High-speed driving scheme and compact high-speed low-power rail-to-rail class-B buffer amplifier for LCD applications

A high-speed driving scheme and a compact high-speed low-power rail-to-rail class-B buffer amplifier, which are suitable for small- and large-size liquid crystal display applications, are proposed. The driving scheme incorporates two output driving stages in which the output of the first output driving stage is connected to the inverting input and that of the second driving stage is connected to the capacitive load. A compensation resistor is connected between the two output stages for stability. The second output stage is used to improve the slew rate and the settling time. The buffer draws little current while static but has a large driving capability while transient. The circuit achieves the large driving capability by employing simple comparators to sense the transients of the input to turn on the output stages, which are statically off in the stable state. This increases the speed of the circuit without increasing static power consumption too much. A rail-to-rail folded-cascode differential amplifier is used to amplify the input signal difference and supply the bias voltages for the second stage. An experimental prototype output buffer implemented in a 0.35-/spl mu/m CMOS technology demonstrates that the circuit draws only 7-/spl mu/A static current and exhibits the settling times of 2.7 /spl mu/s for rising and 2.9 /spl mu/s for falling edges for a voltage swing of 3.3 V under a 600-pF capacitance load with a power supply of 3.3 V. The active area of this buffer is only 46.5/spl times/57/spl mu/m/sup 2/.     

1.5 V large-driving class-AB buffer amplifier with quiescent current control

A 1.5 V large-driving class-AB buffer amplifier with quiescent current control suitable for output driver application is proposed. An experimental prototype buffer demonstrated that the circuit draws only 80 /spl mu/A static current, and exhibited the rise time of 0.4 /spl mu/s and fall time of 1 /spl mu/s under a 100 /spl Omega///150 pF load.     

A high-speed low-power rail-to-rail column driver for AMLCD application

A high-speed rail-to-rail low-power column driver for active matrix liquid crystal display application is proposed. An inversion controller is attached to a typical column driver for rail-to-rail operation. Two high-speed complementary differential buffer amplifiers are proposed to drive a pair of column lines and to realize a rail-to-rail and high-speed drive. The output buffer amplifier achieves a large driving capability by employing a simple comparator to sense the transients of the input to turn on an auxiliary driving transistor, which is statically off in the stable state. This increases the speed without increasing static power consumption. The experimental prototype 6-bit column driver implemented in a 0.35-/spl mu/m CMOS technology demonstrates that the driver exhibits the maximum settling times of 1.2 /spl mu/s and 1.4 /spl mu/s for rising and falling edges with a dot inversion under a 680-pF capacitance load. The static current consumptions are 4.7 and 4.2 /spl mu/A for pMOS input buffers and nMOS input buffers, respectively. The values of the differential nonlinearity (DNL) and integral nonlinearity (INL) are less than 1/2 LSB.     

An 80 ns 1 Mbit MASK ROM with a new memory cell

A high-speed 1-Mb MASK ROM incorporating a new through-hole programmed memory cell, named THOLE CELL, and a full CMOS static sense amplifier is described. The ROM has been fabricated using a double-polysilicon p-well CMOS technology. As a result of achieving a compact ROM cell that is as small as 5.2-/spl times/6.4 /spl mu/m/SUP 2/, even with relatively conservative 2.0 /spl mu/m design rules, a small die size of 7.08/spl times/7.7 mm/SUP 2/ is realized. The ROM organization is 128K/spl times/8 bit and has a typical access time of 80 ns. A typical active current of 8 mA is achieved, in spite of the fully static system. This ROM offers high speed and low power characteristics, while achieving small die size and short turnaround time.     

A dual-path bandwidth extension amplifier topology with dual-loop parallel compensation

A dual-path amplifier topology with dual-loop parallel compensation technique is proposed for low-power three-stage amplifiers. By using two parallel high-speed paths for high-frequency signal propagation, there is no passive capacitive feedback network loaded at the amplifier output. Both the bandwidth and slew rate are thus significantly improved. Implemented in a 0.6-/spl mu/m CMOS process, the proposed three-stage amplifier has over 100-dB gain, 7-MHz gain-bandwidth product, and 3.3-V//spl mu/s average slew rate while only dissipating 330 /spl mu/W at 1.5 V, when driving a 25-k/spl Omega///120-pF load. The proposed amplifier achieves at least two times improvement in bandwidth-to-power and slew-rate-to-power efficiencies than all other reported multistage amplifiers using different compensation topologies.     

Design of low-power analog drivers based on slew-rate enhancement circuits for CMOS low-dropout regulators

Low-power analog driver based on a single-stage amplifier with an embedded current-detection slew-rate enhancement (SRE) circuit is presented. By developing a systematic way to design both the response time and optimal sizing of driving transistors in the SRE circuit, the SRE circuit can be controlled to turn on or turn off properly. In addition, the analog driver only dissipates low static power and its transient responses are significantly improved without transient overshoot when driving large capacitive loads. Implemented in a 0.6-/spl mu/m CMOS process, a current-mirror amplifier with the current-detection SRE circuit has achieved over 43 times improvement in both slew rate and 1% settling time when driving a 470-pF load capacitor. When the proposed analog driver is employed in a 50-mA CMOS low-dropout regulator (LDO), the resultant load transient response of the LDO has 2-fold improvement for the maximum load-current change, while the total quiescent current is only increased by less than 3%.     

A very high precision 500-nA CMOS floating-gate analog voltage reference

A floating gate with stored charge technique has been used to implement a precision voltage reference achieving a temperature coefficient (TC) <1 ppm//spl deg/C in CMOS technology. A Fowler-Nordheim tunnel device used as a switch and a poly-poly capacitor form the basis in this reference. Differential dual floating gate architecture helps in achieving extremely low temperature coefficients, and improving power supply rejection. The reference is factory programmed to any value without any trim circuits to within 200 /spl mu/V of its specified value. The floating-gate analog voltage reference (FGAREF) shows a long-term drift of less than 10 ppm//spl radic/1000 h. This circuit is ideal for portable and handheld applications with a total current of only 500 nA. This is done by biasing the buffer amplifier in the subthreshold region of operation. It is fabricated using a 25-V 1.5-/spl mu/m E/sup 2/PROM CMOS technology.     

Design and anaylsis of a 2.5-Gbps optical receiver analog front-end in a 0.35-/spl mu/m digital CMOS technology

This paper presents the design of an optical receiver analog front-end circuit capable of operating at 2.5 Gbit/s. Fabricated in a low-cost 0.35-/spl mu/m digital CMOS process, this integrated circuit integrates both transimpedance amplifier and post limiting amplifier on a single chip. In order to facilitate high-speed operations in a low-cost CMOS technology, the receiver front-end has been designed utilizing several enhanced bandwidth techniques, including inductive peaking and current injection. Moreover, a power optimization methodology for a multistage wide band amplifier has been proposed. The measured input-referred noise of the optical receiver is about 0.8 /spl mu/A/sub rms/. The input sensitivity of the receiver front-end is 16 /spl mu/A for 2.5-Gbps operation with bit-error rate less than 10/sup -12/, and the output swing is about 250 mV (single-ended). The front-end circuit drains a total current of 33 mA from a 3-V supply. Chip size is 1650 /spl mu/m/spl times/1500 /spl mu/m.     

Low-power fully integrated and tunable CMOS RF wireless receiver for ISM band consumer applications

A 0.25-/spl mu/m single-chip CMOS single-conversion tunable low intermediate frequency (IF) receiver operated in the 902-928-MHz industrial, scientific, and medical band is proposed. A new 10.7-MHz IF section that contains a limiting amplifier and a frequency modulated/frequency-shift-key demodulator is designed. The frequency to voltage conversion gain of the demodulator is 15 mV/kHz and the dynamic range of the limiting amplifier is around 80 dB. The sensitivity of the IF section including the demodulator and limiting amplifier is -72 dBm. With on-chip tunable components in the low-power low-noise amplifier (LNA) and LC-tank voltage-controlled oscillator circuit, the receiver measures an RF gain of 15 dB at 915 MHz, a sensitivity of -80 dBm at 0.1% bit-error rate, an input referred third-order intercept point of -9 dBm, and a noise figure of 5 dB with a current consumption of 33 mA and a 2450 /spl mu/m/spl times/ 2450 /spl mu/m chip area.     

MOS transistors operated in the lateral bipolar mode and their application in CMOS technology

Operation of an MOS transistor as a lateral bipolar is described and analyzed qualitatively. It yields a good bipolar transistor that is fully compatible with any bulk CMOS technology. Experimental results show that high /spl beta/-gain can be achieved and that matching and 1/f noise properties are much better than in MOS operation. Examples of experimental circuits in CMOS technology illustrate the major advantages that this device offers. A multiple current mirror achieves higher accuracy, especially at low currents. An operational transconductance amplifier has an equivalent input noise density below 0.1 /spl mu/V//spl radic/Hz for frequencies as low as 1 Hz and a total current of 10 /spl mu/A. A bandgap reference yields a voltage stable within 3 mV from -40 to +80/spl deg/C after digital adjustment at ambient temperature. Other possible applications are suggested.     

一种用于LCD驱动的低功耗输出缓冲放大器

在AB类输出级的基础上,结合正反馈辅助的B类输出级,提出了一种用于LCD驱动电路的大输出摆率、低功耗的输出缓冲放大器。在0.15μm高压CMOS工艺模型下,该放大器能够驱动0～20nF范围的容性负载,静态电流为7μA,1%精度建立时间小于6μs,满足了LCD驱动电路行建立时间的要求;通过采用共源共栅频率补偿结合输出零点补偿技术,较好地满足了大动态范围容性负载的要求。     

On a new topology for the transconductance feedback amplifier

A new topology for a transconductance feedback amplifier (TFA) is presented in this paper. The topology offers the advantage that it is capable of realizing the negative of the standard inverting gain expression. That is, gains of the form +R/sub 2//R/sub 1/. We will also show that it can realize the standard inverting and noninverting gains, all the while maintaining near constant bandwidth in each configuration as gain is varied. This first feature makes the proposed topology attractive for filtering applications since the TFA can function as an integrator, thereby allowing this amplifier to realize positive and negative lossless integrators. The proposed amplifier can also generate the logarithm of an input in the first and fourth quadrants, unlike previous TFA configurations. The proposed amplifier was verified experimentally for different gain configurations, integration and logarithmic capabilities by a chip designed using TSMC's 0.18-/spl mu/m CMOS process of a single ended power supply of 1.8 V. The chip occupied an area of 752.6 /spl mu/m by 581.2 /spl mu/m and contained the proposed amplifier and a conventional TFA for comparison purposes. A bandwidth of 15 MHz was observed for the proposed TFA in the unity gain (/spl plusmn/1) configuration.     

Transconductance with capacitances feedback compensation for multistage amplifiers

A new performance-boosting frequency compensation technique is presented, named Transconductance with Capacitances Feedback Compensation (TCFC). A transconductance stage and two capacitors introduce negative feedback to a three-stage amplifier, which significantly improves the performance such as gain-bandwidth product, slew rate, stability and sensitivity. An optimized TCFC amplifier has been implemented, and fabricated in a 0.35-/spl mu/m CMOS process. The TCFC amplifier driving a 150-pF load capacitor achieved 2.9-MHz gain-bandwidth product dissipating only 45-/spl mu/W power with a 1.5 V supply, which shows a significant improvement in MHz/spl middot/pF/mA performance.     

An 18 ns CMOS/SOS 4K static RAM

A high-speed CMOS/SOS 4K word/spl times/1 bit static RAM is described. The RAM features a MoSi/SUB 2/ gate CMOS/SOS technology with 2 /spl mu/m gate length and 500 /spl Aring/ thick gate oxide. Performance advantage of SOS over bulk is discussed for the scaled-down MOS LSI with 1-2 /spl mu/m gate. A standard 6-transistor CMOS cell and a two-stage sense amplifier scheme are utilized. In spite of the rather conservative 3.5 /spl mu/m design rule except for the 2 /spl mu/m gate length, the cell size of 36/spl times/36 /spl mu/m, the die size of 3.11/spl times/4.07 mm, and the typical read access and cycle time of 18 ns are achieved. The active and standby power dissipation are 200 mW and 50 /spl mu/W, respectively.     

Micropower CMOS S&H circuit for ambient intelligence applications

A novel sample and hold (S&H) circuit is presented based on the use of a class AB CMOS operational transconductance amplifier with very high slew rate and very low static power consumption. The circuit has been fabricated in a 0.5 /spl mu/m double-poly CMOS technology. The quiescent power consumption is only 80 /spl mu/W using a dual supply voltage of /spl plusmn/1.35 V. The S&H occupies 0.075 mm/sup 2/ of silicon area.     

Design of a low-power 3.5-GHz broad-band CMOS transimpedance amplifier for optical transceivers

This paper describes a novel low-power low-noise CMOS voltage-current feedback transimpedance amplifier design using a low-cost Agilent 0.5-/spl mu/m 3M1P CMOS process technology. Theoretical foundations for this transimpedance amplifier by way of gain, bandwidth and noise analysis are developed. The bandwidth of the amplifier was extended using the inductive peaking technique, and, simulation results indicated a -3-dB bandwidth of 3.5 GHz with a transimpedance gain of /spl ap/60 dBohms. The dynamic range of the amplifier was wide enough to enable an output peak-to-peak voltage swing of around 400 mV for a test input current swing of 100 /spl mu/A. The output noise voltage spectral density was 12 nV//spl radic/Hz (with a peak of /spl ap/25 nV//spl radic/Hz), while the input-referred noise current spectral density was below 20 pA//spl radic/Hz within the amplifier frequency band. The amplifier consumes only around 5 mA from a 3.3-V power supply. A test chip implementing the transimpedance amplifier was also fabricated using the low-cost CMOS process.     

A low-voltage BiMOS op amp

Describes the development of a threshold implanted BiMOS amplifier IC optimized for 2-5 V operation at a supply current of 300 /spl mu/A. A nonlinear operational transconductance amplifier (OTA) buffer having on-chip feedback provides a low-impedance rail-to-rail output, and a bulk-modulated PMOS input pair extends the common-mode range. Protective-network bootstrapping makes possible subpicoampere input-bias currents below 85/spl deg/C, and improved offset stability is achieved by the choice of threshold-level stage currents. Amplifier design is straightforward and readily applied from `micropower' to `broad-band' operating ranges. The combination of these features has produced a unique high-performance integrated circuit.     

Active-feedback frequency-compensation technique for low-power multistage amplifiers

An active-feedback frequency-compensation (AFFC) technique for low-power operational amplifiers is presented in this paper. With an active-feedback mechanism, a high-speed block separates the low-frequency high-gain path and high-frequency signal path such that high gain and wide bandwidth can be achieved simultaneously in the AFFC amplifier. The gain stage in the active-feedback network also reduces the size of the compensation capacitors such that the overall chip area of the amplifier becomes smaller and the slew rate is improved. Furthermore, the presence of a left-half-plane zero in the proposed AFFC topology improves the stability and settling behavior of the amplifier. Three-stage amplifiers based on AFFC and nested-Miller compensation (NMC) techniques have been implemented by a commercial 0.8-/spl mu/m CMOS process. When driving a 120-pF capacitive load, the AFFC amplifier achieves over 100-dB dc gain, 4.5-MHz gain-bandwidth product (GBW) , 65/spl deg/ phase margin, and 1.5-V//spl mu/s average slew rate, while only dissipating 400-/spl mu/W power at a 2-V supply. Compared to a three-stage NMC amplifier, the proposed AFFC amplifier provides improvement in both the GBW and slew rate by 11 times and reduces the chip area by 2.3 times without significant increase in the power consumption.     

Opportunistic multichannel driving scheme for low power mobile TFT-LCD driver IC

A novel source driving scheme called opportunistic multichannel driving (OMCD) is proposed for use in mobile TFT-LCD driver ICs (T-LDIs). In the OMCD scheme, the operation of the source drivers of a T-LDI is controlled by the equivalence of RGB colour data for adjacent pixels. That is, one source driver drives the neighbouring source lines as well as the corresponding one when the colour data of adjacent pixcels are identical to each other. With this scheme, all the source drivers associated with the neighbouring source lines can be completely turned off, allowing the reduction of static and dynamic current of these drivers. A test chip was fabricated in a 5 V/0.8 /spl mu/m 2.5 V/0.25 /spl mu/m triple-metal CMOS process, and the experimental result shows that the power reduction of 12-21% was obtained with die size overhead less than 0.5%.     

High-power 1.5-/spl mu/m InGaAsP-InP slab-coupled optical waveguide amplifier

We report the first demonstration of a high-power semiconductor optical amplifier (SOA) based on the slab-coupled optical waveguide concept. This concept allows the realization of SOAs having large fundamental optical modes, low loss, and small optical confinement factor. These attributes support large output saturation power, long length for efficient heat removal, and direct butt-coupling to single-mode fibers. The 1.5-/spl mu/m InGaAsP-InP quantum-well amplifier described here has a length of 1 cm, 1/e/sup 2/ intensity widths of 4 /spl mu/m (vertical) and 8 /spl mu/m (horizontal), a fiber-to-fiber gain of 13 dB, and a fiber-coupled output saturation power of 630 mW (+28 dBm). The measured butt-coupling efficiency between the amplifier and SMF-28 is 55%. Thus, the output saturation power of the amplifier itself is approximately 1.1 W (+31 dBm).