p型GaN的Ni/Au合金电极的I-V特性

运用传输线方法(TLM)测量了p型GaN合金后的Ni/Au电极的接触电阻率和电流-电压(I-V)关系,推导了合金的Ni/Au电极和p型GaN接触处的电流密度与电压(J-V)的关系.在考虑热发射机制和镜像力的基础上,通过对p型GaN的Ni/Au合金电极的I-V特性分析,进一步得出势垒高Φb=0.41eV,受主浓度Na=4×1019cm-3,能带弯曲Vi=0.26V,和EF-Ev:0.15eV.这些结果与理论值和其他实验结果符合得很好.     

Ni层厚度对p-GaN/Ni/Au欧姆接触特性的影响

对p-GaN/Ni/Au欧姆接触特性与Ni金属层厚度之间的相关性进行了对比实验研究,利用XRD衍射结果与表面金相显微分析手段对Ni/Au双层金属电极在合金退火过程中的行为特性进行了细致探讨。分析结果表明:在Ni/Au电极结构中,由双层互扩散机制与NiO氧化反应机理决定,Ni层与Au层之间的厚度比率对p型GaN欧姆接触特性的优劣有重要影响,在Ni、Au层厚度相当时可获得最佳的p型欧姆接触。     

用于紫外探测器的AlGaN/GaN异质结构的Ti/Al/Ni/Au欧姆接触特性

采用Ti/Al/Ni/Au多层金属体系在Al0.27Ga0.73N/GaN异质结构上制备了欧姆接触.分别采用线性传输线方法(LTLM)和圆形传输线方法(CTLM)对其电阻率进行了测试.当Ti(10nm)/Al(100nm)/Ni(40nm)/Au(100nm)金属体系在650℃高纯N2气氛中退火30s时,测量得到的最小比接触电阻率为1.46×10-5Ω·cm2.并制备了Al0.27Ga0.73N/GaN光导型紫外探测器,通过测试发现探测器的暗电流.电压曲线呈线性分布.实验结果表明在Al0.27 Ga0.73N/GaN异质结构上获得了好的欧姆接触,能够满足制备高性能AlGaN/GaN紫外探测器的要求.     

用于紫外探测器的AlGaN/GaN异质结构的Ti/Al/Ni/Au欧姆接触特性

采用Ti/Al/Ni/Au多层金属体系在Al0.27Ga0.73N/GaN异质结构上制备了欧姆接触. 分别采用线性传输线方法(LTLM)和圆形传输线方法(CTLM)对其电阻率进行了测试. 当Ti(10nm)/Al(100nm)/Ni(40nm)/Au(100nm)金属体系在650℃高纯N2气氛中退火30s时,测量得到的最小比接触电阻率为1.46E-5Ω·cm2. 并制备了Al0.27Ga0.73N/GaN光导型紫外探测器,通过测试发现探测器的暗电流-电压曲线呈线性分布. 实验结果表明在Al0.27Ga0.73N/GaN异质结构上获得了好的欧姆接触,能够满足制备高性能AlGaN/GaN紫外探测器的要求.     

Ti/Al/Ni/Au金属体系在N-polar GaN上的欧姆接触特性

利用金属有机化合物化学气相淀积(MOCVD)在SiC衬底上外延生长了N-polar GaN材料,采用传输线模型(TLM)分析了Ti/Al/Ni/Au金属体系在N-polar GaN上的欧姆接触特性.结果表明,Ti/Al/Ni/Au (20/60/10/50 nm)在N-polar GaN上可形成比接触电阻率为2.2×10-3Ω·cm2的非合金欧姆接触,当退火温度升至200℃,比接触电阻率降为1.44×10-3 Ω·cm2,随着退火温度的进一步上升,Ga原子外逸导致欧姆接触退化为肖特基接触.     

印制板化学镀Ni/Au工艺

概述了印制板化学镀Ni/Au工艺。该工艺仅能活化要求化学镀Ni的Cu表面,而不能活化无需化学镀Ni的绝缘基材区域。     

非故意掺杂GaN上Ti/Al/Ni/Au欧姆接触研究

基于圆形传输线模型,研究了背景载流子浓度为71016cm3的非故意掺杂GaN与Ti/Al/Ni/Au多层金属之间欧姆接触的形成。样品在N2气氛中,分别经过温度450,550,700,800,900℃的1 min快速热退火处理后发现,当退火温度高于700℃欧姆接触开始形成,随着温度升高欧姆接触电阻持续下降,在900℃时获得了最低比接触电阻6.6106O·cm2。研究表明,要获得低的欧姆接触电阻,需要Al与Ti发生充分固相反应,并穿透Ti层到达GaN表面;同时,GaN中N外扩散到金属中,在GaN表面产生N空位起施主作用,可提高界面掺杂浓度,从而有助于电子隧穿界面而形成良好欧姆接触。     

印制板化学镀Ni/Au

本文通过介绍安美特公司(Atotech)化学镀Ni/Au工艺流程,实验和总结药液的性能,列举在生产实践中一些故障的现象和原因,从而达到更有效地、更好地控制工艺参数和维护工艺的稳定,以便为生产服务。     

化学镀Ni/Au及其工艺控制

概述了化学Ni/Au及其工艺控制和质量控制方法,可以获得重复性良好的镀层性能,确保产品的可靠质量。     

氧化Au/Ni/p-GaN欧姆接触形成的机理

用卢瑟福背散射(RBS)和同步辐射X射线衍射(XRD)研究了p-GaN上的Ni/Au电极在空气下不同温度合金后的微结构的演化,并揭示这种接触结构的欧姆接触形成机制.研究不同温度下比接触电阻(ρc)的变化,发现从450℃开始Au扩散到GaN的表面在p-GaN上形成外延结构以及O向电极内部扩散反应生成NiO对降低ρc起到了关键的作用.在500℃时,Au的外延结构进一步改善,O进一步向样品内部扩散生成NiO,ρc也达到了最低值.但当合金温度升高到600℃时,金属-半导体界面NiO的大部分或全部向外扩散,从而脱离与p-GaN的接触,使ρc显著升高.     

氧化Au/Ni/p-GaN欧姆接触形成的机理

用卢瑟福背散射（RBS）和同步辐射X射线衍射（XRD）研究了p-GaN上的Ni/Au电极在空气下不同温度合金后的微结构的演化，并揭示这种接触结构的欧姆接触形成机制．研究不同温度下比接触电阻(ρc)的变化，发现从450℃开始Au扩散到GaN的表面在p-GaN上形成外延结构以及O向电极内部扩散反应生成NiO对降低ρc起到了关键的作用．在500℃时，Au的外延结构进一步改善，O进一步向样品内部扩散生成NiO,ρc也达到了最低值．但当合金温度升高到600℃时，金属-半导体界面NiO的大部分或全部向外扩散，从而脱离与p-GaN的接触，使ρc显著升高．     

p-GaN Ni/Au 电极退火后NiO的除去

The Ni/Au contact was treated with oxalic acid after annealing in 02 ambient, and its 1-V characteristic showed the property of contact has been obviously improved. An Auger electron spectroscopy （AES） depth profile of the contact as-annealed showed that the top layer was highly resistive NiO, while an X-ray photo-electron spectroscopy （XPS） of oxalic acid treated samples indicated that the NiO has been removed effectively. A scanning electron microscope （SEM） was used to observe the surface morphology of the contacts, and it was found that the lacunaris surface right after annealing became quite smooth with lots of small Au exposed areas after oxalic acid treatment. When the test probe or the subsequently deposited Ti/Au was directly in contact with these small Au areas, they worked as low resistive current paths and thus decrease the specific contact resistance.     

NiO removal of Ni/Au Ohmic contact to p-GaN after annealing

The Ni/Au contact was treated with oxalic acid after annealing in O2 ambient, and its I-V characteristic showed the property of contact has been obviously improved. An Auger electron spectroscopy (AES) depth pro-file of the contact as-annealed showed that the top layer was highly resistive NiO, while an X-ray photo-electron spectroscopy (XPS) of oxalic acid treated samples indicated that the NiO has been removed effectively. A scanning electron microscope (SEM) was used to observe the surface morphology of the contacts, and it was found that the lacunaris surface right after annealing became quite smooth with lots of small Au exposed areas after oxalic acid treatment. When the test probe or the subsequently deposited Ti/Au was directly in contact with these small Au areas, they worked as low resistive current paths and thus decrease the specific contact resistance.     

Interface observation in Au/Ni/p-GaN studied by HREM and energy-filtering TEM

The contact resistance of Au/Ni/p-GaN ohmic contacts for different annealing conditions was measured. This was then correlated with microstructure, including phase distribution, observed by high-resolution electron microscopy combined with energy-filtering imaging. A contact resistance of 2.22 x 10(-4) ohms cm2 for Au/Ni contacts to p-GaN after annealing at 500 degrees C for 5 min in air ambient was obtained. NiO layers were identified at the interface and upper area of annealed Ni/Au/p-GaN for air ambient. In addition, an Au layer was found at the interface of p-GaN due to a reversal reaction during annealing. Identification of the observed phases is discussed, along with possible formation mechanisms for the ohmic contacts in the Au/Ni/p-GaN system.     

氧化对 GaN 基LED透明电极接触特性的影响

研究了热退火对InGaN/GaN 多量子阱LED的Ni/Au-p-GaN欧姆接触的影响.发现在空气和 N2气氛中交替地进行热退火的过程中Ni/Au接触特性显示出可逆现象. Ni/Au-p-GaN接触的串联电阻在空气中随合金化时间逐渐减小,在随后的 N2 中的热退火后会使该串联电阻增加,但在空气中再次热退火能使接触特性得到恢复.同时对Ni/Au-p-GaN 接触在空气中合金化过程中的层反转的成因进行了讨论.     

Thermally induced variation in barrier height and ideality factor of Ni/Au contacts to p-GaN

In this paper, we describe the change in barrier heights (ϕ_B) and ideality factors (n) of Ni/Au contacts to p-GaN determined from current-voltage measurements as a result of (a) rapid thermal annealing between 400–700°C under flowing nitrogen, and (b) testing at temperatures of 20–300°C. The lowest barrier height and ideality factor values were obtained from samples annealed at 500–600°C. These results provide supporting evidence that thermal processing helps to remove contaminants at the contact-GaN interface, thus decreasing effective barrier height and consequently, contact resistance.     

HEMT伏安特性

提出HEMT中二维电子气浓度的抛物线近似公式,建立了HEMT非线性电能荷控制模型.采用电子速场特性双折线近似计算了HEMT伏安特性,与实验数据符合良好.