提高陶瓷二次金属化电镀质量的技术要点分析

陶瓷-金属封接工艺是电真空陶瓷生产中的关键工艺,而二次金属化又是保证封接强度和气密性的关键工艺之一。随着国内陶瓷真空开关管的广泛应用,对其可靠性的要求不断提高,如何提高陶瓷金属化质量是一个重要的课题。结合相关理论、生产实践经验与工艺设备分析控制陶瓷二次金属化镀镍质量的工艺技术要点。     

压电陶瓷表面化学镀镍技术及发展趋势

介绍了运用化学镀镍方法使压电陶瓷表面金属化的优点及一般工艺流程.指出了压电陶瓷表面化学镀镍技术的发展趋势是镀层成分环保化、镀层金属多元合金化、镀层材料复合化、施镀工艺实用化.     

陶瓷上镀耐高温耐高真空的厚镍层工艺

在陶瓷上要镀出耐高温、耐高真空的厚镍层,首先要对非导体的陶瓷进行金属化预涂层处理;接着,选用无脆性的镀镍工艺;在施镀过程中,还要注意各种细节和操作规范;最后,还要进行严格的镀层后处理。这样得到的耐高温耐高真空的厚镍层,才能达到合格要求的电子器件。     

氧化铝陶瓷高温银浆表面金属化研究

电子银浆料是通过丝网印刷工艺预先均匀分布在氧化铝陶瓷板表面。笔者通过四探针测试法和背散射电子成像分别研究了烧结保温时间和基板腐蚀情况对银金属化层的形貌、表面电阻率以及机械特性的影响。实验数据显示,在850℃保温40min时银金属化层的表面电阻率最小且有最大的附着力强度。此外,即使在氧化铝陶瓷基板被不同浓度的氢氧化钠碱液腐蚀后,银金属化层仍然具有较小的表面电阻率和较大的附着力强度。基于实验结果可得出,在银金属化层与氧化铝陶瓷基板界面处提出了银金属化层网状结构和玻璃的网状结构相互交错的模型。     

陶瓷金属化微型线路的化学镀镍

本文以陶瓷体金属化徽型线路上的化学镀镍为例,论述了在绝缘材料上印有复杂金属膜图案的化学镀镍问题。文中叙述了工艺、故障和解决故障的方法。所得镀层在焊接时不会与焊锡或银铜焊料生成脆性化合物,其焊接抗拉强度可达1000 kg/mm_2以上。     

活化钼-锰法陶瓷硷属封接研究的进展

介绍了钼-锰（molybdenum-manganese，Mo-Mn）法陶瓷-金属封接工艺、陶瓷-金属封接结构、陶瓷一次金属化机理。在描述双毛细管修正模型的基础上，讨论了活化Mo-Mn法中玻璃相迁移方向。结果表明：金属化层中，玻璃相以向陶瓷体中迁移为主；陶瓷体中，玻璃相以向金属化层中迁移为辅。回顾了国内外活化Mo-Mn法陶瓷-金属封接研究的进展。晟后，展望了活化Mo-Mn法应用于高纯、复合、非氧化、等静压和多孔陶瓷的发展前景，认为采用活化Mo-Mn法制备的封接件的服役性能及力学行为有待进一步研究。     

化学镀镍工艺

概述了以铋（Bi)化合物和碲（Te)化合物中的至少一种为添加剂的化学镀镍液和化学镀镍工艺，可以获得与玻璃基板或者陶瓷基板的附着性优良的化学镀镍层，特别适用于以玻璃基板或者陶瓷基板为基体的磁性记录用硬盘驱动部品的制造。     

陶瓷金属化玻璃相迁移全过程

本文研究了陶瓷金属化玻璃相迁移的全过程，得出了在金属化时，Mo表面微氧化，而Mn是整体全氧化的结论。迁移过程终了，金属化层中玻璃相与距离过渡层200μm之内陶瓷中之玻璃相的组成基本一致。     

高频瓷轴局部化学镀复层材料代银技术的研究

主要介绍了以陶瓷为介质的高频瓷轴局部化学镀工艺，并对瓷轴的预处理、局部活化以及低温自催化镀镍镀铜等作了详细的阐述。通过技术测试的数据说明，该项技术为取代传统的被银工艺开创了一条切实可行的新途径。由于它既节银又节能，还可用于瓷介电容器、蜂鸣片、玻璃电极等电子元器件，表面局部金属化，因此具有广泛的应用价值。     

活化钼-锰法陶瓷-金属封接研究的进展

介绍了钼-锰(molybdenum-manganese,Mo-Mn)法陶瓷-金属封接工艺、陶瓷-金属封接结构、陶瓷一次金属化机理.在描述双毛细管修正模型的基础上,讨论了活化Mo-Mn法中玻璃相迁移方向.结果表明:金属化层中,玻璃相以向陶瓷体中迁移为主;陶瓷体中,玻璃相以向金属化层中迁移为辅.回顾了国内外活化Mo-Mn法陶瓷-金属封接研究的进展.最后,展望了活化Mo-Mn法应用于高纯、复合、非氧化、等静压和多孔陶瓷的发展前景,认为采用活化Mo-Mn法制备的封接件的服役性能及力学行为有待进一步研究.     

镍离子注入Al2O3陶瓷表面化学镀铜层与基体结合特征

用金属蒸汽真空弧离子源在Al2O3陶瓷表面注入Ni2+离子,然后进行化学镀铜。用扫描电镜分析了离子注入辅助Al2O3陶瓷表面化学镀Cu镀层和基体的结合行为。结果表明:镀层呈层状结构生长,镀层与基体存在紧密结合、疏松结合和微孔结合三种形式,紧密结合区镀层像锯齿一样"嵌入"陶瓷基体。镀层与基体的结合机理为机械结合和冶金结合共同作用。     

无机粉体化学镀镍的研究进展

介绍了化学镀镍的特点以及镀液主要成分对镀层性能的影响?综述了无机粉末如石墨粉末、陶瓷粉末、铝粉、金刚石颗粒、空心玻璃微球等材料的化学镀镍研究及发展趋势．     

Effect of surface roughness and mass transfer enhancement on the performance characteristics of nickel-hypophosphite electroless plating baths for metal–ceramic composite membrane fabrication

Mass transfer enhanced electroless plating is a relatively new concept in the field of metal–ceramic composite membrane fabrication. In this article, we present the effect of substrate surface roughness along with various mass transfer enhancement techniques such as solution stirring, membrane stirring and sonication on metal conversion, plating efficiency, thickness, and percent pore densification using electroless plating of nickel on a porous disk shaped ceramic support with a nominal pore size of 700 nm. The plating characteristics were investigated for three different roughness values, stirrer speeds (0–300 rpm) and a loading ratio (defined as membrane area per unit volume of plating solution) value of 196 cm²/L. It was evaluated that stirring as well as sonication had a profound effect on sodium hypophosphite based electroless nickel baths. This led to a reduction in average membrane pore size by 100 nm for stirring and 130 nm for sonication when compared to the base case. Surface roughness was observed to influence the metal deposition characteristics for base case without mass transfer enhancement. Sonication, irrespective of surface roughness, provided the maximum values of selective conversion, densification and membrane thickness along with acceptable values of plating efficiency.     

Low-Pressure Flame Deposition of Nanostructured Oxide Films

The influence of electroless nickel plating on lead-based relaxor ferroelectric multilayer ceramic capacitors (MLCs) was studied by a comparison experiment. It was found that the influence is related to reactions in the electroless plating. It is proposed that adsorbed hydrogen atoms generated in electroless plating can diffuse into the ceramic bodies of MLCs and undergo some reduction reaction with them, resulting in the failure of electroless nickel plating. The implications for the negative influence of electroplating on MLCs and for the degradation in MLCs are also included, in which much attention is paid to the reduction reaction of hydrogen atoms generated by electrolysis of water.     

Influence of Electroless Nickel Plating on Multilayer Ceramic Capacitors and the Implications for Reliability in Multilayer Ceramic Capacitors

The influence of electroless nickel plating on lead-based relaxor ferroelectric multilayer ceramic capacitors (MLCs) was studied by a comparison experiment. It was found that the influence is related to reactions in the electroless plating. It is proposed that adsorbed hydrogen atoms generated in electroless plating can diffuse into the ceramic bodies of MLCs and undergo some reduction reaction with them, resulting in the failure of electroless nickel plating. The implications for the negative influence of electroplating on MLCs and for the degradation in MLCs are also included, in which much attention is paid to the reduction reaction of hydrogen atoms generated by electrolysis of water.     

Preparation,optimization and characterization of low cost ceramics for the fabrication of dense nickel composite membranes

This article addressed a broad research methodology for the development of low cost ceramics to serve as functional supports for dense metal composite membranes. The experimental challenge of this study is to work with laboratory fabricated supports characterized with lower combinations of average pore size (50–70 nm) and lower effective porosity (0.012) and hence lower surface area for activation and plating reaction. Apart from fabrication parameters, the research emphasis has been towards ensuring morphological fitness of the ceramic support, good corrosion resistance and continuous enhancement in pore densification during prolonged nickel electroless plating of about 24 h. Surface and physical characterization using LPSA, BET, FTIR, XRD, FESEM and nitrogen permeation techniques yielded valuable insights. It has been observed that the sonication of the raw membrane support in alkaline conditions enormously contributed towards good corrosion resistance during nickel ELP. The morphological fitness of the ceramic support has been targeted by assuming a combination of Knudsen and Viscous diffusion through the membrane support and activated diffusion through the dense nickel film. Thereby the morphological fitness is ensured by evaluating whether or not nickel film nitrogen flux values are lower than the support fluxes.     

石膏表面电刷镀镍工艺

介绍了石膏表面电刷镀镍的工艺.石膏样品用环氧树脂封闭处理后,涂刷铜导电胶使其表面金属化,在10~14 V电刷镀镍,随后用高整平镍刷镀液在12~16 V第二次电刷镀镍,可以得到结晶细致的光亮镍镀层,测试了所得镀层的附着力、硬度及厚度.     

Electrodeposition Method for Terminals of Multilayer Ceramic Capacitors

A method using a combination of electroless and electrolytic plating was developed to provide an alternative method for forming the end terminals of multilayer ceramic capacitors. Electrodeposited terminals were formed by using electroless copper followed by electrolytic nickel plating. The electrical characteristics of the electrodeposited terminal capacitors were compared with standard capacitors and found to be identical.     

化学镀镍及其前处理对空心陶瓷粉体润湿性的影响

给出了一种空心陶瓷粉体表面化学镀及其前处理工艺,采用透过高度法、红外光谱法对前处理和化学镀后粉体表面性能及在不同润湿相中的润湿性能进行了研究。实验结果表明:空心陶瓷粉体经粗化、化学镀处理后润湿性能有大幅提高,利于提高粉体与基体的结合强度;利用润湿性的变化可以考察其粗化处理程度。     

普通硬质塑料的化学镀镍

实验研究了普通硬质塑料化学镀镍的操作方法、工艺条件及各种因素对普通硬质塑料镀层的影响,确定了普通硬质塑料镀镍的最佳工艺方法及控制条件。经过多次的实验,取得了较好的试验结果。