InP/In_xGa_(1-x)As异质结构中Zn元素的扩散机制

采用闭管扩散方式实现了Zn元素在晶格匹配InP/In_(0.53)Ga_(0.47)As及晶格失配InP/In_(0.82)Ga_(0.18)AS两种异质结构材料中的P型掺杂,利用二次离子质谱(SIMS)以及扫描电容显微技术(SCM)对Zn在两种材料中的扩散机制进行了研究.SIMS测试表明:Zn元素在晶格失配材料中的扩散速度远大于在晶格匹配材料中的扩散速度,而SCM测试表明:两种材料中的实际PN结深度与SIMS测得的Zn扩散深度之间存在一定的差值,这是由于扩散进入材料中的Zn元素并没有被完全激活,而晶格失配材料中Zn的激活效率相对更低,使得晶格失配材料中Zn元素扩散深度与PN结深度的差值更大.SCM法是一种新颖快捷的半导体结深测试法,对于半导体器件工艺研究具有重要的指导意义.     

Open-tube diffusion techniques for InP/LnGaAs heterojunctior bipolar transistors

Open-tube diffusion techniques used between 450 and 600° C are described which involve the supply of diffusant from a vapour source (via a solution) and a solid evaporated metal source. Investigations of Zn into InP and InGaAs(P) have been undertaken using both sources. SIMS profile analyses show that in the case of the vapour source the profiles indicate a concentration-dependent diffusion coefficient while the solid source diffusions can be well described by a Gaussian-type profile. The usefulness of the vapour source method has been demonstrated in the fabrication of bipolar transistors which exhibit good d.c. characteristics. The solid source method is limited by the slow diffusion velocity and more gradual profile. The InGaAs(P)/InP materials system has important applications in optical communications and future high speed microwave and switching devices. Useful technologies allied to the introduction of impurities into Si by diffusion, have gradually been emerging for use in the III-V semiconductor family. Closed tube systems1 have been used in order to contain the volatile group V species and prevent surface erosion. In addition, simpler open tube systems^2,3 have been developed that maintain a sufficient overpressure of the group V element. Zn and Cd p-dopants have been studied extensively because of the volatility and relatively large diffusion rates in III-V semiconductors. Opentube diffusion into both InP and InGaAs^2-6 has been studied but little detail has appeared concerning InGaAs and InGaAsP. In this paper we describe a comprehensive study of the diffusion of Zn into InP and InGaAs(P) using both open-tube vapour source and a Au/Zn/Au evaporated solid source with SiN_x acting both as a mask and also an encapsulant to prevent loss of Zn and decomposition of the substrate material. The techniques have been successfully applied to the fabrication of InP/lnGaAs heterojunction bipolar transistors which show good dc characteristics. Reference to InGaAs in the text implies the InP lattice-matched composition In_0.53Ga_0.47As.     

InP基光电探测器材料的MOCVD锌扩散

锌(Zn)扩散是制作InP基光电探测器(PD)的重要工艺过程.分析了锌扩散的机制,利用金属有机化学气相沉积(MOCVD)设备对InP基PD及雪崩光电探测器(APD)材料进行了锌扩散,由于MOCVD设备具有精确的温度控制系统,所以该扩散工艺具有简单、均匀性好、重复性好的优点.对于扩散后的样品,采用电化学C-V方法和扫描电子显微镜(SEM)等测试分析手段,研究了退火、扩散温度、扩散源体积流量和反应室压力等主要工艺参数对InP材料扩散速率和载流子浓度的影响,并将该锌扩散工艺应用于InP基光电探测器和雪崩光电探测器的器件制作中,得到了优异的器件性能结果.     

Optical properties of Zn-diffused InP layers for the planar-type InGaAs/InP photodetectors

Zn diffusion into InP was carried out ex-situ using a new Zn diffusion technique with zinc phosphorus particles placed around InP materials as zinc source in a semi-closed chamber formed by a modified diffusion furnace.The optical characteristics of the Zn-diffused InP layer for the planar-type InGaAs/InP PIN photodetectors grown by molecular beam epitaxy (MBE) has been investigated by photoluminescence (PL) measurements.The temperature-dependent PL spectrum of Zn-diffused InP samples at different diffusion temperatures showed that band-to-acceptor transition dominates the PL emission,which indicates that Zn was commendably diffused into InP layer as the acceptor.High quality Zn-diffused InP layer with typically smooth surface was obtained at 580 ℃ for 10 min.Furthermore,more interstitial Zn atoms were activated to act as acceptors after a rapid annealing process.Based on the above Zn-diffusion technique,a 50μm planar-type InGaAs/InP PIN photodector device was fabricated and exhibited a low dark current of 7.73 pA under a reverse bias potential of-5 V and a high breakdown voltage of larger than 41 V (I ＜ 10 μA).In addition,a high responsivity of 0.81 A/W at 1.31 μm and 0.97 A/W at 1.55 μm was obtained in the developed PIN photodetector.     

InP/InGaAs(P)材料中的低温开管Zn扩散

为了在InP/InGaAs(P)材料中进行精确的选择扩散,同时又要保证外延生长的多层异质结构不被破坏,提出了一种新的低温开管Zn扩散方法。该法直至在T=500℃,t=5min的条件下,重复性仍很好。应用该法研究了低温条件下Zn在InP,InGaAs(P)材料中的扩散行为。实验首次发现,Zn在InGaAsP材料中的扩散速率与材料中P含量的平方成正比。     

InGaAs/InP材料的Zn扩散技术

使用MOCVD反应室进行了InGaAs和InP材料上的Zn扩散工艺条件研究.通过控制扩散温度、扩散源浓度和扩散时间三个主要工艺参数,研究了InGaAs/InP材料的扩散系数和扩散规律,获得了优化的扩散条件.试验表明,该扩散工艺符合原子扩散规律,扩散现象可以用填隙-替位模型解释.样品经过快速退火过程,获得了极高的空穴浓度.InP的空穴浓度达到7.7×1018/cm3,而InGaAs材料达到7×1019/cm3.在优化的扩散条件下,Zn扩散的深度和浓度精确可控,材料的均匀性好,工艺重复性好,能够应用于光电探测器或其他器件.     

退火对Zn扩散的影响及其在InGaAs探测器中的应用

采用闭管扩散方式,对不同结构的异质结外延材料In0.81Al0.19As/In0.81Ga0.19As、InAs0.6P0.4/In0.8Ga0.2As、InP/In0.53Ga0.47As实现了Zn元素的P型掺杂,采用扫描电容显微技术(SCM)和二次离子质谱(SIMS)研究了在芯片制备中高温快速热退火(RTP)处理环节对p-n结结深的影响。结果表明:由于在这3种异质结外延材料中掺杂的Zn元素并未完全激活,导致扩散深度明显大于p-n结结深;高温快速热退火处理并不会显著影响结深的变化,扩散完成后的p-n结深度可以近似为器件最终的p-n结结深;计算了530℃下Zn在In0.81Al0.19As、InAs0.6P0.4、InP中的扩散系数D分别为1.327×10-12cm2/s、1.341 10-12cm2/s、1.067×10-12cm2/s。     

Kinetics of red AlGaAs light-emitting diodes degradation

The kinetics of the gradual degradation of red AlGaAs light-emitting diodes (LED) has been studied. This degradation has been shown to be due to diffusion of Zn atoms from the GaAs substrate to the p-n⁺ junction. The gradual degradation kinetics has been described on the basis of a diffusion model. It has been ascertained that the Zn atom diffusion process is not recombination-enhanced. At the same time the process of elastic stress relaxation, occuring at the initial stage of the LED degradation, is enhanced by the flowing current.     

用PECVD法制备SiO_2进行Zn在GaAs中掩蔽扩散研究

本文报导丁GaAs表面上淀积液态源PECVD-SiO_2膜掩蔽Zn扩散的规律,估算了Zn在SiO_2膜和GaAs中扩散系数的比值为(1.04～1.85)×10~(-3),在700℃下Zn在GaAs中的横向扩散为结深的3～7倍。这种方法制备的SiO_2膜已应用于GaAs电调变容二极管和LPE-Ga_(1-x)Al-xAs/GaAs DH激光器的研制。     

Characterization of vapor diffused Zn:LiTaO3 opticalwaveguides

Diffusion and optical properties of planar waveguides produced in LiTaO₃ by a recently developed technique that utilizes Zn diffusion from vapor phase are presented. The waveguides are obtained by 6-h diffusion at temperatures as low as 800°C. The results indicate that Zn is a fast diffusant in LiTaO₃ and has activation energies that are slightly less than those for Ti diffusion into LiTaO ₃. The diffusion temperatures for Zn are much lower than the 1150-1200°C require for Ti metal indiffusion. The diffusion coefficient of Zn at 800°C, is comparable to that of Ti at 1200°C. The resulting waveguides support both ordinary and extraordinary modes of polarization. The low temperature diffusion slows out diffusion and has been shown to be advantageous for making low-loss optical waveguides in LiTaO₃     

深扩Zn平面条形激光器的横模稳定性

实验发现扩Zn较深的平面条形激光器的横模比较稳定,提出了一个解释深扩Zn平面条形激光器能获得稳定横模工作的简单等效线路模型.分析表明,不掺杂作用层P-n-N型深扩Zn平面条形激光器,增益波导变窄是其横模稳定的主要原因.     

Zn掺杂n型硅材料的补偿研究

为了获得不同补偿度的硅材料,采用高温气相扩散的方法,在n型硅中掺杂深能级杂质Zn,得到各种电阻率(在25℃下)的补偿硅。实验表明,对具有不同初始电阻率的硅材料,扩散后电阻率随扩散温度和杂质投入量的不同都有较大变化,而且随杂质投入量的增加,电阻率都有一个急剧变化的转折点。     

Effects of S,Si, or Fe dopants on the diffusion of Zn in InP during MOCVD

Diffusion of Zn in InP during growth of InP epitaxial layers has been investigated in layer structures consisting of Zn-InP epilayers grown on S-InP and Fe-InP substrates, and on undoped InP epilayers. The layers were grown by metalorganic chemical vapour deposition (MOCVD) atT = 625° C andP = 75 Torr. Dopant diffusion profiles were measured by secondary ion mass spectrometry (SIMS). At sufficiently high Zn doping levels ([Zn] ≥8 × 10¹⁷ cm⁻³) diffusion into S-InP substrates took place, with accumulation of Zn in the substrate at a concentration similar to [S]. Diffusion into undoped InP epilayers produced a diffusion tail at low [Zn] levels, probably associated with interstitial Zn diffusion. For diffusion into Fe-InP, this low level diffusion produced a region of constant Zn concentration at [Zn] ≈ 3 × 10¹⁶ cm⁻³, due to kick-out of the original Fe species from substitutional sites. We also investigated diffusion out of (Zn, Si) codoped InP epilayers grown on Fe-InP substates. The SIMS profiles were characterised by a sharp decrease in [Zn] at the epilayer-substrate interface; the magnitude of this decrease corresponded to that of the Si donor level in the epilayer. For [Si] ≫ [Zn] in the epilayer no Zn diffusion was observed; Hall measurements indicated that the donor and acceptor species in those samples were electrically active. All these results are consistent with the presence of donor-acceptor interactions in InP, resulting in the formation of ionised donor-acceptor pairs which are immobile, and do not contribute to the diffusion process.     

Dependence of Zn diffusion on the Al content in Ga1−xAlxAs

Zn diffusion in Ga_1?xAl_xAs as a function of Al content has been studied. From the diffusion depth measurements a dependence of the diffusion rate on the Al content has been found and the reason discussed. The use of the GaAs epilayer as a mask for Zn diffusion in Ga_1??xAl_xAs was demonstrated.     

扩Zn2+多孔硅的光致发光性能

用快扩散方式把Zn2 掺入到单晶硅中,再用阳极电化学腐蚀方法把样品腐蚀成多孔硅.利用荧光分光光度计测试了样品的光致发光特性,结果表明Zn2 的扩散增强了多孔硅的荧光发射,并分别利用扫描电镜和傅里叶变换红外光谱仪研究了多孔硅薄膜的表面形态和样品的红外吸收光谱.     

Zn在InP中低温扩散的研究

本文用Zn3P2源在闭管条件下研究了Zn在InP中的低温(520700℃)扩散。比较了用等温扩散和双温区扩散技术扩散后,样品的电学参数。结果表明:双温区扩散法可得到表面光亮,无损伤的高浓度表面层。该法已用于InGaAsP/InP双异质结发光管的制备工艺中,并制得了光功率1mW,串联电阻23的发光管。还讨论了Zn在InP中扩散时的行为,解释了低温(550℃)扩散过程中,等温扩散时出现的异常现象。     

Selective area LPE growth and open tube diffusion in InGaAs/InP

Techniques are described in which selective chemical etching, localised LPE growth and localised diffusion in In_0.53Ga_0.47As and InP were carried out. Spun-on silica films were employed as masks in these processes and its performance was found to be comparable with pyrolytic or rf deposited films. Localised LPE growth of In_0.53Ga_0.47As and in-situ etching enabled well-controlled islands of In_0.53Ga_0.47As embedded in InP to be produced. Orientation dependent growth rates were also identified. An open-tube diffusion technique based on an LPE growth system has been successfully used for diffusion of Zn into InP and In_0.53 Ga_0.47As from Sn solutions. A strong variation of diffusion depth in InP with Zn concentration in Sn has been observed at low Zn concentrations but a constant depth is approached for Zn concentrations greater than ∼0.08 atomic fraction.     

Fabrication and characteristics of ion-implanted GaAs/GaAlAs integrated injection logic inverter

An integrated injection logic inverter has been realised in GaAs/GaAlAs material using ion implantation and Zn diffusion. Si ions have been implanted to merge the current source with the switching transistor, whereas the Be implantation provides the base contact. The shallow p+-emitter of the pnp current source has been fabricated by Zn diffusion. Instead of a lateral pnp transistor, which is typical in I2L technology, a vertical arrangement has been used. This type of transistor shows a better current efficiency and can be fabricated with a better uniformity in terms of base width. First results of an I2L inverter with a vertical pnp transistor are shown.     

Zn在Ge中扩散的研究

用Zn作扩散源在封闭的真空石英管中,研究了Zn在Ge中的扩散问题,给出了xj-t1/2关系和C-1/T关系,比较了扩散源温度对样品表面形貌的影响。采用双温区扩散工艺可获得表面光亮的样品。采用真空退火工艺可使扩散样品表面漏电流降低。     

A study of Zn diffusion in InP at low temperature

The diffusion of Zn in InP at low temperature is investigated. The experiment is accomplished in an evacuated and sealed quartz ampoule using Zn_eP₂ as the source of Zn. The electrical characteristics of the diffusion samples obtained by the isotemperature process and the two-temperature process have been compared. It is found that with the two-temperature process one can obtain a smooth, damageless and high-concentration surface layer. This process has been applied to fabricate InGaAsP/InP light emitting diodes, and the diodes obtained have an output power of ≥1mW with a series resistance of 2–5Ω. The behaviors of Zn diffusion in InP are discussed.