Effects of water sorption at different temperatures on permanent changes in an epoxy

Crosslinked epoxy resins, tetraglycidyl 4,4′-diamino diphenyl methane cured with 4,4′-diamino diphenyl sulfone, were soaked in water at either 25°C or 70°C for varying lengths of time. The infrared spectra and DSC thermograms were obtained for samples that were soaked, or soaked and dried. There was a monotonic decrease in exothermic reaction energy with water content. The glass transition was also lowered, although samples soaked at 70°C showed a leveling in the T_g around 115°C. When the soaked samples were dried, the exothermic reaction energy showed near reversibility for samples soaked at 25°C while the 70°C samples were highly irreversible. IR of the latter samples showed that the 70°C water soaking resulted in reaction of some of the unreacted epoxide groups that remained after the initial cure.     

Polymerization of dicyclopentadiene: A new reaction injection molding system

Dicyclopentadiene was polymerized by reaction injection molding (RIM) using a catalyst system based on WCl₆ and diethylaluminium chloride. Ring opening polymerization results in formation of a crosslinked polymer with a high crosslink density. The kinetics of the fast exothermic reaction was followed by the adiabatic temperature rise method. In addition to the “adiabatic” polymerization, isothermal reactions were carried out in a thin mold. The properties of the cured samples were determined by dynamic mechanical measurements, solgel analysis, gas chromatography, mass spectrometry, DSC, and IR spectrometry. Gel fraction, glass transition temperature, content of the unreacted monomer, the modulus, and the degree of swelling were used to characterize the cured samples. The system shows very low critical conversion at the gel point (α_c < 0.01) proving a chainwise mechanism of the polymerization. Possible participation of a cationic mechanism is discussed. We found the specific reaction temperature range (T = 100–140°C) for optimum properties of the cured samples. Deterioration of properties (decrease in the crosslinking density, etc.) at a high temperature is a result of a faster deactivation of catalytic centers and a reversibility of the exothermic ring opening polymerization. Reverse cyclodegradation is preferred at a higher temperature.     

Citric acid–diethylenetriamine salts as latent curing agents for epoxy resins

Citric acid (CA)–diethylenetriamine (DETA) salts (CADETA) were prepared by using a 4.5 : 1 molar ratio of DETA–CA and removing the DETA excess. The structure of CADETA was analyzed by ¹³C-NMR, IR, and DSC associated with weight loss. One-step formulations consisted on dispersions of CADETA (variable amounts) in an epoxy resin based on diglycidylether of bisphenol A (DGEBA, EEW = 185.5 g/eq). The cure was followed in the pressure cell of a DSC (N₂ at 2.5 MPa), to avoid volatilization of DETA in the temperature range where decomposition of CADETA and beginning of reaction took place (T > 175°C). A very small heat of reaction was observed, (?ΔH) ～ 10 kJ/eq, resulting from the simultaneous endothermic salt decomposition and exothermic network formation. A stoichiometric formulation showed a T_g = 180°C, i.e., some 60°C higher than the one observed for the usual DGEBA/DETA system.     

Thermokinetics and chemorheology of the cure reactions of the tetraglycidyl diamino diphenyl methane–diamino diphenyl sulfone epoxy systems

The cure behavior of commercial grade TGDDM–DDS mixtures of compositions ranging from 10 to 100 phr of hardener and the thermal polymerization of the epoxy component are analyzed by means of differential scanning calorimetry. The kinetic parameters and heats of reaction determined in isothermal and dynamic scans suggest that DDS primary amine addition and epoxide etherification dominate the cure reactions. The primary amine epoxide addition is characterized by overall heat of reaction (referred to the weight of the epoxy component) of 255 cal/g and by an activation energy of 16.6 kcal/mol. The corresponding values for the etherification reaction are, respectively, 170 cal/g and 41 kcal/mol. A method of derivation of the epoxide conversion from the heat evolved in DSC thermal scans of these systems is presented. The results are in good agreement with independent IR determinations. The steady shear and oscillatory viscosity measurements and the calorimetric analysis of the isothermal cure at 140°C, 160°C, and 180°C of a TGDDM–DDS mixture containing 35 phr of hardener indicate that gelation is principally governed by the primary amine addition. The gelation limits calculated in isothermal tests by combining the calorimetric analysis and the theory describing the nonlinear copolymerization of the tetrafunctional TGDDM with an essentially difunctional DDS were in good agreement with the values experimentally determined through rheological measurements.     

Kinetics and thermal properties of epoxy resin cured with Ni(II)‐tris‐(O‐pheneylendiamine) bromide

Diglycidyl ether of bisphenol A (DGEBA) is cured with a nickel complex of O‐phenylendiamine (OPD) as a ligand. The structure of the synthesized curing agent is confirmed through IR and elemental analysis. The curing kinetics of DGEBA/Ni(OPD)₃Br₂ system is studied by the dynamic DSC and isothermal FTIR techniques. In all cases, we have observed at least two exothermic peaks during DSC traces up to 350°C. Dynamic activation energies are calculated by using the two isoconversional, Kissinger and Ozawa, methods applied to peak maximum. A two‐parameter (m, n) autocatalytic model (Sestak–Berggren equation) is found to be the most adequate model to describe the cure kinetics of the observed thermal events. Isothermal kinetic parameters are estimated using the Horie model. The onset decomposition temperature and char yield (at 700°C) of the crosslinked material were 290°C and 27%, respectively. The activation energy of the solid‐state thermal degradation process is evaluated by Ozawa approach, resulting in 95–138 kJ/mol on a range of 2–20% decomposition conversion. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 1257–1265, 2006     

Studies on the cure kinetics of chitosan‐glutamic acid using glutaraldehyde as crosslinker through differential scanning calorimeter

The curing of chitosan‐glutamic acid with glutaraldehyde as curing agent in the presence of chlorpheniramine maleate (CPM) is carried out with the help of differential scanning calorimeter (DSC). The effect of concentration of chitosan and percentage of crosslinker on the curing of chitosan‐glutamic acid is studied at a heating rate of 5°C/min. Cure kinetics are measured by the DSC using scans from 25 to 220°C at four different heating rates (3, 5, 7, and 10°C/min) and it is observed that the crosslinking of chitosan‐glutamic acid is an exothermic process which results in a positive peak in the DSC thermograms. The activation energy (E_α) is determined by Flynn, Wall, and Ozawa method for curing of the samples. An increase in activation energy (E_α) is observed with the extent of conversion. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Preparation and nonisothermal cure kinetics of DGEBA‐nanosilica particles composites

Nanocomposites from nanoscale silica particles (NS), diglycidylether of bisphenol‐A based epoxy (DGEBA), and 4,4′‐diaminobiphenyl benzidine (DAPB) as curing agent were obtained from direct blending of these materials. This homogenous mixture was cured in the oven at a particular temperature for a certain time or scanned from room temperature up to 300°C in differential scanning calorimeter (DSC). Mechanism and kinetic of the cure reaction of nanocomposite and thermal stability of the cured sample were studied with FTIR, DSC, and thermogravimetric analysis, respectively. The effect of amount of nanosilica (NS) particles as catalyst on the cure reaction of DGEBA/DAPB system was studied by the Kissinger and Ozawa equations. The existence of NS particles with hydroxyl groups in the structure catalyzes the cure reaction of DGEBA/DAPB system, increased the rate constant, and shifted the exothermic peak toward lower temperatures with increasing amount of NS particles. The activation energies of cure reaction of pure DGEBA/DAPB system obtained from two methods were in good agreement and decreased when NS particles were present in the mixture. The isothermal cure reaction at 145°C in an oven was followed by measuring the disappearance peak of epoxide group at 916 cm⁻¹ using FTIR. The diffusive behavior of cured samples was investigated during water sorption at 25°C and the experimental results fitted well according to Fick's law. Diffusion coefficient of cured sample containing 10% NS decreased in comparison to the sample without NS particles. POLYM. COMPOS., 2008. © 2007 Society of Plastics Engineers     

Quantitative study of the annealing of poly(vinyl chloride) near the glass transition

Poly(vinyl chloride) displays a normal DSC of DTA curve for the glass transition when quenched from above its T_g. However if cooled slowly or annealed near the glass transition temperature, a peak appears on the DSC or DTA curve at the T_g. In this paper quantitative studies of the time and temperature effects on the production of this endothermal peak during the annealing of PVC homopolymer and an acetate copolymer are presented. The phenomenon conforms to the Williams, Landell, and Ferry equation for the relaxation of polymer chains, the rate of the peak formation becoming negligible at more than 50°C below T_g. The energy difference between the quenched and annealed forms is small. For a PVC homopolymer annealed 2 hr at 68°C, which is T_g ?10°C, the difference is 0.25 cal/g. For a 13% acetate copolymer of PVC similarly annealed, the difference is 0.36 cal/g. The measured rates of the process give a calculated activation energy of 13–14 kcal/mole for PVC homopolymer and copolymer. This appearance of a peak on the T_g curve for a polymer when annealed near the glass temperature appears to be a general phenomenon.     

Curing and Morphology of BPA Epoxy Resin/LC Epoxy Resin PEPEB Composites

Liquid crystalline epoxy resin (LC epoxy resin) – p-phenylene di{4-[2-(2,3-epoxypropyl)ethoxy]benzoate} (PEPEB) was synthesized. The mixture of PEPEB with bisphenol-A epoxy resin (BPAER) was cured with a curing agent 4,4-diamino-diphenylmethane (DDM). The curing process and thermal behavior of this system were investigated by differential scanning calorimeter (DSC) and torsional braid analysis (TBA). The morphological structure was measured by polarizing optical microscope (POM) and scanning electron microscope (SEM). The results show that the initial curing temperature Ticu (gel point) of this system is 68.1°C, curing peak temperature T _pcu is 102.5°C, and the disposal temperature T _fcu is 177.6°C. LC structure was fixed in the cured epoxy resin system. The curing kinetics was investigated by dynamic DSC. Results showed that the curing reaction activation energy of BEPEB/BPAER/DDM system is 22.413 kJ/mol. The impact strength is increased 2.3 times, and temperature of mechanical loss peak is increased to 23°C than the common bisphenol-A epoxy resin, when the weight ratio of BEPEB with BPAER is 6 100.     

Synthesis and thermal cure of diphenyl ethers terminated with acetylene and phenylacetylene

Two kinds of novel compounds, diphenylacetylene diphenyl ether (DPADPE) and diacetylene diphenyl ether (DADPE), were prepared and polymerized under heating. Raman, DSC and ¹³C CP/MAS NMR analyses were used for studying the polymerization reaction. DPADPE and DADPE have melting points at 190 and 79 °C, with exothermic peaks of the DSC curves at 375 and 215 °C for curing, respectively. Raman and ¹³C CP/MAS NMR spectra show that DPADPE could be cured at a temperature higher than 300 °C and DADPE at a lower temperature of higher than 150 °C. The kinetic parameters for the thermal crosslinking reactions were obtained by the Ozawa method and the results show that the apparent activation energy is 152 kJ mol^?1 for DPADPE and 109 kJ mol^?1 for DADPE. An ene–yne Straus product appears in the cured DADPE, whereas this product has not been identified in the cured DPADPE. The cured DPADPE and DADPE demonstrate good thermal and thermo‐oxidative stability. Copyright © 2006 Society of Chemical Industry     

Synthesis,characterization, and curing of a new acrylate‐based dental restorative resin

The synthesis of monomer 1,3‐bis [(2‐hydroxy‐3‐acrylate) propyloxy]2‐hydroxy propane (BHAPP) is reported for the possible use in dental restoratives. The monomer was prepared by the reaction of acrylic acid with diglycerol diglycidyl ether (DGE) in the presence of triethyl amine as a catalyst. The progress of the reaction at 60°C followed by measuring the intensity of the epoxide absorption peak at 915 cm^?1 which has reached to its minimum value after 5 h. The structure of the monomer was characterized by FTIR and ¹H‐NMR. The monomer was a moderately viscous light yellow color liquid having a refractive index of 1.544. Thermal curing of the monomer in DSC in the presence of benzoyl peroxide showed exothermic peak with maximum temperature (T_p) varied from 89 to 107°C depending on the heating rate and activation energy of 83 kJ/mol. Photopolymerization of the monomer by visible light in the presence of camphorquinone and N,N‐dimethylaminoethyl methacrylate as the photoinitiating system showed maximum 60% conversion after 40 s exposure. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Novel flame retardant thermosets from nitrogen‐containing and phosphorus‐containing epoxy resins cured with dicyandiamide

A novel phosphorus‐containing epoxy resin (EPN‐D) was prepared by addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and epoxy phenol‐ formaldehyde novolac resin (EPN). The reaction was monitored by epoxide equivalent weight (EEW) titration, and its structure was confirmed by FTIR and NMR spectra. Halogen‐free epoxy resins containing EPN‐D resin and a nitrogen‐containing epoxy resin (XT resin) were cured with dicyandiamide (DICY) to give new halogen‐free epoxy thermosets. Thermal properties of these thermosets were studied by differential scanning calorimeter (DSC), dynamic mechanical analysis (DMA), thermal mechanical analyzer (TMA) and thermal‐gravimetric analysis (TGA). They exhibited very high glass transition temperatures (T_gs, 139–175°C from DSC, 138–155°C from TMA and 159–193°C from DMA), high thermal stability with T_{d,5 wt %} over 300°C when the weight ratio of XT/EPN‐D is ≥1. The flame‐retardancy of these thermosets was evaluated by limiting oxygen index (LOI) and UL‐94 vertical test. The thermosets containing isocyanurate and DOPO moieties showed high LOI (32.7–43.7) and could achieve UL‐94 V‐0/V‐1 grade. Isocyanurate and DOPO moieties had an obvious synergistic effect on the improvement of the flame retardancy. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Preparation and thermal properties of bismaleimide blends based on hydroxyphenyl maleimide

N‐(4‐hydroxyphenyl)maleimide was melt‐blended with the glycidyl ether of bisphenol‐A and various mole percentages of 4, 4′‐(diaminodiphenylsulfone) bismaleimide. The cure behaviour of the resins was evaluated by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The blends showed distinct reductions in the onset of cure (T_o) and peak exothermic (T_exo) temperatures. The blends cured at low temperatures exhibited glass transition temperatures (T_gs) higher than the cure temperatures. The cured blends showed high moduli, glass transition temperatures in excess of 250 °C and good thermal stabilities up to 400 °C. Copyright © 2005 Society of Chemical Industry     

Studies on the effect of epoxide equivalent weight of epoxy resins on thermal,mechanical, and chemical characteristics of vinyl ester resins

Three samples of vinyl ester resins (VERs) were synthesized using bisphenol‐A‐based epoxy resins of varying epoxide equivalent weights (EEW) and acrylic acid in presence of triphenylphosphine as a catalyst at 80 ± 2°C. The cresyl glycidyl ether was used as reactive diluent during the synthesis of VERs. A suitable reaction mechanism was proposed and discussed for the reactions involving epoxide group and acid groups. This was further confirmed by infrared spectroscopic analysis. The maximum peak temperature from DSC were at 106.05°C, 114.20°C, and 128.86°C for benzoyl peroxide initiated VERs viz. samples V₁C_V, V₂C_V, and V₃C_V, respectively, increased with the increase of EEW of the parent epoxy resin. It has also been found that the films of VER having highest EEW of bisphenol‐A epoxy resin showed best chemical resistance amongst all other VERs in this study. The mechanical properties such as hardness and flexibility also showed a similar trend. The thermal stability was found to decrease with the increase of EEW of bisphenol‐A epoxy resin in the VERs. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Preparation of N-methoxymethylated nylon-3 and application of its membrane to pervaporation of water/alcohol mixture

Nylon-3 prepared by hydrogen transfer polymerization of acrylic amide was N-methoxymethylated by paraformaldehyde/methanol in its formic acid solution. This product was soluble in water, and we were able to obtain a transparent membrane by casting of the solution. Absorbance of the NH group on IR spectrum was decreased by methoxymethylation, and from this depression of absorbance a degree of N-methoxymethylation of about 33% was obtained which agreed with the value from elemental analysis. DSC curve of this polymer showed a endothermic peak at 80°C which was assumed to be the T_g and a exothermic peak starting at 180°C which was assumed to be the crosslinking reaction. The degree of crystalinity of this polymer was about 40% which was obtained by deuterium exchange reaction with deuterium oxide. By heating of this polymer membrane up to 190°C, it was changed to an insoluble polymer by the crosslinkage reaction between methoxymethyle and unreacted amide groups. This insoluble polymer membrane was used for the separation of water/alcohol mixture by the pervaporation technique. Through the membrane, water was permeated selectively compared with alcohol and the selective permeation was found to increase by raising the heat treatment temperature.     

Synthesis and properties of urethane elastomer-modified epoxy resin having hydroxymethyl group

Synthesis and properties of urethane elastomer-modified epoxy resins were studied. The urethane elastomer-modified epoxy resins were synthesized by the reaction of a 4-cresol type epoxy compound having hydroxymethyl groups (EPCDA) with isocyanate prepolymer. The structure was identified by IR, ¹H NMR and GPC. These epoxy resins (EPCDATDI) were mixed with a commercial epoxy resin (DGEBA) in various ratios. The mixed epoxy resins were cured with a mixture of 4,4′-diaminodiphenylmethane and 3-phenylenediamine (molar ratio 6:4) as a hardener. The curing behaviour of these epoxy resins was studied by DSC. The higher the concentration of EPCDATDI, the higher the onset temperature and the smaller the rate constant (k) of the exothermic cure reaction were. It was considered that the ratio of hydroxymethyl group to epoxide group was very small and the molecular weight of EPCDATDI was large. Therefore, the accelerating effect of the hydroxymethyl group on the epoxide–amine reaction was cancelled by the retardant effect of increased molecular weight and viscosity, and decreased molecular motion. Toughness was estimated by Izod impact strength and fracture toughness (K_1C). On addition of 10 wt% EPCDATDI with low molecular weight (M?_n 6710, estimated by GPC using polystyrene standard samples), Izod impact strength and K_1C increased by 70% and 60%, respectively, compared with unmodified epoxy resin. Glass transition temperatures (T_g) for the cured epoxy resins mixed with EPCDATDI measured by dynamic mechanical spectrometry were the same as those of unmodified epoxy resin. The storage modulus (E′) at room temperature decreased with increasing concentration of EPCDATDI. Toughness and dynamic mechnical behaviour of cured epoxy resin systems were studied based on the morphology.     

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

The curing behavior and thermal properties of bisphenol A type novolac epoxy resin (bisANER) with methylhexahydrophthalic anhydride (MHHPA) at an anhydride/epoxy group ratio of 0.85 was studied with Fourier‐transform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), and thermogravimetry. The results showed that the FTIR absorption intensity of anhydride and epoxide decreased during the curing reaction, and the absorption peak of ester appeared. The dynamic curing energies were determined as 48.5 and 54.1 kJ/mol with Kissinger and Flynn–Wall–Ozawa methods, respectively. DSC measurements showed that as higher is the curing temperature, higher is the glass transition. The thermal degradation of the cured bisANER/MHHPA network was identified as two steps: the breaking or detaching of ? OH, ? CH₂? , ? CH₃, OC? O and C? O? C, etc., taking place between 300 and 450°C; and the carbonizing or oxidating of aromatic rings occurring above 450°C. The kinetics of the degradation reaction was studied with Coats–Redfern method showing a first‐order process. In addition, vinyl cyclohexene dioxide (VCD) was employed as a reactive diluent for bisANER (VCD/bisANER = 1 : 2 w/w) and cured with MHHPA, and the obtained network had a higher T_g and a slight lower degradation temperature than the undiluted system. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 2041–2048, 2007     

Study by thermal analysis of composites prepared from silica gel,furfuryl alcohol and acetaldehyde

Composites from furfuryl alcohol, acetaldehyde and silica gel were prepared with trifluoracetic acid as a catalyst. The composites were studied by TGA and DSC. The TGA results showed three main losses of weight, the first of which was ascribed to water. The percentage of polymer in the composites reached a limit value, independently of the ratio of furfuryl alcohol/acetaldehyde used. The layer of polymer that covers the silica was not completely cross‐linked. The composites contain soluble oligomers with 97: M _n < 580 g mol^?1, that could be extracted with THF. The soluble fraction of composites prepared from mixtures of furfurylic alcohol and acetaldehyde decreased as the proportion of the acetaldehyde increased. The DSC of the samples indicated a T_g between ?8 and ?15 °C that disappeared after an extraction with THF. The DSC of the oligomers removed showed a possible T_g at 13 °C and an exothermic peak between 70 and 170 °C which corresponded to an enthalpy of 326.1 J g^?1. © 2003 Society of Chemical Industry     

The influence of extent of polymerization on the thermal behavior of an epoxy-based polyether resin

A number of studies have been reported in the literature on the polymerization and thermal decomposition of epoxide resins. Lee¹ and Anderson² have both studied the thermal decomposition of epoxy resins, and they concluded that the characteristic exothermic peak (which can occur anywhere between 300° and 400°C) is caused at least partially by some reaction of the epoxide group. We have been investigating the thermal decomposition of an aromatic polyether resin which is produced by curing the diglycidyl ether of bisphenol A (Epon 825) with the catalytic agent trimethoxyboroxine (Fig. 1). DTA studies of the polyether in an inert atmosphere of N₂ showed exothermic peaks at approximately 390°, 430°, and 470°C, with the major exotherm being the one at 430°C. Our investigation has shown the important role played by low molecular weight epoxides in these exothermic reactions.     

Cross‐linking of ethylene‐octene copolymer (EOC) by dicumyl peroxide (DCP)

Ethylene‐octene copolymer (EOC) was crosslinked by dicumyl peroxide (DCP) at various temperatures (150–200°C). Six concentrations of DCP in range 0.2–0.7 wt % were investigated. cross‐linking was studied by rubber process analyzer (RPA) and by differential scanning calorimetry (DSC). From RPA data analysis real part modulus s', tan δ, and reaction rate were investigated as a function of peroxide content and temperature. The highest s'_max and the lowest tan δ were found for 0.7% of DCP at 150°C. Chain scission was analyzed by slope analysis of conversion ratio, X in times after reaching the maximum. Less susceptible to chain scission are temperatures in range 150–170°C and peroxide levels 0.2–0.5%. Heat of reaction was analyzed by DSC at various heating rates (5–40°C min⁻¹). It was found to be exothermic. By projection to zero heating rate, the reaction was found to start at 128°C with the maximum at 168°C. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011