Synthesis and characterization of novel aromatic condensation polymers containing rigid benzoxazole pendent groups

A new aromatic diamine monomer containing benzoxazole substituents was prepared by a multistep synthesis starting from 1,4‐dibromo‐2,5‐difluorobenzene. The diamine was polymerized with commercial aromatic dianhydride or dicarboxylic acid chloride monomers to provide several different poly(amic acid)s and polyamides with their inherent viscosities in the range of 0.24–0.46 dL/g. Thermal properties of these polymers including thermal imidization of poly(amic acid)s into polyimides were investigated by using FTIR, DSC, and TGA. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 178–185, 2004     

Novel Sepiolite-based Poly(Amide-imide) Nanocomposites: Preparation and Properties

Novel sepiolite-based poly(amide-imide) nanocomposites were prepared by in-situ polymerization via polycondensation of a diamine containing amide groups with hexafluoropropane dianhydride. The process involved dispersion of sepiolite in poly(amic acid) solution followed by thermal imidization to get ultimate nanocomposites. The morphology, thermal and mechanical performances of nanocomposites with various sepiolite contents were studied. Nanoparticles were homogenously dispersed throughout the matrix with 50–65 nm size range. Due to such dispersion, poly(amide-imide)-sepiolite nanocomposite films exhibited improvements on the thermal-mechanical properties. The best results arose from favorable miscibility between polymer and sepiolite in the nanocomposites when 3 wt.% nanoparticles were introduced into poly(amide-imide) matrix.     

Poly(ether-imide) and poly(ether-imide)-polydimethyl-siloxane containing isopropylidene groups

Summary A poly(ether-imide) was prepared by thermal imidization of poly(amic-acid) intermediate resulting from the solution polycondensation reaction of a bis(ether-anhydride), namely 2,2′-bis-[(3,4-dicarboxyphenoxy)phenyl]-1,4-phenylene-diisopropylidene dianhydride, with an aromatic diamine containing two isopropylidene groups, namely 4,4′-(1,4-phenylenediisopropylidene)bisaniline. A poly(ether-imide)-polydimethylsiloxane copolymer was prepared by polycondensation reaction of the same bis(ether-anhydride) with an equimolar quantity of the aromatic diamine having isopropylidene groups and a bis(aminopropyl)polydimethylsiloxane oligomer of controlled molecular weight. A solution imidization procedure was used to convert quantitatively the poly(amic-acid) intermediates to the corresponding polyimides. The polymers were easily soluble in polar organic solvents and showed good thermal stability with decomposition temperature being above 400 °C. Electrical insulating properties of poly(ether-imide)-polydimethylsiloxane copolymer film were evaluated on the basis of dielectric constant and dielectric loss and their variation with frequency and temperature.     

A new rigid rodlike colored poly(amide hydrazide): Thermal,optical anisotropic,and mechanical behavior

A new aromatic all-para oriented poly(amide hydrazide) containing an azo group in the main chain was prepared by reacting a symmetric diamine containing a preformed hydrazide group, viz., N,N′-bis(4-aminobenzoyl)hydrazine (BABH), with 4,4′-azobenzoyl chloride (ADBC). The thermal behavior of the polymer was studied by TGA and DSC in air and nitrogen. Films of the polymer were prepared by two processes, viz., wet and dry processes, by using its solution in DMAc containing LiCl. The optical anisotropy, surface morphology, and tensile properties of the films were studied. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 64: 1211–1215, 1997     

Synthesis and properties of new poly(ether imides) based on pyridine‐containing aromatic dianhydride and diamine monomers

A series of novel aromatic poly(ether imides) with inherent viscosities of 0.48–0.70 dL/g and weight‐average molecular weights of 18,800–40,500 g/mol were successfully prepared from two dianhydride and two diamine monomers containing pyridine moiety via both two‐step method and one‐step method. Comparison of the one‐step and the two‐step methods for the preparation of poly(ether imides) was carried out and shown that poly (ether imides) obtained via one‐step method exhibited higher molecular weights than the similar polymers prepared through two‐step process. Poly(ether imide) resins obtained via both one‐step and two‐step methods with subsequent chemical dehydration showed good solubility not only in high boiling point solvents but also in low boiling point solvents. High‐quality poly(ether imide) films could be obtained via the two‐step method with subsequent thermal imidization, which exhibited excellent thermal properties with glass transition temperatures of 239–278°C, initial decomposition temperatures of 540–574°C, residual weight percent at 800°C of 64.5–69.3% under nitrogen, good thermo‐oxidative stability with initial decomposition temperatures of 521–544°C, residual weight percent at 800°C of 33.6–51.1% under air atmosphere, outstanding mechanical properties with tensile strengths in the range of 104.6–109.4 MPa, tensile modulus in the range of 1.92–2.58 GPa, and elongation at break from 6.9 to 8.0%, as well as good transparency with cutoff wavelengths of 386–392 nm and low dielectric constants of 2.80–2.92 at 1 MHz. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Synthesis and characterization of novel aromatic poly(ester amide)s containing pendant trifluoromethylphenoxy groups

A new diamine monomer, 1,4-bis(4-aminophenoxycarbonyl)-2-(4-trifluoromethylphenoxy)benzene containing the trifluoromethyl and ester groups, was prepared from 2-(4-trifluoromethylphenoxy)terephthalyol chloride and 4-nitrophenol in two steps. Then, a series of novel aromatic poly(ester amide)s containing pendant trifluoromethylphenoxy groups with inherent viscosities of 0.51–1.14 dL/g have been prepared by low-temperature solution polycondensation from this diamine with various aromatic diacid chlorides. All the poly(ester amide)s are amorphous and readily soluble in many organic solvents such as N,N-dimethylacetamide (DMAC) and dimethyl sulfoxide. Tough and flexible polymer films cast from DMAc solutions have tensile strengths of 89–114 MPa, elongations at break of 5.8–8.8%, and initial moduli of 2.2–3.2 GPa. These poly(ester amide)s show glass transition temperatures between 166 and 256°C, 10% weight loss temperatures ranging from 395 to 445°C, and char yields higher of 46–56% at 800°C in nitrogen, and also exhibit low dielectric constants ranging from 3.31 to 3.52 (1 MHz), and high transparency with an ultraviolet–visible absorption cut-off wavelength in the 362–380 nm range. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Effects of thermal imidization on mechanical properties of poly(amide‐co‐imide)/multiwalled carbon nanotube composite films

In this study, experimental and numerical studies were performed to investigate the relationship among the functionalization method, weight fraction of MWCNTs, thermal imidization cycle, and mechanical properties of various PAI/MWCNT composite films. Poly(amide‐co‐imide)/multiwalled carbon nanotube composite films were prepared by solution mixing and film casting. The effects of chemical functionalization and weight fraction of multiwalled carbon nanotubes on thermal imidization and mechanical properties were investigated through experimental and numerical studies. The time needed to achieve sufficient thermal imidization was reduced with increasing multiwalled carbon nanotube content when compared with that of a pure poly(amide‐co‐imide) film because multiwalled carbon nanotubes have a higher thermal conductivity than pure poly(amide‐co‐imide) resin. Mechanical properties of pure poly(amide‐co‐imide) and poly(amide‐co‐imide)/multiwalled carbon nanotube composite films were increased with increasing imidization time and were improved significantly in the case of the composite film filled with hydrogen peroxide treated multiwalled carbon nanotubes. Both the tensile strength and strain to failure of the multiwalled carbon nanotube filled poly(amide‐co‐imide) film were increased substantially because multiwalled carbon nanotube dispersion was improved and covalent bonding was formed between multiwalled carbon nanotubes and poly(amide‐co‐imide) molecules. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Synthesis and characterization of polyimides with low dielectric constants from aromatic dianhydrides and aromatic diamine containing phenylene ether unit

New aromatic polyimides (PIs) having the lowest dielectric constant in nonfluorinated PIs have been developed from aromatic dianhydrides and an aromatic diamine containing phenylene ether units. The diamine monomer was prepared from 4-bromophenyl ether in five steps. Polycondensations were performed in 1-methyl-2-pyrrolidinone at room temperature for 18 h, giving poly(amic acid)s (PAAs) with inherent viscosities up to 0.53 dl/g. PAAs were converted to corresponding poly(imide)s (PIs) by thermal treatment at 300 °C. New PIs showed good thermal stability (5% weight loss around 450 °C) and the low dielectric constant (2.74).     

Soluble aromatic polyimides based on 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane: Synthesis and properties

Aromatic polyimides were synthesized from 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6F-OH diamine) and different aromatic dianhydrides by a one-step hightemperature polycondensation, or by a two-step procedure using either thermal or chemical imidization of poly(amic acids), PAA. The obtained polyimides were compared in terms of their chemical structure, molecular weight, mechanical and thermal properties. The reaction of 6F-OH diamine with different aromatic dianhydrides in amide solvents at room temperature resulted in the formation of PAA with moderate molecular weight (η_inh ⩽ 0.7 g/dL). The thermal imidization of these PAAs led to brittle hydroxy polyimides (PI-6F-OH). In contrast, chemical imidization of similar PAAs in acetic anhydride and pyridine brought about flexible self-supporting polyimide films. The FTIR analysis indicated that the latter process was accompanied by an esterification of the OH groups in the diamine moieties, resulting in the formation of the polymers with side acetate groups (PI-6F-Ac). The high molecular weight hydroxy polyimides, suitable for preparation of films with good tensile properties, were synthesized by a one-step high-temperature polycondensation in phenolic solvents. All obtained polyimides were well soluble in common organic solvents. The highest solubility was observed for PI-6F-Ac. It was found by means of FTIR and TGA that the polyimides with the R group (R = OH or acetate) in orto position to the nitrogen atom in the diamine moiety underwent a rearrangement to benzoxazoles above 300°C. The starting temperature and conversion of this rearrangement reaction were controlled by the type of R group. The imide-to-benzoxazole rearrangement shifted to lower temperatures, and higher conversion was encountered for the polyimides with side acetate group, PI-6F-Ac, obtained by chemical imidization. © 1996 John Wiley & Sons, Inc.     

Processing of continuous poly(amide‐imide) nanofibers by electrospinning

Continuous poly(amide‐imide) nanofibers were fabricated using a novel electrospinning method with rotating and re‐collecting cylindrical collectors. The nanofilaments were modified using various post‐treatments, i.e. glycerol treatment and thermal imidization under tension, for possible application as high‐performance reinforcements. Morphological and mechanical properties of continuous poly(amide‐imide) nanofibers prepared by the electrospinning process and various post‐treatments were measured. Severe adhesion between individual nanofibers within fiber bundles was inhibited through surface treatment of the electrospun nanofiber bundles by spraying with glycerol. The morphological and mechanical properties of the continuous poly(amide‐imide) nanofibers and thermal stability were improved using thermal imidization at high temperature under tension. The morphological and mechanical properties of the continuous electrospun nanofibers were improved significantly by post‐treatments after electrospinning because uniform and complete thermal imidization occurred through the core region of the nanofibers. Copyright © 2009 Society of Chemical Industry     

Preparation and Properties of Soluble,Thermally Stable Poly(Silyl ether amide)s and Related Silica Nanocomposites

Soluble poly(silyl ether amide)s and related nanocomposites with improved thermally stability was prepared. For this, a diamine was prepared through reaction of para-aminophenol with dichlorodiphenylsilane. Structure of diamine was confirmed with conventional spectroscopic methods. Poly(silyl ether amide)s was synthesized through polycondensation of diamine with different diacid chlorides. Properties of poly(silyl ether amide)s comprising thermal behavior, thermal stability, solubility, solution viscosity, and morphology were studied. Polymers showed high thermal stability and good solubility in organic solvents due to their unique structures. Related nanocomposites with different contents of silica nanoparticles (10–40?wt%) were prepared and their properties compared with pristine polyamides.     

Organosoluble and optically transparent fluorine-containing polyimides based on 4,4′-bis(4-amino-2-trifluoromethylphenoxy)-3,3′,5,5′-tetramethylbiphenyl

A novel fluorinated diamine monomer, 4,4′-bis(4-amino-2-trifluoromethylphenoxy)-3,3′,5,5′-tetramethylbiphenyl, was prepared by a nucleophilic chloro-displacement reaction of 3,3′,5,5′-tetramethyl-4,4′-biphenol with 2-chloro-5-nitrobenzotrifluoride and subsequent reduction of the intermediate dinitro compound. The diamine was reacted with aromatic dianhydrides to form polyimides via a two-step polycondensation method; formation of poly(amic acid)s, followed by thermal imidization. All the resulting polyimides were readily soluble in many organic solvents and exhibited excellent film forming ability. The polyimides exhibited high T_g (312-351 °C), good thermal stability, and good mechanical properties. Low moisture absorptions (0.2-1.1 wt%), low dielectric constants (2.54-3.64 at 10 kHz), and low color intensity were also observed.     

Synthesis and properties of new poly(amide‐imide)s based on 1,3‐bis[4,4'‐(trimellitimido) phenoxy] propane and aromatic diamines

Six new poly(amide‐imide)s 8a–f containing trimethylene moiety in the main chain were synthesized by the polycondensation reactions of 1,3‐bis[4,4'‐(trimellitimido) phenoxy] propane 6 with six different aromatic diamines 7a–f in a medium constituting N‐methyl‐2‐pyrrolidone, triphenylphosphite, CaCl₂, and pyridine as condensing agents. The polycondensation reaction produced a series of novel poly(amide‐imide)s 8a–f in high yields with inherent viscosities between 0.35 and 0.63 dL/g. The resulting poly(amide‐imide)s were characterized by elemental analysis, viscosity measurements, thermal gravimetric analysis (TGA and DTG), solubility tests, and FTIR spectroscopy. 1,3‐Bis[4,4'‐(trimellitimido) phenoxy] propane 6 as a new monomer containing trimethylene moiety was synthesized using a three‐step reaction. At first 1,3‐bis[4,4'‐nitrophenoxy] propane 3 was prepared by the reaction of 4‐nitrophenol 1 with 1,3‐dibromo propane 2 in DMF solution . Then, dinitro 3 was reduced to 1,3‐bis[4,4'‐aminophenoxy] propane 4 by using a solution of sodium sulfite in ethanol. Finally, 1,3‐bis[4,4'‐(trimellitimido) phenoxy] propane 6 was prepared by the reaction of one equivalent diamine 4 with two equivalents of trimellitic anhydride 5 in a mixture of acetic acid‐pyridine (3 : 2). © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Preparation and characterization of novel polyimide films containing amide groups

A novel diamine monomer 4-amino-N-(4-amino-phenyl)-benzamide (DABA) containing amide group was introduced to modify the polyimide of pyromellitic dianhydride (PMDA) and 4, 4′-oxydianiline (ODA) by copolymerization. A series of homo- and co-polyamic acid were synthesized by DABA and ODA in different molar ratio with PMDA, and polyimide films were obtained by thermal imidization. The films were characterized by tensile testing, dynamic mechanical analysis (DMA), thermal gravimetry analysis (TGA), fourier transform infrared (FTIR) and wide x-ray diffraction (WAXD). All of the obtained polyimide films show excellent mechanical properties and thermal stability. With the content of DABA increasing from 0% to 100%, the tensile strength and initial modulus are highly improved from 124.72 MPa and 4.70 GPa to 286.46 MPa and 22.06 GPa respectively. The polyimides have 5% weight loss temperature in the range of 530.0–555.5 °C. The glass transition temperatures are in the range of 387.90–409.16 °C and the tanδ values decrease from 0.3721 to 0.08316. The results of WAXD and FTIR indicate that the introduction of DABA containing amide group can improve the order degree of macromolecule and form hydrogen bonds between the main chains, which results in the improvement of mechanical properties.     

Synthesis and properties of organosoluble polyimides based on novel flourene‐ring containing diacetamido‐diamine

A new diacetamido‐diamine monomer, N′‐[7‐(acetyl‐4‐aminoanilino)‐9,9‐dioctylflouren‐2‐yl]‐N′‐4‐aminophenyl) acetamide (ADOAc), with flourene‐based structure was prepared from the reaction of 4‐aminoacetanillide with 2,7‐dibromo‐9,9‐dioctylfluorene in the presence of 10 mol % CuI, 20 mol % N,N′‐dimethylethylene diamine as catalyst and K₂CO₃ as base. Two new flourene‐ring containing polyimides were prepared from the reaction of ADOAc with aromatic dianhydrides such as pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) via chemical imidization of poly(amic acid). The new diamine and the related polyimides were characterized by using conventional methods such as FT‐IR, NMR, and elemental analysis. The polyimides obtained from the reaction of ADOAc with PMDA (PIa) and of ADOAc with BTDA (PIb) had inherent viscosity of 0.49 and 0.58 dL/g respectively, and showed excellent solubility in a variety of organic solvents. The polyimides of PIa and PIb showed excellent thermal stability with 10% weight loss in nitrogen atmosphere at temperatures of 418°C and 407°C and T_g of 172°C and 167°C, respectively. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Synthesis and characterization of organo‐soluble fluorinated polyimides

A novel fluorinated diamine monomer with a keto group, 4‐[4‐amino‐2‐trifluoromethyl phenoxy]‐4′‐[4‐aminophenoxy]benzophenone (ATAB) was prepared by reacting dihydroxybenzophenone with 4‐chloronitrobenzene and 2‐chloro‐5‐nitrotrifluoromethylbenzene in the presence of potassium carbonate followed by catalytic reduction with palladized carbon (10%). Fluorinated polyimides IVa–e were synthesized from the diamine mentioned above via a two‐step method (thermal and chemical imidization). Polyimides IVa–e have inherent viscosities in the range 0.65–1.06 dL g^?1 (thermal imidization) and 0.82–1.56 dL g^?1 (chemical imidization). The polyimides prepared by chemical imidization exhibit excellent solubility. Polyimide films exhibit tensile strength, elongation and tensile modulus in the ranges 96–106 MPa, 9–13% and 1.1–1.7 GPa, respectively. The T₁₀ values of the polyimides are in the range 540–598 °C in nitrogen and 545–586 °C in air, with more than 50–60% char yield. They have T_g values between 244 and 285 °C. The prepared polyimides show cut‐off wavelengths in the range 365–412 nm and transmittance at 450 nm in the range 80.9–94.2%. The dielectric constants of the polyimide films are in the range 3.10–3.77 at 1 kHz and 3.04–3.66 at 10 kHz, with moisture absorption of 0.14–0.40%. Copyright © 2006 Society of Chemical Industry     

Preparation and properties of polyimide–clay nanocomposite materials for anticorrosion application

A series of polymer–clay nanocomposite (PCN) materials that consist of organosoluble polyimide and layered montmorillonite clay were prepared by the solution dispersion technique. The organosoluble polyimide containing non‐coplanar moiety in diamine monomer and flexible bridging linkages in dianhydride monomer was synthesized by chemical imidization. The as‐synthesized PCN materials were characterized by infrared spectroscopy, wide‐angle powder X‐ray diffraction, and transmission electron microscopy. The organosoluble polyimide showed better corrosion resistance compared to polyaniline, poly(o‐ethoxyaniline) and poly(methyl methacrylate) by using a series of standard electrochemical corrosion measurements of corrosion potential, polarization resistance, and corrosion current in 5 wt % aqueous NaCl electrolyte. Polyimide–clay nanocomposite materials incorporated with low loading of clay were found to further improve corrosion inhibition over pure polyimide. Effects of the material composition on the O₂/H₂O molecular permeability, optical clarity, and thermal properties of polyimide–clay nanocomposite materials were studied by molecular permeability analysis, UV–visible transmission spectra, thermogravimetric analysis, and differential scanning calorimetry, respectively. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 3573–3582, 2004     

Organosoluble,low‐dielectric‐constant fluorinated polyimides based on 2,6‐bis(4‐amino‐2‐trifluoromethylphenoxy)naphthalene

A novel fluorinated bis(ether amine) monomer, 2,6‐bis(4‐amino‐2‐trifluoromethylphenoxy) naphthalene, was prepared through the nucleophilic aromatic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and 2,6‐dihydroxynaphthalene in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of novel trifluoromethylated polyimides were synthesized from the diamine with various commercially available aromatic tetracarboxylic dianhydrides using a two‐stage process with thermal imidization of poly(amic acid) films. Most of the resulting polyimides were highly soluble in a variety of organic solvents and could afford transparent and tough films via solution casting. These polyimides exhibited moderately high glass transition temperatures (T_gs) of 249–311 °C, high thermal stability and good mechanical properties. Low moisture (0.19–0.85 %), low dielectric constants (2.49–3.59 at 10 kHz), and low color intensity were also observed. For a comparative study, a series of analogous polyimides based on 2,6‐bis(4‐aminophenoxy)naphthalene were also prepared and characterized. Copyright © 2005 Society of Chemical Industry     

Synthesis and characterisation of organosoluble polyimides containing the anisyl moiety

A new type of diamine monomer containing the anisyl moiety was synthesized via a straight‐forward one‐step procedure. Anisaldehyde was reacted with 2,6‐dimethylaniline in the presence of dry HCl to attain bis(4‐amino‐3,5‐dimethylphenyl)anisylmethane. A series of organo‐soluble polyimides were prepared using the anisyl diamine and various aromatic dianhydrides via a two step method involving thermal imidization. All polyimides are soluble in strong polar solvents such as N‐methyl‐2‐pyrollidone, N,N‐Dimethylformamide, and N,N‐DimethylAcetamide. The polyimides show excellent thermal stability and good mechanical properties. The glass transition temperatures of the polyimides are in the range 265–294 °C. The tensile strengths are in the range 79–99 MPa and the temperatures at which 10 % weight loss occurs are in the range 460–496 °C. Copyright © 2004 Society of Chemical Industry     

一种三元共聚型聚酰亚胺的制备与表征

以3,3'-二甲基-4,4'-二氨基二苯甲烷、1,3-双(4-氨基苯氧基)苯(1,3-APB)与3,3',4,4'-二苯醚四羧酸二酐(ODPA)进行缩聚反应,制得一种新型的三元共缩聚型聚酰亚胺。将此聚合物与两种二元共缩聚型聚酰亚胺的性能进行对此,发现三元共聚型聚酰亚胺的溶解性能、力学性能和热性能皆较好,且使用范围扩大。