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用液体端羧基丁腈橡胶(CTBN)对氰酸酯树脂(CE)进行了增韧改性,通过树脂体系的凝胶时间曲线和DSC曲线确定了体系的固化工艺,并制备了玻璃纤维(GF)增强复合材料。CTBN改性后的CE树脂及复合材料具有良好的力学性能,其中固化树脂的弯曲强度和冲击强度分别提高了34.6%和48%,复合材料的弯曲强度和冲击强度分别提高了11.4%和21.3%,这来源于CTBN对氰酸酯树脂的增韧作用及与GF良好的粘接性能。 相似文献
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对硼酸铝(Al18B4O33)晶须改性双酚A二氰酸酯(BADCy)树脂基体的力学性能及热性能进行了研究。经硅烷偶联剂处理后,5%(质量含量,下同)Al18B4O33晶须改性体系的弯曲强度和冲击强度分别提高了14.3%和5.9%;当晶须含量为8%时,体系的弯曲强度和冲击强度分别由原来的112.4MPa和9.17kJ/m2提高到了121.7MPa和10.36kJ/m2,热变形温度提高8℃;经24h水煮后力学性能保持率都在70%以上。 相似文献
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制备了受阻酚AO-80/羧基丁腈橡胶(XNBR)复合材料,考察了AO-80用量对复合材料热性能和微观结构的影响,研究了不同AO-80用量和不同形变下复合材料的形状记忆特性。结果表明,随着受阻酚AO-80用量的增加,AO-80/XNBR复合材料的玻璃化转变温度(Tg)逐渐升高,添加100份AO-80时,复合材料的Tg由纯XNBR的-21.30℃升高至7.49℃;在AO-80/XNBR复合材料中,AO-80与XNBR之间形成大量的氢键,通过控制氢键网络强度可以调控材料的特征转变温度;AO-80/XNBR复合材料的形变固定率和形变回复率分别高于99%和89%,明显优于纯XNBR材料,在不同的形变下表现出良好的形状记忆特性,且可重复性非常高。 相似文献
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以不同配比的CE/EP(氰酸酯/环氧树脂)作为共聚体系制备耐温型SMP(形状记忆聚合物)。采用凝胶时间、红外光谱(FT-IR)和弯曲模型等测试手段,确定了合成CE/EP基SMP的最佳工艺条件和形状记忆行为。研究结果表明:当m(CE)∶m(EP)=1∶0.7、固化工艺为"抽真空/30 min→160℃/60 min→190℃/45 min"时,CE/EP共聚体系可完全固化,并能生成网状交联结构的无定形透明态SMP;此时,该SMP具有良好的形状记忆行为,并且其形状记忆行为的可恢复率相对最大。 相似文献
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采用端羧基液体丁腈橡胶(CTBN)对环氧树脂增韧改性,通过扫描电子显微镜观察了环氧树脂/CTBN复合材料的相态形貌,分析了增韧机理,测试了复合材料的力学性能。CTBN对环氧树脂的增韧机理是剪切变形与"钉扎"机制共同作用的结果;当CTBN添加量为15phr时,环氧树脂/CTBN的综合性能最佳,剪切强度、拉伸强度、悬臂梁缺口冲击强度分别为16.8MPa,28.4MPa,17.53kJ/m2;CTBN可与环氧树脂反应并嵌入其中,与环氧树脂随着固化反应的进行形成两相结构。 相似文献
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采用共价键和非共价键结合的方法制备具有自修复和形状记忆功能的羧基丁腈橡胶。首先利用羧基和胺基的酸碱反应来构建离子键和氢键可逆超分子网络,然后通过硫醇-烯反应构建共价交联网络。考察三硫醇交联剂(TMPT)的用量对羧基丁腈橡胶性能的影响。结果表明,随TMPT用量的增加羧基丁腈橡胶的扯断伸长率降低。当不加入TMPT时材料的拉伸强度为1.63 MPa;在120 ℃下修复1 h,自修复效率高达约98%。当加入质量分数为2%的TMPT时,羧基丁腈橡胶拥有最高的拉伸强度,接近2.90 MPa,但在120 ℃下自修复效率仍能达到约84%,且具有约95%的高应变固定率和约90%的应变回复率,表现出优异的形状记忆性能。 相似文献
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Aluminum borate whisker (AlBw) treated with γ‐methacryloxypropyltrimethoxy silane (KH550) and borate ester (BE4) was adopted to modify bisphenol A dicyanate/epoxy resin (BADCy/E‐51) system, in this article. The influence of coupling agent and content of whisker on reaction activity were investigated by gel time and differential scanning calorimeter (DSC) and the results showed that addition of whisker enhances reaction activity of BADCy/E‐51 system slightly. The dispersion of whisker in matrix and reinforcement mechanism was investigated by scanning electron microscope (SEM). Results reveal that whisker treated with BE4 had better dispersing than that treated with KH550 in resin. The thermal stability, mechanical properties, and hot–wet resistance of AlBw/BADCy/E‐51 resin system were also studied. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007 相似文献
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In this article, a hybrid filler based on polyhedral oligomeric silsesquioxane and silica, coded as POSS‐SiO2, has been successfully synthesized. The structure of POSS‐SiO2 was studied by Fourier‐transform infrared spectra, X‐ray diffraction, and scanning electron microscopy. Then the POSS‐SiO2 was compounded with dicyclopentadiene bisphenol dicyanate ester (DCPDCE) resin to prepare composites. The effects of POSS‐SiO2 on the curing reaction, mechanical, thermal, dielectric and tribological properties of DCPDCE resin were investigated systematically. Results of differential scanning calorimetry show that the addition of POSS‐SiO2 can facilitate the curing reaction of DCPDCE and decrease the curing temperature of DCPDCE. Compared with pure DCPDCE resin, the impact and flexural strengths of the composites materials are improved markedly with up to 72 and 52% increasing magnitude, respectively. Meanwhile, the POSS‐SiO2/DCPDCE systems exhibit lower dielectric constant and loss than pure DCPDCE resin over the testing frequency from 10 to 60 MHz. In addition, the thermal stability and tribological properties of POSS‐SiO2/DCPDCE composites are also superior to that of pure DCPDCE resin. POLYM. COMPOS., 36:1840–1848, 2015. © 2014 Society of Plastics Engineers 相似文献
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以六水合氯化镁和硼酸为原料,在水热条件下合成了碱式硼酸镁[MgBO2(OH)]晶须,将其焙烧得到硼酸镁(Mg2B2O5)晶须。采用X射线衍射(XRD)、扫描电镜(SEM)和热重-差热分析(TG-DTA)手段,对前驱体和焙烧产物的物相和形貌进行表征。主要考察了反应物浓度对前驱体物相和形貌的影响,并分析前驱体的形成过程。结果表明,前驱体的制备过程与反应物浓度直接相关,在Mg2+浓度为2.0 mol/L,硼酸浓度为0.75 mol/L的条件下,可合成形貌良好的碱式硼酸镁晶须,将其在较低焙烧温度650 ℃下焙烧3 h,可得到组分单一、直径为40~70 nm、长度为500~1 500 nm、长径比为10~20的硼酸镁晶须。 相似文献
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采用卤化氰-酚合成法制备了酚酞型CE(氰酸酯),并采用红外光谱(FT-IR)法、质谱法、核磁共振氢谱(1H-NMR)法、毛细管法和差示扫描量热(DSC)法等对酚酞型CE的结构和性能进行了表征和分析,同时对其热性能和热解动力学行为进行了研究。结果表明:酚酞型CE的合成条件为"-15℃搅拌反应1 h→升温至5℃搅拌反应4 h→5℃保温反应2 h";目标产物失重5%温度为435℃,最大失重速率温度为453℃,表观活化能为222.49 kJ/mol,指前因子为1013.97s-1;将酚酞型CE加入到胶粘剂的基础配方中,相应胶粘剂的综合性能略高于基础配方胶粘剂。 相似文献
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The composition of the blends and the curing temperature affect the morphology of the blends and the phase separation mechanism. The phase separation mechanism depends on the viscosity of medium at the initial stage of phase separation determined by the amount of thermoplastics and the curing temperature, and is closely related with the final morphology. When the homogeneous bisphenol A dicyanate (BADCy)/polysulfone (PSF) blends with low content of PSF (less than 10 wt %) were cured isothermally, the blends were phase separated by nucleation and growth (NG) mechanism to form the PSF particle structure. On the other hand, with more than 20 wt % of PSF content, the BADCy/PSF blends were phase separated by spinodal decomposition (SD) to form the BADCy particle structure. With about 15 wt % of PSF content, the blends were phase separated by SD and then NG to form a combined structure having both the PSF particle structure and the BADCy particle structure. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 33–45, 1999 相似文献
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通过化学氧化原位聚合法制备了聚苯胺包覆纳米TiO2并将其通过溶液共混的方法添加到氰酸酯树脂中,制备了聚苯胺包覆纳米TiO2/氰酸酯复合材料。利用透射电子显微镜,观察了粒子在氰酸酯基体中的分散情况并采用FT-IR、XRD及TGA等手段对其进行了表征。研究了不同粒子添加量对氰酸酯复合材料介电性能的影响。结果表明,包覆了聚苯胺的纳米TiO2对氰酸酯复合材料的介电常数影响较小,但对介电损耗影响较大,粒子的添加量为3%时其介电损耗最大,且其最大吸收损耗峰从频率较低处转移到较高处。聚苯胺包覆纳米TiO2/氰酸酯复合材料有望成为1种新型吸波材料。 相似文献
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Quartz fibers (QFs) and two polyhedral oligomeric silsesquioxane (POSS) (epoxy‐POSS and hydroxy‐POSS) are performed to regulate the dielectric properties, heat resistance, and mechanical properties of cyanate ester (CE) resins. With the introduction of POSS, the dielectric constant and dielectric loss tangent values of the POSS/QFs/CE laminated composites are decreased obviously. The heat resistance properties and flexural strength values of the laminated composites are increased, but the interlaminar shear strength values of the laminated composites are decreased slightly. The EP‐POSS/QFs/CE laminated composites have relatively better dielectric, heat resistance, and mechanical properties than those of HO‐POSS/QFs/CE laminated composites. POLYM. COMPOS., 36:2017–2021, 2015. © 2014 Society of Plastics Engineer 相似文献