δ－掺杂GaAs／AlxGa_（1－x）As二维电子气结构材料的GSMBE生长与特性

本文用ＧＳＭＢＥ技术生长纯度ＧａＡｓ和δ－掺杂ＧａＡｓ／Ａｌ_ｘＧａ_（１－ｘ）Ａｓ结构二维电子气材料并对其电学性能进行了研究。对于纯度ＧａＡｓ的ＧＳＭＢＥ生长和研究，在低掺Ｓｉ时，载流子浓度为２×１０~（１４）ｃｍ~（－３），７７Ｋ时的迁移率可达８４，０００ｃｍ~２／Ｖ．ｓ。对于用ＧＳＭＢＥ技术生长的δ－掺杂ＧａＡｓ／Ａｌ_ｘＧａ_（１－ｘ）Ａｓ二维电子气材料，在优化了材料结构和生长工艺后，得到了液氮温度和６Ｋ迁移率分别为１７３，５８３ｃｍ~２／Ｖ．５和７．６７×１０~５ｃｍ~２／Ｖ．ｓ的高质量ＧａＡｓ／Ａｌ_ｘＧａ_（１－ｘ）Ａｓ二维电子气材料。     

GaAs－InP复合材料的外延生长方法及金属半导体场效应晶体管器件制备

提出了一种新的生长过渡层的方法，并利用低压金属有机气相外延技术在ＩｎＰ衬底上生长出高质量ＧａＡｓ外延材料，用Ｘ射线双晶衍射测得５μｍ厚ＧａＡｓ外延层的（００４）晶面衍射半峰高宽（ＦＷＨＭ）低至１４０ａｒｃｓｅｃ。并制出ＧａＡｓ金属半导体场效应晶体管（ＭＥＳＦＥＴ），其单位跨导为１００ｍｓ／ｍｍ，可满足与长波长光学器件进行单片集成的需要。     

GaAs—InP复合材料的外延生长方法及金属半导体场效应晶体管器件制备

提出了一种新的生长过渡层的方法，并利用低压金属有机气相外延技术在ＩｎＰ初底上生长出高质量ＧａＡｓ外延材料，用Ｘ射线双晶衍射测得５μｍ厚ＧａＡｓ外延层的晶面衍射半峰高宽（ＦＷＨＭ）低至１４０ａｒｃ ｓｅｃ。并制出ＧａＡｓ金属半导体场效应晶体管（ＭＥＳＦＥＴ），其单位跨导为１００ｍｇ／ｍｍ，可满足与长波长光这器件进行单片集成的需要。     

碳掺杂GaAs的MBE生长

本文在国内首次采用自行设计的碳纤维束源炉及固态源ＭＢＥ技术生长了优质碳掺杂ＧａＡｓ、ＡｌＧａＡｓ及δ碳掺杂ＧａＡｓ外延层。获得了空穴浓度从４×１０１４ｃｍ－３到２×１０１９ｃｍ－３的ＧａＡｓ材料。用霍尔效应测量仪、电化学ＣＶ剖面仪和Ｘ射线双晶衍射仪分析了外延层的质量。用Ｎｏｍａｒｓｋｉ干涉显微镜和原子力显微镜分析了ＧａＡｓ的生长过程。结果表明碳是ＧａＡｓＩＩＶ族化合物半导体的极好的ｐ型掺杂剂。     

p~＋－GaInAsSb／p－GaInAsSb／n－GaSb异质结红外控测器

ＧａＩｎＡｓＳｂ是红外探测器中重要的半导体材料之一。我们用水平常压金属氧化物化学气相淀积（ＭＯＣＶＤ）技术在ｎ型ＧａＳｂ衬底上成功地生长了ＧａＩｎＡｓＳｂ外延层，用ＰＬ谱、红外吸收谱、Ｘ射线衍射和扫描电子超声显微镜（ＳｃａｎｎｉｎｇＥｌｅｃｔｒｏｎＡｃｏｕｓｔｉｃＭｉｃｒｏｓｃｏｐｙ，ＳＥＡＭ）等实验手段对ＧａＩｎＡｓＳｂ外延层进行了表征。用ＧａＩｎＡｓＳｂ材料制作的红外探测器的光谱响应的截止波长达２．４μｍ，室温探测率Ｄ＊达１×１０９ｃｍＨｚ（１／２）／Ｗ，２．２５μｍ波长时的量子效率为３０％。本文首次给出了ＧａＩｎＡｓＳｂ外延层的扫描电子超声显微镜像（ＳＥＡＭ像），为扫描电子超声显微镜在半导体材料方面的应用开辟了一个新的领域。     

国产金属有机化合物TMGa,TMAl,TMIn和TMSb的MOVPE鉴定

利用我们研制的常压ＭＯＶＰＥ设备对国产ＴＭＧａ、ＴＭＡｌ、ＴＭＩｎ和ＴＭＳｂ进行了鉴定，为此分别生长了ＧａＡｓ、ＡｌＧａＡｓ、ＩｎＰ、ＧａＳｂ外延层和ＧａＡｓ／ＡｌＡｓ、ＧａＳｂ／ＩｎＧａＳｂ超晶格和ＧａＡｓ／ＡｌＧａＡｓ量子阱结构。表征材料纯度的７７Ｋ载流予迁移率分别达到ＧａＡｓ：μ＿ｎ＝５６６００ｃｍ￣２／Ｖ·ｓ，Ａｌ＿（０．２５）Ｇａ＿（０．７５）Ａｓ：μ＿ｎ＝５１６０ｃｍ￣２／Ｖ·ｓ，ＩｎＰ：μ＿ｎ＝６５３００ｃｍ￣２／Ｖ·ｓ，ＧａＳｂ：μ＿ｐ＝５０７６ｃｍ￣２／Ｖ·ｓ。由１０个周期的ＧａＡｓ／ＡｌＡｓ超晶格结构组成的可见光区布拉格反射器已观测到很好的反射光谱和双晶Ｘ射线回摆曲线上高达±２０级的卫星峰。ＧａＡｓ／Ａｌ＿（０．３５）Ｇａ＿（０．６５）Ａｓ量子阱最小阱宽为１０，在ｌｉＫ下由量子尺寸效应导致的光致发光峰能量移动为３９０ｍｅＶ，其线宽为１２ｍｅＶ。这些结果表明上述金属有机化合物已达到较高质量。     

GaAs的ICP选择刻蚀研究

选择刻蚀在ＧａＡｓ工艺中是非常重要的一步。由于湿法腐蚀存在钻蚀和选择性差,且精度难以控制,因此有必要进行干法刻蚀的研究。虽然采用反应离子刻蚀（ＲＩＥ）、磁增强反应离子刻蚀（ＭＥＲＩＥ）可以进行选择刻蚀,但是这两种方法在挖槽时会对器件造成较大损伤,影响器件性能。感应耦合等离子刻蚀（ＩＣＰ）是一种低损伤、高刻蚀速率高选择比的刻蚀方法,在ＧａＡｓ器件的制造中有突出的优点。本工作进行ＧａＡｓ／ＡｌＧａＡｓ     

AlGaAsSb/InGaAsSb多量子阱结构的光致发光谱

用固态源ＭＢＥ技术生长了ＡｌＧａＡｓＳｂ／ＩｎＧａＡｓＳｂ多量子阱材料,研究了通过改变多量子阱ＡｌＧａＡｓＳｂ／ＩｎＧａＡｓＳｂ中的结构参数,如多量子阱中ＩｎＧａＡｓＳｂ的阱宽,ＡｌＧａＡｓＳｂ的垒宽及垒层中Ａｌ组分和阱层中的Ｉｎ组分,多量子阱中的阱数等,来提高ＡｌＧａＡｓＳｂ／ＩｎＧａＡｓＳｂ多量子阱的ＰＬ强度。     

光阴极材料GaAs／AlGaAs的组分分析

为探索砷化我阴极的光电灵敏度的影响因素,利用Ｘ射线光电子能谱、二次离子擀谱和电化学方法测试和分析了国内和国外ＧａＡｓ光阴极材料ＧａＡｓ／ＡｌＧａＡｓ的Ｃ,Ｏ含量的空穴深度分布。实验发现,国内的材料在ＧａＡｓ／ＡｌＧａＡｓ 面及ＡｌＧａＡｓ层的Ｏ含量分别为７．６％和１０．６％,Ｃ深度分别为５．２×１０＾１８ａｔｏｍｓ／ｃｍ＾３和１．０×１０＾１９ａｔｏｍｓ／ｃｍ＾３,而国外的材料的Ｏ含量相应为１．０     

Al_xGa_（1－x）As外延层中Si平面掺杂的SIMS研究

利用二次离子质谱（ＳＩＭＳ）系统地研究了生长温度，Ａｌ组份ｘ值和Ａｓ＿４压强对Ｓｉδ掺杂Ａｌ＿ｘＧａ＿（１－ｘ）Ａｓ的ＳＩＭＳ深度剖面，Ｓｉ原子表面分凝和向衬底扩散的影响。实验发现，在外延生长Ｓｉδ掺杂Ａｌ＿ｘＧａ＿（１－ｘ）Ａｓ时，随着生长温度的提高或Ａｌ组份Ｘ值增加，Ｓｉ掺杂分布ＳＩＭＳ峰都非对称展宽，表面分凝作用加强，但不影响Ｓｉ原子的扩散，因此ＳＩＭＳ剖面的展宽与扩散无关。另外，我们还发现Ａｓ＿４压强高于１．５×１０￣（－５）ｍｂａｒ时，Ａｓ＿４压强对δ掺杂空间分布影响不大，而Ａｓ＿４压强低于此压强时，Ｓｉ掺杂分布峰宽度增加很快，这主要由杂质扩散作用引起。生长温度对掺杂分布峰影响最大，其次是Ａｌ组份影响，而较小Ａｓ＿４压强的影响不可忽视。这些研究结果对外延生长Ｓｉδ掺杂Ａｌ＿ｘＧａ＿（１－ｘ）Ａｓ材料是有价值的。     

GaAsN/GaAs and InGaAsN/GaAs heterostructures grown by molecular beam epitaxy

Molecular beam epitaxy was used to fabricate GaAsN/GaAs and InGaAsN/GaAs heterostructures, and the influence of the growth regimes on their characteristics was studied. It is shown that implantation of nitrogen causes a substantial long-wavelength shift of the radiation. The possibility of obtaining 1.4 μm radiation at room temperature was demonstrated using In_0.28Ga_0.72As_0.97N_0.03/GaAs quantum wells. Pis’ma Zh. Tekh. Fiz. 24, 81–87 (December 12, 1998)     

一种具有GaInAsN/GaAs量子阱结构的三结太阳能电池的设计

该文使用传输矩阵法分析了GaInAsN/GaAs量子阱对电子的透射情况,并使用crosslight软件对GaInAsN/GaAs量子阱太阳能电池的伏安特性进行了数值模拟和分析。初步讨论了量子阱的阱宽和垒厚的变化对量子阱电池伏安特性的影响.模拟结果发现垒厚32nm、阱宽7nm的量子阱光伏性能表现良好。作为有源区,当将该量子阱加入到GaAs子电池中,InGaP/GaAs/Ge三结电池在AM0下的短路电流密度达到19.81mA/cm2,比未使用量子阱有源区的三结电池提高了20%。     

Wet oxidation of thin AlAs in cylindrical composite of GaAs/AlAs/GaAs

Lateral wet oxidation in a cylindrical composite, GaAs/AlAs/GaAs, with varying thickness of the AlAs layer has been investigated. The oxidation depth in AlAs was measured in the temperature range of 400–480 °C. At given temperature and time, the depth increases with the increase in thickness. The thickness effect was successfully interpreted based on the kinetic model of boundary layer diffusion. The results are consistent with the findings from early studies on samples of square and rectangular cross-sections with the same activation energy of the thermal process.     

SIMS profiling of GaAs/δ-AlAs/GaAs/… heterostructures using polyatomic ionized oxygen clusters

We have studied the possibility of using polyatomic ions as the primary projectile particles for the depth profiling of solid heterostructures by means of secondary ion mass spectrometry (SIMS) in combination with ion etching. Bombardment of a target by ionized oxygen clusters of the O _n ⁺ (n=3, 4) type allows the specific impact energy per primary atom to be reduced, which significantly improves the depth resolution. It is shown that a beam of primary O _n ⁺ (n=3, 4) clusters with the specific impact energy as low as 1 keV per oxygen atom can be obtained using a standard ion source with a magnetic mass separator. High-resolution depth profiles of a test heterostructure of the GaAs/δ-AlAs/GaAs/… type were obtained using a magnetic sector mass spectrometer and a primary beam of O ₃ ⁺ ions with a specific energy of 1 keV per oxygen atom. The experimental data are compared with the results of computer simulation of the ion sputtering process performed using the DITRIRS code.     

Annealing of GaAs/AIAs superlattices

A 60 nm GaAs/AIAs superlattice has been annealed under a variety of conditions. In the case of samples annealed in an arsenic rich atmosphere, the disordering of the superlattice was observed to be non-uniform. This non-uniformity of the disordering is in contrast to the observed disordering of the sample annealed under arsenic dissociative pressure. In this case the disordering of the superlattice was uniform throughout the sample. Until now evidence for the depth dependency of the interdiffusion process relied solely on the interpretation of photoluminescence results. The data obtained from these experiments clearly indicate that the interdiffusion of GaAs/AIAs superlattices cannot be represented by one interdiffusion coefficient, as proposed by Tan and Gosele. In addition, it is demonstrated that the interdiffusion coefficient presented by Tan and Gosele overestimates the true interdiffusion coefficient at 1000° C.     

自组织InAs/GaAs与InGaAs/GaAs量子点生长及退火情况的比较

本文采用MBE进行InAs/GaAs与InGaAs/GaAs量子点的生长,利用RHEED进行实时监测,并利用RHEED强度振荡测量生长速率。对生长的InAs/GaAs和InGaAs/GaAs两种量子点生长过程与退火情况进行对比,观察到当RHEED衍射图像由条纹状变为网格斑点时,InAs所需要的时间远小于InGaAs;高温退火下RHEED衍射图像恢复到条纹状所需要的时间InAs比InGaAs要长。     

Properties of Au/W/GaAs Schottky barriers

The electrical and chemical properties of r.f. sputtered Au/W Schottky barriers on GaAs studied by Auger electron spectroscopy are reported. There is considerable interest in such work at present owing to the refractory nature and the thermal stability of tungsten on GaAs. The built-in potential of tungsten on GaAs was measured to be about 0.65 eV by both I–V and C–V techniques. Although tungsten alone has been reported to be stable on GaAs even at elevated temperatures of up to 500°C, the presence of a gold overlay and/or pinholes in the r.f. sputtered tungsten reduces its refractory nature. W/Au Schottky barriers annealed at 475 and 575°C for 10 min showed no appreciable degradation in their electrical properties. Samples annealed at 475°C for 2 h and 800°C for 15 min showed some degradation and migration of gold through the tungsten film. GaAs field effect transistors (FETs) with tungsten gates 0.7 μm long showed a maximum measured gain of 14 dB at 8 GHz.     

AlGaInP/GaAs异质结双极晶体管直流特性研究

制备了大尺寸AlGaInP／GaAs SHBT和DHBT，对其直流特性进行了测试，并分析了AlGaInP／GaA。单异质结晶体管(SHBT)和双异质结晶体管(DHBT)的直流特性差异，深入研究了影响AlGaInP／GaAsHBT开启电压(Voffset)的各个因素。结果表明：AlGaInP／GaAsHBT开启电压与外加基极电流密切相关，采用宽发射区可大大降低器件的开启电压。     

Oxidative annealing of ZnSe/GaAs heterostructures

We annealed ZnSe/GaAs heterostructures in the oxygen atmosphere and investigated structural and optical properties of the forming films using X-ray diffraction and photoluminescence. While highly textured ZnO films were synthesized via low-temperature processing (~ 500 °C), high temperature processing (~ 800 °C) promoted reaction at the film/substrate interface and Zn loss from the film surface resulting in the polycrystalline ZnGa₂O₄ and ZnO₂.     

GaAs Mach－Zehnder型光波导开关／调制器

采用非对称Ｘ结耦合器代替传统的Ｙ分支器，研制了ＧａＡｓＭａｃｈ－Ｚｅｈｎｄｅｒ型２×２光开光，得到了小于－２２．４ｄＢ的串音比和１２Ｖ左右的开关电压，器件的波导传输损耗小于７ｄＢ／ｃｍ。预计该器件可广泛应用于ＧａＡｓ开关列阵及高速光调制等领域。