Structure characterization,reactivity, and thermal properties of new cyclic phosphine oxide epoxy resin containing tetra-oxirane rings

A new type of epoxy resin, which contained cyclic phosphine oxide and tetra-oxirane rings in the main chain, was synthesized. The structure of the new type of epoxy resin was confirmed by elemental analyses (EA), infrared (IR) spectroscopy, and ¹H nuclear magnetic resonance (NMR) and ¹³C-NMR spectroscopies. In addition, compositions of the new synthesized cyclic phosphine oxide epoxy resin (TGCAO) with three curing agents, for example, bis(3-aminophenyl)ethylphosphine oxide (BEMP), 4,4′-diaminodiphenylmethane (DDM), and 4,4′-diaminodiphenylsulfone (DDS) were used for making a comparison of its curing reactivity, heat, and flame retardancy with those of Epon 828 and DEN438. The reactivities were measured by differential scanning calorimetry. Through the evaluation of thermal gravimetric analysis, those polymers, which were obtained through the curing reactions between the new epoxy resin and three curing agents (BEMP, DDM, and DDS), also demonstrated adequate thermal propeties, as well as a high char yield. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68: 1397–1409, 1998     

A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

A simple imide compound, 4‐amino‐phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4‐nitro‐phthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and ¹H‐NMR spectra. The thermal properties and dielectric constant (ε) of a phosphorus‐containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′‐diamino diphenyl methane (DDM) or 4,4′‐diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower ε than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Properties of Epon 828 resin cured by cyclic phosphine oxide tetra acid

A new phosphorylated epoxy polymer was obtained using Epon 828 resin cured with a phosphorus-containing curing agent, 10-phenylphenoxaphosphine-2,3,7,8-tetracarboxylic acid-10-oxide (PDAC). In addition, compositions of Epon 828 with common curing agents, for example, 4,4′-diaminodiphenylmethane (DDM) and 4,4′-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity, heat, and flame retardation with that of PDAC. The reactivites of the three curing agents toward Epon 828, as measured by differential scanning calorimetry (DSC), was in the following order: DDM > PDAC > DDS. Through thermal gravimetric analysis evaluation (TGA), the thermal and flame resistance of epoxy polymers were confirmed in this study as capable of being improved through introduction of the cyclic phosphine oxide group into the carboxyl curing agent structure. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 70: 1877–1885, 1998     

The properties of epoxy–imide resin cured by cyclic phosphine oxide diacid

A new phosphorylated epoxyimide polymer synthesized was obtained using diimide-diepoxide (DIDE) resin cured with the new curing agent, 10-phenylphenoxa-phosphine-3,8-dicarboxylic acid-10-oxide (PCAO). In addition, compositions of the synthesized diimide-diepoxide (DIDE), Epon 828, with common curing agents, e.g., 4,4′-diaminodiphenylether (DDE) and 4,4′-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity and heat, and flame retardation with that of (PCAO). The reactivities of those curing agents toward the two kinds of epoxy resins, as measured by differential scanning calorimetry (DSC), were in the following order: DDE> PCAO> DDS. Through evaluation of thermal gravimetric analysis (TGA), the thermal and flame resistances of epoxy polymers were confirmed in this study as capable of being significantly improved through introduction of imide and cyclic phosphine oxide group into the epoxide and curing agent structures. © 1996 John Wiley & Sons, Inc.     

Synthesis of a bifunctional epoxy monomer containing biphenyl moiety and properties of its cured polymer with phenol novolac

A new type of epoxy resin containing a 4,4′‐biphenylene moiety in the backbone (Bis‐EBP) is synthesized and confirmed by elemental analysis, infrared spectroscopy, and ¹H‐nuclear magnetic resonance spectroscopy. In addition, to evaluate the influence of the 4,4′‐biphenylene group in the structure, an epoxy resin having a 1,4‐phenylene group in place of the 4,4′‐biphenylene moiety (Bis‐EP) is synthesized. The cured polymer obtained through the curing reaction between the new biphenyl‐containing epoxy resin and phenol novolac is used for making a comparison of its thermal and physical properties with those obtained from Bis‐EP and bisphenol‐A (4,4′‐isopropylidenediphenyl)‐type epoxy resin (Bis‐EA). The cured polymer obtained from Bis‐EBP shows markedly higher fracture toughness of 1.32 MPa m^1/2, higher glass transition temperature, lower moisture absorption, and higher thermal decomposition temperature. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 690–698, 1999     

Reaction kinetics and thermal properties of epoxidised cresol novolac/4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy resin composite cured with aromatic diamine

A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4′‐diglycidyl(3,3′,5,5′‐tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4′‐methylenediamine (DDM) and 4,4′‐diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging. Copyright © 2011 Society of Chemical Industry     

Phosphorus‐containing epoxy resin for an electronic application

A phosphorus‐containing epoxy resin, 6‐H‐dibenz[c,e][1,2] oxaphosphorin‐6‐[2,5‐bis(oxiranylmethoxy)phenyl]‐6‐oxide (DOPO epoxy resin), was synthesized and cured with phenolic novolac (Ph Nov), 4,4′‐diaminodiphenylsulfone (DDS), or dicyandiamide (DICY). The reactivity of these three curing agents toward DOPO epoxy resin was found in the order of DICY > DDS > Ph Nov. Thermal stability and the weight loss behavior of the cured polymers were studied by TGA. The phosphorus‐containing epoxy resin showed lower weight loss temperature and higher char yield than that of bisphenol‐A based epoxy resin. The high char yields and limiting oxygen index (LOI) values as well as excellent UL‐94 vertical burn test results of DOPO epoxy resin indicated the flame‐retardant effectiveness of phosphorus‐containing epoxy resins. The DOPO epoxy resin was investigated as a reactive flame‐retardant additive in an electronic encapsulation application. Owing to the rigid structure of DOPO and the pendant P group, the resulting phosphorus‐containing encapsulant exhibited better flame retardancy, higher glass transition temperature, and thermal stability than the regular encapsulant containing a brominated epoxy resin. High LOI value and UL‐94 V‐0 rating could be achieved with a phosphorus content of as low as 1.03% (comparable to bromine content of 7.24%) in the cured epoxy, and no fume and toxic gas emission were observed. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 353–361, 1999     

Properties of cyclic phosphine oxide epoxy cured by diacids and anhydride

New phosphorylated epoxy polymers were obtained with a cyclic phosphine oxide epoxy, 10‐phenylphenoxaphosphine‐3,8‐diglycidylester‐10‐oxide (EPCAO), cured with three types of curing agents: N,N′‐(4,4′‐diphenylsulfone)bis(trimellitimide) (DIDA), 10‐phenylphenoxaphosphine‐3,8‐dicarboxylic acid‐10‐oxide (PACO), and phthalic anhydride (PA). In addition, compositions of the new EPCAO synthesized with these three curing agents (DIDA, PACO, and PA) were used to make a comparison of EPCAO's curing reactivities and heat and flame retardancy with those of Epon828 and DEN438. The reactivities were measured by differential scanning calorimetry. Through the evaluation of thermogravimetric analysis, those polymers that were obtained through the curing reactions between the cyclic phosphine oxide epoxy resin and the three curing agents mentioned also demonstrated excellent thermal properties and a high char yield. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 950–961, 2002; DOI 10.1002/app.10146     

The properties of epoxy–imide resin cured by phosphorylated diamines containing different alkyl groups on phosphorus

Cured networks of epoxy–imide resin cured with four types of phosphorylated diamine curing agents that contained different alkyl groups on phosphorus were studied. The structures of these novel phosphorus‐containing curing agents were confirmed by Mass, EA, IR, and ¹H‐NMR and ¹³C‐NMR spectra characterization. The reactivities were measured by differential scanning calorimetry (DSC). It is found that the reactivities were not affected by the types of alkyl groups in the curing agents. In thermal gravimetric analysis (TGA), those polymers that were obtained through the curing reactions between epoxy–imide resin and four curing agents (BAMP, BAEP, BAPP, and BABP) also demonstrated excellent thermal properties as well as a high char yield. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 141–147, 2002     

Synthesis and properties of novel phosphorus‐containing bismaleimide/epoxy resins

A novel soluble phosphorus‐containing bismaleimide (BMI) monomer, bis(3‐maleimidophenyl)phenylphosphine oxide (BMIPO), was synthesized by the imidization of bis(3‐aminophenyl) phenylphosphine oxide, in which its structural characterization was identified with ¹H‐NMR, ¹³C‐NMR, and Fourier transform infrared spectra. The BMIPO resin, with five‐membered imide rings and high phenyl density, was an excellent flame retardant with a high glass‐transition temperature (T_g), onset decomposition temperature, and limited oxygen index. In phosphorus‐containing BMI/epoxy/4,4′‐methylene dianiline (DDM)‐cured resins, homogeneous products were obtained from all proportions without phase separation. Because of the higher reactivity of BMIPO/DDM relative to that of 4,4′‐bismaleimidodiphenylmethane (BMIM)/DDM, the increase in the BMIPO/BMIM ratio in this blending resin increased the recrosslinking hazards of the postcuring stage and so lowered the T_g value and thermal stability. The thermal stability of the BMI/epoxy‐cured system was lower than that of the epoxy‐cured system because of the introduction of a phosphide group into BMIPO, whereas for the T_g value and flame retardancy, the former was significantly higher than the latter: the higher the BMIPO content in the blend, the higher the flame retardancy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2080–2089, 2002; DOI 10.1002/app.10607     

Syntheses,structure, reactivity,and thermal properties of epoxy–imide resin cured by phosphorylated triamine

A new phosphorylated epoxy–imide polymer was obtained using diimide–diepoxide (DIDE) cured with tris(3-aminophenyl)phosphine oxide (TAPO). In addition, compositions of the synthesized diimide diepoxide (DIDE), Epon 828, and DEN 438 with common curing agents, e.g., 4,4′-diaminodiphenyl ether (DDE) and 4,4′-diaminodiphenylsulfone (DDS), were compared as to curing reactivity and heat and flame retardation with that of tris(3-aminophenyl)phosphine oxide. The reactivities of those curing agent toward the three kinds of epoxy resins, as measured by differential scanning calorimetry (DSC), were in the order DDE > TAPO > DDS. Through thermal gravimetric analysis (TGA), the thermal and flame resistances of epoxy were confirmed in this study as capable of being significantly improved through introduction of imide and phosphorus groups into the epoxide structure. © 1996 John Wiley & Sons, Inc.     

Preparation,curing kinetics,and thermal properties of bisphenol fluorene epoxy resin

Diglycidyl ether of 9,9‐bis(4‐hydroxyphenyl) fluorene (DGEBF) was synthesized to introduce more aromatic structures into an epoxy resin system. The structure of DGEBF was characterized with Fourier transform infrared and ¹H‐NMR. 4,4′‐Diaminodiphenylmethane (DDM) was used as the curing agent for DGEBF, and differential scanning calorimetry was applied to study the curing kinetics. The glass‐transition temperature of the cured DGEBF/DDM, determined by dynamic mechanical analysis, was 260°C, which was about 100°C higher than that of widely used diglycidyl ether of bisphenol A (DGEBA). Thermogravimetric analysis was used to study the thermal degradation behavior of the cured DGEBF/DDM system: its onset degradation temperature was 370°C, and at 700°C, its char yield was about 27%, whereas that of cured DGEBA/DDM was only 14%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Improving thermal and flame‐retardant properties of epoxy resins by a new imine linkage phosphorous‐containing curing agent

A new reactive phosphorus‐containing curing agent with imine linkage called 4, 4′‐[1, 3‐phenyl‐bis(9, 10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl)dimethyneimino)]diphenol (2) was synthesized both via two‐pot and one‐pot procedure. The chemical structure of this curing agent was confirmed by FTIR, ¹H, ¹³C, and ³¹P NMR spectra. A series of thermosetting systems were prepared by using conventional epoxy resins (E51), 4, 4′‐diaminodiphenyl methane (DDM) and (2). Resins with different phosphorus contents were obtained by changing the DDM/(2) molar ratios. Their dynamic mechanical thermal, thermal and flame‐retardant properties were evaluated by dynamic mechanical thermal analysis (DMTA), thermogravimetric analysis (TGA), and limiting oxygen index (LOI), respectively. All samples had a single T_g, which showed that these epoxy resins were homogeneous phase. Both the two char yields under nitrogen and air atmospheres increased with increasing content of (2) and the LOI values increased from 24.5 for standard resin to 37.5 for phosphorus‐containing resin, which indicated that incorporation of (2) could impart good thermal stability and excellent flame retardancy to the conventional epoxy thermosets. POLYM. ENG. SCI., 56:441–447, 2016. © 2016 Society of Plastics Engineers     

Improvement of Elastic Modulus and Thermal Stability of Epoxy Resin Using New Curing Agents

New curing agents 2,5-diamino-1,3,4-thiadiazole (DATD) and N-(4-hydroxybenzal) N'(4′-hydroxyphenyl) thiourea (HHPT) were synthesised and characterized using FT-IR, 1H-NMR and 13C-NMR analysis. The curing reactions were studied for the epoxy resin diglycidyl ether of bisphenol-A (DGEBA) using new curing agents along with the conventional aromatic diamine 4,4′-diamino diphenyl methane (DDM) for comparison purpose. The curing profiles of DDM, DATD and DATD/HHPT towards DGEBA were examined by Differential Scanning Calorimetry (DSC). Elastic modulus and thermal stability of the cured resins were evaluated using DMA and TGA analysis. When compared with DDM and DATD, the DATD/HHPT curing system accelerated the curing rate due to the presence of phenol molecules in the HHPT. Furthermore, the DATD/HHPT-cured epoxy resin demonstrated higher elastic modulus along with better thermal stability.     

Development and characterization of phosphorus-containing siliconized epoxy resin coatings

The objective of the present work is the development and characterization of siliconized epoxy-phosphorus based bismaleimide coating systems using diglycidylether terminated poly (dimethylsiloxane) (DGTPDMS) and phosphorus-containing bismaleimide (PBMI) as chemical modifiers for epoxy resin. Phosphorus-containing diamine (DOPO-NH₂) was synthesized from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and 4,4′-diaminobenzophenone (DABP), which was utilized in the preparation of phosphorus-containing bismaleimide (PBMI) with maleic anhydride. Siliconized epoxy prepolymer was prepared using epoxy resin and functionally terminated polydimethylsiloxane. The purity and structural conformation of these materials were ascertained from FTIR and NMR spectral studies. The prepared siliconized epoxy prepolymer was blended with varying percentages of PBMI using diaminodiphenylsulfone (DDS) and diaminodiphenylmethane (DDM) as curing agents. The siliconized epoxy and bismaleimide modified epoxy and siliconized epoxy coating materials were characterized by dynamic mechanical thermal analysis (DMTA), differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), heat distortion temperature (HDT) and Limiting oxygen index (LOI).     

新型耐热环氧单体的合成及性质研究

报道了一种含萘芳香酯型环氧单体二（4-（2,3-环氧丙氧基）苯甲酸）．2,7-萘4,4-二酯（P4）的合成及性质研究。利用FT-IR、1HNMR、质谱等分析测试方法对P4目标化合物的结构进行了表征。并用4,4．二氨基二苯基砜（DDS）和4,4-二氨基二苯基甲烷（DDM）两种芳香二胺固化剂对P4进行非等温固化研究。由结果可知,DDM／P4的固化峰温度为140℃,DDS／P4的固化峰温度为210℃,DDM能显著降低P4的固化温度。最后,通过对P4／DDM和环氧E20／DDM这两种固化物的热失重研究表明P4／DDM固化物具有较高的热稳定性。     

Cure kinetics and catalyzed effect of hydroxyl group of LC diglycidyl ether of bisphenol‐S with aromatic diamines

The curing reactions of liquid crystalline 4,4′‐bis‐(2,3‐epoxypropyloxy)‐sulfonyl‐bis(1,4‐phenylene) (p‐BEPSBP) with 4,4′‐diaminodiphenylmethane (DDM) and 4,4′‐diaminodiphenylsulfone (DDS) were investigated by nonisothermal differential scanning calorimeter (DSC). The relationships of E_a with the conversion α in the curing process were determined. The catalyzed activation of hydroxyl group for curing reaction of epoxy resins with amine in DSC experiment was discussed. The results show that these curing reactions can be described by the autocatalytic ?esták‐Berggren model. The curing technical temperature and parameters were obtained, and the even reaction orders m, n, and ΔS for p‐BEPSBP/DDM and p‐BEPSBP/DDS are 0.35, 0.92, ?81.94 and 0.13, 1.32, ?24.45, respectively. The hydroxyl group has catalyzed activation for the epoxy–amine curing system in the DSC experiment. The average E_a of p‐BEPSBP/DDM is 67.19 kJ mol^?1 and is 105.55 kJ mol^?1 for the p‐BEPSBP/DDS system, but it is different for the two systems; when benzalcohol as hydroxyl group was added to the curing system, the average E_a of p‐BEPSBP/DDM decreases and increases for p‐BEPSBP/DDS. The crystalline phase had formed in the curing process and was fixed in the system. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Development and characterization of novel DOPO based phosphorus tetraglycidyl epoxy nanocomposites for aerospace applications

A study was made in the present investigation on the development and characterization of 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) based phosphorus tetraglycidyl epoxy nanocomposites and to find its suitability for use in aerospace and high performance applications. Phosphorus-containing diamine (DOPO-NH₂) was synthesized from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and 4,4′-diaminobenzophenone (DABP), and this is utilized for the preparation of DOPO based phosphorus containing tetraglycidyl epoxy denoted as ‘D’. The synthesized resin was characterized by Fourier transform infrared spectra (FT-IR) and ¹H, ¹³C nuclear magnetic resonance (NMR) spectra. Nanoclay and polyhedral oligomeric silsesquioxane (POSS)-amine nano-reinforcements denoted as N1 and N2 were incorporated into the synthesized epoxy resin. Curing was done with diaminodiphenylmethane (DDM) and bis(3-aminophenyl) phenylphosphine oxide (BAPPO) curing agents denoted as X and Y respectively. Mechanical, thermal, flame retardant, water absorption behaviour and electrical properties of the epoxy nanocomposites were studied and the results are discussed.     

Thermal properties of an epoxy cresol‐formaldehyde novolac/diaminodiphenyl sulfone system modified by bismaleimide containing tetramethylbiphenyl and aromatic ether structures

A bismaleimide monomer, 4,4′‐bis(4‐maleimidophenoxy)‐3,3′,5,5′‐tetramethyl biphenyl (BMITB), was synthesized in high yield (94%) via a facile four‐step reaction from 2,2′,6,6′‐tetramethyl‐4,4′‐biphenol. The chemical structure of BMITB was confirmed by FTIR, ¹H NMR, ¹³C NMR and elemental analysis. The monomer used to modify the epoxy cresol‐formaldehyde novolac resin (ECN)/diaminodiphenyl sulfone (DDS) system. Cured ECN/BMITB/DDS blends with higher BMITB content had two distinct glass transition temperatures that were above 250°C according to differential scanning calorimetry, indicating that an interpenetrated polymer network structure may be formed. The initial thermal decomposition temperature and integral procedure decomposition temperature of the cured ECN/BMITB/DDS blends were >390 and 1080°C, respectively, according to thermogravimetric analyses. No phase separation was observed in dynamic mechanical analysis of cured ECN/BMITB/DDS blends with small amounts of BMITB (5 and 10 wt%). POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers     

Multifunctional epoxy resins

The curing behavior of epoxy resins prepared by reacting epichlorohydrin with 4,4′-diaminodiphenyl methane (DADPM)/4,4′-diaminodiphenyl ether (DADPE) or 4,4′-diaminodiphenyl sulfone (DDS) was investigated using DDS and tris-(m-aminophenyl)phosphine oxide (TAP) as curing agents. A broad exothermic transition with two maxima were observed in the temperature range of 100–315°C when TAP was used as the curing agent. The effect of varying DDS concentration on curing behavior of epoxy resin was also investigated. Peak exotherm temperature (T_exo) decreased with increasing concentration of DDS, whereas heat of curing (ΔH) increased with an increase in amine concentration up to an optimum value and then decreased. Thermal stability of the resins, cured isothermally at 200°C for 3 h, was investigated using thermogravimetric analysis in a nitrogen atmosphere. Glass fiber-reinforced multifunctional epoxy resin laminates were fabricated and the mechanical properties were evaluated. © 1993 John Wiley & Sons, Inc.