Simulation of the thermal stress in mass concrete using a thermal stress measuring device

An experimental study is conducted to simulate the thermal stresses generated in mass concrete. Accurate prediction of the thermal stresses by analysis is quite difficult particularly at early ages, due to uncertain age-dependent properties of concrete. A series of tests was conducted in which the amount of restraint in a thermal stress device (TSD) was varied. The effect of aging and the amount of restraint on stress development that can occur in realistic structures was evaluated. The influence of the uncertain early-age properties of concrete (i.e., elastic modulus, thermal dilation, autogenous deformation and transitional thermal creep), on the generation of thermal stresses was incorporated using a TSD due to the simultaneous development of temperature and the corresponding stress in a restrained specimen from the very beginning of the process. The effect of various amounts of restraint on the generation of thermal stress was pronounced. Numerical simulations of the thermal stress setup were also performed using the finite element code DIANA to verify and extend the experimental interpretation and to determine the maximum value of restrained stress which would occur under highest level of restraint. Adopting this methodology may simplify the complexity of thermal stress analyses (i.e., more precise 3-D thermal stress analysis can be performed using material properties achieved from 1-D uniaxial tests) due to the difficulty of accurately determining the early-age properties of concrete.     

Re-examination of the relationship between packing coefficient and thermal expansion coefficient for aromatic polyimides

The existence of a possible relationship between molecular packing coefficient and thermal expansion coefficient for various aromatic polyimides was investigated. Rod-like low-thermal-expansion polyimides without side groups were seen to have very high packing coefficients, pointing to free volume as a factor in lowering their thermal expansion coefficients. But the small packing coefficients for low-thermal-expansion polyimides with side groups indicated that this was not so. Also, even if the large packing coefficients tended to increase the Young's moduli for these polyimides without side groups, the rod-like polyimides with side groups have small packing coefficients and large Young's moduli. The polyimides with low packing coefficients were found to have very small diffusion coefficients for water vapour.     

磷灰石晶格热膨胀性质的实验研究

本文采用高温粉晶X射线衍射技术 ,对溶胶—凝胶法合成羟基磷灰石 (Hap) ,提拉法合成氟磷灰石 (Fap)和天然沉积型碳氟磷灰石 (CFap)从室温到 95 0℃之间的晶格热膨胀系数进行了测定。实验结果表明 :在测试温度范围内 ,各样品的晶格膨胀系数与温度呈线性关系。Hap的△a/a与△c/c分别为 13 .8× 10 - 6 C- 1 和 15 .3× 10 - 6 C- 1 ,Fap的△a/a与△c/c分别为 15 .8× 10 - 6 C- 1 和 18.2× 10 - 6 C- 1 ,CFap的△a/a与△c/c分别为 15 .3× 10 - 6 C- 1 和 18.5× 10 - 6 C- 1 。在实验温度区间内未发现样品有明显的相变或结构转变现象 ,高温实验后样品的傅立叶变换红外光谱测定证实了这一推断。     

Temperature dependence of effective thermal conductivity and thermal diffusivity of treated and untreated polymer composites

Thermal properties, such as thermal conductivity, thermal diffusivity, and specific heat, of treated and untreated oil palm fiber–reinforced PF composites were measured simultaneously at room temperature and normal pressure using the transient plane source (TPS) technique. An increase in thermal conductivity was observed in the fiber‐treated and resin‐treated composites. Surface modifications of fibers by prealkali, potassium permanganate, and peroxide treatments increased the fiber–matrix adhesion by increasing porosity and pore size of the fiber surfaces. The increase in crosslinking enhanced the thermal conductivity of a composite of resin treated with peroxide compared to other composites. Also an attempt was made to explain the temperature dependence of thermal conductivity and thermal diffusivity of amorphous polymer samples using the same technique. It was observed that at the glass‐transition peak of the polymer, thermal conductivity and diffusivity were maximum. Below and above this temperature their values decreased. This has been explained on the basis of predominant scattering processes. An empirical relationship was established for the theoretical prediction of thermal conductivity and diffusivity. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 1708–1714, 2003     

Effect of thermal ratcheting on the mechanical properties of Teflon and fiber based gasket materials

This paper discusses the effect of thermal ratcheting on the material properties of expand polytetrafluoroethylene (ePTFE), virgin polytetrafluoroethylene (vPTFE), and compressed nonasbestos fiber (CNA) gasket materials. Comparison between the creep strain at constant temperature and when subjected to thermal ratcheting show a 7.7 and 28% increase in the creep strain of ePTFE and vPTFE, respectively. In addition, thermal ratcheting produces a substantial reduction of creep modulus of these materials. The CNA material does not exhibit significant change in creep strain or in creep modulus with thermal ratcheting. However, all three gasket materials show a momentous raise in the creep strain when the material temperature is reduced. On declining the gasket temperature from 212 to 100 °F at the end of 20th thermal cycle, the materials—ePTFE, vPTFE, and CNA exhibit 27, 48, and 15% increase in creep strain value, respectively. The percentage of thickness reduction raises with the increase of cyclic temperature and with increase of creep pre-exposure time, except for CNA where only a small variation is observed. The coefficient of thermal expansion of both PTFE materials shows a significant change due to cyclic temperature and initial creep exposure. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47265.     

Enhanced doping effects of multielement on anisotropic thermal expansion in ZrO2 with new compositions

Coefficient of thermal expansion (CTE) of a solid material plays a critical role for a variety of high temperature applications such as thermal barrier coating (TBC) systems during the thermal cycling process. Ceramics contain ionic bonds; hence they tend to exhibit lower CTE values than alloys/metals. Developing new ceramic thermal barrier materials using promising dopants and compositions that have higher CTE values than the conventional 6-8 wt% Y₂O₃ stabilized ZrO₂(8YSZ) will contribute to the decrease in thermal expansion mismatch between a typical ceramic 8YSZ (10 ~ 11 × 10⁻⁶°C⁻¹) top coat and a metal alloy based bond coat such as NiCrAlY (14 ~ 17×10⁻⁶°C⁻¹, Padture et al., Science, 2002;296:280–4; Liang et al., J Mater Sci Technol, 2011;27(5):408–14), which is highly desirable. This work reports design, modeling, synthesis, and characterization of promising new compositions based on Dy³⁺, Al³⁺, and Ce⁴⁺-doped YSZ that consist of the tetragonal structure and have an enhanced thermal expansion than 8YSZ. The intrinsic CTE at the atomic level has been investigated via molecular dynamics (MD) simulation. The atomic scale analysis provides new insights into the enhanced doping effects of multiple trivalent and tetravalent cations on the lattice structure, lattice energy, and thermal expansion in ZrO₂. The calculated lattice energy becomes smaller with the incorporation of Dy³⁺, Al³⁺, and Ce⁴⁺ions, which corresponds strongly to the increase in CTE. The crystalline size is reduced due to the incorporation of the Al³⁺ and Ce⁴⁺, whereas the sintering resistance is enhanced ascribed to the addition of Dy³⁺ and Al³⁺. Doping Dy³⁺, Al³⁺, and Ce⁴⁺ cations to YSZ increased the CTE value of YSZ and for Dy_0.03Y_0.075Zr_0.895O_1.948, the CTE is 12.494 × 10⁻⁶°C⁻¹ at 900°C, which has an 11% increase, as compared with that of 8YSZ.     

Epoxy nanocomposites with reduced coefficient of thermal expansion

Control of the coefficient of thermal expansion (CTE) of polymeric materials is critical in many applications, particularly the electronics industry where CTE mismatches have caused failures. In theory, adding exfoliated nanoplatelets with high aspect ratios would offer an effective solution for reducing CTE, but reported results have not been compelling due to poor dispersion. In this study, α-zirconium phosphate (ZrP) nanoplatelets, along with organic surfactants, were added to epoxy thermosets. The CTE reduction and glass-transition temperature (T_g) were measured while the molecular weight of the surfactant was varied. High-molecular-weight surfactants are effective for ZrP exfoliation and dispersion, but they can also lead to a reduction in T_g and hinder the drop in CTE. A combination of two low-molecular-weight tetrabutylammonium hydroxide and 2-methoxyethylamine surfactants for exfoliation of ZrP were found to give a CTE reduction of 40% with just 3.5 vol % of ZrP added. This CTE reduction correlates well with theory. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47703.     

Anomalous thermal expansion behavior in Er1-xCaxMnO3

Perovskite Er_1-xCa_xMnO₃ (x = 0, 0.1, 0.2, 0.25, 0.3, 0.4, 0.5) was synthesized using a solid-state method. Thermal expansion behavior was tested using a thermal dilatometer and high-temperature X-ray diffraction (XRD). The experimental results indicated the doping contents of Ca (x) in the Er_1-xCa_xMnO₃ have a dramatic effect on their thermal expansion behavior. The samples of Er_1-xCa_xMnO₃ (x = 0.1,0.2 and 0.25) exhibit positive thermal expansion (PTE) characteristics while Er_0.7Ca_0.3MnO₃ (x = 0.3) exhibits a negative thermal expansion (NTE) property with a thermal expansion coefficient of −3.1 × 10⁻⁶ K⁻¹ in room temperature (RT) −750 K. In addition, Er_0.6Ca_0.4MnO₃ (x = 0.4) exhibits NTE properties only at RT–500 K, and Er_0.5Ca_0.5MnO₃ (x = 0.5) exhibits PTE properties at RT–750 K. The thermal shrinkage mechanism is the Jahn–Teller effect of the Mn³⁺ ions and the double exchange of Mn³⁺–O–Mn⁴⁺ in Er_0.7Ca_0.3MnO₃. This phenomenon causes Mn–O octahedral distortion and oxygen vacancy, causing Er_0.7Ca_0.3MnO₃ to become anisotropic. This feature results in the elastic deformation of Er_0.7Ca_0.3MnO₃ during heating, which consumes the void and displays NTE at macro level.     

核壳聚合物粒子对环氧树脂热膨胀系数的影响

采用核壳聚合物(Core-Shell Polymer,CSP)粒子改性环氧树脂,通过红外光谱、热力学分析和扫描电镜研究了CSP粒子对环氧树脂基体热膨胀系数(CTE)的影响。结果表明:CSP粒子壳材料分子链中的羰基在环氧树脂固化过程中可与环氧分子侧链上的羟基形成氢键作用,从而加强了核壳聚合物粒子与环氧树脂的界面作用。随着CSP粒子质量分数的增加,改性环氧树脂基体的玻璃化转变温度呈下降趋势;相对于纯环氧树脂,改性环氧树脂在玻璃化转变温度下的CTE呈现先下降后上升的趋势,添加质量分数为0.5%的CSP后,其CTE值降低了12.88%。但在玻璃化转变温度上的热膨胀系数均高于纯环氧树脂。     

石墨化温度对针状焦热膨胀系数的影响

测定了三种不同类型针状焦(石油针状焦,煤沥青针状焦以及加氢煤沥青针状焦)的热膨胀系数,同时测定了不同石墨化温度下针状焦的CET值,指出了在2500℃～3000℃石墨化温度范围内,不同种类的针状焦CET值都呈现出线性增长,并且指出了由于加氢煤沥青针状焦具有特殊的结构而导致其石墨化以后具有最小的CET值。     

R2O对低熔点硼硅酸盐玻璃性能的影响

R2O-A l2O3-B2O3-SiO2-TiO2-F玻璃系统中在碱金属氧化物R2O(Li2O、Na2O、K2O)总量不变的情况下,通过调节R2O的组成,分别研究了组成变化对玻璃热膨胀系数、化学稳定性和转变温度Tg、软化温度Tf的影响规律。研究表明,R2O组分的调节可以明显降低玻璃的热膨胀系数、酸性失重、转变温度Tg以及软化温度Tf,而对碱性失重影响不大。     

Thermal properties of La2Zr2O7 double-layer thermal barrier coatings

La₂Zr₂O₇ is a promising thermal barrier coating (TBC) material. In this work, La₂Zr₂O₇ and 8YSZ-layered TBC systems were fabricated. Thermal properties such as thermal conductivity and coefficient of thermal expansion were investigated. Furnace heat treatment and jet engine thermal shock (JETS) tests were also conducted. The thermal conductivities of porous La₂Zr₂O₇ single-layer coatings are 0.50–0.66?W?m^?1?°C^?1 at the temperature range from 100 to 900°C, which are 30–40% lower than the 8YSZ coatings. The coefficients of thermal expansion of La₂Zr₂O₇ coatings are about 9–10?×?10^?6?°C^?1 at the temperature range from 200 to 1200°C, which are close to those of 8YSZ at low temperature range and about 10% lower than 8YSZ at high temperature range. Double-layer porous 8YSZ plus La₂Zr₂O₇ coatings show a better performance in thermal cycling experiments. It is likely because porous 8YSZ serves as a buffer layer to release stress.     

Behavior and mechanism of the stress buffer effect of the inside ceramic layer to the top ceramic layer in a double-ceramic-layer thermal barrier coating

The Double-Ceramic-Layer Thermal Barrier Coating (DCL-TBC) consists of a top ceramic layer (TC1), an inside ceramic layer (TC2), bond coat (BC) and alloy substrate. The top ceramic layer is made by new ceramic materials which has the lower thermal conductivity, such as LZ, LZ₇C₃, LMA etc. Although these materials have good high temperature performance and thermal insulation properties, their thermal expansion coefficients are very low which cause higher degree of mismatch with material properties of alloy substrate.     

中温裂纹釉的研究

本文以钠长石、石英、硅灰石、方解石等为主要原料,采用正交实验法制备了一种中温裂纹釉,并探究了配方组成对冰裂纹釉面效果的影响。研究结果表明：坯、釉的膨胀系数差值大,是釉面开裂的重要影响因素。当坯体的膨胀系数为6.52×10-6/℃,釉的膨胀系数为7.29×10-6/℃时,可获得良好的冰裂纹釉。     

Enhanced thermal conductivity and dimensional stability of flexible polyimide nanocomposite film by addition of functionalized graphene oxide

Polyimide (PI) nanocomposites with both enhanced thermal conductivity and dimensional stability were achieved by incorporating glycidyl methacrylate‐grafted graphene oxide (g‐GO) in the PI matrix. The PI/g‐GO nanocomposites exhibited linear enhancement in thermal conductivity when the amount of incorporated g‐GO was less than 10 wt%. With the addition of 10 wt% of g‐GO to PI (PI/g‐GO‐10), the thermal conductivity increased to 0.81 W m^?1 K^?1 compared to 0.13 W m^?1 K^?1 for pure PI. Moreover, the PI/g‐GO‐10 composite exhibited a low coefficient of thermal expansion (CTE) of 29 ppm °C^?1. The values of CTE and thermal conductivity continuously decreased and increased, respectively, as the g‐GO content increased to 20 wt%. Combined with excellent thermal stability and high mechanical strength, the highly thermally conducting PI/g‐GO‐10 nanocomposite is a potential substrate material for modern flexible printed circuits requiring efficient heat transfer capability.     

Development of new device for measuring thermal stresses

In recent years, numerous analytical and experimental researches have been performed on the prediction of thermal stresses in mass concrete structures. However, due to the difficulty of the problem, limitations still exist for both analytical and experimental methods of measuring thermal stresses in mass concrete. In this research, a new experimental device measuring thermal stresses directly in a laboratory setting is developed. The equipment is located in a temperature chamber that follows the temperature history, which has been previously obtained from temperature distribution analyses. Thermal forces are measured continuously by two load cells in the device. The results show that the thermal stresses estimated by the newly developed device agree well with general stress variations in actual structures.     

堇青石蜂窝陶瓷热膨胀特性的研究

汽车尾气净化器用蜂窝陶瓷载体对材料的抗热冲击性能要求很高,要求材料具有特别低的热膨胀系数。本文通过对堇青石陶瓷的平均热膨胀系数及微观热膨胀系数的分析,研究了堇青石蜂窝陶瓷的热膨胀特性。     

Thermal conductivity,elastic modulus,and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging

The effective thermal conductivity, elastic modulus, and coefficient of thermal expansion of epoxy resins filled with ceramic fillers like silica, alumina, and aluminum nitride were determined. The data obtained was compared with theoretical and semitheoretical equations in the literature that are used to predict the properties of two phase mixtures. It was found that Agari's model provided a good estimate of the composite thermal conductivity. The Hashin‐Shtrikman lower bound for composite modulus fits the modulus data fairly well at low concentrations of the filler. Also, it was found that the coefficients of thermal expansion of the filled composites lie in between Schapery's upper and lower bounds. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 3396–3403, 1999     

High Temperature Thermosets With a Low Coefficient of Thermal Expansion

Summary: Polymeric thermosetting composites can be used as metal substitutes for certain applications if they possess high temperature stability in air, low coefficient of thermal expansion (CTE), and sufficient flexural strength, in combination with competitive costs. Commercial bismaleimide, bisnadimide, and cyanate ester thermosetting materials were selected due to their excellent thermal stability. Low CTEs were achieved by adding high loading levels of fused silica or silicon nitride fillers. Several optimized composites were fabricated by varying the materials, composition, and cure conditions. Characteristic composite properties, such as CTE, thermal stability, glass transition temperature (T_g), flexural strength, and filler distribution were investigated. The best system developed consists of Matrimide 5292, a commercial two‐component bismaleimide resin, filled with 75% Silbond FW100EST, and additionally reinforced with 0.5% Twaron short fibers. This composite is distinguished by a CTE around 15 ppm · K⁻¹, a T_g around 340 °C, flexural strength above 100 MPa, and attractive material costs.

Matrimid 5292 (75%)/Silbond FW100AST (24.5%), and Twaron 2 mm short fibers (0.5%). Three fibers are visible, embedded and well dispersed in the matrix.     

Improvement of thermal ageing and transparency of methacrylate based poly(siloxane–silsesquioxane) for optoelectronic application

Trisilanolphenyl–polyhedral oligosilsesquioxane (trisilanolphenyl–POSS) structure is introduced into a polysiloxane network in an attempt to produce thermally stable material with improved transparency. A series of organic–inorganic resins comprised of diphenylsilanediol, 3‐methacryloxypropyl trimethoxysilane, and varying content of trisilanolphenyl–POSS were copolymerized through condensation followed by curing using phenyltris(hydrogendimethylsiloxy)silane as curing agent. Fourier transform infrared spectroscopy (FTIR), proton‐nuclear magnetic resonance spectroscopy (¹H‐NMR), and silicon‐nuclear magnetic resonance spectroscopy (²⁹Si‐NMR) were used to confirm the synthesized product. Excellent thermal stability, improved glass transition temperature (T_g), and lower coefficient of thermal expansion with the increasing POSS content were observed from thermomechanical analysis. Its extreme thermal degradation stability was attributable to the crosslinked network as well as the heavily substituted aromatic ring present in the system. Steric hindrance effect is noticeable beyond 5.66 mol % trisilanolphenyl–POSS content. Incorporation of POSS substituent in methacrylate‐based polysiloxane give excellent transparency and improved thermal discoloration resistance as deduced from UV/vis Spectrophotometer, making it a potential material to be used in optoelectronics. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 45285.