液体端羧基丁腈橡胶改性氰酸酯／玻璃纤维复合材料的性能研究

用液体端羧基丁腈橡胶(CTBN)对氰酸酯树脂(CE)进行了增韧改性,通过树脂体系的凝胶时间曲线和DSC曲线确定了体系的固化工艺,并制备了玻璃纤维(GF)增强复合材料。CTBN改性后的CE树脂及复合材料具有良好的力学性能,其中固化树脂的弯曲强度和冲击强度分别提高了34.6%和48%,复合材料的弯曲强度和冲击强度分别提高了11.4%和21.3%,这来源于CTBN对氰酸酯树脂的增韧作用及与GF良好的粘接性能。     

CTBN改性双环戊二烯型氰酸酯树脂研究

采用端羧基液体丁腈橡胶(CTBN)对双环戊二烯型氰酸酯树脂(DCPDCE)进行改性。结果表明,CTBN对DCPDCE的固化反应具有催化作用;CTBN用量较小时就能够有效地改善DCPDCE的力学性能;CTBN改性DCP-DCE服从孔洞剪切屈服机理;CTBN的加入对DCPDCE的吸湿性能有负面影响,但在用量少于8%时吸水率均在1%以下。     

硼酸铝晶须改性双酚A二氰酸酯树脂性能研究

对硼酸铝(Al18B4O33)晶须改性双酚A二氰酸酯(BADCy)树脂基体的力学性能及热性能进行了研究。经硅烷偶联剂处理后,5％(质量含量,下同)Al18B4O33晶须改性体系的弯曲强度和冲击强度分别提高了14．3％和5．9％;当晶须含量为8％时,体系的弯曲强度和冲击强度分别由原来的112．4MPa和9．17kJ／m2提高到了121．7MPa和10．36kJ／m2,热变形温度提高8℃;经24h水煮后力学性能保持率都在70％以上。     

受阻酚AO-80/羧基丁腈橡胶复合材料的形状记忆特性

制备了受阻酚AO-80/羧基丁腈橡胶(XNBR)复合材料,考察了AO-80用量对复合材料热性能和微观结构的影响,研究了不同AO-80用量和不同形变下复合材料的形状记忆特性。结果表明,随着受阻酚AO-80用量的增加,AO-80/XNBR复合材料的玻璃化转变温度(Tg)逐渐升高,添加100份AO-80时,复合材料的Tg由纯XNBR的-21.30℃升高至7.49℃;在AO-80/XNBR复合材料中,AO-80与XNBR之间形成大量的氢键,通过控制氢键网络强度可以调控材料的特征转变温度;AO-80/XNBR复合材料的形变固定率和形变回复率分别高于99%和89%,明显优于纯XNBR材料,在不同的形变下表现出良好的形状记忆特性,且可重复性非常高。     

CTBN对CB/EP基导电复合材料电性能的影响

以低结构CB(炭黑)为导电填料、EP(环氧树脂)为基体、CTBN(端羧基液体丁腈橡胶)为改性剂和2,4-EMI(2-乙基-4-甲基咪唑)为固化剂,采用超声分散法制备CB/EP基导电复合材料.研究结果表明:CB/EP基导电复合材料具有明显的导电渗流行为,其渗流阈值为w(CB)=7.1％;当w(CTBN)=12％时,含CT...     

氰酸酯/环氧树脂体系的形状记忆效应研究

以不同配比的CE/EP(氰酸酯/环氧树脂)作为共聚体系制备耐温型SMP(形状记忆聚合物)。采用凝胶时间、红外光谱(FT-IR)和弯曲模型等测试手段,确定了合成CE/EP基SMP的最佳工艺条件和形状记忆行为。研究结果表明:当m(CE)∶m(EP)=1∶0.7、固化工艺为"抽真空/30 min→160℃/60 min→190℃/45 min"时,CE/EP共聚体系可完全固化,并能生成网状交联结构的无定形透明态SMP;此时,该SMP具有良好的形状记忆行为,并且其形状记忆行为的可恢复率相对最大。     

环氧树脂/CTBN复合材料的力学性能

采用端羧基液体丁腈橡胶(CTBN)对环氧树脂增韧改性,通过扫描电子显微镜观察了环氧树脂/CTBN复合材料的相态形貌,分析了增韧机理,测试了复合材料的力学性能。CTBN对环氧树脂的增韧机理是剪切变形与"钉扎"机制共同作用的结果;当CTBN添加量为15phr时,环氧树脂/CTBN的综合性能最佳,剪切强度、拉伸强度、悬臂梁缺口冲击强度分别为16.8MPa,28.4MPa,17.53kJ/m2;CTBN可与环氧树脂反应并嵌入其中,与环氧树脂随着固化反应的进行形成两相结构。     

离子液体改性石墨烯/聚氨酯弹性体复合材料的制备及形状记忆性能

采用1-丁基-3甲基咪唑四氟硼酸盐离子液体对石墨烯表面进行功能化修饰,用溶液共混法将离子液体改性石墨烯(IG)填入热塑性聚氨酯弹性体(TPU)制备IG/TPU复合材料,并考察了IG用量对IG/TPU复合材料形状记忆性能的影响.结果表明,纯TPU没有表现出光响应形状记忆性能,在激光照射下几乎没有回复.而IG的加入能显著提...     

具有自修复和形状记忆功能的羧基丁腈橡胶的制备

采用共价键和非共价键结合的方法制备具有自修复和形状记忆功能的羧基丁腈橡胶。首先利用羧基和胺基的酸碱反应来构建离子键和氢键可逆超分子网络，然后通过硫醇-烯反应构建共价交联网络。考察三硫醇交联剂（TMPT）的用量对羧基丁腈橡胶性能的影响。结果表明，随TMPT用量的增加羧基丁腈橡胶的扯断伸长率降低。当不加入TMPT时材料的拉伸强度为1.63 MPa；在120 ℃下修复1 h，自修复效率高达约98%。当加入质量分数为2%的TMPT时，羧基丁腈橡胶拥有最高的拉伸强度，接近2.90 MPa，但在120 ℃下自修复效率仍能达到约84%，且具有约95%的高应变固定率和约90%的应变回复率，表现出优异的形状记忆性能。     

形状记忆聚合物/碳纳米管复合材料的进展

形状记忆聚合物是一种智能材料,能够在外界刺激下改变自身形状.该材料因具有质轻、易加工等优点,受到了人们的广泛关注,并且,在某些领域已经得到应用.但是,聚合物的低强度使其应用范围受到了限制,因此,制备形状记忆复合材料是改善这一缺陷的有效方法.文章介绍了近年来以碳纳米管作为增强填料的形状记忆聚合物复合材料的研究进展,详细说...     

Performance of aluminum borate whisker reinforced cyanate ester resin

Aluminum borate whisker (AlBw) treated with γ‐methacryloxypropyltrimethoxy silane (KH550) and borate ester (BE4) was adopted to modify bisphenol A dicyanate/epoxy resin (BADCy/E‐51) system, in this article. The influence of coupling agent and content of whisker on reaction activity were investigated by gel time and differential scanning calorimeter (DSC) and the results showed that addition of whisker enhances reaction activity of BADCy/E‐51 system slightly. The dispersion of whisker in matrix and reinforcement mechanism was investigated by scanning electron microscope (SEM). Results reveal that whisker treated with BE4 had better dispersing than that treated with KH550 in resin. The thermal stability, mechanical properties, and hot–wet resistance of AlBw/BADCy/E‐51 resin system were also studied. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

以棒状碱式碳酸铝铵为原料制备硼酸铝晶须

在均匀设计实验法及数据挖掘技术得到的优化条件下,采用低温固相法合成棒状碱式碳酸铝铵,以棒状碱式碳酸铝铵和硼酸为原料制备硼酸铝晶须。实验结果表明,棒状碱式碳酸铝铵的Al-O骨架结构对硼酸铝晶须的合成具有诱导作用,加入助熔剂氯化钾有利于一维晶须的生长。经过X射线衍射（XRD）及扫描电镜（SEM）表征,得到的硼酸铝晶须平均直径为0.4 μm,平均长度为16 μm。     

Preparation and characterization of POSS‐SiO2/cyanate ester composites with high performance

In this article, a hybrid filler based on polyhedral oligomeric silsesquioxane and silica, coded as POSS‐SiO₂, has been successfully synthesized. The structure of POSS‐SiO₂ was studied by Fourier‐transform infrared spectra, X‐ray diffraction, and scanning electron microscopy. Then the POSS‐SiO₂ was compounded with dicyclopentadiene bisphenol dicyanate ester (DCPDCE) resin to prepare composites. The effects of POSS‐SiO₂ on the curing reaction, mechanical, thermal, dielectric and tribological properties of DCPDCE resin were investigated systematically. Results of differential scanning calorimetry show that the addition of POSS‐SiO₂ can facilitate the curing reaction of DCPDCE and decrease the curing temperature of DCPDCE. Compared with pure DCPDCE resin, the impact and flexural strengths of the composites materials are improved markedly with up to 72 and 52% increasing magnitude, respectively. Meanwhile, the POSS‐SiO₂/DCPDCE systems exhibit lower dielectric constant and loss than pure DCPDCE resin over the testing frequency from 10 to 60 MHz. In addition, the thermal stability and tribological properties of POSS‐SiO₂/DCPDCE composites are also superior to that of pure DCPDCE resin. POLYM. COMPOS., 36:1840–1848, 2015. © 2014 Society of Plastics Engineers     

硼酸镁晶须的合成及表征

以氢氧化镁和硼酸为原料,利用高温-助熔剂-湿法工艺合成了高品质的硼酸镁晶须。采用XRD、SEM、HR-TEM、SAED等手段表征,系统研究了焙烧温度、焙烧时间、硼镁物质的量比及助熔剂添加量对晶须形貌的影响。结果表明,在焙烧温度为850 ℃、焙烧时间为4 h、n（硼）∶n（镁）=3∶1、n（钠+钾）∶n（镁+硼）=4∶1的条件下,可合成直径为0.5~0.8 μm、长径比为40~240且表面光滑的硼酸镁晶须。还对硼酸镁晶须的高温-助熔剂-湿法工艺合成生长机理进行了探讨。     

硼酸镁晶须的制备与应用研究

系统地介绍了硼酸镁晶须在制备工艺及其应用技术领域的国内外研究现状,通过详细对比分析当前各种硼酸镁晶须的制备方法,回顾硼酸镁晶须的应用范围和增强效果,指出了硼酸镁晶须在制备、应用中存在的问题,以期对中国硼酸镁晶须的开发和综合利用起到促进作用。最后就硼酸镁晶须今后的发展趋势作了展望。     

硼酸镁晶须的可控合成及表征

以六水合氯化镁和硼酸为原料,在水热条件下合成了碱式硼酸镁［MgBO2（OH）］晶须,将其焙烧得到硼酸镁（Mg2B2O5）晶须。采用X射线衍射（XRD）、扫描电镜（SEM）和热重-差热分析（TG-DTA）手段,对前驱体和焙烧产物的物相和形貌进行表征。主要考察了反应物浓度对前驱体物相和形貌的影响,并分析前驱体的形成过程。结果表明,前驱体的制备过程与反应物浓度直接相关,在Mg2+浓度为2.0 mol/L,硼酸浓度为0.75 mol/L的条件下,可合成形貌良好的碱式硼酸镁晶须,将其在较低焙烧温度650 ℃下焙烧3 h,可得到组分单一、直径为40~70 nm、长度为500~1 500 nm、长径比为10~20的硼酸镁晶须。     

酚酞型氰酸酯的合成与表征

采用卤化氰-酚合成法制备了酚酞型CE(氰酸酯),并采用红外光谱(FT-IR)法、质谱法、核磁共振氢谱(1H-NMR)法、毛细管法和差示扫描量热(DSC)法等对酚酞型CE的结构和性能进行了表征和分析,同时对其热性能和热解动力学行为进行了研究。结果表明:酚酞型CE的合成条件为"-15℃搅拌反应1 h→升温至5℃搅拌反应4 h→5℃保温反应2 h";目标产物失重5%温度为435℃,最大失重速率温度为453℃,表观活化能为222.49 kJ/mol,指前因子为1013.97s-1;将酚酞型CE加入到胶粘剂的基础配方中,相应胶粘剂的综合性能略高于基础配方胶粘剂。     

Phase separation behavior of cyanate ester resin/polysulfone blends

The composition of the blends and the curing temperature affect the morphology of the blends and the phase separation mechanism. The phase separation mechanism depends on the viscosity of medium at the initial stage of phase separation determined by the amount of thermoplastics and the curing temperature, and is closely related with the final morphology. When the homogeneous bisphenol A dicyanate (BADCy)/polysulfone (PSF) blends with low content of PSF (less than 10 wt %) were cured isothermally, the blends were phase separated by nucleation and growth (NG) mechanism to form the PSF particle structure. On the other hand, with more than 20 wt % of PSF content, the BADCy/PSF blends were phase separated by spinodal decomposition (SD) to form the BADCy particle structure. With about 15 wt % of PSF content, the blends were phase separated by SD and then NG to form a combined structure having both the PSF particle structure and the BADCy particle structure. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 33–45, 1999     

聚苯胺包覆纳米TiO2/氰酸酯复合材料的介电性能

通过化学氧化原位聚合法制备了聚苯胺包覆纳米TiO2并将其通过溶液共混的方法添加到氰酸酯树脂中,制备了聚苯胺包覆纳米TiO2/氰酸酯复合材料。利用透射电子显微镜,观察了粒子在氰酸酯基体中的分散情况并采用FT-IR、XRD及TGA等手段对其进行了表征。研究了不同粒子添加量对氰酸酯复合材料介电性能的影响。结果表明,包覆了聚苯胺的纳米TiO2对氰酸酯复合材料的介电常数影响较小,但对介电损耗影响较大,粒子的添加量为3%时其介电损耗最大,且其最大吸收损耗峰从频率较低处转移到较高处。聚苯胺包覆纳米TiO2/氰酸酯复合材料有望成为1种新型吸波材料。     

Preparation of POSS/Quartz fibers/cyanate ester resins laminated composites

Quartz fibers (QFs) and two polyhedral oligomeric silsesquioxane (POSS) (epoxy‐POSS and hydroxy‐POSS) are performed to regulate the dielectric properties, heat resistance, and mechanical properties of cyanate ester (CE) resins. With the introduction of POSS, the dielectric constant and dielectric loss tangent values of the POSS/QFs/CE laminated composites are decreased obviously. The heat resistance properties and flexural strength values of the laminated composites are increased, but the interlaminar shear strength values of the laminated composites are decreased slightly. The EP‐POSS/QFs/CE laminated composites have relatively better dielectric, heat resistance, and mechanical properties than those of HO‐POSS/QFs/CE laminated composites. POLYM. COMPOS., 36:2017–2021, 2015. © 2014 Society of Plastics Engineer