Study of the ground bounce caused by power plane resonances

We describe Delta-I noise caused by power plane resonances in multilayer boards. First, we study the effect of power plane resonances on the ground bounce of the system by performing finite-difference time-domain (FDTD) simulations. We simulate the voltage fluctuations at one point of the printed circuit board (PCB) due to a current surge between the power planes in a different point. Next, two methods to prevent this ground bounce effect are investigated. The first method consists of adding lumped capacitances to the design. The effect of one large capacitor is compared to the effect of adding a “wall” of smaller capacitors. A second approach is to isolate the chips by etching a slot around the sensitive integrated circuits (ICs) and connecting both sides by a small inductor. Both methods provide excellent protection against power plane resonances     

A novel uniplanar compact photonic bandgap power plane with ultra-broadband suppression of ground bounce noise

A novel /spl pi/-bridged photonic bandgap (PBG) power/ground planes is proposed with ultra-broadband suppression of the ground bounce noise(GBN) in the high-speed printed circuit boards. The S-parameters of the proposed low-period structures show that the novel uniplanar compact photonic bandgap (UC-PBG) structures could omni-directionally suppress the GBN in RF/analog circuits and digital circuits. The high omnidirectionally suppressions of the GBN for the proposed structure are validated both experimentally and numerically in the noise bandwidth from 300MHz to 6GHz, almost the whole noise band.     

A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits

A novel L-bridged electromagnetic bandgap (EBG) power/ground planes is proposed with super-wideband suppression of the ground bounce noise (GBN) from 600Mz to 4.6GHz. The L-shaped bridge design on the EBG power plane not only broadens the stopband bandwidth, but also can increase the mutual coupling between the adjacent EBG cells by significantly decreasing the gap between the cells. It is found the small gap design can prevent from the severe degradation of the signal quality for the high-speed signal referring to the perforated EBG power plane. The excellent GBN suppression performance with keeping reasonably good signal integrity for the proposed structure is validated both experimentally and numerically. Good agreement is seen.     

Estimation of ground bounce effects on CMOS circuits

Ground bounce estimation is important to determine the impact of simultaneous switching of input/output (I/O) drivers and clock drivers on the performance of application-specific integrated circuits (ASIC's). In this paper, we develop models to estimate the peak and damped resonance noise of the ground and power bounce. These models are developed for both long and short channel devices. Comparison with H-simulation program with integrated circuit emphasis (HSPICE) simulation indicates a good match. These models are simple and suitable for hand calculation     

Modeling of striplines between a power and a ground plane

In this paper, a stripline model is presented for coupled signal lines routed between a power and a ground plane based on multiconductor transmission line (MTL) theory. Through a suitable diagonalization of the MTL equations for striplines, the transverse electromagnetic (TEM) parallel-plate mode is decoupled from the stripline mode. In this way, stripline models that are obtained assuming ideal planes at ground potential can be extended to take into account the nonideal behavior of the planes. The presented model is applied to represent mode conversion due to vias, holes in the reference planes, and terminations of the stripline. Influence of inhomogeneous media is discussed.     

Modeling of the transmission of power line communication signal through the power electric transformer

In this work, we investigate the transmission of outdoor power line communication (PLC) in the power electric network. For this purpose, we propose an efficient and accurate modeling of the propagation of PLC signal through a power transformer using bond graph theory. Electrical energy is a univocally measurable physical quantity which is not the case of the voltage and the current. The analysis by bond graph where theoretical concept is based on energy and its conservation appear to be the most appropriate for modeling the transmission of low level PLC signals. To demonstrate this advantage, we treat an application on a power transformer and we compare our results to the measure and those obtained by another method of calculation.     

Radiation through an inhomogeneous plasma covering a ground plane

Electromagnetic radiation from a slot-excited ground plane covered by a plasma layer with exponentially decreasing electron density is considered. It is found that the far-field radiation pattern is simply related to that found for the case where the layer is absent.     

Advanced signal processing for power line communications

In this article, signal processing techniques to combat the adverse communications environment on power lines are addressed, so as to enable reliable high speed data communications over low-voltage power distribution networks for Internet access and in-home/office networking. It is seen that multicarrier code-division multiple access, multiuser detection, and turbo decoding, having demonstrated their limit-approaching capacity in DSL and wireless communication systems, are readily applied to power line communications. In particular, it is argued that these methods can successfully mitigate the influence of the principal impairments in PLC channels: time-varying channel attenuation, multipath frequency-selective fading, multiple access interference, and background noise. Strategies to deal with the most unfavorable noise source, the impulse noise, are also discussed.     

Analysis of an array of line sources above a finite ground plane

A simplified analysis which gives insight into and physical interpretation on the radiation mechanism of an array of line sources above a finite ground plane is presented. Computations have been restricted to an array of two line sources since data are available for comparison. Results on the variation of the maximum field intensity, the angle of maximum field intensity, and the field intensity at the axis of the counterpoise as functions of the size of the ground plane are presented. Variations of the maximum field intensity and the angle of maximum field intensity as functions of the distance of the source above the ground plane are also illustrated. These data become very important in the design of antennas for aircraft navigation taking into account the presence of the finite counterpoise which otherwise could lead to erroneous designs.     

Achieving both wideband mitigation of ground bounce noise and good signal integrity by novel period structure

A double-square-ring slot period structure is proposed, designed in the power plane of the circuit board to suppress the ground bounce noise (GBN) in high-speed circuits. The novel design is based on the ring splits that connect the adjacent square patches in the power plane, which results in a wideband mitigation of the GBN ranging from 500 MHz to 5.5 GHz. The impact of the etched structures on the signal integrity (SI) is also investigated. Results show that good SI can be maintained while using the novel period structure in the power plane, and further improvement of the SI performance can be obtained by employing differential pairs of microstrip line for signals.     

Accurate power supply and ground plane pair models [for MCMs]

In this paper, we derive a theory and method for the use of two-dimensional (2-D) discrete transmission lines (TL's) or discrete coupled transmission lines (CTL's) in modeling power supply and ground planes accurately. If the stray coupling between power or local ground and global ground is not significant, the discrete TL's model is used. Otherwise the discrete CTL's model is used. An arbitrarily shaped plane pair is discretized into a 2-D TL or CTL array by an automatic mesh algorithm. The equivalent distributed circuit, including skin loss effect at high frequencies, represents this power ground plane pair. The theory is extended to be applicable to a generic multiple dielectric layer structure. The model computation results are in excellent agreement with S parameter measurements for practical frequency ranges, including the first major resonant nulls and peaks. The null or peak of the S parameter frequency response represents the test port interaction with the resonant standing wave of these planes at that frequency. The resultant S parameter data of these models can be condensed into a simpler N port equivalent circuit to represent a larger hierarchical power and ground plane network for fast simulation     

Analysis of a wide radiating slot in the ground plane of amicrostrip line

An analysis of a wide rectangular radiating slot excited by a microstrip line is described. Coupled integral equations are formulated to find the electric current distribution on the feed line and the electric field in the aperture. The solution is based on the method of moments and using the space domain Sommerfeld-type Green's function. The information about the input impedance or reflection coefficient is extracted from the electric current distribution on the microstrip line utilizing the matrix pencil technique. The theoretical analysis is described and data are presented and compared with other theoretical and experimental results     

Radiation from a line source in a ground plane covered by a warm plasma slab

The problem of a magnetic line source in a ground plane coated with a warm plasma slab is investigated. Consideration is given to electromagnetic and plasma waves in the slab and to the coupling at the boundaries between these waves and the free-space fields. An integral expression for the radiation field is obtained and is evaluated by the method of steepest descent. The resulting radiation patterns display interesting effects due to electron pressure near the electron plasma frequency, and these are discussed with the help of the transmission line analog to the problem. The surface-wave poles are located and discussed using this same analog.     

Edge effects in finite arrays of uniform slits on a ground plane

The results obtained by modeling a linear array as an infinite periodic structure can be used for the analysis of finite arrays as the zero-order approximation of a perturbation technique. This idea is utilized to investigate the edge effects in two arrays of uniform slits fed by parallel-plate waveguides terminated on a ground plane. It is shown that the realized gain pattern of an element depends substantially upon its position in the array. This is true particularly for the deep resonance notches in the patterns which are present for certain element spacings. When the array is excited with uniform magnitude and linear phase, the aperture voltages are the superposition of a term, corresponding to the infinite array model, plus another correction term (a "spatial transient") representing the edge effect. The influence of this term is particularly relevant when the array is scanned at endfire. In such a case, the method introduced here allows the prediction of the element terminal admittances and the array pattern, while according to the infinite array model no radiation would be permitted.     

Digital circuit capacitance and switching analysis for ground bounce in ICs with a high-ohmic substrate

Substrate noise is a major obstacle for mixed-signal integration. Ground bounce is a major contributor to substrate noise generation due to the resonance caused by the inductance and the Vdd-Vss admittance that consists of the on-chip digital circuit capacitance of the MOS transistors, the decoupling, and the parasitics arising from the interconnect. In this paper, we address: 1) the dependence of the Vdd-Vss admittance on the different states of the circuit, the supply voltage, and the interconnect, and 2) the computation of the total supply current with ground bounce. By using a fast and accurate macromodeling approach, the Vdd-Vss admittances of several test circuits are computed with 2%-3% error relative to the values simulated from the complete SPICE level netlist, but several orders of magnitude faster in CPU time and with 10% maximum error relative to the measurements on a test ASIC fabricated in a 0.18-/spl mu/m CMOS process on a high-ohmic substrate with 18 /spl Omega//spl middot/cm resistivity. The measurements also show that this admittance mainly depends only on the connectivity of the gates to the supply rail rather than their connectivity among each other.     

Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs

The authors introduced a model of simultaneous switching noise (SSN) coupling between the power/ground plane cavities through cutouts in high-speed and high-density multilayer pack-ages and printed circuit boards (PCBs). Usually, the cutouts are used in multilayer plane structures to isolate the SSN of noisy digital circuits from sensitive analog circuits or to provide multiple voltage levels. The noise-coupling model is expressed in terms of the transfer impedance. The proposed modeling and analysis results are compared with measured data up to 10 GHz to demonstrate the validity of the model. It is demonstrated that the cutout is the major gate for SSN coupling between the plane cavities, and that substantial SSN coupling occurs between the plane cavities through the cutout at the resonant frequencies of the plane cavities. The coupling mechanism and characteristics of the noise coupling, from which a method of suppression of the SSN coupling evaluated was also analyzed and discussed. Proper positioning of the cutout and the devices at each plane cavity achieves significant noise suppression at certain resonant frequencies. The suggested suppression method of the SSN coupling was successfully proved by frequency domain measurement and time domain analysis.     

A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures

A novel power/ground planes design for eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period photonic bandgap (PBG) structure. Keeping solid for the ground plane and designing low-period PBG pattern on the power plane, the proposed structure omni-directionally behaves highly efficient suppression of GBN (over 50 dB) within broadband frequency range from 1 GHz to 4 GHz. Although the power plane has low-period perforation, the proposed structure still performs with relatively low radiation within the stopband compared with the solid power/ground planes. The low radiation and high suppression of the GBN for the proposed structure are checked both experimentally and numerically. Good consistency is seen.     

电磁带隙结构在抑制电源层上噪声的应用

本文在阐述电磁带隙结构的基础上,从理论上分析其原理,结合印制电路板电源层存在的瓶颈,即目标阻抗随着设计频率的不断上升而变得越来越难控制。电磁带隙结构最早应用在天线结构中,而本文引用到PCB板电源完整性的设计中来达到抑制高频谐振的目的,并且通过Slwave建模仿真验证了其正确性。     

Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures

Split ground planes are sometimes used in RF and mixed signal packages in order to isolate the RF and analog circuits from the digital circuits. Undesired radiation in a packaging environment may occur when a signal trace is routed over a slot in the ground plane. This paper examines and investigates ways to eliminate signal coupling into split ground plane structures and assesses the impact of this reduced coupling on signal integrity in a packaging environment. Suggested methods to reduce coupling of energy into the slot are to alter the shape of the slot with RF chokes or corrugations.     

舰载导弹电源线尖峰信号敏感度指标要求与考核

舰载导弹在值班状态时被认为是一种舰上设备,在飞行状态时被认为是一种飞行器。GJB151B-2013中明确了舰载平台设备需进行CS106项目检测,而导弹由于并非直接与舰上电网连接,如若仍按照GJB151B-2013中规定的尖峰信号指标进行考核,明显存在过试验的情况。针对舰载导弹在电磁兼容CS106指标的裁剪需求,对其考核要求进行了充分的分析和研究,并给出了试验的裁剪建议。