集成电路

高增益和宽带宽的运算放大器 OPA685是电流反馈型运放。适用于中至高增益场合。当增益为8时,输入带宽大于400MHz,而在增益为2时,带宽高达900MHz。在5V的电源电压下功耗址129mW,静态时功耗降至3mW。     

低压低功耗CMOS电流运算放大器的设计

设计了一种新型CMOS电流反馈运算放大器结构,通过在输出端采用电阻反馈,增强负载能力,利用MOS管实现串联电阻以消除补偿电容带来的低频零点.使用0.5 μm CMOS工艺参数,PSPICE模拟结果获得了与增益关系不大的带宽.电路参数为:80.7 dB的开环增益,266 MHz的单位增益带宽,62°的相位裕度,149 dB共模抑制比以及在1.2 V电源电压仅产生0.82 mW的功耗.     

一种用于开关电容电路的高性能运算放大器

设计了一种高性能BCMOS全差分运算放大器.该运放采用复用型折叠式共源共栅结构、开关电容共模反馈以及增益增强技术,在相同功耗和负载电容条件下,与传统CM0S增益增强型运算放大器相比,具有高单位增益带宽、高摆率及相位裕度改善的特点.在Cadence环境下,基于Jazz 0.35μm BiCMOS标准工艺模型,对电路进行Spectre仿真.在5 V电源电压下,驱动6pF 负载时,获得开环增益为115.3 dB、单位增益带宽为161.7 MHz、开环相位裕度为77.3°、摆率为327.0 V/μm、直流功耗(电流)为1.5 mA.     

用于数字电视接收机中PGA的设计

本文采用新型的电流模放大器和可编程的电阻反馈网络设计了一种高线性度的可编程增益放大器(PGA),单级的电压增益范围为0～20dB,增益步长0.5dB,3dB带宽1.7MHzMHz,两个输入谐波(tone)的频率为0.2MHz和0.3MHz,输出摆幅为峰峰值1V时,IM3大于60dB.在3.3V电源电压时功耗为2.38mW.     

基于0.25μm CMOS工艺的1.8V Rail-to-Rail运算放大器

采用TSMC0．25μm CMOS工艺，设计实现了一种低功耗、高增益带有恒跨导输入级的Rail—to—Rail运算放大器。基于BSIM3V3 Spice模型，采用Hspice对整个电路进行仿真，在1．8V的单电源电压工作条件下，直流开环增益达到108．6dB，相位裕度为57．2度，单位增益带宽为5MHz，功耗为0．23mW。     

新型电流反馈放大器的特点及应用

电流反馈运算放大器CFOA是近几年才推出的新型器件。与电压反馈运算放大器VFOA相比,CFOA具有更宽的带宽和更高的转换速率。如电压运算放大器OP27的转换速率SR＝2.8V／μs,增益带宽积为8MHz。电流反馈放大器EL2020最小的转换速率SR＝500V／μs,带宽为50MHz并且与闭环增益无关。输出电流可达+33mA。新型运算放大器要能够进行电流反馈,运算放大器的设计就要使其中一个输入端为低阻抗。考虑到通常的输入信号为电压信号,另一个输入端设计有一个放大倍数为1的电压缓冲器,输入信号电压接到电压缓冲器上,使该运算放大器能被电压驱…     

低压低功耗CMOS电流反馈运算放大器的设计

通过在输出级采用电阻反馈,以增强负载驱动能力,采用隔离补偿电容,以消除低频零点等方式,设计了一种性能较高的CMOS电流反馈运算放大器。在1.5 V电源电压下,当偏置电流为1μA,负载电容为80 pF时,采用BSM3 0.5μm CMOS工艺进行HSPICE仿真。结果表明,该电路结构达到了76 dB的开环增益、312 MHz单位增益带宽、62°相位裕度,139 dB共模抑制比,功耗仅为0.73 mW。     

基于0.5μm CMOS工艺的低压低功耗电流放大器

采用BSM30.5μm CMOS工艺,通过引入电流模式的缓冲级输入输出结构而设计了一种性能较高的CMOS电流反馈运算放大器.在1.5V的电源电压下,当偏置电流为1μA,负载电容为20pF时,对整个电路进行HSPICE仿真.结果表明,该电路结构达到了87dB的开环增益,23.8MHz的单位增益带宽,48°的相位裕度,139dB的共模抑制比,功耗仅为2.09mW.     

一种增益和摆率提升的电流镜运算放大器

提出了一种应用于低压低功耗电路的新型电流镜运算放大器。该运算放大器在传统电流镜运算放大器结构的基础上,在输入级增加电流复用模块,在输出级增加动态调控单元,提升了电路的增益和摆率,且不产生额外的静态功耗,不影响电路的稳定性。在UMC 28 nm CMOS工艺下进行设计和验证。仿真结果表明,在1.05 V电源电压下,与传统电流镜运算放大器相比,该运算放大器的摆率提高了11倍,增益提升了20 dB。     

低电压高增益带宽CMOS折叠式共源共栅运算放大器设计

本文基于SIMC 0．18μm CMOS工艺模型参数,设计了一种低电压高单位增益带宽CMOS折叠式共源共栅运算放大器。该电路具有相对高的单位增益带宽,并具有开关电容共模反馈电路（CMFB）稳定性好、对运放频率特性影响小的优点,Hspice仿真结果表明,在1．8V电压下,运算放大器的直流开环增益为62．1dB,单位增益带宽达到920MHz。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.