An Analytical Method to Extract the Physical Parameters of a Solar Cell From Four Points on the Illuminated $J{-}V$ Curve

For a variety of solar cells, it is shown that the single exponential $J{-}V$ model parameters, namely—ideality factor $eta$ , parasitic series resistance $R_{s}$, parasitic shunt resistance $R_{rm sh}$, dark current $J_{0}$, and photogenerated current $J_{rm ph}$ can be extracted simultaneously from just four simple measurements of the bias points corresponding to $V_{rm oc}$, $sim!hbox{0.6}V_{rm oc}$, $J_{rm sc}$, and $sim! hbox{0.6}J_{rm sc}$ on the illuminated $J{-}V$ curve, using closed-form expressions. The extraction method avoids the measurements of the peak power point and any $dJ/dV$ (i.e., slope). The method is based on the power law $J{-}V$ model proposed recently by us.      

Demonstration of Tunneling FETs Based on Highly Scalable Vertical Silicon Nanowires

This letter demonstrates a vertical silicon-nanowire (SiNW)-based tunneling field-effect transistor (TFET) using CMOS-compatible technology. With a $hbox{Si} hbox{p}^{+}{-}hbox{i}{-} hbox{n}^{+}$ tunneling junction, the TFET with a gate length of $sim$200 nm exhibits good subthreshold swing of $sim$ 70 mV/dec, superior drain-induced-barrier-lowering of $sim$ 17 mV/V, and excellent $I_{rm on} {-} I_{rm off}$ ratio of $sim!!hbox{10}^{7}$ with a low $I_{rm off} (sim!!hbox{7} hbox{pA}/muhbox{m})$. The obtained 53 $muhbox{A}/muhbox{m} I_{rm on}$ can be further enhanced with heterostructures at the tunneling interface. The vertical SiNW-based TFET is proposed to be an excellent candidate for ultralow power and high-density applications.      

A Multi-Path Gated Ring Oscillator TDC With First-Order Noise Shaping

An 11-bit, 50-MS/s time-to-digital converter (TDC) using a multipath gated ring oscillator with 6 ps of effective delay per stage demonstrates 1st-order noise shaping. At frequencies below 1 MHz, the TDC error integrates to 80 fs (rms) for a dynamic range of 95 dB with no calibration required. The $hbox{157}times, hbox{258} mu{hbox {m}}$ TDC is realized in 0.13 $mu{hbox {m}}$ CMOS and, depending on the time difference between input edges, consumes 2.2 to 21 mA from a 1.5$~$ V supply.      

Dopant-Segregated Schottky Silicon-Nanowire MOSFETs With Gate-All-Around Channels

In this letter, we demonstrated dopant-segregated Schottky (DSS) p-MOSFET with gate-all-around silicon-nanowire (SiNW) channel of 10 nm in diameter. The DSS transistor shows improved performance as compared to a reference Schottky barrier (SB) transistor without dopant segregation. The DSS transistor shows $I_{rm ON}$ of 319 $mu hbox{A}/muhbox{m}$ at a low gate overdrive of $-$ 0.6 V, high $I_{rm ON}/I_{rm OFF}$ ratio $(sim!hbox{10}^{5})$, and short-channel performance with subthreshold slope $sim$90 mV/dec down to 100-nm gate length with relatively thick (6 nm) deposited gate oxide. The DSS transistor also shows significant reduction ( $sim!hbox{40}times$ lower) in the series resistance as compared to the SB transistor. The origin of the improved performance of the DSS is the thin dopant layer segregated at the nickel monosilicide/SiNW point contact which results in the enhanced hole injection at the source side and the suppressed electron injection at the drain side.      

Comparative Study of the Low-Frequency-Noise Behaviors in a-IGZO Thin-Film Transistors With $hbox{Al}_{2}hbox{O}_{3}$ and $hbox{Al}_{2}hbox{O}_{3}/hbox{SiN}_{x}$ Gate Dielectrics

A comparative study is made of the low-frequency noise (LFN) in amorphous indium–gallium–zinc oxide (a-IGZO) thin-film transistors (TFTs) with $hbox{Al}_{2}hbox{O}_{3}$ and $hbox{Al}_{2}hbox{O}_{3}/hbox{SiN}_{x}$ gate dielectrics. The LFN is proportional to $hbox{1}/f^{gamma}$, with $gamma sim hbox{1}$ for both devices, but the normalized noise for the $hbox{Al}_{2}hbox{O}_{3}/hbox{SiN}_{x}$ device is two to three orders of magnitude lower than that for the $hbox{Al}_{2} hbox{O}_{3}$ device. The mobility fluctuation is the dominant LFN mechanism in both devices, but the noise from the source/drain contacts becomes comparable to the intrinsic channel noise as the gate overdrive voltage increases in $hbox{Al}_{2}hbox{O}_{3}/hbox{SiN}_{x}$ devices. The $hbox{SiN}_{x}$ interfacial layer is considered to be very effective in reducing LFN by suppressing the remote phonon scattering from the $hbox{Al}_{2}hbox{O}_{3}$ dielectric. Hooge's parameter is extracted to $sim !!hbox{6.0} times hbox{10}^{-3}$ in $hbox{Al}_{2}hbox{O}_{3}/hbox{SiN}_{x}$ devices.      

GaAs MESFET With a High-Mobility Self-Assembled Planar Nanowire Channel

We demonstrate the first metal–semiconductor field-effect transistor with a self-assembled planar $langlehbox{110}rangle$ GaAs nanowire channel. Well-defined dc output and transfer characteristics have been observed with a subthreshold slope of $sim$150 mV/dec, maximum $g_{m}$ of 23 mS/mm, and excellent on-current saturation. Bulklike mobility of $sim! hbox{4100} hbox{cm}^{2}/hbox{V}cdot hbox{s}$ with corresponding electron concentration of $hbox{2.3} cdot hbox{10}^{17} hbox{cm}^{-3}$ is derived by fitting the experimental data using a self-consistent long channel field effect device model.      

$hbox{TiN/ZrO}_{2}$/Ti/Al Metal–Insulator–Metal Capacitors With Subnanometer CET Using ALD-Deposited $hbox{ZrO}_{2}$ for DRAM Applications

We provide the first report of the structural and electrical properties of $hbox{TiN/ZrO}_{2}$/Ti/Al metal–insulator–metal capacitor structures, where the $hbox{ZrO}_{2}$ thin film (7–8 nm) is deposited by ALD using the new zirconium precursor ZrD-04, also known as Bis(methylcyclopentadienyl) methoxymethyl. Measured capacitance–voltage ($C$– $V$) and current–voltage ( $I$–$V$) characteristics are reported for premetallization rapid thermal annealing (RTP) in $hbox{N}_{2}$ for 60 s at 400 $^{circ}hbox{C}$, 500 $^{circ}hbox{C}$, or 600 $^{ circ}hbox{C}$. For the RTP at 400 $^{circ}hbox{C}$ , we find very low leakage current densities on the order of nanoamperes per square centimeter at a gate voltage of 1 V and low capacitance equivalent thickness values of $sim$ 0.9 nm at a gate voltage of 0 V. The dielectric constant of $ hbox{ZrO}_{2}$ is 31 $pm$ 2 after RTP treatment at 400 $^{circ}hbox{C}$.      

InGaAs/GaAs 0.98- $mu{hbox {m}}$ Low-Divergence Central-Lobe Semiconductor Lasers With $delta$ -Doped Resonant Tunneling Quantum Wells

In this paper, we describe a new structure design for producing low-threshold, high-efficiency, and high-brightness 0.98-$mu{hbox {m}}$ lasers. In this structure, we incorporated a self-discriminating weak optical confinement asymmetrical waveguide coupled to passive waveguides, and an active region based on three InGaAs quantum wells (QWs) coupled to Te n-type $delta$-doping. Optimized coupling between the $delta$-doping and the three QWs, together with waveguide optimization and doping profile optimization, yields $J_{rm th}=98 {hbox {A/cm}}^{2}$ per QW, ${T}_{0}=80;^{circ}hbox{C}$, and a far-field central lobe angle of $sim 10^{circ}$.      

Positive Bias Temperature Instability (PBTI) Characteristics of Contact-Etch-Stop-Layer-Induced Local-Tensile-Strained $hbox{HfO}_{2}$ nMOSFET

The positive bias temperature instability (PBTI) characteristics of contact-etch-stop-layer (CESL)-strained $hbox{HfO}_{2}$ nMOSFET are thoroughly investigated. For the first time, the effects of CESL on an $hbox{HfO}_{2}$ dielectric are investigated for PBTI characteristics. A roughly 50% reduction of $V_{rm TH}$ shift can be achieved for the 300-nm CESL $hbox{HfO}_{2}$ nMOSFET after 1000-s PBTI stressing without obvious $ hbox{HfO}_{2}/hbox{Si}$ interface degradation, as demonstrated by the negligible charge pumping current increase ($≪$ 4%). In addition, the $hbox{HfO}_{2}$ film of CESL devices has a deeper trapping level (0.83 eV), indicating that most of the shallow traps (0.75 eV) in as-deposited $ hbox{HfO}_{2}$ film can be eliminated for CESL devices.      

Novel NiGe MSM Photodetector Featuring Asymmetrical Schottky Barriers Using Sulfur Co-Implantation and Segregation

We report the first demonstration of a novel germanium (Ge) metal–semiconductor–metal (MSM) photodetector featuring asymmetrical Schottky-barrier height for low dark current and high-speed photodetection applications. Through co-implantation and segregation of valence-mending adsorbate such as sulfur at the NiGe/Ge interface, the germanide Fermi level can be pinned close to the conduction band edge. This results in an effective modulation of hole Schottky-barrier height, leading to a significant dark current suppression by $≫$3 orders of magnitude over a conventional MSM photodetector. When operated at a bias voltage $V_{A}$ of 1.0 V, a detector with an area of 804 $muhbox{m}^{2}$ shows a spectrum response of $sim$0.36 A/W or a corresponding quantum efficiency of $sim$34%. In addition, a frequency response measurement reveals the achievement of a $-$3-dB bandwidth of $sim!$15 GHz at an illumination photon wavelength of 1550 nm.      

First Internal Spacers' Introduction in Record High $I_{rm ON}/I_{rm OFF} hbox{TiN/HfO}_{2}$ Gate Multichannel MOSFET Satisfying Both High-Performance and Low Standby Power Requirements

For the first time, internal spacers have been introduced in multichannel CMOSFET (MCFET) structures, featuring a decrease of the intrinsic $CV/I$ delay by 39%. The process steps introduced for this new MCFET technological option are studied and optimized in order to achieve excellent $I_{rm ON}/I_{rm OFF}$ characteristics (NMOS: 2.33 $hbox{mA}/muhbox{m}$ at 27 $hbox{pA}/muhbox{m}$ and PMOS: 1.52 $hbox{mA}/muhbox{m}$ at 38 $hbox{pA}/muhbox{m}$). A gate capacitance $C_{rm gg}$ reduction of 32% is measured, thanks to $S$-parameter extraction. Moreover, a significant improvement of the analogical figure of merit is measured compared with optimized fully depleted silicon-on-insulator planar reference; the voltage gain $A_{rm VI}(= g_{m}/g_{rm ds})$ is improved by 92%.      

Characterization and Modeling of RF-Performance $(f_{T})$ Fluctuation in MOSFETs

The fluctuation of RF performance (particularly for $f_{T}$ : cutoff frequency) in the transistors fabricated by 90-nm CMOS technology has been investigated. The modeling for $f_{T}$ fluctuation is well fitted with the measurement data within approximately 1% error. Low-$V_{t}$ transistors (fabricated by lower doping concentration in the channel) show higher $f_{T}$ fluctuation than normal transistors. Such a higher $f_{T}$ fluctuation results from $C_{rm gg}$ (total gate capacitance) variation rather than $g_{m}$ variation. More detailed analysis shows that $C_{rm gs} + C_{rm gb}$ (charges in the channel and the bulk) are predominant factors over $C_{rm gd}$ (charges in LDD/halo region) to determine $C_{rm gg}$ fluctuation.      

Performance Improvement of N-Type $hbox{TiO}_{x}$ Active-Channel TFTs Grown by Low-Temperature Plasma-Enhanced ALD

We report on performance improvement of $n$-type oxide–semiconductor thin-film transistors (TFTs) based on $hbox{TiO}_{x}$ active channels grown at 250 $^{circ}hbox{C}$ by plasma-enhanced atomic layer deposition. TFTs with as-grown $hbox{TiO}_{x}$ films exhibited the saturation mobility $(mu_{rm sat})$ as high as 3.2 $hbox{cm}^{2}/hbox{V}cdothbox{s}$ but suffered from the low on–off ratio $(I_{rm ON}/I_{rm OFF})$ of $hbox{2.0} times hbox{10}^{2}$. $hbox{N}_{2}hbox{O}$ plasma treatment was then attempted to improve $I_{rm ON}/I_{rm OFF}$. Upon treatment, the $hbox{TiO}_{x}$ TFTs exhibited $I_{rm ON}/I_{rm OFF}$ of $hbox{4.7} times hbox{10}^{5}$ and $mu_{rm sat}$ of 1.64 $hbox{cm}^{2}/hbox{V}cdothbox{s}$, showing a much improved performance balance and, thus, demonstrating their potentials for a wide variety of applications such as backplane technology in active-matrix displays and radio-frequency identification tags.      

High Microwave-Noise Performance of AlGaN/GaN MISHEMTs on Silicon With Gate Insulator Grown by ALD

High microwave-noise performance is realized in AlGaN/GaN metal–insulator semiconductor high-electron mobility transistors (MISHEMTs) on high-resistivity silicon substrate using atomic-layer-deposited (ALD) $hbox{Al}_{2}hbox{O}_{3}$ as gate insulator. The ALD $hbox{Al}_{2}hbox{O}_{3}/hbox{AlGaN/GaN}$ MISHEMT with a 0.25- $muhbox{m}$ gate length shows excellent microwave small signal and noise performance. A high current-gain cutoff frequency $f_{T}$ of 40 GHz and maximum oscillation frequency $f_{max}$ of 76 GHz were achieved. At 10 GHz, the device exhibits low minimum-noise figure $(hbox{NF}_{min})$ of 1.0 dB together with high associate gain $(G_{a})$ of 10.5 dB and low equivalent noise resistance $(R_{n})$ of 29.2 $Omega$. This is believed to be the first report of a 0.25-$muhbox{m}$ gate-length GaN MISHEMT on silicon with such microwave-noise performance. These results indicate that the AlGaN/GaN MISHEMT with ALD $hbox{Al}_{2}hbox{O}_{3}$ gate insulator on high-resistivity Si substrate is suitable for microwave low-noise applications.      

High-Reflectivity Thermally Stable Ultrafast Induced Fiber Bragg Gratings in H$_{2}$ -Loaded SMF-28 Fiber

High-temperature stable high-reflectivity gratings are fabricated in hydrogen-loaded single-mode fiber (SMF-28) using ultrafast 800-nm radiation. An index modulation of $sim 9times 10^{-4}$ and a loss of $>$15 dB at the Bragg resonance is present after isochronal annealing up to 1000 $^{circ}hbox{C}$ followed by 96 h of isothermal annealing.      

A Biphase Modulator Circuit for Impulse Radio-UWB Applications

This letter presents a circuit to provide binary phase shift keying to ultra-wideband (UWB) impulse transmitters. The circuit is based on a Gilbert-cell multiplier and uses active on-chip balun and unbalanced-to-balanced converters for single-ended to single-ended operation. Detailed measurements of the circuit show a gain ripple of $pm 1~{rm dB}$ at an overall gain of $-2~{rm dB}$, an input reflection below $-12~{rm dB}$, an output reflection below $-18~{rm dB}$, a group delay variation below 6 ps and a $-1~{rm dB}$ input compression point of more than 1 dBm in both switching states over the full 3.1–10.6 GHz UWB frequency range. A time domain measurement verifies the switching operation using an FCC-compliant impulse generator. The circuit is fabricated in a $0.8~mu {rm m}$ Si/SiGe HBT technology, consumes 31.4 mA at a 3.2 V supply and has a size of $510 times 490~mu{rm m}^{2}$ , including pads. It can be used in UWB systems using pulse correlation reception or spectral spreading.      

Extraction of the Effective Mobility of $ hbox{In}_{0.53}hbox{Ga}_{0.47}hbox{As}$ MOSFETs

The extraction of the effective mobility on $hbox{In}_{0.53} hbox{Ga}_{0.47}hbox{As}$ metal–oxide–semiconductor field-effect transistors (MOSFETs) is studied and shown to be greater than 3600 $hbox{cm}^{2}/hbox{V} cdot hbox{s}$. The removal of $C_{rm it}$ response in the split $C$–$V$ measurement of these devices is crucial to the accurate analysis of these devices. Low-temperature split $C$–$V$ can be used to freeze out the $D_{rm it}$ response to the ac signal but maintain its effect on the free carrier density through the substrate potential. Simulations that match this low-temperature data can then be “warmed up” to room temperature and an accurate measure of $Q_{rm inv}$ is achieved. These results confirm the fundamental performance advantages of $hbox{In}_{0.53}hbox{Ga}_{0.47}hbox{As}$ MOSFETs.      

Linear Systems, Sparse Solutions, and Sudoku

In this paper, we show that Sudoku puzzles can be formulated and solved as a sparse linear system of equations. We begin by showing that the Sudoku ruleset can be expressed as an underdetermined linear system: ${mmb{Ax}}={mmb b}$, where ${mmb A}$ is of size $mtimes n$ and $n>m$. We then prove that the Sudoku solution is the sparsest solution of ${mmb{Ax}}={mmb b}$, which can be obtained by $l_{0}$ norm minimization, i.e. $minlimits_{mmb x}Vert{mmb x}Vert_{0}$ s.t. ${mmb{Ax}}={mmb b}$. Instead of this minimization problem, inspired by the sparse representation literature, we solve the much simpler linear programming problem of minimizing the $l_{1}$ norm of ${mmb x}$, i.e. $minlimits_{mmb x}Vert{mmb x}Vert_{1}$ s.t. ${mmb{Ax}}={mmb b}$, and show numerically that this approach solves representative Sudoku puzzles.      

A Temperature-to-Digital Converter Based on an Optimized Electrothermal Filter

This paper describes the design of a CMOS temperature-to-digital converter (TDC). It operates by measuring the temperature-dependent phase shift of an electrothermal filter (ETF). Compared to previous work, this TDC employs an ETF whose layout has been optimized to minimize the thermal phase spread caused by lithographic inaccuracy. To minimize electrical phase spread, the TDC's front-end consists of a wide bandwidth gain-boosted transconductor. The transconductor's output current is then digitized by a phase-domain $Sigma Delta $ modulator whose phase-summing node is realized by a chopper demodulator. To minimize the residual offset caused by the demodulator's switching action, the demodulator is located at the virtual ground nodes established by the transconductor's gain-boosting amplifiers. Measurements on 16 samples (within one batch) show that the TDC has an untrimmed inaccuracy of less than $pm hbox{0.7} ,^{circ}hbox{C}$ ($3sigma $) over the military range ($- hbox{55} ,^{circ}hbox{C}$ to 125$ ,^{circ}hbox{C}$).      

A Low-Voltage Mobility-Based Frequency Reference for Crystal-Less ULP Radios

The design of a 100 kHz frequency reference based on the electron mobility in a MOS transistor is presented. The proposed low-voltage low-power circuit requires no off-chip components, making it suitable for application in wireless sensor networks (WSN). After a single-point calibration, the spread of its output frequency is less than 1.1% (3$sigma $) over the temperature range from $-{hbox{22}},^{circ}{hbox{C}}$ to 85$,^{circ}{hbox{C}}$ . Fabricated in a baseline 65$~$nm CMOS technology, the frequency reference circuit occupies 0.11$ hbox{mm}^{2}$ and draws 34 $ muhbox{A}$ from a 1.2 V supply at room temperature.