Compact $S$ -/$Ka$-Band CMOS Quadrature Hybrids With High Phase Balance Based on Multilayer Transformer Over-Coupling Technique

This paper presents compact CMOS quadrature hybrids by using the transformer over-coupling technique to eliminate significant phase error in the presence of low-$Q$ CMOS components. The technique includes the inductive and capacitive couplings, where the former is realized by employing a tightly inductive-coupled transformer and the latter by an additional capacitor across the transformer winding. Their phase balance effects are investigated and the design methodology is presented. The measurement results show that the designed 24-GHz CMOS quadrature hybrid has excellent phase balance within ${pm}{hbox{0.6}}^{circ}$ and amplitude balance less than ${pm} {hbox{0.3}}$ dB over a 16% fractional bandwidth with extremely compact size of 0.05 mm$^{2}$. For the 2.4-GHz hybrid monolithic microwave integrated circuit, it has measured phase balance of ${pm}{hbox{0.8}}^{circ}$ and amplitude balance of ${pm} {hbox{0.3}}$ dB over a 10% fractional bandwidth with a chip area of 0.1 mm$^{2}$ .      

A Phase-Locked Loop With Injection-Locked Frequency Multiplier in 0.18-$mu{hbox{m}}$ CMOS for $V$ -Band Applications

In this paper, a novel CMOS phase-locked loop (PLL) integrated with an injection-locked frequency multiplier (ILFM) that generates the $V$-band output signal is proposed. Since the proposed ILFM can generate the fifth-order harmonic frequency of the voltage-controlled oscillator (VCO) output, the operational frequency of the VCO can be reduced to only one-fifth of the desired frequency. With the loop gain smaller than unity in the ILFM, the output frequency range of the proposed PLL is from 53.04 to 58.0 GHz. The PLL is designed and fabricated in 0.18-$mu{hbox{m}}$ CMOS technology. The measured phase noises at 1- and 10-MHz offset from the carrier are $-$ 85.2 and $-{hbox{90.9 dBc}}/{hbox{Hz}}$, respectively. The reference spur level of $-{hbox{40.16 dBc}}$ is measured. The dc power dissipation of the fabricated PLL is 35.7 mW under a 1.8-V supply. It can be seen that the advantages of lower power dissipation and similar phase noise can be achieved in the proposed PLL structure. It is suitable for low-power and high-performance $V$-band applications.      

A $Q$ -Band Four-Element Phased-Array Front-End Receiver With Integrated Wilkinson Power Combiners in 0.18-$mu{{hbox{m}}}$ SiGe BiCMOS Technology

A four-element phased-array front-end receiver based on 4-bit RF phase shifters is demonstrated in a standard 0.18- $mu{{hbox{m}}}$ SiGe BiCMOS technology for $Q$-band (30–50 GHz) satellite communications and radar applications. The phased-array receiver uses a corporate-feed approach with on-chip Wilkinson power combiners, and shows a power gain of 10.4 dB with an ${rm IIP}_{3}$ of $-$13.8 dBm per element at 38.5 GHz and a 3-dB gain bandwidth of 32.8–44 GHz. The rms gain and phase errors are $leq$1.2 dB and $leq {hbox{8.7}}^{circ}$ for all 4-bit phase states at 30–50 GHz. The beamformer also results in $leq$ 0.4 dB of rms gain mismatch and $leq {hbox{2}}^{circ}$ of rms phase mismatch between the four channels. The channel-to-channel isolation is better than $-$35 dB at 30–50 GHz. The chip consumes 118 mA from a 5-V supply voltage and overall chip size is ${hbox{1.4}}times {hbox{1.7}} {{hbox{mm}}}^{2}$ including all pads and CMOS control electronics.      

A Sub-0.2$^{circ}/$ hr Bias Drift Micromechanical Silicon Gyroscope With Automatic CMOS Mode-Matching

This paper describes a system architecture and CMOS implementation that leverages the inherently high mechanical quality factor (Q) of a MEMS gyroscope to improve performance. The proposed time domain scheme utilizes the often-ignored residual quadrature error in a gyroscope to achieve, and maintain, perfect mode-matching (i.e., $sim$0 Hz split between the high-Q drive and sense mode frequencies), as well as electronically control the sensor bandwidth. A CMOS IC and control algorithm have been interfaced with a 60 $mu{hbox {m}}$ thick silicon mode-matched tuning fork gyroscope $({rm M}^{2}mathchar"707B {rm TFG})$ to implement an angular rate sensing microsystem with a bias drift of 0.16$^{circ}/{hbox{hr}}$. The proposed technique allows microsystem reconfigurability—the sensor can be operated in a conventional low-pass mode for larger bandwidth, or in matched mode for low-noise. The maximum achieved sensor Q is 36,000 and the bandwidth of the microsensor can be varied between 1 to 10 Hz by electronic control of the mechanical frequencies. The maximum scale factor of the gyroscope is 88 ${hbox{mV}}/^{circ}/{hbox{s}}$ . The 3$~$ V IC is fabricated in a standard 0.6 $ mu{hbox {m}}$ CMOS process and consumes 6 mW of power with a die area of 2.25 ${hbox {mm}}^{2}$.      

Experimental Demonstration of Deeply-Etched SiO$_{2}$ Ridge Optical Waveguides and Devices

Deeply-etched ${hbox{SiO}}_{2}$ optical ridge waveguides are fabricated and characterized. A detailed discussion of the fabrication process (especially for the deep etching process) is presented. The measured propagation losses for the fabricated waveguides with different core widths range from $0.33sim {hbox {0.81}}~{hbox {dB}}/{hbox {mm}}$. The loss is mainly caused by the scattering due to the sidewall roughness. The losses in bending sections are also characterized, which show the possibility of realizing a small bending radius (several tens of microns). 1 $,times {rm N}$ ( ${rm N}=2$, 4, 8) multimode interference couplers based on the deeply-etched ${hbox{SiO}}_{2}$ ridge waveguide are also fabricated and show fairly good performances.      

A 2.4-GHz Resistive Feedback LNA in 0.13-$mu$m CMOS

A $g_{m}$-boosted resistive feedback low-noise amplifier (LNA) using a series inductor matching network and its application to a 2.4 GHz LNA is presented. While keeping the advantage of easy and reliable input matching of a resistive feedback topology, it takes an extra advantage of $g_{m}$ -boosting as in inductively degenerated topology. The gain of the LNA increases by the $Q$ -factor of the series RLC input network, and its noise figure (NF) is reduced by a similar factor. By exploiting the $g_{m}$-boosting property, the proposed fully integrated LNA achieves a noise figure of 2.0 dB, S21 of 24 dB, and IIP3 of ${- 11}~ hbox{dBm}$ while consuming 2.6 mW from a 1.2 V supply, and occupies 0.6 ${hbox {mm}}^{2}$ in 0.13-$mu{hbox {m}}$ CMOS, which provides the best figure of merit. This paper also includes an LNA of the same topology with an external input matching network which has an NF of 1.2 dB.      

Electrical Properties of $hbox{Bi}_{5}hbox{Nb}_{3} hbox{O}_{15}$ Thin Film Grown on $hbox{TiN}/hbox{SiO}_{2}/ hbox{Si}$ at Room Temperature for Metal–Insulator–Metal Capacitors

Buckling was observed in $hbox{Bi}_{5}hbox{Nb}_{3}hbox{O}_{15}$ (BiNbO) films grown on $hbox{TiN}/hbox{SiO}_{2}/hbox{Si}$ at 300 $^{circ}hbox{C}$ but not in films grown at room temperature and annealed at 350 $^{circ}hbox{C}$. The 45-nm-thick films showed a high capacitance density and a low dissipation factor of 8.81 $hbox{fF}/muhbox{m}^{2}$ and 0.97% at 100 kHz, respectively, with a low leakage current density of 3.46 $hbox{nA}/hbox{cm}^{2}$ at 2 V. The quadratic and linear voltage coefficients of capacitance of this film were 846 $hbox{ppm}/hbox{V}^{2}$ and 137 ppm/V, respectively, with a low temperature coefficient of capacitance of 226 $hbox{ppm}/^{circ}hbox{C}$ at 100 kHz. This suggests that a BiNbO film grown on a $hbox{TiN}/ hbox{SiO}_{2}/hbox{Si}$ substrate is a good candidate material for high-performance metal–insulator–metal capacitors.      

Reliability of Combined $k{hbox{-out-of-}}n$ and Consecutive $k_{c}{hbox{-out-of-}}n$ Systems of Markov Dependent Components

A combined $k{hbox{-out-of-}}n$ :$F(G)$ & consecutive $k_{c}{hbox{-out-of-}}n{hbox{:}}F(G)$ system fails (functions) iff at least $k$ components fail (function), or at least $k_{c}$ consecutive components fail (function). These models involve two common failure criteria, and can be used in various situations depending on the actual failure criteria involving consecutive components, or all components. Explicit formulas for the reliabilities of these systems are obtained for Markov dependent components using the distribution theory of runs. Some numerical results are also presented.      

LMS-Based Noise Leakage Calibration of Cascaded Continuous-Time Modulators

In cascaded $DeltaSigma$ modulators (DSMs), the quantization noise of the earlier stage leaks to the output unless completely cancelled by the digital noise cancellation filter (NCF). The noise leakage is worse in the continuous-time (CT) implementation due to the poorly controlled time constant of the analog loop filter. A parameter-based continuous-time to discrete-time transform is developed to get an exact digital NCF, and the analog filter time constant is calibrated to match with the digital NCF. A binary pulse tone is injected into the quantizer to detect the filter time-constant error, and eliminated by zero-forcing its residual power based on the adaptive least-mean-square (LMS) algorithm. A 2-1-1 cascaded CT-DSM prototype in 0.18-$mu{hbox {m}}$ CMOS demonstrates that the spectral density of the leaked noise is lower than 10 ${rm nV}/surd{hbox {Hz}}$ after the capacitors in the Gm-C loop filters are trimmed with 1.1% step. With a 1- ${rm V}_{rm pp}$ full-scale input, it achieves a dynamic range of 68$~$ dB within 18-MHz bandwidth at an over-sampling ratio of 10. The analog core and the digital logic occupy 1.27 ${hbox {mm}}^{2}$, and consume 230 mW at 1.8 V.      

A Dual-Band Self-Oscillating Mixer for -Band and -Band Applications

A self-oscillating mixer that employs both the fundamental and harmonic signals generated by the oscillator subcircuit in the mixing process is experimentally demonstrated. The resulting circuit is a dual-band down-converting mixer that can operate in $C$ -band from 5.0 to 6.0 GHz, or in $X$-band from 9.8 to 11.8 GHz. The oscillator uses active superharmonic coupling to enforce the quadrature relationship of the fundamental outputs. Either the fundamental outputs of the oscillator or the second harmonic oscillator output signals that exists at the common-mode nodes are connected to the mixer via a set of complementary switches. The mixer achieves a conversion gain between 5–12 dB in both frequency bands. The output 1-dB compression points for both modes of the mixer are approximately $-{hbox{5 dBm}}$ and the output third-order intercept point for $C$ -band and $X$ -band operation are 12 and 13 dBm, respectively. The integrated circuit was fabricated in 0.13-$mu {hbox{m}}$ CMOS technology and measures ${hbox{0.525 mm}}^{2}$ including bonding pads.      

$S$ - and $C$ -Band Ultra-Compact Phase Shifters Based on All-Pass Networks

Ultra-compact phase shifters are presented. The proposed phase-shifting circuits utilize the lumped element all-pass networks. The transition frequency of the all-pass network, which determines the size of the circuit, is set to be much higher than the operating frequency. This results in a significantly small chip size of the phase shifter. To verify this methodology, 5-bit phase shifters have been fabricated in the $S$ - and $C$ -band. The $S$ -band phase shifter, with a chip size of 1.87 mm $,times,$0.87 mm (1.63 mm $^{2}$), has achieved an insertion loss of ${hbox{6.1 dB}} pm {hbox{0.6 dB}}$ and rms phase-shift error of less than 2.8$^{circ}$ in 10% bandwidth. The $C$ -band phase shifter, with a chip size of 1.72 mm $,times,$0.81 mm (1.37 mm $^{2}$), has demonstrated an insertion loss of 5.7 dB $pm$ 0.8 dB and rms phase-shift error of less than 2.3 $^{circ}$ in 10% bandwidth.      

$hbox{TiN/ZrO}_{2}$/Ti/Al Metal–Insulator–Metal Capacitors With Subnanometer CET Using ALD-Deposited $hbox{ZrO}_{2}$ for DRAM Applications

We provide the first report of the structural and electrical properties of $hbox{TiN/ZrO}_{2}$/Ti/Al metal–insulator–metal capacitor structures, where the $hbox{ZrO}_{2}$ thin film (7–8 nm) is deposited by ALD using the new zirconium precursor ZrD-04, also known as Bis(methylcyclopentadienyl) methoxymethyl. Measured capacitance–voltage ($C$– $V$) and current–voltage ( $I$–$V$) characteristics are reported for premetallization rapid thermal annealing (RTP) in $hbox{N}_{2}$ for 60 s at 400 $^{circ}hbox{C}$, 500 $^{circ}hbox{C}$, or 600 $^{ circ}hbox{C}$. For the RTP at 400 $^{circ}hbox{C}$ , we find very low leakage current densities on the order of nanoamperes per square centimeter at a gate voltage of 1 V and low capacitance equivalent thickness values of $sim$ 0.9 nm at a gate voltage of 0 V. The dielectric constant of $ hbox{ZrO}_{2}$ is 31 $pm$ 2 after RTP treatment at 400 $^{circ}hbox{C}$.      

High-Performance $hbox{In}_{0.7}hbox{Ga}_{0.3}hbox{As}$ -Channel MOSFETs With High-$kappa$ Gate Dielectrics and $alpha$-Si Passivation

Long and short buried-channel $hbox{In}_{0.7}hbox{Ga}_{0.3}hbox{As}$ MOSFETs with and without $alpha$-Si passivation are demonstrated. Devices with $alpha$-Si passivation show much higher transconductance and an effective peak mobility of 3810 $hbox{cm}^{2}/ hbox{V} cdot hbox{s}$. Short-channel MOSFETs with a gate length of 160 nm display a current of 825 $muhbox{A}/muhbox{m}$ at $V_{g} - V_{t} = hbox{1.6} hbox{V}$ and peak transconductance of 715 $muhbox{S}/muhbox{m}$. In addition, the virtual source velocity extracted from the short-channel devices is 1.4–1.7 times higher than that of Si MOSFETs. These results indicate that the high-performance $hbox{In}_{0.7}hbox{Ga}_{0.3} hbox{As}$-channel MOSFETs passivated by an $alpha$ -Si layer are promising candidates for advanced post-Si CMOS applications.      

Low-Threshold Strained Quantum-Well GaSb-Based Lasers Emitting in the 2.5- to 2.7-$mu$ m Wavelength Range

GaInAsSb–GaSb strained quantum-well (QW) ridge waveguide diode lasers emitting in the wavelength range from 2.51 to 2.72 $ mu{hbox {m}}$ have been grown by molecular beam epitaxy. The devices show ultralow threshold current densities of 44 $hbox{A}/{hbox {cm}}^{2}$ (${L}rightarrow infty $) for a single QW device at 2.51 $ mu{hbox {m}}$, which is the lowest reported value in continuous-wave operation near room temperature (15 $^{circ}hbox{C}$) at this wavelength. The devices have an internal loss of 3 ${hbox {cm}}^{-1}$ and a characteristic temperature of 42 K. By using broader QWs, wavelengths up to 2.72 $mu{hbox {m}}$ could be achieved.      

Extraction of the Effective Mobility of $ hbox{In}_{0.53}hbox{Ga}_{0.47}hbox{As}$ MOSFETs

The extraction of the effective mobility on $hbox{In}_{0.53} hbox{Ga}_{0.47}hbox{As}$ metal–oxide–semiconductor field-effect transistors (MOSFETs) is studied and shown to be greater than 3600 $hbox{cm}^{2}/hbox{V} cdot hbox{s}$. The removal of $C_{rm it}$ response in the split $C$–$V$ measurement of these devices is crucial to the accurate analysis of these devices. Low-temperature split $C$–$V$ can be used to freeze out the $D_{rm it}$ response to the ac signal but maintain its effect on the free carrier density through the substrate potential. Simulations that match this low-temperature data can then be “warmed up” to room temperature and an accurate measure of $Q_{rm inv}$ is achieved. These results confirm the fundamental performance advantages of $hbox{In}_{0.53}hbox{Ga}_{0.47}hbox{As}$ MOSFETs.      

Near-Stoichiometric Ti : LiNbO$_{3}$ Strip Waveguides Fabricated by Standard Ti Diffusion and Post-VTE

We report near-stoichiometric (NS) Ti : LiNbO$_{3}$ waveguides fabricated by indiffusion of 4-, 5-, 6-, 7- $mu{hbox {m}}$-wide 120-nm-thick Ti-strips at 1060 $^{circ}hbox{C}$ for 10 h into a congruent $hbox{LiNbO}_{3}$ (i.e., standard Ti diffusion procedure) and post-vapour-transport-equilibration (VTE) treatment at 1100 $^{circ}hbox{C}$ for 5 h. These waveguides are NS and single-mode at 1.5 $mu{hbox {m}}$, and have a loss of 1.0/0.8 dB/cm for the TM/TE mode. In the width/depth direction of the waveguide, the mode field follows a Gauss/Hermite–Gauss profile, and the Ti profile follows a sum of two error functions/a Gauss function. The post-VTE resulted in increase of diffusion width/depth by 2.0/1.0 $mu{hbox {m}}$. A two-dimensional refractive index profile in the guiding layer is suggested.      

Comparative Study of the Low-Frequency-Noise Behaviors in a-IGZO Thin-Film Transistors With $hbox{Al}_{2}hbox{O}_{3}$ and $hbox{Al}_{2}hbox{O}_{3}/hbox{SiN}_{x}$ Gate Dielectrics

A comparative study is made of the low-frequency noise (LFN) in amorphous indium–gallium–zinc oxide (a-IGZO) thin-film transistors (TFTs) with $hbox{Al}_{2}hbox{O}_{3}$ and $hbox{Al}_{2}hbox{O}_{3}/hbox{SiN}_{x}$ gate dielectrics. The LFN is proportional to $hbox{1}/f^{gamma}$, with $gamma sim hbox{1}$ for both devices, but the normalized noise for the $hbox{Al}_{2}hbox{O}_{3}/hbox{SiN}_{x}$ device is two to three orders of magnitude lower than that for the $hbox{Al}_{2} hbox{O}_{3}$ device. The mobility fluctuation is the dominant LFN mechanism in both devices, but the noise from the source/drain contacts becomes comparable to the intrinsic channel noise as the gate overdrive voltage increases in $hbox{Al}_{2}hbox{O}_{3}/hbox{SiN}_{x}$ devices. The $hbox{SiN}_{x}$ interfacial layer is considered to be very effective in reducing LFN by suppressing the remote phonon scattering from the $hbox{Al}_{2}hbox{O}_{3}$ dielectric. Hooge's parameter is extracted to $sim !!hbox{6.0} times hbox{10}^{-3}$ in $hbox{Al}_{2}hbox{O}_{3}/hbox{SiN}_{x}$ devices.      

A Theoretical Comparison of the Breakdown Behavior of $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ and InP Near-Infrared Single-Photon Avalanche Photodiodes

We study the breakdown characteristics and timing statistics of InP and $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ single-photon avalanche photodiodes (SPADs) with avalanche widths ranging from 0.2 to 1.0 $mu{hbox {m}}$ at room temperature using a random ionization path-length model. Our results show that, for a given avalanche width, the breakdown probability of $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ SPADs increases faster with overbias than InP SPADs. When we compared their timing statistics, we observed that, for a given breakdown probability, InP requires a shorter time to reach breakdown and exhibits a smaller timing jitter than $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ . However, due to the lower dark count probability and faster rise in breakdown probability with overbias, $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ SPADs with $hbox{avalanche} hbox{widths}leq 0.5 mu{hbox {m}}$ are more suitable for single-photon detection at telecommunication wavelengths than InP SPADs. Moreover, we predict that, in InP SPADs with $hbox{avalanche} hbox{widths}leq 0.3 mu{hbox {m}}$ and $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}$ SPADs with $hbox{avalanche} hbox{widths}leq 0.2 mu{hbox {m}}$, the dark count probability is higher than the photon count probability for all applied biases.      

New Terahertz Laser Lines From $^{13}{hbox {CD}}_{3}{hbox {OH}}$ Pumped by Regular and Hot Bands ${hbox {CO}}_{2}$ Laser

We have used our new pulsed ${hbox {CO}}_{2}$ laser, operating both on regular and hot bands, to excite the $^{13}{hbox {CD}}_{3}{hbox {OH}}$ methanol isotopomer. This has lead to the observation of 13 new high-threshold far-infrared laser emissions (also identified as terahertz laser lines), with frequencies in the range between 24.11 and 102.56 cm$^{-1}$ (0.72–3.07 THz). The absorption transitions leading to these new FIR laser emissions have been located by observing the optoacoustic absorption spectra around the ${hbox {CO}}_{2}$ emissions. Here, we present these new far-infrared laser lines, characterized in wavelength, polarization, offset relative to the center of the pumping ${hbox {CO}}_{2}$ laser transition, relative intensity, and optimum operation pressure.      

A 5-GHz CMOS Type-II PLL With Low $K_{rm VCO}$ and Extended Fine-Tuning Range

A 5-GHz dual-path integer-$N$ Type-II phase-locked loop (PLL) uses an LC voltage-controlled oscillator and softly switched varactors in an overlapped digitally controlled integral path to allow a large fine-tuning range of approximately 160 MHz while realizing a low susceptibility to noise and spurs by using a low $K_{rm VCO}$ of 3.2 MHz/V. The reference spur level is less than $-$70 dBc with a 1-MHz reference frequency and a total loop-filter capacitance of 26 pF. The measured phase noise is $-$75 and $-$115 dBc/Hz at 10-kHz and 1-MHz offsets, respectively, using a loop bandwidth of approximately 30 kHz. This 0.25-${hbox{mm}}^{2}$ PLL is fabricated in a 90-nm digital CMOS process and consumes 11 mW from a 1.2-V supply.