件的集成具有耐温性好、变形小、强度高等优点,集成后红外焦平面的探测性能显著提高,有利于探测器微小型化发展。 相似文献
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基于标量衍射理论设计了8位相菲涅尔衍射微透镜阵列.利用多次曝光和离子束刻蚀技术在大规模面阵(256×256)PtSi红外焦平面阵列的背面制作了单片集成微透镜阵列样品(单元面积为30μm×40μm).测试结果表明,单片集成微透镜的红外焦平面阵列样品的信噪比提高了2.0倍. 相似文献
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基于标量衍射理论设计了8位相菲涅尔衍射微透镜阵列.利用多次曝光和离子束刻蚀技术在大规模面阵(256×256)PtSi红外焦平面阵列的背面制作了单片集成微透镜阵列样品(单元面积为30μm×40μm).测试结果表明,单片集成微透镜的红外焦平面阵列样品的信噪比提高了2.0倍. 相似文献
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提出了一种新的曲率补偿法用于长焦距微透镜阵列的制作.扫描电子显微镜(SEM)显示微透镜阵列为表面极为平缓的方底拱形阵列,表面探针测试结果显示用曲率补偿法制作的微透镜的焦距可达到3861.70μm,而常规光刻热熔法很难制作出焦距超过200μm的相同尺寸的微透镜阵列.微透镜阵列器件与红外焦平面阵列器件在红外显微镜下对准胶合,显著改善了红外焦平面阵列器件的响应特性. 相似文献
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提出了一种新的曲率补偿法用于长焦距微透镜阵列的制作。扫描电子显微镜(SEM)显示微透镜阵列为表面极为平缓的方底拱形阵列,表面探针测试结果显示用曲率补偿法制作的微透镜的焦距可达到3861.70um,而常规光刻热熔法很难制作出焦距超过200um的相同尺寸的微透镜阵列。微透镜阵列器件与红外焦平面阵列器件在红外显微镜下对准胶合,显著改善了红外焦平面阵列器件的响应特性。 相似文献
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提出了一种新的曲率补偿法用于长焦距微透镜阵列的制作。扫描电子显微镜 ( SEM)显示微透镜阵列为表面极为平缓的方底拱形阵列 ,表面探针测试结果显示用曲率补偿法制作的微透镜的焦距可达到 3 861.70 μm,而常规光刻热熔法很难制作出焦距超过 2 0 0μm的相同尺寸的微透镜阵列。微透镜阵列器件与红外焦平面阵列器件在红外显微镜下对准胶合 ,显著改善了红外焦平面阵列器件的响应特性 相似文献
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256×256 Si微透镜阵列与红外焦平面阵列单片集成研究 总被引:1,自引:0,他引:1
基于标量衍射理论设计了 8位相菲涅尔衍射微透镜阵列 .利用多次曝光和离子束刻蚀技术在大规模面阵( 2 5 6× 2 5 6) Pt Si红外焦平面阵列的背面制作了单片集成微透镜阵列样品 (单元面积为 3 0μm× 4 0μm ) .测试结果表明 ,单片集成微透镜的红外焦平面阵列样品的信噪比提高了 2 .0倍 . 相似文献
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Diffractive 11-phase-level Si microlens arrays are fabricated by a special method, i.e. part-etching. The method can increase focal length of diffractive microlens arrays. By using this method, the microlens arrays on the back side of the Si substrate and PtSi IR focal plane arrays(FPAs) on the front side of the same wafer are monolithically integrated together. The IR response characteristics of the integrated devices are improved greatly. 相似文献
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Yi Li Xinjian Yi Liping Cai 《Journal of Infrared, Millimeter and Terahertz Waves》2000,21(9):1417-1425
Diffractive microlens arrays can completely collect the light at the focal plane and concentrate it into a smaller spot size on the detector plane, the photodetector area can be substantially reduced. Increased gamma radiation hardening and noise reduction result from the decrease in photodetector sensitive area. The diffractive microlens arrays have been designed by considering the correlative optical and processing parameters for PtSi focal plane array. They have been fabricated on the backside of PtSi focal plane array chip by successive photolithography and Ar+ ion-beam-etching technique. The alignment of microlens array with PtSi focal plane array was completed by a backside aligner with IR light source. The practical processes and fabrication method are discussed. The performance parameters of PtSi FPA with diffractive microlens array are presented. 相似文献
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为研究铟镓砷焦平面的噪声特性,设计了两种不同吸收层掺杂浓度的InGaAs外延材料,采用标准工艺制备了平面型160×128元光敏芯片,并与相同结构的读出电路倒焊耦合形成160×128元焦平面,采用改变积分时间和改变器件温度的方法,测试焦平面的信号与噪声.通过研究不同材料参数、器件性能与焦平面噪声的关系,定量分析了短波红外InGaAs焦平面的噪声特性.结果表明,焦平面噪声主要来源于焦平面耦合噪声和探测器噪声,降低InGaAs外延材料吸收层的掺杂浓度,可以有效降低探测器电容,从而降低焦平面的耦合噪声;而探测器噪声由探测器暗电流和工作温度影响,该噪声在长积分时间下决定了焦平面的总噪声水平.实现低暗电流、低电容特性的光敏芯片是降低焦平面噪声的有效途径. 相似文献
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Ashok K. Sood James E. Egerton Yash R. Puri Enrico Bellotti Donald D’Orsogna Latika Becker Raymond Balcerak Ken Freyvogel Robert Richwine 《Journal of Electronic Materials》2005,34(6):909-912
Multicolor infrared (IR) focal planes are required for high-performance sensor applications. These sensors will require multicolor
focal plane arrays (FPAs) that will cover various wavelengths of interest in mid wavelength infrared/long wavelength infrared
(MWIR/LWIR) and long wavelength infrared/very long wavelength infrared (LWIR/VLWIR) bands. There has been significant progress
in HgCdTe detector technology for multicolor MWIR/LWIR and LWIR/VLWIR FPAs.1–3 Two-color IR FPAs eliminate the complexity of multiple single-color IR FPAs and provide a significant reduction of weight
and power in simpler, reliable, and affordable systems. The complexity of a multicolor IR detector MWIR/LWIR makes the device
optimization by trial and error not only impractical but also merely impossible. Too many different geometrical and physical
variables need to be considered at the same time. Additionally, material characteristics are only relatively controllable
and depend on the process repeatability. In this context, the ability of performing “simulation experiments” where only one
or a few parameters are carefully controlled is paramount for a quantum improvement of a new generation of multicolor detectors
for various applications. 相似文献
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S. Velicu T. S. Lee C. H. Grein P. Boieriu Y. P. Chen N. K. Dhar J. Dinan D. Lianos 《Journal of Electronic Materials》2005,34(6):820-831
The cost and performance of hybrid HgCdTe infrared (IR) focal plane arrays are constrained by the necessity of fabricating
the detector arrays on a CdZnTe substrate. These substrates are expensive, fragile, available only in small rectangular formats,
and are not a good thermal expansion match to the silicon readout integrated circuit. We discuss in this paper an IR sensor
technology based on monolithically integrated IR focal plane arrays that could replace the conventional hybrid focal plane
array technology. We have investigated the critical issues related to the growth of HgCdTe on Si read-out integrated circuits
and the fabrication of monolithic focal plane arrays: (1) the design of Si read-out integrated circuits and focal plane array
layouts; (2) the low-temperature cleaning of Si(001) wafers; (3) the growth of CdTe and HgCdTe layers on read-out integrated
circuits; (4) diode creation, delineation, electrical, and interconnection; and (4) demonstration of high yield photovoltaic
operation without limitation from earlier preprocessing such as substrate cleaning, molecular beam epitaxy (MBE) growth, and
device fabrication. Crystallographic, optical, and electrical properties of the grown layers will be presented. Electrical
properties for diodes fabricated on misoriented Si and readout integrated circuit (ROIC) substrates will be discussed. The
fabrication of arrays with demonstrated I–V properties show that monolithic integration of HgCdTe-based IR focal plane arrays
on Si read-out integrated circuits is feasible and could be implemented in the third generation of IR systems. 相似文献
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Sihai Chen Xinjian Yi Hongchen Wang Luqin Liu Yingrui Wang 《Journal of Infrared, Millimeter and Terahertz Waves》2002,23(5):705-710
Monolithic integration method has been demonstrated to increase the fill factor of the infrared focal plane arrays (IRFPA). Which is consists of 256×256 Pt-Si schottky barrier charge coupled devices(CCD) operation in 3-5μm IR region. The relative silicon 256×256 element diffractive microlens arrays have been fabricated on the back side of the substrate of the IRFPA using binary optics technology. The aligning process between IRFPA and microlens arrays on each side of the substrate has been completed by IR mask aligner. The testing results show that the imaging quality is very good and the average optical response of the IR FPA is increased by a factor of 3.0, which is improved by about 25% compared with the hybrid integration method in the previous work. 相似文献
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硅化铂红外焦平面探测器具有响应光谱宽、规模大、均匀性好、时间稳定性高、制造成本低等优点,在多/宽光谱成像、激光探测、天文观测、医疗检测等领域具有应用潜力,但NETD 100 mK 的灵敏度对其广泛应用有一定的限制。文中从该探测器的量子效率和填充因子两方面总结和分析了国内外的改进技术,重点分析了光腔结构、多孔硅结构、重掺杂P+和合适硅化铂膜厚提高量子效率的机理,并定量比较了提升幅度:多孔硅结构提升幅度最大,在波长4 m 处的量子效率可达27%;相比内线转移CCD,电荷扫描器件、曲流沟道CCD 和混合读出结构均能改善填充因子,其中混合读出结构的填充因子可提高为80%。微透镜列阵能将填充因子提高到85%以上。 相似文献
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M. F. Vilela A. A. Buell M. D. Newton G. M. Venzor A. C. Childs J. M. Peterson J. J. Franklin R. E. Bornfreund W. A. Radford S. M. Johnson 《Journal of Electronic Materials》2005,34(6):898-904
Middle wave infrared (MWIR) HgCdTe p-on-n double-layer heterojunctions (DLHJs) for infrared detector applications have been
grown on 100-mm Si (112) substrates by molecular beam epitaxy (MBE) for large format 2,560×512 focal plane arrays (FPAs).
In order to meet the performance requirements needed for these FPAs, cutoff and doping uniformity across the 100-mm wafer
are crucial. Reflection high-energy electron diffraction (RHEED), secondary ion mass spectrometry (SIMS), Fourier transform
infrared spectrometry (FTIR), x-ray, and etch pit density (EPD) were monitored to assess the reproducibility, uniformity,
and quality of detector material grown. Material properties demonstrated include x-ray full width half maximum (FWHM) as low
as 64 arc-sec, typical etch pit densities in mid-106 cm−2, cutoff uniformity below 5% across the full wafer, and typical density of macrodefects <1000 cm−2. The detector quality was established by using test structure arrays (TSAs), which include miniarray diodes with the similar
pitch as the detector array for easy measurement of critical parameters such as diode I-V characteristics and detector quantum
efficiency. Typical I-V curves show excellent R0A products and strong reverse breakdown characteristics. Detector quantum efficiency was measured to be in the 60–70% range
without an antireflection coating. 相似文献
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High-quality large-area MBE HgCdTe/Si 总被引:2,自引:0,他引:2
J. M. Peterson J. A. Franklin M. Reddy S. M. Johnson E. Smith W. A. Radford I. Kasai 《Journal of Electronic Materials》2006,35(6):1283-1286
HgCdTe offers significant advantages over other similar semiconductors, which has made it the most widely utilized variable-gap
material in infrared (IR) focal plane array (FPA) technology. HgCdTe hybrid FPAs consisting of two-dimensional detector arrays
that are hybridized to Si readout circuits (ROIC) are the dominant technology for second-generation infrared systems. However,
one of the main limitations of the HgCdTe materials system has been the size of lattice-matched bulk CdZnTe substrates, used
for epitaxially grown HgCdTe, which have been limited to 30 cm2 in production. This size limitation does not adequately support the increasing demand for larger FPA formats which now require
sizes up to 2048×2048, and only a single die can be printed per wafer. Heteroepitaxial Si-based substrates offer a cost-effective
technology that can be scaled to large wafer sizes and further offer a thermal-expansion-matched hybrid structure that is
suitable for large format FPAs. This paper presents data on molecular-beam epitaxy (MBE)-grown HgCdTe/Si wafers with much
improved materials characteristics than previously reported. We will present data on 4- and 6-in diameter HgCdTe both with
extremely uniform composition and extremely low defects. Large-diameter HgCdTe/Si with nearly perfect compositional uniformity
and ultra low defect density is essential for meeting the demanding specifications of large format FPAs. 相似文献