Experimental characterization of a curing thermoset epoxy‐anhydride system—Isothermal and nonisothermal cure kinetics

This work describes in detail the kinetic model for the cure of an epoxy‐anhydride thermoset matrix resin system. The cure kinetics in both nonisothermal and isothermal modes has been characterized using differential scanning calorimetry. The Sestak–Berggren two‐parameter autocatalytic model was used to describe the nonisothermal cure behavior of the resin satisfactorily. The isothermal cure data was fitted with Kamal's four‐parameter autocatalytic model, coupled with a diffusion factor. These characterization data will form material property inputs for a multiscale modeling framework for the estimation of cure‐induced residual stresses in thick thermoset matrix composites. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Modification of epoxy–anhydride thermosets using a hyperbranched poly(ester‐amide): I. Kinetic study

An epoxy‐anhydride formulation used for the coating of electrical devices was modified with a commercially available hyperbranched poly(ester‐amide), Hybrane? S2200, in order to improve the thermal degradability of the resulting thermoset and thus facilitate the recovery of substrate materials after use of the component. The curing kinetics of the unmodified and modified formulations were studied in detail with differential scanning calorimetry, Fourier transform infrared spectroscopy and rheology. The results suggest that S2200 gets incorporated into the network structure and the curing kinetics are accelerated by the presence of hydroxyl groups from S2200. Copyright © 2012 Society of Chemical Industry     

Kinetics modeling of a modified epoxy–amine formulation cured by thermal and microwave energy

The reaction kinetics of a rubber-modified epoxy formulation cured by microwave or thermal energy were investigated. Two phenomenological models were developed to predict the time and temperature dependence of the conversion for the neat and the modified systems. Good agreement was observed between the kinetic models and experimental results generated by chromatographic and calorimetric techniques. The same kinetic behavior was observed whatever the curing process (conventional or microwave heating). © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68: 543–552, 1998     

Preparation,characterization, and thermal properties of controllable metal–imidazole complex curing agents for epoxy resins

A series of complexes incorporating the epoxy–imidazole adduct of phenyl glycidyl ether with 2‐ethyl‐4‐methylimidazole (PGE‐EMI), has been prepared with the acetato and chloro transition metal salts of Mn, Co, Ni, Cu, Zn, and Ag. These complexes have been characterized using spectroscopic methods (IR, UV‐Vis, ¹H‐ and ¹³C‐NMR, where appropriate) and their thermal stabilities have been determined using elevated temperature NMR techniques. These high‐temperature NMR results indicated that the chloro complexes studied (of Mn²⁺, Co²⁺, Ni²⁺, Cu²⁺, and Zn²⁺) exist in equilibrium (i.e., they dissociate reversibly in a solution of dimethylsulphoxide, DMSO, at elevated temperatures), while the corresponding acetato complexes dissociate irreversibly. For the silver complexes, thermogravimetric analysis (TGA) was used to monitor the dissociation, showing that the weight loss recorded was consistent with the dissociation of the metal salt to liberate the PGE–imidazole ligand. The thermal stabilities of the metal complexes were influenced by changing both the transition metal (e.g., from Mn to Zn) and varying the anion (e.g., from acetate to chloride). From ¹H‐NMR analysis, a decrease of ca. 10°C was observed in the thermal dissociation of the acetato complexes when compared with the chloro complexes, showing that the series of PGE‐EMI complexes with acetate anions is less thermally stable than the corresponding chlorides. This finding suggests that these PGE‐EMI complexes may be modified to accommodate their use in a variety of different curing schedules when used to cure epoxy resins. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 201–217, 2000     

聚酰亚胺-环氧树脂胶黏剂的固化动力学研究

以2,2-双[4-(4-氨基苯氧基)苯基1丙烷(BAPOPP)和2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BPADA)为原料在室温下于DMAe溶剂中合成了一种新型聚酰亚胺,并用其改性环氧树脂体系获得聚酰亚胺-环氧体系胶黏剂.利用差示扫描量热计(DSC),以不同的升温速率对聚酰亚胺-环氧树脂胶黏剂进行DSC...     

Preparation and properties of multiwalled carbon nanotube/epoxy‐amine composites

Different amounts of multiwalled carbon tubes (MWCNTs) were incorporated into an epoxy resin based on diglycidyl ether of bisphenol A and both epoxy precursor and composite were cured with 4,4′‐diamino diphenyl sulfone. Transmission and scanning electron microscopy demonstrated that the carbon nanotubes are dispersed well in the epoxy matrix. Differential scanning calorimetry measurements confirmed the decrease in overall cure by the addition of MWCNTs. A decrease in volume shrinkage of the epoxy matrix caused by the addition of MWCNTs was observed by pressure–volume–temperature measurements. Thermomechanical and dynamic mechanical analysis were performed for the MWCNT/epoxy composites, showing that the T_g was slightly affected, whereas the dimensional stability and stiffness are improved by the addition of MWCNTs. Electrical conductivity measurements of the composite samples showed that an insulator to conductor transition takes place between 0.019 and 0.037 wt % MWCNTs. The addition of MWCNTs induces an increase in both impact strength (18%) and fracture toughness (38%) of the epoxy matrix with very low filler content. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Determining the gel point of an epoxy–hexaanhydro‐4‐methylphthalic anhydride (MHHPA) system

The DEBGA–MHHPA epoxy system has found increasing applications in microelectronics packaging for which the ability to understand and model the cure kinetics mechanism accurately is crucial. The present article reports on the work done to elucidate accurate knowledge of the gel point by rheological methods. To determine the gel point using the G′–G″ crossover method was found not to be accurate, and the gel point obtained by this method was found to be frequency‐dependent. Using the point where tgδ was found independent of the frequency can accurately define the gel point at different temperatures. At the gel point determined by this method, G′ and G″ were found to follow the same power law, demonstrating the accuracy of the method in determining the gel point. The scaling exponent obtained was 0.75–0.79. The activation energy for the cure reaction of the system was determined to be 75.1 kJ/mol by the obtained gel times at different temperatures. The steady‐shear rheology test was also used to observe the viscosity change at the gel point. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1248–1256, 2000     

Curing kinetics and thermal property characterization of a bisphenol‐S epoxy resin and DDS system

The kinetics of the cure reaction for a system of bisphenol‐S epoxy resin (BPSER), with 4,4′‐diaminodiphenyl sulfone (DDS) as a curing agent was investigated with a differential scanning calorimeter (DSC). Autocatalytic behaviour was observed in the first stages of the cure which can well be described by the model proposed by Kamal, using two rate constants, k₁ and k₂, and two reaction orders, m and n. The overall reaction order, m + n, is in the range 2∼2.5, and the activation energy for k₁ and k₂ was 86.26 and 65.13 kJ mol⁻¹, respectively. In the later stages, a crosslinked network was formed and diffusion control was incorporated to describe the cure. The glass transition temperature (T_g) of the BPSER/DDS samples partially cured isothermally was determined by means of torsional braid analysis (TBA) and the results showed that the reaction rate increased with increasing T_g, in terms of rate constant, but decreased with increasing conversion. It was also found that the  SO₂ group both in the epoxy resin and in the hardener increases the T_g values of the cured materials compared with that of BPAER. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of BPSER/DDS has nth order reaction kinetics. © 2000 Society of Chemical Industry     

Cure characterization of soybean oil—Styrene—Divinylbenzene thermosetting copolymers

Bio‐based resins are an alternative to petroleum‐based resins in the production of fiber‐reinforced polymers (FRPs) by processes such as pultrusion. A detailed understanding of the cure behavior of the resin is essential to determine the process variables for production of FRPs. In this work, the cure kinetics of soybean oil‐styrene‐divinylbenzene thermosetting polymers is characterized by differential scanning calorimetry (DSC) measurements. By varying the concentration of the cationic initiator from 1 to 3 weight percent (wt %), the most viable resin composition for pultrusion is identified. The ability of phenomenological reaction models to describe the DSC measurements for the optimum resin composition is tested and kinetic equations, which can be used to determine the degree of cure at any temperature and time, are determined. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Processing and characterization of epoxy–anhydride‐based intercalated nanocomposites

A study of the kinetic and thermal characterization of an epoxy resin (DGEBA) polymerized with a methyl tetrahydrophthalic anhydride reinforced with montmorillonite‐layered silicates is presented. The nanoreinforcement used was compatibilized by exchanging the cations between the silicate layers with alkylammonium salts, containing long hydrocarbon chains. The aim of this study was to develop new nanocomposites based on thermoset resins with improved thermal stability, suitable for electronic applications. Differential scanning calorimetry was used here to produce the polymerization kinetics data, while thermogravimetric analysis was used to evaluate the effects of the nanoreinforcements on the thermal stability and to analyze the degradation kinetics. Unexpected strong effects of the nanocomposite on the polymerization kinetics of the epoxy–anhydride system were detected and evaluated. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 2532–2539, 2003     

Curing kinetics and thermal property characterization of a bisphenol‐F epoxy resin and DDO system

The curing kinetics of a bisphenol‐F epoxy resin (BPFER)/4,4′‐diaminodiphenyl oxide (DDO) system were studied with isothermal experiments via differential scanning calorimetry. Autocatalytic behavior was shown in the first stages of the cure for the system, which was well described by the model proposed by Kamal that includes two rate constants, k₁ and k₂, and two reaction orders, m and n. The curing reaction at the later stages was practically diffusion‐controlled because of the onset of gelation and vitrification. For a more precise consideration of the diffusion effect, a diffusion factor, f(α), was introduced into Kamal's equation. In this way, the curing kinetics were predicted well over the entire range of conversion, covering both previtrification and postvitrification stages. The glass‐transition temperatures (T_g's) of the BPFER/DDO system partially isothermally cured were determined by means of torsional braid analysis, and the results showed that T_g's increased with conversion up to a constant value. The highest T_g was 376.3 K. The thermal degradation kinetics of cured BPFER were investigated with thermogravimetric analysis, which revealed two decomposition steps. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1586–1595, 2002     

Chemorheology and ultimate behavior of epoxy‐amine mixtures modified with a liquid oligomer

Rubber toughening of epoxy resins has been actively studied since the 1960s with clear progress in understanding of the ultimate properties: microstructure relationships. The morphology, obtained after curing of the modified thermosetting matrix, is a function of the process conditions as well as of the materials used because both influence the thermodynamics and the kinetics of phase separation. In this work several amounts of poly(oxypropylentriamine) (POPTA), have been added as modifier to a diglycidyl ether of bisphenol‐A (DGEBA)‐based epoxy matrix cured with a cycloaliphatic amine. Molecular weight of the neat resin and amine/epoxy stoichiometric ratio have also been used as variables. This investigation has focused upon the importance of cure chemorheology for microstructure formation by using both physicochemical (isothermal and dynamic calorimetry) and rheological techniques. In the second part of this study, the influence of the molecular weight of the epoxy resin in the ultimate properties of 15 wt % POPTA‐modified epoxy matrices is also analyzed. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1269–1279, 2000     

Curing kinetics of epoxy‐urethane copolymers

The cure of the epoxy resin diglycidyl ether of bisphenol A (Araldyt GY9527) with a mixture of cycloaliphatic amines (Distraltec) was studied, and the focus was on the effect of the copolymerization with a commercial polyurethane (PU) elastomer (Desmocap 12). A simplified phenomenological model was proposed to represent the copolymerization reaction. It considered the effect of the temperature and the concentration of the elastomer on the reaction rate, and it was simple enough to be included in models of processing conditions. A nonlinear regression analysis of the experimental conversion data obtained from differential scanning calorimetry was utilized to find the best fitting parameters to Kamal's equation for the chemically controlled part of the reaction (short times) under isothermal and constant heating‐rate conditions. The Rabinowitch approach together with the Addam–Gibbs theory was utilized to introduce the effect of diffusion control at the end of the reaction on the overall constant for the reaction rate. The Di Benedetto equation was used to predict the conversion at which vitrification takes place for each run. Experimental results for conversions higher than this critical conversion were utilized to obtain information about the diffusion kinetic constant using a nonlinear regression analysis as previously. The overall model obtained was used to calculate a calorimetric conversion and reaction rate as functions of time, which was in excellent agreement with the experimental results. The addition of PU elastomers affected the values of the activation energies of the chemically and diffusion controlled parts of the reaction, as well as the final conversion reached by the epoxy–amine system. The proposed model allowed prediction of all the observed features using parameters that were independent of the temperature of the curing reaction. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 79: 1771–1779, 2001     

Use of temperature‐modulated DSC in kinetic analysis of a catalysed epoxy–anhydride system

The curing kinetics of a catalysed epoxy‐anhydride system was studied by temperature‐modulated differential scanning calorimetry. The chemical‐controlled regime was analysed by empirical kinetic equations. The diffusion‐controlled regime was detected by the diffusion factor, DF(α,T), which was calculated from the ratio of the experimental rate to the chemical reaction rate. DF(α,T) was compared with a mobility factor, MF(α,T), which was obtained by measuring the modulus of the complex heat capacity |C_p*|. The equivalence of the two factors allowed the diffusion‐controlled regime to be studied using the |C_p*| signal. However, the results obtained in the epoxy–anhydride system showed a limitation to the method, and this is discussed in terms of the modulation period necessary for the variation in MF(α,T) to occur in the same conversion interval as does DF(α,T). Copyright © 2004 Society of Chemical Industry     

Synthesis and characterization of epoxy‐acrylate composite latex

A waterborne epoxy‐acrylate composite latex was synthesized. The effects of the concentration of the initiator, surfactant, and epoxy resin on the particle size, molecular weight, and grafting ratios of the composite latex were investigated. The increase of the concentration of the initiator and epoxy resin led to the decrease of the weight‐average molecular weight. The graft ratios increased with an increase in the initiator level and a decrease in the epoxy resin concentration whereas the variation of the concentration of the surfactant did not have much influence on the graft ratios. The increase in the initiator level caused the aggrandizement of the particle size, and the increase of the concentration of the surfactant and epoxy resin caused a decrease in the latex particle size. Fourier transform IR spectroscopy with attenuated total reflectance indicated that the epoxy resin molecules were enriched in the mold‐facing surface in the film from the composite latex. The differential scanning calorimetry analysis, dynamic mechanical analysis, and Instron test showed that the polymer films cast by the composite latex had lower tensile strength and glass transition than those by the blend latex. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1736–1743, 2002     

Etherification versus amine addition during epoxy resin/amine cure: An in situ study using near-infrared spectroscopy

The reactions between a multifunctional epoxy resin, tetraglycidyl 4,4′-diaminodiphenylmethane (TGDDM) and a monofunctional amine, methylaniline (mAnil) are studied. Due to the existence of a tertiary amine catalytic center within the TGDDM molecule, the etherification reaction during cure of TGDDM is usually more significant than in other epoxide systems. The importance of this reaction relative to the amine addition reactions is investigated. In situ near-infrared spectroscopy is used to obtain kinetic data during the cure reactions. The reaction rate constants are calculated from linear regression analysis for both amine addition and etherification reactions based on the reaction mechanisms proposed. Arrhenius relationships are observed for all the reaction rate constants involved. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 67:895–901, 1998