High‐performance thermosetting films based on an amino‐functionalized poly(ether sulfone)

We have developed a sequence‐dependent synthesis of the amino‐functionalized poly(ether sulfone) P2 . The amino groups of P2 act as reactive sites toward epoxy resins. After curing P2 with diglycidyl ether of bisphenol A (DGEBA) and cresol novolac epoxy (CNE), we obtained the flexible, light‐yellow, transparent, epoxy thermosetting films P2 /DGEBA, and P2 /CNE, respectively, having glass transition temperatures (T_g) of 258 and 274°C, respectively. In addition, we also prepared a flexible film after condensation of the amino groups of P2 with the anhydride groups of 4,4′‐oxydiphthalic anhydride (ODPA); after imidization at 300°C for 1 h, the resulting P2 /ODPA thermosetting film possessed a value of T_g of 340°C. These three thermosetting films also exhibited flame retardancy with a UL‐94 VTM‐0 grade. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40980.     

Thermal,mechanical, and dielectric studies on the DGEBA epoxy blends by using liquid oxidized poly(1,2‐butadiene) as a reactive component

Liquid oxidized poly(1,2‐butadiene) (LOPB) with multi epoxy groups is synthesized to modify diglycidyl end‐caped poly(bisphenol A‐co‐epichlorohydrin) (DGEBA) cured by 4,4′‐diaminodiphenyl sulfone (DDS). FTIR spectra shows that DGEBA and LOPB can be effectively cured by DDS, and the epoxide rubber particles are evenly distributed in the composites till their addition up to 20 wt % of DGEBA as seen from the scanning electron microscope (SEM). Their decomposition temperatures (Td) increase with the increase in LOPB addition at around 10 wt % of DGEBA while the Td for the composite containing 20 wt % LOPB of DGEBA is lower than that of the neat epoxy. The addition of LOPB improves their storage moduli and especially these values at temperatures higher above 150 °C; all the composites exhibit higher glass transition temperature (T_g) than that of the neat epoxy, and the maximum T_g reaches up to 255 °C for the composite containing 15 wt % LOPB of DGEBA. The incorporation of LOPB effectively decreases their dielectric constants and the composite with 10 wt % LOPB of DGEBA possesses the lowest one. The synergic improvements in their various properties are attributed to the networks formation via covalent linkage between the two phases in these reactive blends. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44689.     

Synthesis and properties of methyl hexahydrophthalic anhydride‐cured fluorinated epoxy resin 2,2‐bisphenol hexafluoropropane diglycidyl ether

The fluorinated epoxy resin, 2,2‐bisphenol hexafluoropropane diglycidyl ether (DGEBHF) was synthesized through a two‐step procedure, and the chemical structure was confirmed by ¹H n uclear magnetic resonance (NMR), ¹³C NMR, and Fourier transform infrared (FTIR) spectra. Moreover, DGEBHF was thermally cured with methyl hexahydrophthalic anhydride (MHHPA). The results clearly indicated that the cured DGEBHF/MHHPA exhibited higher glass transition temperature (T_g 147°C) and thermal decomposition temperature at 5% weight loss (T₅ 372°C) than those (T_g 131.2°C; T₅ 362°C) of diglycidyl ether of bisphenol A (DGEBA)/MHHPA. In addition, the incorporation of bis‐trifluoromethyl groups led to enhanced dielectric properties with lower dielectric constant (D_k 2.93) of DGEBHF/MHHPA compared with cured DGEBA resins (D_k 3.25). The cured fluorinated epoxy resin also gave lower water absorption measured in two methods relative to its nonfluorinated counterparts. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 2801–2808, 2013     

Effects of amino‐functionalized carbon nanotubes on the properties of amine‐terminated butadiene–acrylonitrile rubber‐toughened epoxy resins

Amino‐functionalized multiwalled carbon nanotubes (MWCNT‐NH₂s) as nanofillers were incorporated into diglycidyl ether of bisphenol A (DGEBA) toughened with amine‐terminated butadiene–acrylonitrile (ATBN). The curing kinetics, glass‐transition temperature (T_g), thermal stability, mechanical properties, and morphology of DGEBA/ATBN/MWCNT‐NH₂ nanocomposites were investigated by differential scanning calorimetry (DSC), thermogravimetric analysis, a universal test machine, and scanning electron microscopy. DSC dynamic kinetic studies showed that the addition of MWCNT‐NH₂s accelerated the curing reaction of the ATBN‐toughened epoxy resin. DSC results revealed that the T_g of the rubber‐toughened epoxy nanocomposites decreased nearly 10°C with 2 wt % MWCNT‐NH₂s. The thermogravimetric results show that the addition of MWCNT‐NH₂s enhanced the thermal stability of the ATBN‐toughened epoxy resin. The tensile strength, flexural strength, and flexural modulus of the DGEBA/ATBN/MWCNT‐NH₂ nanocomposites increased increasing MWCNT‐NH₂ contents, whereas the addition of the MWCNT‐NH₂s slightly decreased the elongation at break of the rubber‐toughened epoxy. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40472.     

Mechanical,Thermal, and Electrical Properties of Epoxy Matrix Composites Reinforced With Polyamide-Grafted-MWCNT/poly(azo-pyridine-benzophenone-imide)/Polyaniline Nanofibers

Friedel-Crafts acylation and in situ polymerization were adopted to graft polyamide on multi-walled carbon nanotube (MWCNT) surface to form MWCNT-PA using γ-Phenyl-?-caprolactone. Via electrospinning, MWCNT-PA/PAPBI and MWCNT-PA/PAPBI/PANI nanofibers were prepared using MWCNT-PA, poly(azo-pyridine-benzophenone-imide) (PAPBI) and polyaniline (PANI) and DGEBA as matrix. Compared with 3 wt% MWCNT-PA/PAPBI nanofibers (20.2 GPa), tensile modulus for film reinforced with 3 wt% MWCNT-PA/PAPBI/PANI nanofibers (27.6 GPa) was considerably increased. Thermal stability of MWCNT-PA/PAPBI/PANI nanofibers reinforced epoxy was higher with T₁₀ 633–654°C and T_g 283–291°C relative to DGEBAMWCNT-PA/PAPBI system. The filler loading also increased the electrical conductivity of DGEBA/MWCNT-PA/PAPBI/PANI from 3.44 to 6.01 S cm^?1.     

New epoxy resins. II. The preparation,characterization, and curing of epoxy resins and their copolymers

A polymer having high aromaticity and/or cyclic ring structures in the chain backbone usually gives high heat resistance and flame resistance. Five glycidyl ether-type epoxy resins are prepared from bisphenol A (DGEBA), 9,9-bis(4-hydroxyphenyl)fluorene (DGEBF), 3,6-dihydroxyspiro-[fluorene-9,9′-xanthane] (DGEFX), 10,10-bis(4-hydroxyphenyl) anthrone (DGEA), and 9,9,10,10-tetrakis(4-hydroxyphenyl)anthracene (TGETA) in order to study structure–thermal stability–flame resistance property relationships. In this study, trimethoxyboroxine (TMB) and diaminodiphenylsulfone (DDS) are employed as the curing agents. The char yield at 700°C under a nitrogen atmosphere and the glass transition temperature (T_g) for the uncured resins decrease according to the sequence TGETA > DGEFX > DGEA > DGEBF > DGEBA. The Tg values for these cured epoxy resins are DGEBA < DGEBF < DGEFX < DGEA. A T_g for the TGETA is not obtainable but would be expected to be the highest. The char yields at 700°C of these cured epoxy resins have the same trend as the uncured resins. DGEBF, DGEFX, DGEA, and TGETA added to the DGEBA system show increases in the char yield, T_g, and oxygen index with increasing concentration of these novel epoxy resins.     

Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

The study synthesized a trifluoromethyl (CF₃) groups with a modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. The epoxy resin was cured with 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this study also investigated curing of commercially available diglycidyl ether of bisphenol A (DGEBA) with the same curing agent by varying the ratios of DGEBF. The structure and physical properties of the epoxy resins were characterized to investigate the effect of injecting fluorinated groups into epoxy resin structures. Regarding the thermal behaviors of the specimens, the glass transition temperatures (T_g) of 50–160°C and the thermal decomposition temperatures of 200–350 °C at 5% weight loss (T_d5%) in nitrogen decreased as amount of DGEBF increased. The different ratios of cured epoxy resins showed reduced dielectric constants (D_k) (2.03–3.80 at 1 MHz) that were lower than those of pure DGEBA epoxy resins. Reduced dielectric constant is related to high electrronegativity and large free volume of fluorine atoms. In the presence of hydrophobic CF₃ groups, the epoxy resins exhibited low moisture absorption and higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Effect of structural change of pitch on the thermal conductivity of epoxy‐based composites filled with heat‐treated pitch

Petroleum‐based pitches were used as filler materials to study the effects of heat‐treatment‐induced changes in pitch structure on the thermal conductivity of epoxy‐based composites. The heat treatment was performed in two steps: the first involved heating the pitch to 250 °C in order to remove the low‐molecular‐weight compounds from the pitch, and the second involved heating the pitch to either 430 or 450 °C. There was no significant difference in the curing behavior of the diglycidyl ether of bisphenol A (DGEBA)/pitch composites, regardless of the heat‐treatment temperature. However, the thermal conductivity of the DGEBA/pitch composites improved with increasing heat‐treatment temperature, and the epoxy composite prepared with pitch heat‐treated at 430 °C exhibited the maximum thermal conductivity. This can be attributed to structural changes in the pitch, such as the distance between adjacent planes (d‐spacing), crystallite height (L_c) and crystallite width (L_a). Although L_c of the pitch increased with increasing heat‐treatment temperature, the d‐spacings and L_a decreased. These results suggest that the heat treatment of the pitch led to a well‐stacked crystalline structure. However, compared with the pitch heat‐treated at 430 °C, that heat‐treated at 450 °C exhibited lower thermal conductivity in the DGEBA/pitch composite because of the low L_a, resulting in the loss of basal carbon as a consequence of in situ gasification, and pyrolysis of the low‐molecular‐weight compounds in the pitch. © 2013 Society of Chemical Industry     

Curing of DGEBA epoxy resin by low generation amino‐group‐terminated dendrimers

Low generation amino‐group‐terminated poly(ester‐amine) dendrimers PEA1.0 (NH₂)₃ and PEA1.5 (NH₂)₈, and poly(amido‐amine) dendrimer PAMAM1.0 (NH₂)₄ were used as diglycidyl ether of bisphenol A (DGEBA) epoxy resin hardeners. Thermal behavior and curing kinetics of dendrimer/DGEBA systems were investigated by means of differential scanning calorimetry (DSC). Compared with ethylene diamine (EDA)/DGEBA system, the dendrimer/DGEBA systems gradually liberated heat in two stages during the curing process, and the total heat liberated was less. Apparent activation energy and curing reaction rate constants for dendrimer and EDA/DGEBA systems were estimated. Thermal stabilities and mechanical properties of cured thermosetting systems were examined as well. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3902–3906, 2006     

Blends of epoxy–amine resins with poly(phenylene oxide) as processing aids and toughening agents: I. Uncured systems

The effect of two different bisphenol‐A‐based diepoxides—nearly pure DGEBA340 and a DGEBA381 oligomer—and an aromatic diamine curative (MCDEA) on the solubility and processability of poly(phenylene oxide) (PPO) was studied. The solubility parameters of the diepoxies and the curative calculated from Fedors's method suggest miscibility of PPO with the components, and this was observed at the processing temperature; however, some of the blends were not transparent at room temperature, indicating phase immiscibility and/or partial PPO crystallization. The steady shear and dynamic viscosities of the systems agreed well with the Cox–Merz relationship and the logarithmic viscosities decreased approximately linearly with increasing amounts of DGEBA381, DGEBA340 or MCDEA, thus causing a processability enhancement of the PPO. The dynamic rheology of intermediate PPO:DGEBA compositions at 200 °C showed gel‐like behaviour. Dynamic mechanical analysis of blends with varying PPO:DGEBA ratios showed that the main glass transition temperature (T_g) of the blends decreased continuously with increasing epoxy content, with a slightly higher plasticizing efficiency being exhibited by DGEBA340 compared to DGEBA381. However, blends with 50 and 60 wt% PPO had almost identical T_g due to the phase separation of the former blends. The blends of MCDEA and PPO were miscible over the concentration range investigated and T_g of the blends decreased with increasing MCDEA concentration. © 2013 Society of Chemical Industry     

Effect of Hyperbranched Poly (Trimellitic Anhydride Ethylene Glycol) Epoxy (HTME) on Thermal Degradation Activation Energies of HTME/Diglycidyl Ether of Bisphenol-A Epoxy Hybrid Resin by Kissinger and Flynn–Wall–Ozawa Method

The thermal degradation behavior and kinetics of hyperbranched poly (trimellitic anhydride ethylene glycol) epoxy (HTME)/diglycidyl ether of bisphenol-A epoxy (DGEBA) hybrid resin was investigated with thermogravimetric analysis (TGA) by using Kissinger method and Flynn–Wall–Ozawa method. The results show that the thermal degradation activation energies of DGEBA, 9 wt% HTME-1/91wt% DGEBA, 3 wt% HTME-2/97 wt% DGEBA, 9 wt% HTME-2/91 wt% DGEBA, 15 wt% HTME-2/85 wt% DGEBA, and 9 wt% HTME-3/91wt% DGEBA are 152.5, 144.4, 135.4, 133.2, 121.8 and 143.0 kJmol^?1, respectively, by Kissinger method. and the activation energies are 173.3, 165.0, 163.2, 151.7, 137.7 and 159.7 kJmol^?1, respectively by Flynn–Wall–Ozawa method. With the increase of HTME content, the activation energies of HTME/DGEBA hybrid resin decrease. Although molecular weight or generation of hyperbranched epoxy resins (HTME) has little effect on the thermal degradation activation energies and other kinetics data.     

Syntheses of epoxy‐bridged polyorganosiloxanes and the effects of terminated alkoxysilanes on cured thermal properties

A series of epoxy‐bridged polyorganosiloxanes have been synthesized by reacting multifunctional aminoalkoxysilanes with diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The reactions of trifunctional 3‐aminopropyltriethoxysilane (APTES), difunctional 3‐aminopropylmethyldiethoxysilane (APMDS), and monofunctional 3‐aminopropyldimethylethoxysilane (APDES) with DGEBA epoxy have been monitored and characterized by FTIR, ¹H NMR, and ²⁹Si NMR spectra in this study. The synthesized epoxy‐bridged polyorganosiloxanes precursors, with different terminated alkoxysilane groups, are thermally cured with or without the addition of curing catalysts. Organometallic dibutyltindilaurate, and alkaline tetrabutylammonium hydroxide have been used as curing catalysts to investigate the thermal curing behaviors and cured properties of epoxy‐bridged polyorganosiloxanes precursors. The maximum exothermal curing temperatures of epoxy‐bridged polyorganosiloxanes precursors are found to appear around the same region of 120°C in DSC analysis. The addition of catalysts to the epoxy/APTES precursor shows significant influence on the cured structure; however, the catalysts exhibit less influence on the cured structure of epoxy‐APMDS precursor and epoxy/APDES precursor. Curing catalysts also show significant enhancement in increasing the thermal decomposition temperature (T_d50s) of cured network of trifunctional epoxy‐bridged polyorganosiloxane (epoxy/APTES). High T_d50s of 518.8 and 613.6 in the cured hybrids of epoxy/APTES and epoxy/APMDS precursors are also observed, respectively. When trialkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes precursor are cured, with or without the addition of catalyst, no obvious T_g transition can be found in the TMA analysis of cured network. The cured network of trialkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes also exhibits the lowest coefficient of thermal expansion (CTE) among the three kinds of alkoxysilane‐terminated epoxy‐bridged polyorganosiloxanes investigated. The organic–inorganic hybrid, from epoxy‐bridged polyorganosiloxanes after the thermal curing process, shows better thermal stability than the cured resin network of pure epoxy‐diaminopropane. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3491–3499, 2006     

Epoxy matrices for filament-wound carbon fiber composites

Epoxies suitable for filament-winding fibrous composites must be processible at ambient temperatures, nontoxic, chemically simple, undergo full cure at ≤ 100°C and, also, be tough and exhibit a T_g > 120°C. In this paper, we report the cure characteristics, processibility, toxicity, and mechnical and physical properties of a number of amine-cured diglycidyl ether of bisphenol-A (DGEBA) epoxide candidate systems suitable for filament-wound carbon fiber composites. 2,5-Dimethyl-2,5-hexane diamine (DMHDA)-cured DGEBA epoxy was found to be the most promising candidate. The good processibility and thermal properties, together with the low cure characteristics of the DGEBA–DMHDA epoxy system, are discussed in terms of molecular structure of the amine molecule. The network structural parameters that control epoxy toughness and subsequent embrittlement upon plastic flow are discussed. Evidence is presented for plastic flow-induced thermal and mechanical property deterioration of epoxies as a result of network chain scission.     

Thermal and mechanical properties of poly(urethane‐imide)/epoxy/silica hybrids

Improving properties of polyurethane (PU) elastomers have drawn much attention. To extend the properties of the modified PU composite, here a new method via the reaction of poly(urethane‐imide) diacid (PUI) and silane‐modified epoxy resin (diglycidyl ether of bisphenol A) was developed to prepare crosslinked poly (urethane‐ imide)/epoxy/silica (PUI/epoxy/SiO₂) hybrids with enhanced thermal stability. PUI was synthesized from the reaction of trimellitic anhydride with isocyanate‐terminated PU prepolymer, which was prepared from reaction of polytetramethylene ether glycol and 4,4′‐diphenylmethane diisocyanate. Thermal and mechanical properties of the PUI/epoxy/SiO₂ hybrids were investigated to study the effect of incorporating in situ SiO₂ from silane‐modified epoxy resin. All experimental data indicated that the properties of PUI/epoxy/SiO₂ hybrids, such as thermal stability, mechanical properties, were improved due to the existence of epoxy resin and SiO₂. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Citric acid–diethylenetriamine salts as latent curing agents for epoxy resins

Citric acid (CA)–diethylenetriamine (DETA) salts (CADETA) were prepared by using a 4.5 : 1 molar ratio of DETA–CA and removing the DETA excess. The structure of CADETA was analyzed by ¹³C-NMR, IR, and DSC associated with weight loss. One-step formulations consisted on dispersions of CADETA (variable amounts) in an epoxy resin based on diglycidylether of bisphenol A (DGEBA, EEW = 185.5 g/eq). The cure was followed in the pressure cell of a DSC (N₂ at 2.5 MPa), to avoid volatilization of DETA in the temperature range where decomposition of CADETA and beginning of reaction took place (T > 175°C). A very small heat of reaction was observed, (?ΔH) ～ 10 kJ/eq, resulting from the simultaneous endothermic salt decomposition and exothermic network formation. A stoichiometric formulation showed a T_g = 180°C, i.e., some 60°C higher than the one observed for the usual DGEBA/DETA system.     

Improvement of fracture toughness and glass transition temperature of DGEBA‐based epoxy systems using toughening and crosslinking modifiers

Several toughening and crosslinking modifiers were tested in two epoxy resin systems based on the diglycidyl ether of bisphenol A (DGEBA) with the objective to improve the critical stress intensity factor K_IC and the glass transition temperature (T_g) simultaneously. An amine hardener (isophorone diamine (IPD)) and a homopolymerization initiator (1‐ethyl‐3‐methylimidazolium acetate (EMIM Ac)) were used as curing agents. The highest effect on the K_IC value of the resin system DGEBA/IPD (K_IC = 0.72 MPa^1/2; T_g = 164°C) was achieved with the dendric polymer Boltorn P501 (10 wt%), but it decreased the T_g (K_IC = 1.39 MPa^1/2; T_g = 136°C). A high toughening effect with a low decrease of T_g was achieved with a combination of a self‐organized block copolymer (Nanostrength M22N) and silica nanoparticles (Nanopox F400) (K_IC =1.15 MPa^1/2; T_g =157°C). The K_IC value of the resin system DGEBA/EMIM Ac was improved from 0.44 to 0.66 MPa^1/2. An improvement of both, the thermal and mechanical properties was established for a combination of a poly(tetrahydrofuran) as toughening modifier (PolyTHF2000) with the post‐crosslinking modifier diethylphosphite (DEP) in the resin system DGEBA/IPD (K_IC = 0.86 MPa^1/2; T_g = 180°C). A system with chemical linkages between both modifiers was investigated for comparison but yielded inferior results. POLYM. ENG. SCI., 59:86–95, 2019. © 2018 Society of Plastics Engineers     

Acid- and base-catalyzed epoxy-phenol thermosets from catechol,resorcinol and hydroquinone: A structure–property study

In order to better understand the design rules of epoxy–phenol thermosets we will report on the chemistry and (thermo)mechanical properties of cured epoxy–phenol thermoset films. Ortho-, meta- and para-isomers of dihydroxybenzene (DHB) were reacted with the diglycidyl ether of bisphenol A (DGEBA) in the presence of an acid catalyst or triphenylphosphine (PPh₃). The glass transition temperatures (T_g) of the cross-linked films decreases in the order of meta- (T_g = 115°C) > ortho- (T_g = 102°C) > para-DHB (T_g = 96°C) as measured by differential scanning calorimetry. Uniaxial tensile testing of cross-linked films showed excellent stress–strain behavior. The average ultimate strength values ranged from 65 to 82 MPa and the average values of the strain-at-break ranged from 4.8% to 6.9% at 25°C for all cross-linked films. When a PPh₃ was used, the network properties were profoundly different. The base catalyzed thermoset of DGEBA and meta-DHB shows a T_g of 85°C, which is 30°C lower than the T_g of the acid-catalyzed analog. Tensile films appear to be more ductile, as they exhibit a strain-at-break of 20%. The results of this study confirm that simple dihydroxybenzene hardeners can be used to prepare cross-linked films with excellent thermomechanical properties.     

Preparation and characterization of epoxidate poly(1,2‐butadiene)–toughened diglycidyl ether bisphenol‐A epoxy composites

By the oxidation of liquid poly(1,2‐butadiene) (LPB) with H₂O₂/HCOOH, epoxidate poly(1,2‐butadiene) (ELPB) was obtained as a toughening agent to prepare diglycidyl ether bisphenol‐A (DGEBA) epoxy composites by using V115 polyamide(PA) as a cross‐linking agent. DGEBA, ELPB, and the composites were effectively cured by PA at 100°C for 2 h followed by postcuring at 170°C for 1 h. Thermal gravimetric analysis results in air and nitrogen atmosphere showed that the thermal stability of composites could be improved by the addition of ELPB. Compared with DGEBA/PA, the composites exhibited a decrease in strength at yield but an increase in strain at break with the increase in ELPB amount. The composite with 10% ELPB exhibited both thermal stability and tenacity superior to those of DGEBA/PA and composites with 5 and 20% ELPB, respectively. The improvements in thermal and mechanical properties of composites depended on the formation of Inter Penetrating Networks (IPN) among DGEBA/PA/ELPB and their distributions in the matrix. At an appropriate ELPB amount, the IPN, mostly made of DGEBA/PA/ELPB, may be distributed more evenly in the matrix; less ELPB resulted in the formation of IPN mainly made of DGEBA/PA; excessive addition of ELPB resulted in the local aggregation of ELPB/PA and phase separations. The toughening mechanism was changed from chemically forming IPN made of DGEBA/PA/ELPB to physically reinforcing DGEBA/PA by ELPB/PA with the increase in ELPB addition. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Epoxy nanocomposites containing mercaptopropyl polyhedral oligomeric silsesquioxane: Morphology,thermal properties,and toughening mechanism

A novel polyhedral oligomeric silsesquioxane (POSS) containing a mercaptopropyl group [mercaptopropyl polyhedral oligomeric silsesquioxane (MPOSS)] was synthesized via the hydrolytic condensation of γ-mercaptopropyl triethoxysilane in an ethanol solution catalyzed by concentrated hydrochloric acid and was used to modify epoxy–amine networks by a cocuring reaction with diglycidyl ether of bisphenol A (DGEBA). The structure, morphology, and thermal and mechanical properties of these MPOSS/DGEBA epoxy nanocomposites were studied and investigated with thermogravimetric analysis/differential thermal analysis (TGA–DTA), scanning electron microscopy (SEM), and Fourier transform infrared spectroscopy (FTIR). From SEM analysis, we observed that the miscibility between epoxy and POSS occurred at a relatively high POSS content, which characterized this mixture as a polymer nanocomposite system. The impact test showed that MPOSS reinforced the epoxy effectively, and the SEM study of the impact fracture surface showed that the fibrous yielding phenomenon observed was an indication of the transition of the brittle stage to a ductile stage and correlated well with the large increases in the impact strength; this was in agreement with the in situ reinforcing and toughening mechanism. The TGA–DTA analysis indicated that the MPOSS/DGEBA epoxy hybrids exhibited lower thermostability at a lower temperature but higher thermostability and higher efficiency in char formation at an elevated temperature. Differential scanning calorimetry showed that the glass transition temperature (T_g) of the MPOSS/epoxy hybrids were lower than that of the neat epoxy. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Physical aging of epoxy resin blended with poly(ether sulfone): Effect of poly(ether sulfone) molecular weight

The physical aging process of 4-4′-diaminodiphenylsulfone (DDS) cured diglycidyl ether bisphenol-A (DGEBA) blended with various molecular weights of poly(ether sulfone) (PES; M_n = 28,600, 10,600, and 6,137) was studied by DSC. For DGEBA/DDS system blended with a low MW PES-3 (M_n = 6,137), no phase separation of the polymer blend and only one enthalpic relaxation process due to physical aging was observed. Since the high MW PES-1 (M_n = 28,600) had a T_g close to that of fully cured DGEBA/DDS, the fully cured DGEBA/DDS/PES-1 blend had a broader glass transition than a neat DGEBA/DDS system. However, the DSC results showed two enthalpic relaxation processes due to the physical aging of PES-rich and cured epoxy-rich phases as the material was aged at 155 °C (30 °C below T_g). Since the T_gs of PES-1-rich and epoxy-rich phases overlapped with each other, the enthalpic relaxation processes corresponding to each phase coupled to each other in the earlier stage of physical aging. The medium MW PES-2 (M_n = 10,600) has a much lower T_g than that of fully cured DGEBA/DDS, two well separated T_gs were observed for the cured DGEBA/DDS/PES-2 blend, indicating the cured epoxy was immiscible with PES. Aging the polymer blend at 155 °C (24 °C below T_g1 of the PES-2-rich phase and 53 °C below T_g2 of the epoxy-rich phase) produced two well separated relaxation processes due to PES-2-rich and epoxy-rich phases. The experimental results suggested that aging the polymer blend at a suitable temperature would improve the phase separation between PES-1-rich and epoxy-rich phases.