An SOI LDMOS/CMOS/BJT technology for integrated power amplifiersused in wireless transceiver applications

This paper describes a SOI LDMOS/CMOS/BJT technology that can be used in portable wireless communication applications. This technology allows the complete integration of the front-end circuits with the baseband circuits for low-cost/low-power/high-volume single-chip transceiver implementation. The LDMOS transistors (0.35 μm channel length, 3.8 μm drift length, 4.5 GHz f_T and 21 V breakdown voltage), CMOS transistors (1.5 μm channel length, 0.8/-1.2 V threshold voltage), lateral NPN transistor (18 V BV_CBO and h _FE of 20), and high Q-factor (up to 6.1 at 900 MHz and 7.2 at 1.8 GHz) on-chip inductors are fabricated. A fully-functional high performance integrated power amplifier for 900 MHz wireless transceiver application is also demonstrated     

A LDMOS technology compatible with CMOS and passive components forintegrated RF power amplifiers

The authors describe a bulk silicon LDMOS technology, which is compatible with CMOS and passive components, for the implementation of RF integrated power amplifiers (IPA's) used in portable wireless communication applications. This technology allows complete integration of the low cost and low power front-end circuits with the baseband circuits for single-chip wireless communication systems. The LDMOS transistor (0.35 μm channel length, 3.85 μm drift length, 3 GHz f _T and 20 V breakdown voltage), CMOS transistors (1.5 μm channel length), and high Q-factor (up to 6.10 at 900 MHz and 7.14 at 1.8 GHz) on-chip inductor are designed and fabricated to show the feasibility of the IPA implementation     

A BiCMOS wideband operational amplifier with 900 MHz gain-bandwidth and 90 dB DC gain

A fully differential operational amplifier has been designed and fabricated for a novel high resolution and high frequency analog-to-digital converter(>12-bit). The amplifier mainly consists of folded cascode structure with current source as output loads and common-mode feedback circuits. The technique of feedforward compensation is used in order to improve the settling time and gain bandwidth (GBW) of this amplifier. This amplifier is integrated in 0.8 mm BiCMOS process with an active die area of 0.1 mm². The DC gain of this amplifier is 90 dB. The GBW and phase margin of this amplifier is 900 MHz and 47°, respectively. The power dissipation is minimized by using BiCMOS technology and is about 25 mW for 2 pF load capacitance. This level of performance is competitive with CMOS and BiCMOS operational amplifier circuits previously reported by nearly two orders of magnitude.Ecole Polytechnique of the University of Montreal     

A 3.2-V operation single-chip dual-band AlGaAs/GaAs HBT MMIC poweramplifier with active feedback circuit technique

This paper describes the design and experimental results for a 3.2-V operation single-chip AlGaAs/GaAs heterojunction bipolar transistor (HBT) monolithic microwave integrated circuit (IMMIC) power amplifier for GSM900 and DCS1800 dual-band applications. The following two new circuit techniques are proposed for implementing the power amplifier. One is an on-chip HBT bias switch which in turn switches the amplifier between 900 and 1800 MHz. The proposed switch configuration allows the switch using a high turn-on voltage of 1.3 V of AlGaAs/GaAs HBT's to operate with a 3-V low supply voltage, because the switch circuitry needs no stacked configuration. The other is an active feedback circuit (AFB) to prevent permanent failure of HBT's in the output power stage even under severe conditions of oversupply voltage and strongly mismatching load. Experimental results revealed that the proposed feedback circuit, which works as a voltage limiter, can protect the output stage HBT's from an excessive collector voltage swing even when the amplifier is operated under a condition of a 5-V oversupply voltage and a 10:1 voltage standing-wave ratio (VSWR) mismatching load. Under a normal condition of 3.2 V and a 50-Ω matching load, the IC is capable of delivering an output power of 34.5 dBm and a power-added efficiency (PaE) of 52% in a GSM900 mode, and a 32-dBm output power and a 32% PAE in a DCS1800 mode     

A single-chip 900-MHz spread-spectrum wireless transceiver in1-μm CMOS. I. Architecture and transmitter design

A single-chip transceiver for frequency-hopped code division multiple access (CDMA) in the 900 MHz industrial, scientific and medical (ISM) band is implemented in 1-μm CMOS. It combines a digital frequency synthesizer, a double quadrature upconverter, an integrated oscillator, and a power amplifier with variable output. Data modulates a carrier hopping at 20 kHz with quaternary frequency-shift keying (4-FSK). At an output power level of +3 dBm, the harmonics and spurious tones lie at -52 dBc or below. When active, the transmitter drains 100 mA from 3 V     

A Single-Chip CMOS Transceiver for UHF Mobile RFID Reader

This paper describes a single-antenna low-power single-chip radio frequency identification (RFID) reader for mobile phone applications. The reader integrates an RF transceiver, data converters, a digital baseband modem, an MPU, memory, and host interfaces. The direct conversion RF receiver architecture with the highly linear RF front-end circuit and DC offset cancellation circuit is used to give good immunity to the large transmitter leakage. It is suitable for a mobile phone reader with single-antenna architecture and low-power reader solution. The transmitter is implemented in the direct I/Q up-conversion architecture. The frequency synthesizer based on a fractional-N phase-locked-loop topology offering 900 MHz quadrature LO signals is also integrated with the RF transceiver. The reader is fabricated in a 0.18 mum CMOS technology, and its die size is 4.5 mm times 5.3 mm including electrostatic discharge I/O pads. The reader consumes a total current of 89 mA apart from the external power amplifier with 1.8 V supply voltage. It achieves an 8 dBm P1dB, an 18.5 dBm IIP3, and a maximum transmitter output power of 4 dBm.     

A fully integrated SOI RF MEMS technology for system-on-a-chip applications

In this paper, a silicon-on-insulator (SOI) radio-frequency (RF) microelectromechanical systems (MEMS) technology compatible with CMOS and high-voltage devices for system-on-a-chip applications is experimentally demonstrated for the first time. This technology allows the integration of RF MEMS switches with driver and processing circuits for single-chip communication applications. The SOI high-voltage device (0.7-/spl mu/m channel length, 2-/spl mu/m drift length, and over 35-V breakdown voltage), CMOS devices (0.7-/spl mu/m channel length and 1.3/-1.2 V threshold voltage), and RF MEMS capacitive switch (insertion loss 0.14 dB at 5 GHz and isolation 9.5 dB at 5 GHz) are designed and fabricated to show the feasibility of building fully integrated RF systems. The performance of the fabricated RF MEMS capacitive switches on low-resistivity and high-resistivity SOI substrates will also be compared.     

A $$3\,\hbox{nV}/{\sqrt{\hbox{Hz}}}$$ rail-to-rail operational amplifier in silicon-on-sapphire with constant transconductance

This paper presents the design, fabrication, and electrical measurement results from a low-noise high-performance amplifier fabricated in the 0.5 μm silicon-on-sapphire (SOS) technology. The amplifier was designed with rail-to-rail input and output swing and constant transconductance in its entire common-mode range and targets biomedical instrumentation in SOS/SOI technologies. The amplifier reports \(3\,\hbox{nV}/{\sqrt{\hbox{Hz}}}\) of input-referred voltage noise at 10 kHz and has 0.4 mV of input-referred offset. The gain-bandwidth product of the amplifier is 12 MHz and the open-loop gain is 75 dB. The amplifier occupies 0.08 mm² of area and consumes 1.4 mW of power.     

An Assessment of µ-Czochralski, Single-Grain Silicon Thin-Film Transistor Technology for Large-Area, Sensor and 3-D Electronic Integration

Single-grain (SG) thin-film transistors (TFTs) fabricated inside location-controlled silicon grains using the mu-Czochralski method are benchmarked for analog and RF applications. Each silicon grain is defined by excimer laser recrystallization of polysilicon. Thin-film transistors may be fabricated in this manner on silicon or low-cost flexible plastic substrates as processing temperatures remain below 350degC, making the SG-TFT a potential enabling technology for large-area highly integrated electronic systems or systems-in-package with low manufacturing cost. Operational amplifier and voltage reference circuits of varying complexity were designed and measured in order to evaluate the effects of channel position and processing variation on analog circuits. A two-stage telescopic cascode operational amplifier fabricated in an experimental 1.5 mum SG-TFT technology demonstrates a DC gain of 55 dB (unity-gain bandwidth of 6.3 MHz), while a prototype CMOS voltage reference with a power supply rejection ratio (PSRR) of 50 dB is also demonstrated. With f_T comparable to single-crystal MOSFETs of comparable gate length, the SG-TFT can also enable RF circuits for wireless applications. A 12 dB gain RF cascode amplifier with on-chip inductors and operating in the 433 MHz ISM band is demonstrated. Excellent agreement with simulations is attained using a modified BSIM-SOI model extracted from measurements of experimental SG-TFT devices.     

100-V high-performance amplifiers in BCD technology for SLICapplications

The circuits described by the authors are a line driver and a sensing amplifier. They are part of a subscriber line interface circuits (SLIC) fabricated in BCD technology that operates up to 100 V. The driver requires about 500 μA of quiescent current, can sink and source up to 100 mA, and remains stable for all possible line lengths. The sensing amplifier senses the line current to synthesize both the AC and DC line terminations. It achieves a 2-mV offset and a gain-bandwidth product of 2.5 MHz. The adopted mixed technology allows the realization of a compact single-chip SLIC     

A 0.5-V power-supply scheme for low-power system LSIs using multi-V/sub th/ SOI CMOS technology

This paper proposes a novel power-supply scheme suitable for 0.5-V operating silicon-on-insulator (SOI) CMOS circuits. The system contains an on-chip buck DC-DC converter with over 90% efficiency, 0.5-V operating logic circuits, 100-MHz operating flip-flops at 0.5-V power supply, and level converters for the interface between the 0.5-V operating circuit and on-chip digital-to-analog (D/A) converters or external equipment. Based on the theory, the values of on-resistance and threshold voltage of SOI transistors are clarified for the 0.5-V/10-mW output DC-DC converter, which satisfies both high efficiency and low standby power. The proposed flip-flop can hold the data during the sleep with the use of the external power supply, while maintaining high performance during the active. The level converter comprises dual-rail charge transfer gates and a CMOS buffer with a cross-coupled nMOS amplifier to operate with high speed even in a conversion gain of higher than 6, where the conversion gain is defined as the ratio of the output and input signal swings. The test chip was fabricated for the 0.5-V power supply scheme by using multi-V/sub th/ SOI CMOS technology. The experimental results showed that the buck DC-DC converter achieved a conversion efficiency of 91% at 0.5-V/10-mW output with stable recovery characteristics from the sleep, and that the dual-rail level converter operated with a maximum data rate of 300 Mb/s with the input signal swing of 0.5 V.     

Ku-Band Power Amplifier MMIC Chipset with On-Chip Active Gate Bias Circuit

We propose a Ku-band driver and high-power amplifier monolithic microwave integrated circuits (MMICs) employing a compensating gate bias circuit using a commercial 0.5 μm GaAs pHEMT technology. The integrated gate bias circuit provides compensation for the threshold voltage and temperature variations as well as independence of the supply voltage variations. A fabricated two-stage Ku-band driver amplifier MMIC exhibits a typical output power of 30.5 dBm and power-added efficiency (PAE) of 37% over a 13.5 GHz to 15.0 GHz frequency band, while a fabricated three-stage Ku-band high-power amplifier MMIC exhibits a maximum saturated output power of 39.25 dBm (8.4 W) and PAE of 22.7% at 14.5 GHz.     

Designing gallium nitride-based monolithic microwave integrated circuits for the Ka, <Emphasis Type="Italic">V</Emphasis>, and <Emphasis Type="Italic">W</Emphasis> bands

A technology for fabricating multifunction monolithic microwave integrated circuits (MMICs) based on gallium nitride (GaN) heterostructures, which operate at the frequency range up to 100 GHz (the Ka, V, and W bands), is developed. Power amplifier (PA) MMICs operating at 90 GHz are fabricated using the coplanar technology with the gain coefficient being up to 15 dB and the specific output power exceeding 500 mW/mm. In addition, microstrip technology with the use of the polymer dielectric and grounding metallization over the wafer surface without through holes in the substrate is approved. The parameters of the MMICs for multifunction single-chip transmit-receive modules (TRMs), as well as the parameters of the MMICs for intermediate-frequency amplifiers (IFAs), voltage-controlled oscillators (VCOs), low noise amplifiers (LNAs), PAs, and balanced mixers operating in the Ka and V bands (up to 70 GHz), which are fabricated using the proposed technology, are presented.     

Design and implementation of a reconfigurable mixed-signal SoC based on field programmable analog arrays

This work presents a reconfigurable mixed-signal system-on-chip (SoC), which integrates switched-capacitor-based field programmable analog arrays (FPAA), analog-to-digital converter (ADC), digital-to-analog converter, digital down converter, digital up converter, 32-bit reduced instruction-set computer central processing unit (CPU) and other digital IPs on a single chip with 0.18 μm CMOS technology. The FPAA intellectual property could be reconfigured as different function circuits, such as gain amplifier, divider, sine generator, and so on. This single-chip integrated mixed-signal system is a complete modern signal processing system, occupying a die area of 7×8 mm² and consuming 719 mW with a clock frequency of 150 MHz for CPU and 200 MHz for ADC/DAC. This SoC chip can help customers to shorten design cycles, save board area, reduce the system power consumption and depress the system integration risk, which would afford a big prospect of application for wireless communication.     

A 0.13 μm CMOS UWB RF Transmitter with an On‐Chip T/R Switch

This paper presents a fully integrated 0.13 μm CMOS MB‐OFDM UWB transmitter chain (mode 1). The proposed transmitter consists of a low‐pass filter, a variable gain amplifier, a voltage‐to‐current converter, an I/Q up‐mixer, a differential‐to‐single‐ended converter, a driver amplifier, and a transmit/receive (T/R) switch. The proposed T/R switch shows an insertion loss of less than 1.5 dB and a Tx/Rx port isolation of more than 27 dB over a 3 GHz to 5 GHz frequency range. All RF/analog circuits have been designed to achieve high linearity and wide bandwidth. The proposed transmitter is implemented using IBM 0.13 μm CMOS technology. The fabricated transmitter shows a ?3 dB bandwidth of 550 MHz at each sub‐band center frequency with gain flatness less than 1.5 dB. It also shows a power gain of 0.5 dB, a maximum output power level of 0 dBm, and output IP3 of +9.3 dBm. It consumes a total of 54 mA from a 1.5 V supply.     

A 0.5-V 25-MHz 1-mW 256-kb MTCMOS/SOI SRAM for solar-power-operated portable personal digital equipment - sure write operation by using step-down negatively overdriven bitline scheme

Multithreshold-voltage CMOS (MTCMOS) technology has a great advantage in that it provides high-speed operation with low supply voltages of less than 1 V. A logic gate with low-V/sub th/ MOSFETs has a high operating speed, while a low-leakage power switch with a high-V/sub th/ MOSFET eliminates the off-leakage current during sleep time. By using MTCMOS circuits and silicon-on-insulator (SOI) devices, the authors have developed a 256-kb SRAM for solar-power-operated digital equipment. A double-threshold-voltage MOSFET (DTMOS) is adopted for the power switch to further reduce the off leakage. As regards the SRAM core design, we consider a hybrid configuration consisting of high-V/sub th/ and low-V/sub th/ MOSFETs (that is, multi-V/sub th/ CMOS). A new memory cell with a separate read-data path provides a larger readout current without degrading the static noise margin. A negatively overdriven bitline scheme guarantees sure write operation at ultralow supply voltages close to 0.5 V. In addition, a charge-transfer amplifier integrated with a selector and data latches for intrabus circuitry are installed to enhance the operating speed and/or reduce power dissipation. A 32K-word /spl times/ 8-bit SRAM chip, fabricated with the 0.35-/spl mu/m multi-V/sub th/ CMOS/SOI process, has successfully operated at 25 MHz under typical conditions with 0.5-V (SRAM core) and 1-V (I/O buffers) power supplies. The power dissipation during sleep time is less than 0.4 /spl mu/W and that for 25-MHz operation is 1 mW, excluding that of the I/O buffers.     

Application of enhancement mode FET technology for wirelesssubscriber transmit/receive circuits

Single-supply power amplifiers have become the new paradigm in portable phone handsets due to the recent availability of heterojunction bipolar transistor (HBT) and pseudo enhancement mode PHEMT technology. We have developed a true enhancement mode heterostructure insulated-gate FET device (HIGFET) which is suitable for use in both saturated and linear power amplifiers. A three-stage power amplifier designed for 1900-MHz NADC application delivered +30-dBm output power and 41.7% power-added efficiency with an adjacent channel power of -29.8 dBc and alternate adjacent channel power of -48.4 dBc. In addition to this, we have demonstrated excellent noise figure and linearity performance for small-signal applications. At 900 MHz and bias conditions V_DS=1.0 V and I_DSQ=1 mA, a single-stage amplifier achieved a noise figure of 1.17 dB with an associated gain of 18.5 dB. These results make the technology an ideal candidate for application in both transmitter and receiver circuits     

A low-power highly linear cascoded multiple-gated transistor CMOS RF amplifier with 10 dB IP3 improvement

A low-power highly linear CMOS RF amplifier circuit composed of a Multiple-Gated common-source FET TRansistor (MGTR) in cascode configuration is reported. In a MGTR amplifier, linearity is improved by using transconductance linearization which can be achieved by canceling the negative peak value of g/sub m/" of the main transistor with the positive one in the auxiliary transistor having a different size and gate drive combined in parallel. This enhancement, however, is limited by the distortion originated from the combined influence of g/sub m/' and harmonic feedback, which can greatly be reduced by the cascoding MGTR output. IP3 improvement as large as 10 dB has been obtained from an experimental RF amplifier designed at 900 MHz and fabricated using 0.35 /spl mu/m BiCMOS technology using only CMOS at a similar power consumption and gain as those obtainable from conventional cascode single gate transistor amplifiers.     

A low-power highly linear cascoded multiple-gated transistor CMOS RF amplifier with 10 dB IP3 improvement (Revised)

A low-power highly linear CMOS RF amplifier circuit composed of a Multiple-Gated common-source FET TRansistor (MGTR) in cascode configuration is reported. In an MGTR amplifier, linearity is improved by using transconductance linearization which can be achieved by canceling the negative peak value of g/sub m/" of the main transistor with the positive one in the auxiliary transistor having a different size and gate drive combined in parallel. This enhancement, however, is limited by the distortion originated from the combined influence of g/sub m/' and harmonic feedback, which can greatly be reduced by the cascoding MGTR output. IP3 improvement as large as 10 dB has been obtained from an experimental RF amplifier designed at 900 MHz and fabricated using 0.35 /spl mu/m BiCMOS technology using only CMOS at a similar power consumption and gain as those obtainable from conventional cascode single gate transistor amplifiers.     

Simple, low-cost, subsystem fabrication

We have successfully developed a simple and low-cost 1.9-GHz, 25-W power amplifier by using only one prematched 50-mm PHEMT with external matching circuits on a FR-4 PCB. As the output stage integrated with other driver stages and dc control circuits, a completed four-stage power-amplifier subsystem is also demonstrated. When operating at 38.5-dBm output power with /spl pi//4-DQPSK signal, the proposed power amplifier subsystem shows low distortion, with better than 75-dBc ACPR (adjacent-channel leakage power ratio) at 600 kHz and 79-dBc ACPR at 900 kHz offset from the center frequency, and is suitable for PHS 500-mW base-station applications.