共查询到18条相似文献,搜索用时 125 毫秒
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MLCC钯银内电极浆料性能研究 总被引:3,自引:2,他引:1
MLCC钯银内电极浆料主要由钯银粉、有机载体和无机添加剂三部分组成.试验表明:钯银粉中钯的含量决定了浆料的烧成温度及成本价格的高低;有机载体的作用是提供浆料一定的流变性能,以满足浆料在MLCC丝网印刷时的工艺要求,有机载体触变性的大小直接影响着浆料丝印图形质量的好坏;无机添加剂的作用是抑制浆料在烧成过程中的过快收缩,选择不同的无机添加剂可以调整浆料在烧成过程中其所形成的电极层与介质层之间的烧成收缩率的匹配,避免MLCC产品由于匹配问题所引起电极开裂等质量问题. 相似文献
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多层陶瓷电容器银/钯内电极浆料的烧结 总被引:1,自引:0,他引:1
研究了多层陶瓷电容器银/钯内电极浆料的烧结行为。热重分析(TGA)结果表明,在烧结过程中,银/钯内电极浆料发生氧化-还原反应。XRD分析表明,由于内电极浆料的氧化-还原反应,在不同的烧成温度下,银/钯内电极具有不同的合金状态。通过计算,可以初步确定内电极的银/钯合金状态和银/钯合金为银/钯比例。这些结果有助于理解多层陶瓷电容器在烧成过程中的银扩散和挥发。 相似文献
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MLC银端电极浆料的研究 总被引:3,自引:0,他引:3
用光亮超细导电银粉、玻璃料粉和有机粘合剂等制成浆料。经浸涂、干燥、烧成形成多层瓷介电容器的端电极。试验结果表明,本浆料达到引进线的工艺技术要求和端电极专用浆料的标准要求;各种技术性能良好,可与进口的美国同类浆料媲美。 相似文献
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PTCR热敏电阻器电极浆料烧成工艺 总被引:2,自引:2,他引:0
对SD1140型欧姆银浆、SD1141型表层银浆、SD1142型铝电极浆料进行了工艺实验,确定了烧成工艺的最佳参数,如:烧成膜厚、升温时间、保温时间、烧成温度。 相似文献
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银/导电陶瓷复合电极浆料导电性的研究 总被引:2,自引:2,他引:0
采用银和导电陶瓷(LaNiO3和LaFe0.25Ni0.75O3)作复合电极浆料,并研究了复合电极浆料的导电性与导电陶瓷比例及种类的关系。结果发现,复合电极浆料的电阻率随导电陶瓷比例的增加而增大,当LaNiO3和LaFe0.25Ni0.75O3两种导电陶瓷的质量分数<15%时,两种复合浆料的导电性均变化不大。SEM观测显示,复合电极浆料制成的电极有很好的烧成表面。 相似文献
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Yaqing Li Xiayao Lu Yantao Mei Chen Dong Deepak Thrithamarassery Gangadharan Kong Liu Zhijie Wang Shengchun Qu Makhsud I. Saidaminov Weifeng Zhang Furui Tan 《Advanced functional materials》2023,33(34):2301920
Perovskite solar cells with carbon electrode have a commercial impact because of their facile scalability, low-cost, and stability. In these devices, it remains a challenge to design an efficient hole transport layer (HTL) for robust interfacing with perovskite on one side and carbon on another. Herein, an organic/inorganic double planar HTL is constructed based on polythiophene (P3HT) and nickel oxide (NiOx) nanoparticles to address the named challenge. Through adding an alkyl ammonium bromide (CTAB) modified NiOx nanoparticle layer on P3HT, the planar HTL achieves a cascade type-II energy level alignment at the perovskite/HTL interfaces and a preferential ohmic contact at NiOx/carbon electrode, which greatly benefits in charge collection while suppressing charge transfer recombination. Besides, compared with the single P3HT layer, the planar composite enables a robust interfacial contact by protecting perovskite from being corroded by carbon paste during fabrication. As a result, the blade-coated FA0.6MA0.4PbI3 perovskite solar cells (fabricated in ambient air in fume hood) with carbon electrode deliver an efficiency of 20.14%, the highest value for bladed coated carbon and perovskite solar cells, and withstand 275 h maximum power point tracking in air without encapsulation (95% efficiency retained). 相似文献
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Micrometric-sized pixels of hybrid organic–inorganic thin films (Ag/parylene-C) have been printed by laser-induced forward transfer (LIFT) on flexible, cost-efficient substrates. Micrometric capacitors have been fabricated by laser printing such pixels together with silver nanoparticles (AgNP) paste. The AgNP paste has been deposited in the shape of square pads, acting as bottom electrode. This combination is suitable to be used in microelectronic circuits, as the electrical components exhibit controllable capacity in the pF–nF range. Electrical characterizations of the printed pixels demonstrate that the capacitors are fully operative and stable over time. 相似文献
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Microstructure of termination of a base metal electrode multilayer ceramic capacitor (BME-MLCC) using copper-nickel bimetallic powder as electrode material was investigated. Thick film paste containing nonagglomerated monodispersed copper-nickel bimetallic powder was applied in preparing the termination electrode of a BME-MLCC. Influence of an inorganic binder on the microstructure of the termination of BME-MLCC was studied. The distribution of metallic copper on the surface of glass bubbles in termination was investigated by energy dispersive X-ray. A scanning electron microscope and a polarized light microscope were applied to discuss the microstructure of thick film. The results show that suitable binder and firing temperature result in the excellent connection between internal and termination electrode, as well as one between termination electrode and green chip. The BME-MLCCs with a dense surface of end termination, high adhesion, and qualified electrical behavior were obtained. The rough interface from interfacial reaction between glass and chip gives high adhesion 相似文献
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氮化铝共烧基板金属化及其薄膜金属化特性研究 总被引:2,自引:0,他引:2
大规模集成电路的发展,对芯片之间的互连提出了更高的要求,高端电子系统中高密度封装技术逐渐成为发展的主流。多芯片组件(MCM)是微电子封装的高级形式,它是把裸芯片与微型元件组装在同一个高密度布线基板上,组成能够完成一定的功能的模块甚至子系统。MCM还能够实现电子系统的小型化、高密度化,是实现系统集成的重要途径,在MCM中高密度布线的多层基板技术是实现高密度封装的关键。 相似文献
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研究了导电相、玻璃相和添加剂对多层布线表面电阻的方阻、温度系数和稳定性的影响,分析了介质层与电阻层之间的相互作用而导致电阻阻值变化的机理。结果表明,选择与介质层相匹配的钌酸铅导电相和铅硅铝玻璃相做功能相,可制得性能良好的电阻浆料。添加剂对提高电阻性能有很大影响。 相似文献