Resistive switching characteristics of polyimides derived from 2,2′‐aryl substituents tetracarboxylic dianhydrides

2,2′‐Position aryl‐substituted tetracarboxylic dianhydrides including 2,2′‐bis(biphenyl)‐4,4′,5,5′‐biphenyl tetracarboxylic dianhydride and 2,2′‐bis[4‐(naphthalen‐1‐yl)phenyl)]‐4,4′,5,5′‐biphenyl tetracarboxylic dianhydride were synthesized. A new series of aromatic polyimides (PIs) were synthesized via a two‐step procedure from 3,3′,4,4′‐biphenyl tetracarboxylic dianhydride and the newly synthesized tetracarboxylic dianhydrides monomers reacting with 2,2′‐bis[4′‐(3″,4″,5″‐trifluorophenyl)phenyl]‐4,4′‐biphenyl diamine. The resulting polymers exhibited excellent organosolubility and thermal properties associated with T_g at 264 °C and high initial thermal decomposition temperatures (T_5%) exceeding 500 °C in argon. Moreover, the fabricated sandwich structured memory devices of Al/PI‐a/ITO was determined to present a flash‐type memory behaviour, while Al/PI‐b/ITO and Al/PI‐c/ITO exhibited write‐once read‐many‐times memory capability with different threshold voltages. In addition, Al/polymer/ITO devices showed high stability under a constant stress or continuous read pulse voltage of ? 1.0 V. Copyright © 2011 Society of Chemical Industry     

Preparation and characterization of organosoluble polyimides based on 1,1-bis[4-(3,4-aminophenoxy)phenyl]cyclohexane and commercial aromatic dianhydrides

A bis(ether amine) III-A containing a cyclohexane cardo group, 1,1-bis[4-(4-aminophenoxy)phenyl]cyclohexane, was synthesized and used as a monomer to prepare polyimides VI-A with six commercial dianhydrides via three different procedures. The intermediate poly(amic acid)s had inherent viscosities of 0.83–1.69 dL g⁻¹ and were thermally or chemically converted into polyimides. Polyimides were also prepared by high-temperature direct polymerization in m-cresol and had inherent viscosities higher than the thermally or chemically cyclodehydrated ones. To improve the solubility of polyimides, six copolyimides were also synthesized from bis(ether amine) III-A with a pair of dianhydrides, which contained 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride or 4,4′-hexafluoroisopropylidenediphthalic anhydride. Series VI-A polyimides were characterized by the good physical properties of their film-forming ability, thermal stability, and tensile properties. A comparative study of the properties, with the corresponding polyimides derived from 2,2-bis[4-(4-aminophenoxy)phenyl]propane, is also presented. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 2750–2759, 2001     

Synthesis and properties of polyimides derived from diamine monomer containing bi-benzimidazole unit

A new aromatic heterocyclic diamine monomer containing bi-benzimidazole unit, 2,2-bis(4′-aminophenyl)-5,5-bi-1H-benzimidazole, was synthesized from 2,2-bis(4′-nitrophenyl)-5,5-bi-1H-benzimidazole (BNPBBI) prepared via the reaction of 3,3′,4,4′-biphenyltetramine and p-nitrobenzaldehyde with a high yield. Their compositions and chemical structures containing polybenzimidazole backbone were characterized by FTIR, ¹H NMR and elemental analysis. A series of aromatic polyimides containing the heterocyclic moiety in the main chain were prepared by the reaction of BAPBBI with various aromatic dianhydrides of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 4,4′-oxydiphthalic anhydride or pyromellitic dianhydride. The polymers possess a high glass transition temperature of >415 °C and a good thermal stability up to 566 °C with a 5 % weight loss. The combination of polybenzimidazole and polyimide via introducing BAPBBI into the main chains provides the rigid structure, and macromolecular interactions are thus enhanced, resulting in the outstanding mechanical properties. These polyimides exhibit the strong tensile strength of 201 to 327 MPa, and the ultrahigh tensile moduli of 10.7 to 15.5 GPa without post stretching.     

Synthesis of a new diamine and its effect on the residual stress of colorless polyimide

A new diamine was designed and synthesized to improve the flexibility of colorless polyimides by reducing residual stress. Four variations of colorless polyimides with the same dianhydride (4,4′-(hexafluoroisopropylidene)-diphthalic) and four different diamines (bis[4-(3-aminophenoxy)-phenyl] sulfone, bis(3-aminophenyl) sulfone, 2,2′-bis(trifluoromethyl)benzidine, and 2,2-bis(4-aminophenyl)-hexafluoropropane) were used. A series of colorless polyimides were prepared by adding the new diamine. The carbon and ether bonds between the benzene rings of the new diamine affected the flexibility and optical properties of colorless polyimide. The synthesis of the new diamine was confirmed by NMR measurements. Furthermore, the decrease in residual stress at room temperature and the glass transition temperature was confirmed. The effect of the new diamine was most evident for polyimide with a bulky and rigid structure. Though a slight yellow color appears because of the broken charge transfer complex balance, controlling the content of the new diamine will allow application of polyimides in flexible display.     

Sulfonated polyimide copolymers based on 4,4′-diaminostilbene-2,2′-disulfonic acid and 3,5,3′,5′-tetramethylbenzidine with enhanced solubility

A new series of six-membered ring sulfonated polyimides with different combinations of two comonomers in the nonsulfonated diamine was prepared by one-step high-temperature polycondensation in m-cresol to improve the solubility of the resulting sulfonated polyimides. They are based on 1,4,5,8-naphthalenetetracarboxylic dianhydride, 4,4′-diaminostilbene-2,2-disulfonic acid sulfonated diamine, and equimolar mixture of 3,5,3′,5′-tetramethylbenzidine (TMB) and 4,4′-oxydianiline, bis(4-aminophenyl)methane, or bis(4-(aminophenoxy)-4-phenyl)isopropylidene nonsulfonated diamines. The introduction of TMB comonomer in the nonsulfonated diamine resulted in a remarkable improvement in the solubility of the resulting polyimides in comparison with the corresponding single-monomer nonsulfonated diamine polyimides. Flexible, transparent, and tough membranes were prepared by solution casting method from the different polyimides. The membranes were characterized with FTIR and ¹H-NMR spectroscopy, differential scanning calorimetry, thermogravimetric analysis, water uptake, and ion-exchange capacity measurements. They exhibit high thermal stability and good correlation between the ion-exchange capacity and water uptake values.     

Novel soluble polyimides derived from 2,2′-bis[4-(5-amino-2-pyridinoxy)phenyl]hexafluoropropane: Preparation,characterization, and optical,dielectric properties

Two novel aromatic diamine monomer, 2,2′-bis[4-(5-amino-2-pyridinoxy)phenyl] hexafluoropropane (6FBAPDP) and 2,2′-bis[4-(5-amino-2-pyridinoxy)phenyl] propane (BAPDP), were successfully synthesized. Aimed at clarifying the structure-property relationships of pyridine-containing high-performance polymers, a series of novel fluorinated polyimides PI-(1–4) were prepared from 6FBAPDP with various commercially aromatic anhydrides, and polyimide (PI-5) was synthesized derived from BAPDP and 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA) via a two-stage process with heating imidization method. The fluorinated polyimides PI-(1–4) exhibited good solubility in strong polar solvents, such as N, N-dimethylacetamide, N, N-dimethylformamide, N-methyl-2-pyrrolidone, dimethyl sulfoxide, m-cresol, and could afford flexible, tough and transparent films with an UV–visible absorption cut-off wavelength at 342–393 nm. The glass transition temperatures of these polyimides were recorded between 239 and 306 °C by differential scanning calorimetry, and the 5% weight loss occurred at temperatures above 498 and 490 °C, in nitrogen and air, respectively. The polyimide films had the in-plane coefficients of thermal expansion (CTE) that ranged from 54 to 74 ppm °C⁻¹. Moreover, the fluorinated polyimide films showed low moisture absorptions of 0.51–0.82% and outstanding mechanical properties with the tensile strengths of 75–100 MPa, tensile moduli of 3.2–4.0 GPa and elongation at break of 5.5–10.3%, good dielectric properties with low dielectric constants of 2.71–2.92 at 1 MHz.     

Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory

Flexible memory devices are one of the most crucial elements in the wearable electronics. In this work, polyimides (PIs)-based flexible resistive memory devices with an excellent thermal and mechanical durability are demonstrated. Four kinds of functional PIs are derived from the heterocyclic diamines including 2,6-diaminodibenzo-p-dioxin (OODA) and 2,6-diaminothianthrene, and dianhydrides including 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride. PI with diamine of OODA and dianhydride of 6FDA (PI(OODA_6FDA)) possesses outstanding thermal and mechanical properties with a high glass transition temperature of 352 °C, a low coefficient of thermal expansion of 28.1 ppm K⁻¹, and a high elongation at break of 10%. In addition, PI(OODA_6FDA)-based memory shows write-once-read-many behavior with a high on/off current ratio of 10⁶ and a stable data retention, attributed to the donor–acceptor charge transfer between the polymer chains. The retained current levels at a low resistive state can be observed even with thermal treatment at 200 °C for 24 h or 1000 times cyclic bending at a bending radius of 5 mm. These results demonstrate the potential of heterocyclic PIs for flexible resistive memory.     

Inclusion of covalent triazine framework into fluorinated polyimides to obtain composites with low dielectric constant

Polyimides possess good mechanical properties, favorable dielectric properties, and chemical inertness, which enabled them to find applications in microelectronic industries. The dielectric constant of the polyimides varies between 2.5 and 4, which is rather high for such applications. Hence, synthesizing polyimides with still lower dielectric constant has become one of the critical research confronts. As the properties of a terpolyimides (TPI) could be altered as per the requirement, it was synthesized by combining the dianhydrides 3,3′,4,4′-biphenyldianhydride, 3,3′,4,4′-oxydiphthalicdianhydride, and 4,4′-(hexafluoroisopropylidene) with a diamine 4,4′-(hexafluoroisopropylidene)dianiline or 2,2-bis[4-(4-amino phenoxy)phenyl]hexafluoropropane. As porous covalent triazine framework (CTF-1) is capable of capturing much air within its pores and interfacial voids, it was combined with the TPI matrix in different loadings to obtain CTF-1/TPI composite films with low dielectric constant. The composites exhibited high thermal stability, as their thermal decomposition occurred above 520°C. The tensile properties and the dielectric constant of the composites declined with the raise in CTF-1 loading up to 4%. The decrease in dielectric constant is essentially due to the incorporation of air voids (dielectric constant of air ~1) in the TPI matrix due to the inclusion of porous CTF-1.     

Blue light-emitting diodes from 2-(10-naphthylanthracene)-spiro[fluorene-7,9′-benzofluorene] host material

A novel, spiro-type host material 2-(10-naphthylanthracene)-spiro[fluorene-7,9′-benzofluorene] was prepared by reacting 2-bromo-spiro[fluorene-7,9′-benzofluorene] with 9-(2-naphthylanthracene)-10-boronic acid via the Suzuki reaction. 2-4′-(Phenyl-4-vinylbenzeneamine)phenyl-spiro[fluorene-7,9′-benzofluorene], 4-[2-naphthyl-4′(phenyl-4-vinylbenzeneamine)]phenyl and diphenyl-[4-(2-[1,1;4,1]terphenyl-4-yl-vinyl)-phenyl]-amine were used as dopant materials. Devices with the configuration of ITO/N,N′-bis[4-(di-m-tolylamino)phenyl]-N,N′-diphenylbiphenyl-4,4′-diamine)/bis[N-(1-naphthyl)-N-phenyl]benzidine/2-(10-naphthylanthracene)-spiro[fluorene-7,9-benzofluorene]:5% dopant/aluminum tris(8-hydroxyquinoline)/Al-LiF showed a maximum power efficiency of 3.7 cd/A at 17.93 mA/cm² and a maximum luminance of 5018 cd/m² at 10 V with a turn-on voltage of 4.5 V.     

Organosoluble and light-colored fluorinated semialicyclic polyimide derived from 1,2,3,4-cyclobutanetetracarboxylic dianhydride

In this study, the alicyclic dianhydrides 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) was polymerized with seven kinds of fluorinated aromatic diamines, 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (1), 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (2), 1,4-bis(4-amino-2-trifluoromethylphenoxy)diphenyl (3), 1,4-bis(4-amino-2-trifluoromethylphenoxy) diphenyl ether (4), 2,2-bis[4-(4-amino-2-trifluoromethylphenoxy)phenyl]hexafluoropropane (5), 4,4′-bis(4-amino-2-trifluoromethylphenoxy)diphenyl sulfone (6), and 2,7-bis(4-amino-2-trifluoromethylphenoxy)naphthalene (7), via a two-step polycondensation procedure to prepare seven kinds of fluorinated semialicyclic polyimides (PI) PI-1 ∼ PI-7. The structures of these polyimides were confirmed by infrared spectroscopy (IR). Solubility of the polyimides was tested in various organic solvents and their thermal properties were investigated by dynamic mechanical analysis (DMA) and thermogravimetric analysis (TGA). Ultraviolet-visible spectra (UV-vis) and near infrared absorption spectra (NIR) were obtained to evaluate the optical properties of these polyimides. The obtained polyimides PI-1 ∼ PI-7 displayed excellent solubility in a variety of organic solvents; they were readily soluble in amide-type polar solvent. These polyimide films exhibited good optical transparency in the visible light region (400–700 nm) with the transmittance higher than 80% at 450 nm, and these polyimide films showed little absorption at the optocommunication wavelengths of 1.30 and 1.55 μm. These polyimides showed good thermal stability with the 10% thermal decomposing temperatures higher than 443°C in nitrogen and the glass transition temperatures higher than 265°C. In addition, the effect of the structure of fluorinated diamines on the properties of polyimide films was also compared. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Adhesion property of novel polyimides containing fluorine and phosphine oxide moieties

Novel diamine monomers containing fluorine and phosphine oxide - bis(3-aminophenyl)-3,5-bis(trifluoromethyl)phenyl phosphine oxide (mDA6FPPO) and bis(3-aminophenyl)-4-(trifluoromethyl)phenyl phosphine oxide (mDAFPPO) - were utilized to prepare polyimides with dianhydrides such as 6FDA, BTDA or ODPA by the conventional two-step route, i.e. preparation of poly(amic acid) followed by solution imidization. The polyimides were characterized by FT-IR, NMR, DSC, and intrinsic viscosity measurements. The adhesion property of the polyimides was evaluated via a peel test with bare Cu foil, as well as silane/Cr-coated Cu foil, and failure surfaces were analyzed by SEM/EDX to elucidate the failure mechanism. The results were compared with those from the polyimides prepared from bis(3-aminophenyl)phenyl phosphine oxide (mDAPPO) containing only the phosphine oxide moiety, 1,1-bis(4-aminophenyl)-1-phenyl-2,2-trifluoroethane (3FDAm) containing only the fluorine moiety, and a commercial 3,3′-diaminodiphenylsulfone (mDDS). The polyimides with 3FDAm exhibited the highest T _g, followed by the mDAPPO-, mDA3FPPO-, and mDA6FPPO-based polyimides, but the mDAPPO-based polyimides exhibited the highest adhesion properties, followed by mDA3FPPO, mDA6FPPO, mDDS, and 3FDAm, which is attributed to the phosphine oxide and fluorine moieties.     

Preparation and Properties of Cyano-Containing Polyimide Films Based on 2,6-Bis(4-aminophenoxy)- benzonitrile

Summary A series of cyano-containing polyimides were synthesized from 2,6-bis(4-amino- phenoxy)benzonitrile and some aromatic dianhydride monomers by solution polycondensation. The poly(amic acid) films could be obtained by solution-cast from N-methyl-2-pyrrolidinone solutions and thermally converted into tough polyimide films. Structure and physical properties of thin films of those polyimides were measured by FTIR, TGA, dynamic mechanical analysis and LCR hitester et al. Results showed that the polyimides prepared from 2,6-bis(4-aminophenoxy)- benzonitrile and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride or 4,4’-(hexafluoropropylidene)diphthalic anhydride exhibited more excellent energy-damping characteristic and excellent solubility in NMP, DMF, DMAc, DMSO, THF and CHCl₃, whereas the polyimides from 2,6-bis(4-aminophenoxy)benzonitrile and 3,3’,4,4’-biphenyltetracarboxylic dianhydride or Pyromellitic dianhydride were insoluble in polar and nonpolar organic solvents. All polyimides indicated higher glass transition temperatures, excellent thermal stability and tensile properties. Incorporating a nitrile group into the polyimide backbone would enhance the dielectric constant of the polyimide films.     

Synthesis and properties of novel polyimides derived from 2,6-bis(4-aminophenoxy-4′-benzoyl)pyridine with some of dianhydride monomers

A new kind of aromatic diamine monomer containing pyridine unit, 2,6-bis(4-aminophenoxy-4′-benzoyl)pyridine (BABP), was synthesized successfully. The Friedel-Crafts acylation of phenyl ethyl ether with 2,6-pyridinedicarbonyl chloride formed 2,6-bis(4,4′-dihydroxybenzoyl)-pyridine (BHBP), BHBP was changed into 2,6-bis(4-nitrophenoxy-4′-benzoyl)-pyridine (BNBP) by the nucleophilic substitution reaction of it and p-chloronitrobenzene, and BNBP was reduced with SnCl₂ and HCl in ethanol to form the diamine monomer BABP finally, the diamine monomer BABP could be obtained in quantitative yield. A series of novel polyimides were prepared by polycondensation of BABP with various aromatic dianhydrides in N-methy-2-pyrrolidone (NMP) via the conventional two-step method. Experimental results indicated that some of the polyimides were soluble both in strong dipolar solvents (N-methy-2-pyrrolidone or N,N-dimethylacetamide) and in common organic solvents tetrahydrofuran. The resulting polyimides showed exceptional thermal and thermooxidative stability, no weight loss was detected before a temperature of 450 °C in nitrogen, and the values of glass-transition temperature of them were in the range of 208-324 °C. Wide-angle X-ray diffraction measurements revealed that these polyimides were predominantly amorphous.     

Thermoplastic and low dielectric constants polyimides based on BPADA-BAPP

ABSTRACT

The thermoplastic and low dielectric constants polyimides were introduced. The polyimides were prepared by pyromellitic dianhydride (PMDA) or 4,4?-(4,4?-Isopropylidenediphenoxy)diphthalic anhydride (BPADA) as anhydride monomer and 4,4?-oxydianiline (ODA) or 2,2-bis(4-(4-aminephenoxy)phenyl)propane (BAPP) as amine monomer. The polyimides were well characterized by FT-IR, thermogravimetric analysis, dynamic thermomechanical analysis, dielectric measurement, and tensile test. The dielectric constants were 2.32–2.95 compared with 3.10 of ODA-PMDA polyimide, while partly polyimides were thermoplastic. The results indicated anhydride monomers, containing lateral methyl groups, made polyimides become thermoplastic. The results of molecular simulations via Materials Studio also proved this conclusion.     

Preparation and characterization of highly transparent and colorless semi-aromatic polyimide films derived from alicyclic dianhydride and aromatic diamines

A novel meta-substituted aromatic diamine containing trifluoromethyl and sulfonyl groups in the backbone, i.e., 2,2′-bis[4-(3-amino-5-trifluoromethylphenoxy)phenyl]sulfone (m-6FBAPS), was synthesized and characterized. A series of semi-aromatic polyimides were prepared from 1,2,4,5-cyclohexanetetracarboxylic dianhydride (CHDA) and various aromatic diamines. These polymers exhibited excellent solubility, high thermal stabilities and good mechanical properties. All semi-aromatic polyimide films showed considerably improved optical transparency as comparing with traditional aromatic ones due to the incorporation of alicyclic moieties. They gave the UV cutoff wavelengths of 292–314 nm, transmittance at 450 nm > 91% and yellowness indices <3.8. The extremely transparent and entirely colorless films were obtained from the polymers incorporated with bulky electron-withdrawing trifluoromethyl and sulfonyl groups in diamine moieties, such as PI-2, PI-5 and PI-6. Their excellent optical properties are attributed to the distorted molecular conformation combined with the weakened electron-accepting and electron-donating properties of dianydride and diamines, which significantly restrained the formation of inter-/intra-molecular charge transfer interactions.     

Synthesis,characterization, thermal and optical properties of soluble polyimides derived from an unsymmetrical diamine

A new unsymmetrical diamine monomer, 2,4‐diaminophenyl [4′‐(2′′,6′′‐diphenyl‐4′′‐pyridyl)phenyl]ether, was successfully synthesized by nucleophilic substitution of 1‐chloro‐2,4‐dinitrobenzene with 4‐(2′,6′‐diphenyl‐4′‐pyridyl) phenol. The diamine monomer was characterized by FTIR, ¹H and ¹³C NMR, and elemental analysis techniques and used for the preparation of novel polyimides (PIs) by reaction with commercially available tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride, and bicyclo[2.2.2]‐oct‐7‐ene‐2,3,5,6‐tetracarboxylic dianhydride. These PIs with inherent viscosities ranged from 0.43 to 0.48 dL/g were readily soluble in many organic solvents and afforded tough and flexible films by solution casting. These polymers exhibited T_gs between 237 and 294°C, and 10% weight loss temperatures in excess of 500°C with up to 56% char yield at 600°C in air. Their maximum fluorescence emission in dilute (0.2 g/dL) NMP solution appeared at 450 nm. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

含氰基二元芳胺固化的酞菁预聚物的合成及表征

以亲核取代反应合成了3种酞菁单体(2,2′-二[4-(3,4-二氰基苯氧基)]丙烷(BAPh)、4,4′-二(3,4-二氰基苯氧基)联苯(BPh)、4,4′-二(3,4-二氰基苯氧基)甲烷(BFPh))和1种含有氰基的高熔点二元芳胺2,6-二(4-氨基苯氧基)苯甲腈(APBN)。通过核磁共振氢谱(1H-NMR)、傅里叶变换红外光谱(FT-IR)、示差扫描量热仪(DSC)和热重分析(TGA)对合成的化合物的化学结构,芳胺和酞菁单体的热聚合行为,不同固化时间预聚物的热性能进行了研究。结果表明,BAPh/APBN和BFPh/APBN体系分别具有宽达101℃与107℃的加工窗口。BFPh型预聚物(固化1 h)比其他2种预聚物具有更高的初始分解温度(390℃下失重5%)、高温残炭率(800℃下61.7%)和固化效率。     

Polyimides based on furanic diamines and aromatic dianhydrides: synthesis,characterization and properties

Novel polyimides containing furan moieties were prepared from the resulting furanic diamine monomers with various aromatic dianhydrides including 1,2,4,5-benzene-tetracarboxylic dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 4,4′-oxydiphthalic anhydride, and hexafluoroisopropylidene 2,2-bis(phthalic anhydride), via a two-step process. The resulting polyimides were characterized by solubility tests, viscosity measurements, FTIR, ¹H NMR spectroscopy, differential scanning calorimetric (DSC), and thermogravimetric analysis (TGA) analysis. The polyimides with inherent viscosities in the range of 0.048–0.095 L/g showed excellent solubility in aprotic amide and organic solvents, such as N,N-dimethylacetamide, N-methyl-2-pyrrolidinone, dimethylformamide and acetone, chloroform, etc. DSC showed glass transition temperatures (T _g) in the range of 116–143 °C. These polymers showed excellent thermal stability up to 390 °C.     

Organosoluble polyimides derived from asymmetric 2‐substituted‐and 2,2′,6‐trisubstituted‐4,4′‐oxydianilines

We report a new method for the preparation of asymmetric diamines using 4,4′‐oxydianiline (4,4′‐ODA) as the starting material. By controlling the equivalents of bromination agent, N‐bromosuccinimide, we were able to attach bromide and phenyl substituents at the 2‐ or 2,2′,6‐positions of 4,4′‐ODA. Thus, four new asymmetric aromatic diamines, 2‐bromo‐4,4′‐oxydianiline (6), 2,2′,6‐tribromo‐4,4′‐oxydianiline (7), 2‐phenyl‐4,4′‐oxydianiline (8) and 2,2′,6‐triphenyl‐4,4′‐oxydianiline (9), were synthesized by this method. Their structural asymmetry was confirmed using ¹H NMR spectroscopy. Asymmetric polyimides (PI10–PI13) were prepared from these diamines and three different dianhydrides (pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride and 2,2‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride) in refluxing m‐cresol. The formed polyimides, except PI10a derived from 6 and PMDA, were all soluble in m‐cresol without premature precipitation during polymerization. These polyimides with inherent viscosity of 0.41–0.96 dL g^?1, measured at a concentration of 0.5 g dL^?1 in N‐methyl‐2‐pyrrolidone at 30 °C, can form tough and flexible films. Because of the structural asymmetry, they also exhibited enhanced solubility in organic solvents. Especially, polyimides PI11a and PI13a derived from 7 and 9 with rigid PMDA were soluble in various organic solvents at room temperature. The structural asymmetry of the prepared polyimides was also evidenced from ¹H NMR spectroscopy. In the ¹H NMR spectrum of PI11a, the protons of pyromellitic moiety appeared in an area ratio of 1:2:1 at three different chemical shifts, which were assigned to head‐to‐head, head‐to‐tail and tail‐to‐tail configurations, respectively. These polyimides also exhibited good thermal stability. Their glass transition temperatures ranged from 297 to 344 °C measured using thermal mechanical analysis. © 2013 Society of Chemical Industry     

Synthesis and properties of fluorinated polyimides. 3. Derived from novel 1,3-bis[3′-trifluoromethyl-4′(4″-amino benzoxy) benzyl] benzene and 4,4-bis[3′-trifluoromethyl-4′(4-amino benzoxy) benzyl] biphenyl

Novel diamine monomers, 1,3-bis[3′-trifluoromethyl-4′(4″-amino benzoxy) benzyl] benzene (IV) and 4,4-bis[3′-trifluoromethyl-4′(4-amino benzoxy) benzyl] biphenyl (V) have been synthesized. These monomers lead to several novel fluorinated polyimides on reaction with different commercially available dianhydrides like pyromellatic dianhydride (PMDA), benzophenone tetracarboxylic acid dianhydride (BTDA) or 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane (6FDA). The polyimides prepared from above two monomers on reaction with 6FDA are soluble in several organic solvents such as N,N-dimethyl formamide (DMF), N,N-dimethyl acetamide (DMAc) and tetrahydrofuran (THF). The polyimides prepared from PMDA/IV is soluble in DMF and N-methyl pyrollidone (NMP) on heating, whereas V/PMDA is insoluble in all solvents. BTDA/IV polyimide is also soluble in NMP, DMF and DMAc. These polyimide films have low water absorption rate 0.2-0.7% and low dielectric constant 2.74-3.2 at 1 MHz. These polyimides showed very high thermal stability even up to 531 °C for 5% weight loss in synthetic air and glass transition temperature up to 316 °C (by DSC) in nitrogen. All polyimides formed tough transparent films, with tensile strength up to 148 MPa, a modulus of elasticity up to 2.6 GPa and elongation at break up to 31% depending upon the exact repeating unit structure.