金属氧化物气敏新材料的开发

提出了开发n型金属氧化物气敏材料的理论,指出了禁带宽度Eg2 eV的材料都有可能研制薄膜气敏元件,通过Fe2O3/2%CeO2,TiO2/2%CeO2薄膜元件试制成功,论证了理论的正确性;发展了复合材料的开发理论,对ZnSnO3的气敏特性进行了测试。     

薄膜气敏材料的性能和研制薄膜气敏元件的工艺探索

给出了薄膜气敏材料性能的测试结果：存在最佳灵敏度膜厚l *（ l *≈1500?）;动态特性;膜越薄响应越快;存在最佳掺杂（ CeO2）量x%,x的取值范围为5~15。提出了复合绝缘膜Si/SiO2/Al2 O3衬底;提出了研制薄膜的粉末溅射;给出了研制电导气敏薄膜元件的工艺流程,并对各工艺进行了必要的说明。     

半导体陶瓷型薄膜气敏传感器的研究进展

半导体陶瓷型薄膜气敏传感器,具有灵敏度高、与气体反应快、制备成本较低等优点,已经成为近年传感器研究和开发的重点．是未来气敏传感器的发展方向之一。本文介绍了陶瓷型半导体薄膜气敏传感器常见的器件结构、薄膜材料的主要制备方法．部分主要的半导体金属氧化物薄膜气敏材料．以及近期相关的研究进展,并扼要分析了今后的发展方向。     

金属氧化物半导体气敏传感器稳定性研究进展

金属氧化物半导体(MOS)气敏传感器的稳定性是气敏器件实用化进程中最具有挑战性的因素。影响器件稳定性的主要因素包括颗粒尺寸、颈部宽度、微裂纹、电极、湿度和温度的变化。颗粒的长大和颗粒间颈部尺寸的变化降低了耗尽层对总电阻变化的贡献;微裂纹的加剧使器件的电阻发生漂移,并且为水蒸气、氧气和待测气体扩散到敏感膜内部提供便捷的通道;电极的退化影响电极与气敏材料之间的接触电阻Rc;温度和湿度的改变使气体的吸附、脱附、反应活性和电子迁移率等都发生变化,因而器件的稳定性得不到保证。在机理分析的基础上,分别介绍了提高器件稳定性的方法。     

金属氧化物半导体薄膜气敏机理研究进展

气体传感器的核心介质为气敏薄膜,而薄膜本身的特性有关键的影响,主要体现在薄膜微观结构如晶粒尺寸、膜厚、空隙率和有效表面积等方面。溶胶-凝胶法由于有方法简单及成膜温度低等优点,得到了广泛研究与应用。本文综述了溶胶-凝胶法制备的金属氧化物薄膜微纳结构与气敏机理进来的研究进展,结果表明最佳的晶粒尺寸约为10nm,最佳膜厚约为110 nm。在晶粒尺寸控制方面,通过控制煅烧温度与时间及在溶胶-凝胶过程中加入不同的添加剂,可有效优化晶粒尺寸提高灵敏度。最后,从能带结构角度总结了气敏传感器的电学特性及荷电传输机理,讨论了热电子发射理论和电子隧穿理论起主导作用时的薄膜微纳结构。     

金属氧化物气敏传感器的研究现状及其发展趋势

综述了国内外金属氧化物气敏传感器的生产和应用概况，分析了国内外目前的生产技术水平与现状，展望了金属氧化物气噩在的发展前景。     

磁控溅射WO_3薄膜的制备及其NO_2气敏特性研究

采用直流反应磁控溅射法,在室温条件下通过改变放电气体压强制备出具有不同膜密度的WO3薄膜。结构表征结果表明,由单斜晶WO3纳米颗粒组成的薄膜具有层状结构,随着放电气体压强的增加,膜密度呈下降趋势。气敏特性研究结果表明,由WO3薄膜制备而成的气体传感器在工作温度为200℃时获得对NO2气体的最大灵敏度,并在50~300℃的工作温度范围内对NO2气体均展现出良好的气敏特性。在相同的检测条件下,气体灵敏度随着膜密度的减少而增加。     

WO3薄膜的制备及气敏特性研究进展

WO3薄膜是一种智能材料，在电致变色、共催化和气敏性方面具有广阔的应用前景。综述了WO3薄膜材料的制备方法及现状，并对其优缺点进行了评价。介绍了气敏性方面的应用和机理，说明了不同掺杂对气敏的影响；并对今后的发展方向提出了一些看法。     

高性能金属氧化物基气敏材料研究及应用

金属氧化物基气敏材料是新型气体传感器的核心组成部分,近年来发展迅速。围绕金属氧化物基气敏材料的作用机理、特征参数、性能强化及工业应用进行了阐述和展望。重点分析了金属掺杂、结构薄膜化以及多元复合技术在强化金属氧化物基气敏材料性能方面的研究。在此基础上,对今后的研究方向和趋势作了展望。     

多层气敏薄膜表面吸附及界面扩散的研究

制备了ＳｎＯ３／ＺｎＯ及ＺｎＯ／ＳｎＯ３多层结构的气敏薄膜，用能谱结合氩离子刻蚀的方法及Ｘ射线衍射法，对薄膜的表面吸附。膜间的相互与组成等进行了研究，结果表明：薄膜表面存在少量的吸附多层膜中锌的扩散远比锡一个模型，对吸附现象作了初步的解释，讨论了造成锌锡扩散的原因。     

Al-Mg-B thin films prepared by magnetron sputtering

Hard, nanocomposite aluminum magnesium boride thin films were prepared on Si (100) substrates with a three target magnetron sputtering system. The films were characterized by X-ray diffraction, atomic force microscope, electron micro-probe, Fourier transform infrared spectroscopy and nanoindentation. The results show that the maximum hardness of the as-deposited films is about 30.7 GPa and these films are all X-ray amorphous with smooth surfaces. The influences of substrate temperature and boron sputtering power on the quality of the films are discussed. From the results of this work, magnetron sputtering is a promising method to deposit Al-Mg-B thin films.     

磁控溅射Ni-Mn-Ga薄膜的磁致应变

采用直流磁控溅射的方法,在NaCl基底上沉积了Ni-Mn-Ga薄膜,对薄膜进行了形貌观察、微区成分及结构分析,并测量了薄膜的磁致应变.结果表明,薄膜表面可见大小不一的团簇颗粒,具有明显的岛状结构,表明Ni-Mn-Ga薄膜的形成为典型的核生长型机制.热处理前的薄膜具有部分非晶存在,热处理后薄膜晶化为多晶形态.无约束薄膜在磁场下呈现负的磁致应变,在1.3T磁场下,其最大应变值可达-0.008%,并且可以完全恢复.     

Properties of zirconia thin films prepared by reactive magnetron sputtering

The search for alternative dielectric materials with high dielectric constant, thermodynamic stable on silicon substrate and low direct tunneling current leads to oxide based materials like zirconia. Zirconia thin films were prepared by reactive magnetron sputtering. The capacitance voltage, ac and dc electrical characteristics were investigated and the values like fixed oxide charges were calculated and compared among the samples with and without annealing. Films annealed at 700 °C showed a dielectric constant ∼ 26 with interface trap densities of 1.629 × 10¹² eV^− 1 cm^− 2.     

Ellipsometry study of InN thin films prepared by magnetron sputtering

Indium nitride (InN) thin films have been deposited on Si(1 0 0) substrates at temperature of 100–400 °C by reactive radio frequency (RF) magnetron sputtering. We measured the ellipsometric spectra of the InN film samples, and obtained the optical constants for the wavelength range of 410–1100 nm. The absorption edge of the InN films is 1.85–1.90 eV. The thicknesses of various InN films are found to be dependent on the substrate temperature.     

Electronic conduction processes in Pt-doped tin oxide thin films prepared by RF magnetron sputtering

Thin films of Pt-doped SnO₂ were prepared by RF magnetron sputtering onto glass substrates maintained at room temperature. Gold electrodes were provided by conventional vacuum evaporation to form sandwich structures. X-ray diffraction measurements confirmed the films to be of an amorphous structure. Room temperature d.c. measurements showed a dominant Poole-Frenkel conduction process at low applied voltages, both under vacuum and in ambient air, but the results of the latter exhibited localized field enhancement caused by various adsorbed oxygen species. At higher voltages space-charge-limited conductivity was observed, with the temperature parameter characterizing the exponential trap distribution decreasing from approximately 1500 to 1050 K as a result of the oxygen adsorption. A.c. conductivity was characterized by an angular frequency, , dependence of the form ^s with an indexs < 1, and was associated with a relaxation process due mainly to a charge-carrier hopping mechanism. Both capacitance and loss tangent decreased with increasing frequency, in accordance with existing theory for samples provided with ohmic contacts.     

Photoemission study of the tin doped cerium oxide thin films prepared by RF magnetron sputtering

Ce-Sn-O mixed oxide films prepared by simultaneous Sn metal and cerium oxide magnetron sputtering were studied by high resolution photoemission. The analysis showed that the degree of reduction of the cerium oxide depends on the tin concentration in the film. Ce⁴⁺ → Ce³⁺ conversion is explained by a charge transfer from Sn atoms to unoccupied orbital Ce 4f⁰ of cerium oxide by forming Ce 4f¹ state. The X-ray Photoelectron Spectroscopy data were compared with study of the single-crystalline CeO₂ thin films and Sn/CeO₂(111) model system prepared and studied in situ excluding air exposure effects.     

Amorphous indium tungsten oxide films prepared by DC magnetron sputtering

Indium-tungsten-oxide (IWO) films were prepared by dc magnetron sputtering at ambient substrate temperature (T_s). Characteristics of the films were compared with those of In₂O₃–SnO₂ (ITO) thin films prepared under the same condition. The sputter-deposited IWO films have entirely amorphous structure with an average transmittance of over 85% in the visible range and exhibit a minimum resistivity of 3.2 × 10^–4cm at W content [W/(In + W)] of 0.57 at.%. An in-situ heating X-ray diffraction measurement have shown that the crystallization temperature of IWO films is higher than those of ITO films (150–160C) and increases with increasing W content. This enabled a smooth amorphous surface of IWO films as compared with a rough surface of partially crystallized ITO films as revealed by an atomic force microscopy. IWO films are useful for transparent electrode of organic light emitting diode and polymer LCDs because of the low resistivity, high transparency and smooth surface obtainable by the conventional dc magnetron sputtering at room temperature.     

Photoelectrochemical properties of nitrogen-doped indium tin oxide thin films prepared by reactive DC magnetron sputtering

Nitrogen-doped indium tin oxide (N-ITO) thin films are deposited on unheated ITO glass substrates in this study. The structural properties of the N-ITO thin films, determined by X-ray diffraction (XRD) and Raman scattering, show that the indium nitride (InN) phase is liable to form in N-ITO films prepared in 20% N₂. A broad XRD peak around 2θ = 33° and Raman peak around 490 cm^− 1 are assigned to the InN phase, but no such peak is observed from the ITO film. Hence, the bandgap is narrowed by N-doping for absorbing light of longer wavelengths of ~ 500 nm. However, under illumination by ultraviolet, the N-ITO film prepared in 20% N₂ exhibits the least photocurrent response, which is less than one third that of the N-ITO catalyst that was doped in 16.4% N₂. This result is attributed mostly to the fact that the valence and conduction band potentials are not positioned properly between the newly formed InN and host ITO phases, rendering inefficient inter-semiconductor electron transfer. Therefore, higher N-doped samples exhibit a lower photocurrent response. Interestingly, the N-ITO film prepared in 16.4% N₂ exhibits the highest photocurrent density of about 165.5 μA/cm² at an applied bias of 1.2 V. This implies that the N-ITO films should be prepared at a low N₂ ratio to ensure a favorable photoelectrochemical activity.     

磁控溅射抗EMI金属膜的研究

首先对金属屏蔽的机理以及Schelkunoff电磁屏蔽理论进行了分析,然后采用磁控溅射的方法在PET塑料上沉积了Cu/1Cr18Ni9Ti,并采用波导的方法对样品的屏蔽效能进行了测试.研究表明单次反射损耗对屏蔽效能的贡献最大,双面金属膜层比单面金属膜层具有更高的屏蔽效果.