The influence of annealing temperatures on the properties of Bi2VO5.5/LaNiO3/Si thin films

Bi₂VO_5.5 ferroelectric thin films were fabricated on LaNiO₃/Si(100) substrate via chemical solution deposition. Ferroelectric and dielectric properties of the thin films annealed at 500-700 °C were studied. The thin film annealed at 700 °C exhibited more favorable ferroelectric and dielectric properties than those annealed at lower temperatures. The values of remnant polarization 2P_r and coercive field E_c for the film annealed at 700 °C are 10.62 µC/cm² and 106.3 kV/cm, respectively. The leakage current of the film is about 1.92 × 10^− 8 A/cm² at 6 V. The possible mechanism of the dependence of electrical properties of the films on the annealing temperature was discussed.     

Dielectric and ferroelectric properties of Ba(Sn0.15Ti0.85)O3 thin films grown by a sol-gel process

Ferroelectric Ba(Sn_0.15Ti_0.85)O₃ (BTS) thin films were deposited on LaNiO₃-coated silicon substrates via a sol-gel process. Films showed a strong (1 0 0) preferred orientation depending upon annealing temperature and concentration of the precursor solution. The dependence of dielectric and ferroelectric properties on film orientation has been studied. The leakage current density of thin films at 100 kV/cm was 7 × 10⁻⁷ A/cm² and 5 × 10⁻⁵ A/cm² and their capacitor tunability was 54 and 25% at an applied field of 200 kV/cm (measurement frequency of 1 MHz) for the thin films deposited with 0.1 and 0.4 M spin-on solution, respectively. This work clearly reveals the highly promising potential of BTS compared with BST films for application in tunable microwave devices.     

Influence of annealing treatments for ZnO-doped Zr0.8Sn0.2TiO4 thin films by RF magnetron sputtering

Zirconium tin titanium oxide doped 1 wt.% ZnO thin films on n-type Si substrate were deposited by rf magnetron sputtering at a fixed rf power of 300 W, a substrate temperature of 450 °C, a deposition pressure of 5 mTorr and an Ar/O₂ ratio of 100/0 with various annealing temperatures and annealing times. Electrical properties and microstructures of 1 wt.% ZnO-doped (Zr_0.8Sn_0.2)TiO₄ thin films prepared by rf magnetron sputtering on n-type Si(100) substrates at different annealing temperatures (500 °C-700 °C) and annealing times (2 h-6 h) have been investigated. The structural and morphological characteristics analyzed by X-ray diffraction (XRD) and atomic force microscope (AFM) were sensitive to the treatment conditions such as annealing temperature and annealing time. At an annealing temperature of 600 °C and an annealing time of 6 h, the ZnO-doped (Zr_0.8Sn_0.2)TiO₄ thin films possess a dielectric constant of 46 (at f = 10 MHz), a dissipation factor of 0.059 (at f = 10 MHz), and a low leakage current density of 3.8 × 10^− 9 A/cm² at an electrical field of 1 kV/cm.     

Interfacial characteristics and dielectric properties of Ba0.65Sr0.35TiO3 thin films

Ba_0.65Sr_0.35TiO₃ (BST) thin films were deposited on Pt/Ti/SiO₂/Si substrates by radio frequency magnetron sputtering technique. X-ray photoelectron spectroscopy (XPS) depth profiling data show that each element component of the BST film possesses a uniform distribution from the outermost surface to subsurface, but obvious Ti-rich is present to BST/Pt interface because Ti⁴⁺ cations are partially reduced to form amorphous oxides such as TiO_x (x < 2). Based on the measurement of XPS valence band spectrum, an energy band diagram in the vicinity of BST/Pt interface is proposed. Dielectric property measurements at 1 MHz reveal that dielectric constant and loss tangent are 323 and 0.0095 with no bias, while 260 and 0.0284 with direct current bias of 25 V; furthermore, tunability and figure of merit are calculated to be 19.51% and 20.54, respectively. The leakage current density through the BST film is about 8.96 × 10^− 7 A/cm² at 1.23 V and lower than 5.66 × 10^− 6 A/cm² at 2.05 V as well as breakdown strength is above 3.01 × 10⁵ V/cm.     

Structural and electrical properties of BiFeO3 thin films by solution deposition and microwave annealing

Lead-free polycrystalline BiFeO₃ (BFO) thin films were developed using a chemical solution deposition method to deposit the films and the multi-mode 2.45 GHz microwave furnace to optimize the annealing condition of the films. Phase-pure BFO films were obtained at 500 °C-600 °C for 1-5 min with a heating rate of 10 °C/min. The film by microwave annealing (MW) at 550 °C for 5 min exhibited a (012)-preferred orientation with a dense morphology of grain size ~ 294 nm. Its dielectric constant of 96.2, low leakage current density of 2.466 × 10^− 6 A/cm², polarization (2P_r) and coercive field (2E_c) of 0.931 μC/cm² and 57.37 kV/cm, respectively, were improved compared to those by conventional annealing (CA) at the same annealing conditions.     

Structure and ferroelectric properties of barium titanate films synthesized by sol–gel method

The barium strontium titanate (Ba_0.7Sr_0.3TiO₃, BST) thin films were synthesized by a sol–gel technique on a silicon nanoporous pillar array (Si-NPA) substrate. SEM observation reveals that the as-prepared BST thin film has uniformly covered the inherited pillar-like surface of the Si-NPA substrate. X-ray diffraction analysis indicates that the perovskite phase was able to be generated in the BST film when the annealing temperature was higher than 600 °C. The remnant polarization (Pr) and coercive field (Ec) values were also found to increase with the annealing temperature, with the maxima of 4.57 μC cm⁻² for Pr and 7.61 kV mm⁻¹ for Ec at 800 °C, respectively. The measurement of leakage current density against voltage applied suggested that the BST films are excellent insulators along with fair resistance to breakdown, and the mechanism of leakage current was discussed.     

Enhanced ferroelectric properties of Mg doped (Ba,Sr)TiO3 thick films grown on (001) SrTiO3 substrates

Highly (001)-oriented 1 mol% Mg doped (Ba_0.67,Sr_0.33)TiO₃ (BST) films with a thickness of 1.25 μm were grown on (110) SrRuO₃/(001) SrTiO₃ substrates by pulsed laser deposition. X-ray diffraction measurements reveal that the BST thick films have very high crystalline quality, and have a distorted lattice with a large tetragonality a/c = 1.012. The BST thick films have a remanent polarization (P_r) value as large as 10.1 μC/cm² and a coercive electric field (E_c) value of 65.0 kV/cm. The films possess dielectric constant and loss values of ε_r = 385.36 and tgδ = 0.038 at 1 kHz and room temperature. The leakage currents of the films are on the order of 10^− 5 A/cm² at ± 150 kV/cm. The mechanism for enhancing electric properties of the Mg doped BST films was also discussed.     

Properties of atomic-vapor and atomic-layer deposited Sr, Ti, and Nb doped Ta2O5 Metal-Insulator-Metal capacitors

Atomic Vapor Deposition and Atomic Layer Deposition techniques were applied for the depositions of Ta₂O₅, Ti-Ta-O, Sr-Ta-O and Nb-Ta-O oxide films for Metal-Insulator-Metal (MIM) capacitors used in back-end of line for Radio Frequency applications. Structural and electrical properties were studied. Films, deposited on the TiN bottom electrodes, in the temperature range of 225-400 °C, were amorphous, whereas the post deposition annealing at 600 °C resulted in the crystallization of Nb-Ta-O films. Electrical properties of MIM structures, investigated after sputtering Au top electrodes, revealed that the main characteristics were different for each oxide. On one hand, Ti-Ta-O based MIM capacitors possessed the highest dielectric constant (50), but the leakages currents were also the highest (~ 10^− 5 A/cm² at − 2 V). On the other hand, Sr-Ta-O showed the lowest leakage current densities (~ 10^− 9 A/cm² at − 2 V) as well as the smallest capacitance-voltage nonlinearity coefficients (40 ppm/V²), but the dielectric constant was the smallest (20). The highest nonlinearity coefficients (290 ppm/V²) were observed for Nb-Ta-O based MIM capacitors, although relatively high dielectric constant (40) and low leakage currents (~ 10^− 7 A/cm² at − 2 V) were measured. Temperature dependent leakage-voltage measurements revealed that only Sr-Ta-O showed no dependence of leakage current as a function of the measurement temperature.     

Zinc oxide thin film transistors using MgO-Bi1.5Zn1.0Nb1.5O7 composite gate insulator on glass substrate

We report on high mobility ZnO thin film transistors (TFTs) (< 5 V), utilizing a room temperature grown MgO-Bi_1.5Zn_1.0Nb_1.5O₇ (BZN) composite gate insulator on a glass substrate. 30 mol% MgO added BZN composite gate insulators exhibited greatly enhanced leakage current characteristics (~< 2 × 10^− 8 A/cm² at 0.3 MV/cm) due to the high breakdown strength of MgO, while retaining an appropriate high-k dielectric constant of 32. The ZnO-TFTs with MgO-BZN composite gate insulators showed a high field-effect mobility of 37.2 cm²/Vs, a reasonable on-off ratio of 1.54 × 10⁵, a subthreshold swing of 460 mV/dec, and a low threshold voltage of 1.7 V.     

Composition, surface morphology and electrical characteristics of Al2O3-TiO2 nanolaminates and AlTiO films on silicon

We propose and demonstrate Metal-Oxide-Semiconductor structures comprising Al₂O₃-TiO₂ nanolaminate and AlTiO films. Composition, structural and electrical characteristics were studied in detail and compared to TiO₂ thin film-based structures. All dielectric films were evaporated using an electron beam gun (EBG) system on unheated p-Si substrate without adding O₂. MOS structures were investigated in detail before and after annealing at up to 950 °C in O₂ and N₂ + O₂ environments. The nanolaminate films remain in an amorphous state after annealing at 950 °C. The smallest quantum mechanical corrected equivalent oxide thickness measured was ∼1.37 nm. A large reduction of the leakage current density to 1.8 × 10^− 8 A/cm² at an electric field of 2 MV/cm was achieved by the annealing process.     

Characterization and optoelectronic properties of sol-gel-derived CuFeO2 thin films

In this study, CuFeO₂ thin films were deposited onto quartz substrates using a sol-gel and a two-step annealing process. The sol-gel-derived films were annealed at 500 °C for 1 h in air and then annealed at 600 to 800 °C for 2 h in N₂. X-ray diffraction patterns showed that the annealed sol-gel-derived films were CuO and CuFe₂O₄ phases in air annealing. When the films were annealed at 600 °C in N₂, an additional CuFeO₂ phase was detected. As the annealing temperature increased above 650 °C in N₂, a single CuFeO₂ phase was obtained. The binding energies of Cu-2p_3/2, Fe-2p_3/2, and O-1s were 932.5 ± 0.1 eV, 710.3 ± 0.2 eV and 530.0 ± 0.1 eV for CuFeO₂ thin films. The chemical composition of CuFeO₂ thin films was close to its stoichiometry, which was determined by X-ray photoelectron spectroscopy. Thermodynamic calculations can explain the formation of the CuFeO₂ phase in this study. The optical bandgap of the CuFeO₂ thin films was 3.05 eV, which is invariant with the annealing temperature in N₂. The p-type characteristics of CuFeO₂ thin films were confirmed by positive Hall coefficients and Seebeck coefficients. The electrical conductivities of CuFeO₂ thin films were 0.28 S cm^− 1 and 0.36 S cm^− 1 during annealing at 650 °C and 700 °C, respectively, in N₂. The corresponding carrier concentrations were 1.2 × 10¹⁸ cm^− 3 (650 °C) and 5.3 × 10¹⁸ cm^− 3 (700 °C). The activation energies for hole conduction were 140 meV (650 °C) and 110 meV (700 °C). These results demonstrate that sol-gel processing is a feasible preparation method for delafossite CuFeO₂ thin films.     

Lead-free piezoelectric thin films of Mn-doped NaNbO3-BaTiO3 fabricated by chemical solution deposition

Lead-free piezoelectric thin films of NaNbO₃-BaTiO₃ were fabricated on Pt/TiO_x/SiO₂/Si substrates by chemical solution deposition. Perovskite NaNbO₃-BaTiO₃ single-phase thin films with improved leakage-current and ferroelectric properties were prepared at 650 °C by doping with a small amount of Mn. The 1.0 and 3.0 mol% Mn-doped 0.95NaNbO₃-0.05BaTiO₃ thin films showed slim ferroelectric P-E hysteresis and field-induced strain loops at room temperature. The 1.0 and 3.0 mol% Mn-doped 0.95NaNbO₃-0.05BaTiO₃ films showed remanent polarization values of 6.3 and 6.2 μC/cm², and coercive field of 41 and 55 kV/cm, respectively. From the slope of the field-induced strain loop, the effective piezoelectric coefficient (d₃₃) was found to be 40-60 pm/V.     

Microstructure and electrical properties of Al2O3-ZrO2 composite films for gate dielectric applications

Al₂O₃-ZrO₂ composite films were fabricated on Si by ultrahigh vacuum electron-beam coevaporation. The crystallization temperature, surface morphology, structural characteristics and electrical properties of the annealed films are investigated. Our results indicate that the amorphous and mixed structure is maintained up to an annealing temperature of 900 °C, which is much higher than that of pure ZrO₂ film, and the interfacial oxide layer thickness does not increase after annealing at 900 °C. However, a portion of the Al₂O₃-ZrO₂ film becomes polycrystalline after 1000 °C annealing and interfacial broadening is observed. Possible explanations are given to explain our observations. A dielectric constant of 20.1 is calculated from the 900 °C-annealed ZrO₂-Al₂O₃ film based on high-frequency capacitance-voltage measurements. This dielectric characteristic shows an equivalent oxide thickness (EOT) as low as 1.94 nm. An extremely low leakage current density of ∼2×10⁻⁷ A/cm² at a gate voltage of 1 V and low interface state density are also observed in the dielectric film.     

Deposition of silicon nitride thin films by hot-wire CVD at 100 °C and 250 °C

Silicon nitride thin films for use as passivation layers in solar cells and organic electronics or as gate dielectrics in thin-film transistors were deposited by the Hot-wire chemical vapor deposition technique at a high deposition rate (1-3 ?/s) and at low substrate temperature. Films were deposited using NH₃/SiH₄ flow rate ratios between 1 and 70 and substrate temperatures of 100 °C and 250 °C. For NH₃/SiH₄ ratios between 40 and 70, highly transparent (T ~ 90%), dense films (2.56-2.74 g/cm³) with good dielectric properties and refractive index between 1.93 and 2.08 were deposited on glass substrates. Etch rates in BHF of 2.7 ?/s and < 0.5 ?/s were obtained for films deposited at 100 °C and 250 °C, respectively. Films deposited at both substrate temperatures showed electrical conductivity ~ 10^− 14 Ω^− 1 cm^− 1 and breakdown fields > 10 MV cm^− 1.     

Structural, optical and electrical properties of high-k ZrO2 dielectrics on Si prepared by plasma assisted pulsed laser deposition

ZrO₂ films were grown on p-type Si(100) using plasma assisted pulsed laser deposition and the electrical characteristics of the ZrO₂ dielectrics incorporated in metal oxide silicon (MOS) capacitors were studied in combination with their structural and optical properties. The ZrO₂ dielectric layers are of polycrystalline structure with a monoclinic phase and show good interfacial properties without obvious SiO_x interface. The electrical performance of the capacitors exhibits typical MOS-type capacitance-voltage (C-V) and leakage current density-voltage (J-V) characteristics. Thermal annealing of the ZrO₂ dielectrics results in an improvement in C-V and J-V characteristics and a reduction in C-V hysteresis without obvious introduction of leakage paths for the fabricated MOS capacitors. The dielectric constant was calculated to be 15.4 and the leakage current density was measured to be 6.7 × 10^− 6 A/cm² at a gate voltage of + 1.0 V for 900 °C annealed ZrO₂ dielectric layers with an equivalent oxide thickness of 5.2 nm.     

Characteristics of laser-annealed ZnO thin film transistors

We investigated the effects of laser annealing on ZnO thin film transistors (TFTs). ZnO layers were deposited on a bottom-gate patterned Si substrate by radio-frequency sputtering at room temperature. Laser annealing of the ZnO films reduced the full width at half maximum of the ZnO (002) diffraction peak from 0.49° to 0.1°. It reveals that the crystalline quality is improved by annealing effect. A SiO₂ formed in low temperature was used as the gate dielectric. Unannealed ZnO-TFTs were operated in enhancement mode with a threshold voltage of 21.6 V. They had a field-effect mobility of 0.004 cm²/Vs and an on/off current ratio of 134. Laser annealing of the ZnO-TFTs by 200 laser pulses reduced their threshold voltage to 0.6 V and increased their field-effect mobility to 5.08 cm²/Vs. The increase of mobility is originated from the crystallization enhancement of ZnO films after laser annealing.     

Laser annealing of Pb(Zr0.52Ti0.48)O3 thin films for the pyroelectric detectors

Lead zirconate titanate (Pb(Zr_0.52Ti_0.48)O₃, PZT) thin films fabricated by magnetron sputtering technique on the Pt/Ti/SiO₂/Si substrates at room temperature, were annealed by means of CO₂ laser with resulting average substrate temperature below 500 °C. The crystal structure, surface morphology and pyroelectric properties of the PZT films before and after annealing were investigated by X-ray diffraction, atomic force microscopy, and pyroelectric measurements. The results show that the annealed PZT thin film with a laser energy density of 490 W/cm² for 25 s has a typical perovskite phase, uniform crystalline particles with a size of about 90 nm, and a high pyroelectric coefficient with 1.15 × 10^− 8 Ccm^− 2 K^− 1.     

Enhanced conductivity of pulsed laser deposited n-InGaZn6O9 films and its rectifying characteristics with p-SiC

Wide band gap InGaZn₆O₉ films of thickness ~ 350 nm were deposited on sapphire (0001) at room temperature by using the pulsed laser deposition technique. The transparent films showed the optical transmission of > 80% with the room temperature Hall mobility of ~ 10 cm²/V s and conductivity of 4 × 10² S/cm at a carrier density > 10²⁰ cm^− 3. The electrical properties as a function of deposition temperatures revealed that the conductivity and mobility almost retained up to the deposition temperature of 200 °C. The films annealed in different atmospheres suggested oxygen vacancy plays an important role in determining the electrical conductivity of the compound. Room temperature grown heterostructure of n-InGaZn₆O₉/p-SiC showed a good rectifying behavior with a leakage current density of less than 10^− 9 A/cm², current rectifying ratio of 10⁵ with a forward turn on voltage ~ 3 V, and a breakdown voltage greater than 32 V.     

Atomic Vapor Depositions of Ti-Ta-O thin films for Metal-Insulator-Metal applications

Atomic Vapor Deposition technique was applied for the depositions of Ti-Ta-O oxide films for Metal-Insulator-Metal capacitors used in back-end of line for Radio Frequency applications. Composition, crystallinity, thermal stability and electrical properties were studied. Ti-Ta-O films, with the ratio of Ta/Ti ~ 1.5, deposited at 400 °C on TiN electrodes, were amorphous and possessed a dielectric constant of 50 with low voltage linearity coefficients and leakage currents densities as low as 10^− 7 A/cm² at 1 V. The films, deposited on Si wafers, were amorphous up to the annealing temperature of 700 °C and crystallized in orthorhombic Ta₂O₅ phase at higher temperatures.     

Enhancement on effective piezoelectric coefficient of Bi3.25Eu0.75Ti3O12 ferroelectric thin films under moderate annealing temperature

Bi_3.25Eu_0.75Ti₃O₁₂ (BET) thin films were deposited on Pt/Ti/SiO₂/Si(111) substrates by a metal-organic decomposition method. The effects of annealing temperatures 600-800 °C on microstructure, ferroelectric, dielectric and piezoelectric properties of BET thin films were studied in detail. The spontaneous polarization (87.4 × 10^− 6 C/cm² under 300 kV/cm), remnant polarization (65.7 × 10^− 6 C/cm² under 300 kV/cm), the dielectric constant (992.9 at 100 kHz) and the effective piezoelectric coefficient d₃₃ (67.3 pm/V under 260 kV/cm) of BET thin film annealed at 700 °C are better than those of the others. The mechanisms concerning the dependence of the enhancement d₃₃ are discussed according to the phenomenological equation, and the improved piezoelectric performance could make the BET thin film a promising candidate for piezoelectric thin film devices.