Studies on the curing behavior,thermal, and mechanical properties of epoxy resin-co-amine-functionalized lead phthalocyanine

A high performance copolymer was prepared by using epoxy (EP) resin as matrix and 3,10,17,24-tetra-aminoethoxy lead phthalocyanine (APbPc) as additive with dicyandiamide as curing agent. Fourier-transform infrared spectroscopy, dynamic mechanical analysis (DMA), differential scanning calorimetric analysis (DSC), and thermogravimetric analysis (TGA) were used to study the curing behavior, curing kinetics, dynamic mechanical properties, impact and tensile strength, and thermal stability of EP/APbPc blends. The experimental results show that APbPc, as a synergistic curing agent, can effectively reduce the curing temperature of epoxy resin. The curing kinetics of the copolymer was investigated by non-isothermal DSC to determine kinetic data and measurement of the activation energy. DMA, impact, and tensile strength tests proved that phthalocyanine can significantly improve the toughness and stiffness of epoxy resin. Highest values were seen on the 20 wt% loading of APbPc in the copolymers, energy storage modulus, and impact strength increased respectively 388.46 MPa and 3.6 kJ/m², T_g decreased 19.46°C. TGA curves indicated that the cured copolymers also exhibit excellent thermal properties.     

Effects of mesoporous SBA-15 contents on the properties of polystyrene composites via in-situ emulsion polymerization

Different loading of mesoporous molecular sieve SBA-15 was used to prepare polystyrene (PS)/SBA-15 composite materials via in-situ emulsion polymerization. The influence of SBA-15 silica on the styrene emulsion polymerization was studied regarding to the monomer conversion, particle size and particle size distribution, stability and viscosity of the resulting emulsion. The structure and properties of the composites were investigated by infrared spectroscopy (IR), X-ray diffraction (XRD), scanning electron microscopy (SEM) and gel permeation chromatography (GPC). In addition, the glass transition temperature (T_g), thermal mechanical property and thermal stability of the composite film were measured by differential scanning calorimeter (DSC), dynamic mechanical analysis (DMA) and thermogravimetric analysis (TGA), respectively. The results indicated that the composite emulsion showed high monomer conversion, thick viscosity, low coagulum, uniform particle size and broad size distribution. Molecular weight of the polymer decreased with the increase of mesoporous silica. SBA-15 silica was dispersed evenly in PS matrix at a loading of 5 %. The PS/SBA-15 composite material containing 10 % silica maintained a certain ordered structure. DMA results demonstrated that PS/SBA-15 composite exhibited greater storage modulus and high T_g compared to pure PS. The improved thermal stability and T_g of the composite were also confirmed by the TGA and DSC.     

Effect of poly(epichlorohydrin) on the thermal and mechanical properties of poly(vinyl chloride)

Five kinds of polyepichlorohydrin (PECH) of different molecular weights were synthesized and characterized by gel permeation chromatography (GPC). Mechanical blending was used to mix PECH and poly(vinyl chloride) (PVC) together. The blends of different PVC/PECH ratios were characterized by thermogravimetric analysis (TGA), tensile tests, differential scanning calorimetry (DSC), and dynamic mechanical analysis (DMA). TGA results show the thermal stability of PVC/PECH blends is desirable. Tensile tests indicate elongation at break is raised by increasing both the amount and the molecular weight of PECH. DSC is used to determine the glass transition temperature of PECH, and a quite low T_g is obtained. DMA results indicate that PECH has a perfect compatibility with PVC, when PECH concentration is below 20 wt %. There is only one peak in each tan δ curve, and the corresponding T_g decreases as PECH amount increases. However, above 20 wt %, phase separation takes place. The molecular weight of PECH also has a great influence on the glass transition temperature of the blends. This study shows that PECH is an excellent plasticizer for PVC, and one can tailor the glass transition temperature and tensile properties by changing the amount and the molecular weight of PECH. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

A high temperature polymer of phthalonitrile‐substituted phosphazene with low melting point and good thermal stability

A phthalonitrile‐substituted phosphonitrilic monomer has been synthesized from phosphonitrilic chloride trimer and then polymerized with addition of 4‐(hydroxylphenoxy)phthalonitrile (HPPN). The chemical structures of the phosphonitrilic monomer and polymer were characterized by Fourier Transform Infrared spectroscopy (FT‐IR) and proton Nuclear Magnetic Resonance spectroscopy (¹H NMR). Curing behaviors and thermal stabilities of the polymer were investigated through differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Analysis showed that the monomer has large processing temperature window and good thermal stability. Apparent activation energy, initial curing temperature (T_i), curing temperature (T_p), and termination curing temperature (T_f) of the phosphonitrilic polymer were explored. Dynamic mechanical analysis (DMA), glass transition temperature (T_g) were studied, and limiting oxygen index (LOI) were estimated from the van Krevelen equation, which indicates the polymer process high modulus and good flame retardance. Micro‐scale combustion calorimetry (MCC) was also used for evaluating the flammability of the polymers. Postcuring effects were explored, showing excellent thermal and mechanical properties with postcuring. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42606.     

Polyhedral oligomeric silsesquioxanes nanoreinforced methacrylate/epoxy hybrids

The aim of this study was to design novel binary and ternary copolymers based on methacrylate and/or epoxy monomers reinforced with 10 wt % mono‐/octafunctional polyhedral oligomeric silsesquioxanes (POSS) compounds bearing one or eight epoxy or methacrylate moieties. The experimental parameters such as temperature and time of reaction, comonomer ratio and the incorporation of various types of POSS that strongly influences the curing behavior, polymerization kinetics, glass transition temperature (T_g), thermostability and morphological structure of the obtained copolymers were investigated through DSC, FTIR, DMA, TGA, and SEM techniques. The obtained results evidenced that the complex kinetic mechanisms of curing reactions for the binary and ternary copolymers ± POSS influence the thermomechanical and morphological properties of the materials. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 42912.     

Study of the epoxy system BADGE (n = 0)/1,2‐DCH/CaCO3 filler by DMA and DSC

The influence of an inorganic filler, CaCO₃, on the curing kinetics of an epoxy system composed of diglycidyl ether of bisphenol A [BADGE (n = 0)], 1,2‐diaminecyclohexane (1,2‐DCH), and CaCO₃ filler was studied by DMA and DSC. Different contents of filler in the range from 10 to 30%, referred to the total weight of the mixture, were tried. It was found that maximum reproducibility of the results and better performance correspond to a filler content of 20%. As usual, the T_g's obtained by DMA and DSC are different at 10–20°C. The results obtained from this study were compared with those corresponding to the system BADGE (n = 0)/1,2‐DCH without filler; the T_g for this last system is higher than that for the system with filler incorporated, whereas E′ and M_c (molecular weight between repetition units) are lower for the system without filler. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 366–370, 2002     

Ecofriendly modification of acetosolv lignin from oil palm biomass for improvement of PMMA thermo‐oxidative properties

The environmentally friendly esterification of acetosolv lignin (AL), obtained from pressed oil palm mesocarp fibers, is described, for the improvement of thermo‐oxidative properties of poly(methyl methacrylate) (PMMA) films. Acetylation of AL was performed in ecofriendly conditions using acetic anhydride in the absence of catalysts. Acetylated acetosolv lignin (AAL) was successfully obtained in only 12 min with a solvent‐free and catalyst‐free microwave‐assisted procedure. Lignins were characterized by Fourier transform infrared spectroscopy, size exclusion chromatography, thermogravimetric analysis (TGA), and differential scanning calorimetry (DSC), confirming the efficacy of the methodology employed. AL and AAL as fillers in different concentrations (1% and 5%) were added to PMMA films. The thermal and mechanical properties of the lignin‐incorporated films were analyzed by TGA, DSC, and dynamic mechanical analysis (DMA). The films incorporated with lignin and acetylated lignin presented initial degradation temperature (T_onset) and onset oxidative temperature (OOT) values higher than pure PMMA films, contributing thus to an enhancement of thermo‐oxidative stability of PMMA. The DMA analyses showed that incorporation of AL or AAL increased the storage modulus (E′) of PMMA films, but did not affect their glass‐transition temperatures (T_g). The results indicate the potential use of oil palm mesocarp lignin to enhance the thermo‐oxidative properties of PMMA without compromising its mechanical response. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 45498.     

Preparation and properties of high performance phthalide‐containing bismaleimide modified epoxy matrices

A series of intercrosslinked networks formed by diglycidyl ether of bisphenol A epoxy resin (DGEBA) and novel bismaleimide containing phthalide cardo structure (BMIPP), with 4,4′‐diamino diphenyl sulfone (DDS) as hardener, have been investigated in detail. The curing behavior, thermal, mechanical and physical properties and compatibility of the blends were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), notched Izod impact test, scanning electron microscopy (SEM) and water absorption test. DSC investigations showed that the exothermic transition temperature (T_p) of the blend systems shifted slightly to the higher temperature with increasing BMIPP content and there appeared a shoulder on the high‐temperature side of the exothermic peak when BMIPP content was above 15 wt %. TGA and DMA results indicated that the introduction of BMIPP into epoxy resin improved the thermal stability and the storage modulus (G′) in the glassy region while glass transition temperature (T_g) decreased. Compared with the unmodified epoxy resin, there was a moderate increase in the fracture toughness for modified resins and the blend containing 5 wt % of BMIPP had the maximum of impact strength. SEM suggested the formation of homogeneous networks and rougher fracture surface with an increase in BMIPP content. In addition, the equilibrium water uptake of the modified resins was reduced as BMIPP content increased. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Degradable epoxy resins based on bisphenol A diglycidyl ether and silyl ether amine curing agents

A series of silyl ether amine curing agents were synthesized by selective substitution reactions of chloroalkylsilanes or the transetherification of alkoxysilanes. Crosslinked networks were prepared by mixing a stoichiometric ratio of bisphenol A diglycidyl ether (D.E.R 331) with the amine curing agents. The networks were characterized by ATR‐FTIR spectroscopy, TGA, DSC, and DMA. The onset of thermal degradation, glass transition temperatures, and storage moduli for the networks were 350 °C, 70–108 °C, and 5–25 MPa, respectively. The degradation behavior of the cured samples was monitored for 30 days in PBS, NaOH 5% (w/v), and HCl 5% (v/v) solutions and the degradation products were characterized by spectroscopic methods. The thermal, mechanical, and degradation studies indicated that crosslink density, T_g, storage modulus, and the rate of degradation were affected by the functionality of the amine curing agents and the number of hydrolyzable silyl ether bonds present per mole of curing agent. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44620.     

Super-crosslinked ionic liquid-intercalated montmorillonite/epoxy nanocomposites: Cure kinetics,viscoelastic behavior and thermal degradation mechanism

Super-crosslinked epoxy nanocomposites containing N-octadecyl-N′-octadecyl imidazolium iodide (IM)-functionalized montmorillonite (MMT-IM) nanoplatelets were developed and examined for cure kinetics, viscoelastic behavior and thermal degradation kinetics. The structure and morphology of MMT-IM were characterized by FTIR, XRD, TEM, and TGA. Synthesized MMT-IM revealed synergistic effects on the network formation, the glass transition temperature (T_g) and thermal stability of epoxy. Cure and viscoelastic behaviors of epoxy nanocomposites containing 0.1 wt% MMT and MMT-IM were compared based on DSC and DMA, respectively. Activation energy profile as a function of the extent of cure was obtained. DMA results indicated a strong interface between imidazole groups of MMT-IM and epoxy, which caused a significant improvement in storage modulus and the T_g of epoxy. Network degradation kinetics of epoxy containing 0.5, 2.0, and 5.0 wt% MMT and MMT-IM were compared by using Friedman, Kissinger-Akahira-Sunose (KAS), Flynn-Wall-Ozawa (FWO) and the modified Coats-Redfern methods. Although addition of MMT to epoxy was detrimental to the T_g value, as featured by a fall from 94.1°C to 89.7°C detected by DMA method, and from 103.3°C to 97.9°C by DSC method, respectively. By contrast, meaningful increase in such values were observed in the same order from 94.1°C to 94.7°C and from 103.3°C to 104.7°C for super-crosslinked epoxy/MMT-IM systems.     

Copolymerization of styrene and maleic anhydride in supercritical carbon dioxide

The copolymerization of styrene (St) and maleic anhydride (MA) was carried out in supercritical carbon dioxide (SC CO₂). It was found that St and MA are easy to copolymerize in SC CO₂ and the conversion can reach 97%, and that very fine and dry powders are obtained. The products were characterized using Fourier transform infrared spectroscopy (FTIR), gel permeation chromatography (GPC), scanning electron microscopy (SEM), differential scanning calorimetry (DSC), and thermogravimetric analysis (TGA). GPC data showed that the molecular weight of the copolymer reach 3.62 × 10⁴ g mol^?1. Scanning electron microphotographs showed the minimum particle size of the product is about 200 nm. DSC measurements indicated that the glass transition temperature (T_g) of the copolymer increases with increasing the MA content in the copolymer. TGA curve showed that the copolymers were decomposed at about 350°C. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Comparison of thermal techniques for glass transition measurements of polystyrene and cross-linked acrylic polyurethane films

There are few quantitative comparisons in the literature between glass transitions (T_g) measured by differential scanning calorimetry (DSC) and by dynamic mechanical analysis (DMA). Also, in the case of DMA, two different operational definitions have been used to obtain the glass transition, namely, the loss modulus (E″) and damping (tan δ) peak temperatures. We propose a new DMA definition of T_g and demonstrate that it agrees with DSC T_g measurements within ±2°C for both thermoplastic polystyrene and thermoset cross-linked acrylic polyurethane films with measurable tan δ peaks. The glass transitions for a single polystyrene standard and several cross-linked acrylic polyurethane films were measured by DSC. Additionally, E″ and tan δ peak temperatures were measured by DMA as a function of frequency and temperature. Empirically, it was determined that the average of the E″ and tan δ peak temperatures measured at 1 rad/s oscillation frequency corresponds to the glass transition measured by the ASTM E1356 DSC test method. © 1994 John Wiley & Sons, Inc.     

Montmorillonite nanoclay filler effects on electrical conductivity,thermal and mechanical properties of epoxy‐based nanocomposites

Epoxy‐based nanocomposites with 2, 5, and 7 wt% of montmorillonite (MMT) nanoclay were prepared using high shear melt mixing technique. The microstructural features of the nanocomposites were investigated by transmission electron microscopy (TEM). The thermal and mechanical properties were measured using differential scanning calorimetry (DSC), thermogravimetric analyzer (TGA), and dynamic mechanical analyzer (DMA). Further, the effect of voltage, temperature, seawater aging on the electrical conductivity (σ_DC) of the nanocomposites was also measured. To understand the free volume behavior upon filler loading, and to observe the connectivity between microstructure and other properties, positron annihilation lifetime spectroscopy was used. The TEM results revealed that MMT nanoparticles were uniformly dispersed in the epoxy matrix. Experimental results showed that the inclusion of 2 wt% MMT nanofiller increased the T_g, electrical conductivity, thermal stability, modulus, free volume of the epoxy nanocomposite significantly. This is well explained from the results of T_g (DSC and DMA), thermal stability, TGA residue, free volume analysis, and electrical conductivity. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers     

Microwave processing of SiC nanoparticles infused polymer composites: Comparison of thermal and mechanical properties

The goal of this study is to compare thermal and mechanical properties of an epoxy resin system reinforced with SiC nanoparticles using both conventional thermal curing and microwave irradiation techniques. The microwave curing technique has shown potential benefits in processing polymeric nanocomposites by reducing the curing time without compromising the thermo‐mechanical performances of the materials. It was observed from this investigation that, the curing time was drastically reduced to ～30 min for microwave curing instead of 12 h room temperature curing with additional 6 h post curing at 75°C. Ductile behavior was more pronounced for microwave curing technique while thermal curing showed brittle like behavior as revealed from flexural test. The maximum strain to failure was increased by 25–40% for microwave‐cured nanocomposites over the room temperature cured nanocomposites for the same loading of nanofillers. The glass transition temperature (T_g) also increased by ～14°C while curing under microwave irradiation. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41708.     

Fabrication and characterization of the mechanical properties of multi-walled carbon nanotube-reinforced epoxy resins by e-beam irradiation

In this study, the multi-walled carbon nanotubes (MWNT) were reinforced to epoxy resin as fabrication of epoxy/MWNT nanocomposites by electron beam (e-beam) curing. An attempt is made to disperse MWNT into diglycidyl ether of bisphenol A (DGEBA) as epoxy resins, using triarylsulfonium hexafluoroantimonate (TASHFA) as an initiator. E-beam irradiation effect on the curing of the epoxy resin was investigated in oxygen and nitrogen atmospheres at room temperature. The flexural modulus was measured by a universal testing machine (UTM). Here, the flexural modulus factor exhibits an upper limit at 0.3 wt% MWNT. The dynamic mechanical and thermal properties of the irradiated epoxy resins were characterized using DMA, DSC and TGA machines. DMA curves of the storage modulus revealed an increase with an increasing MWNT content and radiation dose. However, the T_g curve decreased as a function of the increasing MWNT content and radiation dose. The thermal properties of the TGA and DSC data were improved by increasing the content of the MWNT and the radiation dose. Likewise, the thermal properties were stabilized by increasing the amount of initiator and irradiating the resins in a nitrogen atmosphere.     

Comparison of thermal techniques for glass transition assignment. II. Commercial polymers

The differential scanning calorimetry glass transition (DSC T_g), measured by ASTM test method E-1356, and the dynamic mechanical analysis glass transition (DMA T_g), measured using a new definition of the DMA T_g, generally agree within ±4°C for a wide variety of commercially available polymers. The DMA T_g is defined as the average of E′ and tan δ peak temperatures measured at a 1 rad/s oscillation frequency. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 64: 191–195, 1997     

Deeper insights into the thermal properties of epoxy thermoset resins using torsion measurements

The glass transition temperature (T_g) of epoxy thermosets is a critical material property that depends on the component chemistry, the final cross-link density, and processing conditions. This study incorporates dynamic mechanical analysis (DMA) testing with a torsion clamp geometry on a TA Instruments DHR-2 and differential scanning calorimetry (DSC) to characterize five different two-component epoxy-amine systems. Investigation of the T_g dependence on DMA frequency and heating shows that lowering the frequency from 1 to 0.01 Hz results in a T_g very similar to that measured using DSC, while a heating rate of 0.3°C/min using DMA gives a T_g comparable to the DSC measured value at 30°C/min. The DMA technique reveals secondary relaxation transitions and peak broadening in the tan(δ) plots of poorly mixed epoxy blends, quantified using full width at half maximum (FWHM) of tan(δ) peaks, and are indicative of a non-homogeneous cross-linked network and off-ratio blending, respectively. The increase in the FWHM due to poor mixing ranges from 8% to 96%. These parameters are easily measurable and quantifiable in DMA, but are not observed in DSC. The additional DMA insights are valuable for process development and failure analysis, and can improve the understanding of epoxies.     

Compatibility study of chlorinated polyethylene/ethylene methacrylate copolymer blends using thermal,mechanical, and chemical analysis

Blends of chlorinated polyethylene (CPE) elastomer and ethylene methacrylate copolymer (EMA) in various compositions were studied for their compatibility using differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and Fourier transform infrared (FTIR) spectroscopy techniques. Irrespective of measurement techniques used, all blends showed a single glass transition temperature (T_g) lying in between the T_g of control polymers in both DSC and DMA. Glass transition temperatures of blends obtained from DSC were in consistency with Couchman–Karasz equation. Also, the T_g obtained from both DSC and DMA are above the “rule of mixing” line of the two control polymers. These results from thermal analysis clearly indicate some compatibility between the two polymers. Furthermore, compatibility of CPE/EMA blends were also been investigated by FTIR spectroscopy and scanning electron microscopic analysis. A shifting of characteristic C? Cl stretching peak of CPE and C?O stretching peak of EMA toward lower wave number indicate the presence of specific interaction between the two polymers. Mechanical properties like tensile strength, modulus at 100% elongation, elongation at break, and hardness were observed above the line of additivity drawn between the two control polymers, which corroborate compatibility between CPE and EMA. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40316.     

Synthesis and properties of a novel bismaleimide resin containing 1,3,4‐oxadiazole moiety and the blend systems thereof with epoxy resin

A new bismaleimide monomer, 2‐((4‐maleimidophenoxy)methyl)‐5‐(4‐maleimidophenyl)‐1,3,4‐oxadiazole (Mioxd), was designed and synthesized. The chemical structure of the monomer was confirmed by means of Fourier transform infrared (FTIR) spectroscopy, proton nuclear magnetic resonance (¹H NMR) spectroscopy and elemental analysis, and its thermal properties were characterized using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Mioxd as a reactive modifier was blended with epoxy resin based on bisphenol A diglycidyl ether (DGEBA) in weight ratio of 5, 10, and 15%, using 4,4′‐diaminodiphenyl sulfone (DDS) as hardener. The effect of Mioxd addition on the cure behavior and thermal properties of the blend resins was studied by DSC, TGA, and dynamic mechanical analysis (DMA). DSC investigations showed that the main exothermic peak temperature (T_p) of the blend systems did not obviously shift with increasing Mioxd content whereas a new shoulder appeared and gradually grew on the high temperature side of the exothermic peak. The results of DMA measurements exhibited the glassy storage modulus (G') and glass transition temperatures (T_g) increased as the Mioxd content was increased, the cured blends investigated were miscible and no phase separation occurred. Further, the thermal decomposition temperature first decreased and then increased, but the char yield at 600°C increased with an increase in Mioxd content. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers     

Thermal characteristics of IPNs composed of polyallylamine and chitosan

Interpenetrating polymer network (IPN) hydrogels composed of polyallylamine and chitosan were synthesized by radical polymerization using 2,2‐dimethyl‐2‐ phenylacetophenone (DMPAP) and methylene bisacrylicamide (MBAAm) as initiator and crosslinker, respectively. The IPNs thus obtained were characterized by using Fourier transform infrared (FT‐IR) spectroscopy, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and dielectric analysis (DEA). The melting temperatures of IPNs were observed with increasing chitosan content by DSC. DEA was employed to ascertain the glass transition temperature (T_g) of IPNs. From the result of DEA, IPNs exhibited two T_gs indicating the presence of phase separation in the IPN. The thermal decomposition of IPNs was investigated by TGA and appeared at near 270 °C. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 1956–1960, 2002