HgCdZnTe quaternary materials for lattice-matched two-color detectors

As the number of bands and the complexity of HgCdTe multicolor structures increases, it is desirable to minimize the lattice mismatch at growth interfaces within the device structure in order to reduce or eliminate mismatch dislocations at these interfaces and potential threading dislocations that can degrade device performance. To achieve this we are investigating the use of Hg_1−x−yCd_xZn_yTe quaternary alloys which have an independently tunable lattice constant and bandgap. Lattice matching in Hg_1−x−yCd_xZn_yTe structures can be achieved using small additions of Zn (y<0.015) to HgCdTe ternary alloys. We have investigated some of the basic properties of Hg_1−x−yCd_xZn_yTe materials with x≈0.31 and 0≤y≤0.015. The quaternary layers were grown on (112)CdZnTe substrates using MBE and the amount of Zn in the layers was determined from calibrated SIMS measurements. As expected, the lattice constant decreased and the bandgap increased as Zn was added to HgCdTe to form Hg_1−x−yCd_xZn_yTe. Hall-effect results for both n-type (In) and p-type (As) Hg_1−x−yCd_xZn_yTe layers were very similar to HgCdTe control samples. We have also utilized x-ray rocking curve measurements with (246) asymmetric reflections as a novel sensitive technique to determine the correct amount of Zn needed to achieve lattice matching at an interface. MWIR/LWIR n-p-n two-color triple-layer heterojunction structures were grown to evaluate the effects of minimizing the lattice mismatch between the widest bandgap p-type collector layer, using Hg_1−x−yCd_xZn_yTe, and the HgCdTe MWIR and LWIR collector layers and compared to structures that did not incorporate the quaternary. Sequential mode two-color detectors were fabricated using a 256 × 256, 30 μm unit cell design. There were several interesting findings. Macro defects predominantly affected the LWIR band (Band 2) operability and had little effect on the MWIR band (Band 1). The incorporation of Hg_1−x−yCd_xZn_yTe p-type collector layers had little effect on MWIR detector performance, but overall the LWIR performance was generally better. These initial detector results indicate that the use of Hg_1−x−yCd_xZn_yTe alloys in multicolor detector structures are potentially promising and should be pursued further.     

Planar n-on-p ion milled mid-wavelength and long-wavelength infrared diodes on molecular beam epitaxy vacancy-doped CdHgTe on CdZnTe

Planar mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) photodiodes were fabricated by ion milling molecular beam epitaxy (MBE) Cd_xHg_1−xTe (CMT) layers with and without compositional grading in the layer. Linear arrays with 32 and 64 diodes, as well as test diodes of varying size, were fabricated. Good quantum efficiencies were measured, and MWIR diodes, with cutoff wavelength λ_CO=4.5 μm, had zero-bias resistance-area values (R₀A) in excess of 1×10⁷ Ωcm², whereas LWIR diodes with λ_CO=8.9−9.3 μm had R₀A=3×10² Ωcm² at 77 K. Comparison between a limited number of layers indicates that in layers with a gradient the RA values are a factor of ∼10 larger, and possibly more uniform, than in layers without a gradient.     

VSWIR to VLWIR MBE grown HgCdTe material and detectors for remote sensing applications

The molecular beam epitaxy (MBE) growth technology is inherently flexible in its ability to change the Hg_1−xCd_xTe material’s bandgap within a growth run and from growth run to growth run. This bandgap engineering flexibility permits tailoring the device architecture to the various specific requirements. Material with active layer x values ranging from ∼0.198 to 0.570 have been grown and processed into detectors. This wide range in x values is perfectly suited for remote sensing applications, specifically the National Polar Orbiting Environmental Satellite System (NPOESS) program that requires imaging in a multitude of infrared spectral bands, ranging from the 1.58 to 1.64 μm VSWIR (very short wave infrared) band to the 11.5 to 12.5 μm LWIR (longwave infrared) band and beyond. These diverse spectral bands require high performance detectors, operating at two temperatures; detectors for the VSWIR band operate near room temperature while the SWIR, MWIR (mid wave infra red), LWIR and VLWIR (very long wave infrared) detectors operate near 100K, because of constraints imposed by the cooler for the NPOESS program. This paper uses material parameters to calculate theoretical detector performance for a range of x values. This theoretical detector performance is compared with median measured detector optical and electrical data. Measured detector optical and electrical data, combined with noise model estimates of ROIC performance are used to calculate signal to noise ratio (SNR), for each spectral band. The SNR are compared with respect to the meteorological NPOESS system derived focal plane. The derived system focal plane requirements for NPOESS are met in all the spectral bands.     

1/f noise in large-area Hg<Subscript>1−x</Subscript>Cd<Subscript>x</Subscript>Te photodiodes

The 1/f noise in photovoltaic (PV) molecular-beam epitaxy (MBE)-grown Hg_1−xCd_xTe double-layer planar heterostructure (DLPH) large-area detectors is a critical noise component with the potential to limit sensitivity of the cross-track infrared sounder (CrIS) instrument. Therefore, an understanding of the origins and mechanisms of noise currents in these PV detectors is of great importance. Excess low-frequency noise has been measured on a number of 1000-μm-diameter active-area detectors of varying “quality” (i.e., having a wide range of I-V characteristics at 78 K). The 1/f noise was measured as a function of cut-off wavelength under illuminated conditions. For short-wave infrared (SWIR) detectors at 98 K, minimal 1/f noise was measured when the total current was dominated by diffusion with white noise spectral density in the mid-10⁻¹⁵A/Hz^1/2 range. For SWIR detectors dominated by other than diffusion current, the ratio, α, of the noise current in unit bandwidth i_n(f = 1 Hz, V_d = −60 mV, and Δf = 1 Hz) to dark current I_d(V_d = −60 mV) was α_SW-d = i_n/I_d ∼ 1 × 10⁻³. The SWIR detectors measured at 0 mV under illuminated conditions had median α_SW-P = i_n/I_ph ∼ 7 × 10⁻⁶. For mid-wave infrared (MWIR) detectors, α_MW-d = i_n/I_d ∼ 2 × 10⁻⁴, due to tunneling current contributions to the 1/f noise. Measurements on forty-nine 1000-μm-diameter MWIR detectors under illuminated conditions at 98 K and −60 mV bias resulted in α_MW-P = i_n/I_ph = 4.16 ± 1.69 × 10⁻⁶. A significant point to note is that the photo-induced noise spectra are nearly identical at 0 mV and 100 mV reverse bias, with a noise-current-to-photocurrent ratio, α_MW-P, in the mid 10⁻⁶ range. For long-wave infrared (LWIR) detectors measured at 78 K, the ratio, α_LW-d = i_n/I_d ∼ 6 × 10⁻⁶, for the best performers. The majority of the LWIR detectors exhibited α_LW-d on the order of 2 × 10⁻⁵. The photo-induced 1/f noise had α_LW-P = i_n/I_ph ∼ 5 × 10⁻⁶. The value of the noise-current-to-dark-current ratio, α appears to increase with increasing bandgap. It is not clear if this is due to different current mechanisms impacting 1/f noise performance. Measurements on detectors of different bandgaps are needed at temperatures where diffusion current is the dominant current. Excess low-frequency noise measurements made as a function of detector reverse bias indicate 1/f noise may result primarily from the dominant current mechanism at each particular bias. The 1/f noise was not a direct function of the applied bias.     

Transient behavior of Hg1−xCdxTe film growth on 3° off-(100) CdTe substrates by chemical vapor transport

The effects of substrate misorientation on Hg_1−xCd_xTe films, deposited on 3° off-(100) CdTe substrates by chemical vapor transport (CVT), have been studied for the first time using a transient growth technique. The morphological evolution of Hg_1−xCd_xTe films deposited on the vicinal CdTe substrates at 545°C shows a transition from three-dimensional islands to two-dimensional layer growth. The time and thickness required for the above morphological transition is about 0.75 h and 7 μm, respectively, under present experimental conditions. The pronounced long-range-terrace surface morphology of the Hg_1−xCd_xTe films illustrates the strong effects of the misorientation of the CdTe substrates and of the growth kinetics on the CVT growth of this hetero-epitaxial system. The transient behavior of the surface morphology, of the surface composition, and of the growth rate all reveal the influences of the 3° misorientation of the (100) CdTe substrates on the Hg_1−xCd_xTe epitaxy. The experimental mass flux results of the Hg_1−xCd_xTe-HgI₂ CVT system under transient and steady-state conditions can be related to the surface kinetics and to the thermodynamic properties of the system. The combined results show that the interface kinetics are not fixed in the transient regime and that they are coupled to the vapor mass transport.     

The HgCdTe electron avalanche photodiode

Electron injection avalanche photodiodes in short-wave infrared (SWIR) to long-wave infrared (LWIR) HgCdTe show gain and excess noise properties indicative of a single ionizing carrier gain process. The result is an electron avalanche photodiode (EAPD) with “ideal” APD characteristics including near noiseless gain. This paper reports results obtained on long-, mid-, and short-wave cutoff infrared Hg_1−xCd_xTe EAPDs (10 μm, 5 μm, and 2.2 μm) that use a cylindrical “p-around-n” front side illuminated n+/n-/p geometry that favors electron injection into the gain region. These devices are characterized by a uniform, exponential, gain voltage characteristic that is consistent with a hole-to-electron ionization coefficient ratio, k=α_h/α_e, of zero. Gains of greater than 1,000 have been measured in MWIR EAPDS without any sign of avalanche breakdown. Excess noise measurements on midwave infrared (MWIR) and SWIR EAPDs show a gain independent excess noise factor at high gains that has a limiting value less than 2. At 77 K, 4.3-μm cutoff devices show excess noise factors of close to unity out to gains of 1,000. A noise equivalent input of 7.5 photons at a 10-ns pulsed signal gain of 964 measured on an MWIR APD at 77 K provides an indication of the capability of this new device. The excess noise factor at room temperature on SWIR EAPDs, while still consistent with the k=0 operation, approaches a gain independent limiting value of just under 2 because of electron-phonon interactions expected at room temperature. The k=0 operation is explained by the band structure of the HgCdTe. Monte Carlo modeling based on the band structure and scattering models for HgCdTe predict the measured gain and excess noise behavior.     

Performance limitation of short wavelength infrared InGaAs and HgCdTe photodiodes

The carrier lifetimes in In_xGa_1−xAs (InGaAs) and Hg_1−xCd_xTe (HgCdTe) ternary alloys for radiative and Auger recombination are calculated for temperature 300K in the short wavelength range 1.5<λ<3.7 μm. Due to photon recycling, an order of magnitude enhancements in the radiative lifetimes over those obtained from the standard van Roosbroeck and Shockley expression, has been assumed. The possible Auger recombination mechanisms (CHCC, CHLH, and CHSH processes) in direct-gap semiconductors are investigated. In both n-type ternary alloys, the carrier lifetimes are similar, and competition between radiative and CHCC processes take place. In p-type materials, the carrier lifetimes are also comparable, however the most effective channels of Auger mechanism are: CHSH process in InGaAs, and CHLH process in HgCdTe. Next, the performance of heterostructure p-on-n photovoltaic devices are considered. Theoretically predicted R_oA values are compared with experimental data reported by other authors. In_0.53Ga_0.47As photodiodes have shown the device performance within a factor often of theoretical limit. However, the performance of InGaAs photodiodes decreases rapidly at intermediate wavelengths due to mismatch-induced defects. HgCdTe photodiodes maintain high performance close to the ultimate limit over a wider range of wavelengths. In this context technology of HgCdTe is considerably advanced since the same lattice parameter of this alloy is the same over wide composition range.     

An improved method for Hg<Subscript>1−x</Subscript>Cd<Subscript>x</Subscript>Te surface chemistry characterization

Hg_1−xCd_xTe surface chemistry has been studied extensively with well-known tools such as electron spectroscopy for chemical analysis (ESCA) and Auger electron spectroscopy (AES) in order to advance detector array operability, performance, and yield. Raytheon Vision Systems has pioneered the first application of time-of-flight secondary ion mass spectrometry (TOF-SIMS) as a Hg_1−xCd_xTe surface diagnostic tool to provide unprecedented analysis capability, including analyzing a 0.5-μm-diameter spot, high mass resolution, elemental and molecular composition scrutiny, applicability to insulators, and surface film sensitivity in the part per million range. In this study, data are presented illustrating surface chemistry geometry effects and photoresist redeposition due to common Hg_1−xCd_xTe processing steps including photolithography, bromine etching, and photoresist stripping.     

1/f noise in very-long-wavelength infrared Hg1−xCdx Te detectors

This paper investigates 1/f noise performance of very-long-wavelength infrared (VLWIR) Hg_1−xCd_xTe (cutoff wavelengths λ_c=15 μm and λ_c=16 μm) photodiodes at 78 K, where detector current is varied by changing detector area, detector bias, and illumination conditions. Holding detector bias and temperature constant, the 1/f noise current is proportional to the detector current. Significant nonuniformity is observed in the noise data for each detector area because of the varying detector quality. Defects are presumed resident in the detectors to produce greater nonuniformity in 1/f noise as compared to dark current at 100-mV reverse bias. For λ_c=16 μm, 4-μ-radius, diffusion-limited diodes at 78 K and 100-mV reverse bias, the average dark current is I_d=9.76±1.59×10⁻⁸ A, while the average noise current measured at 1 Hz is i_n=1.01±0.63×10⁻¹² A/Hz^1/2. For all detector areas measured, the average ratio in 1-Hz bandwidth is α _D =i_n/I_d=1.39±1.09×10⁻⁵. The 1/f noise was also measured on one diode as a function of detector-dark current as the applied bias is varied. In the diffusion-limited portion of this detector’s current-voltage (I-V) curve, to about 130 mV, the 1/f noise was independent of bias. For this diode, the ratio α_D=i_n/I_d=1.51±0.12×10⁻⁵. The 1/f noise associated with tunneling currents is a factor of 3 greater than the 1/f noise associated with diffusion currents, α_T=i_n/I_T=5.21±0.83×10⁻⁵. In addition, 1/f noise was measured on detectors held at −100 mV and 78K under dark and illuminated conditions. The measured ratios α_P ∼α_D ∼1.5×10⁻⁵ were about the same for the dark and photon-induced diffusion currents. Therefore, the diffusion current appears to have a unique value of α as compared to the tunneling current. This may be indicative of unique noise-generation mechanisms associated with each current.     

Resistivity variation of semi-insulating Cd1−xZnx Te in relationship to alloy composition

We investigated the resistivity variation of semi-insulating Cd_1−xZn_xTe used as room temperature nuclear radiation detectors, in relationship to the alloy composition. The resistivity and the zinc composition were determined using leakage current measurements and triple axis x-ray diffraction lattice parameter measurements, respectively. While the zinc content of the nominally x_Zn∼0.1 ingot varied monotonically according to the normal freezing behavior with an effective segregation coefficient of k_eff=1.15, the resistivity was found to vary non-systematically throughout the ingot. Furthermore, the “expected” relationship of higher zinc content with higher resistivity was not always observed. For example, wafer regions of x_Zn∼0.12 and x_Zn∼0.08 exhibited resistivity values of ∼10¹⁰ and ∼10¹¹ Ω·cm, respectively. In general, the experimental resistivity values can be explained by calculated values which take into account a compensating deep level defect and various electron and hole mobility values. The relative influence of the parameters that govern the resistivity (n,p, μ_e, and μ_h) are quantitatively investigated.     

Percolation problem in boron—Implanted mercury cadmium telluride

We used high-resolution x-ray diffraction to measure precisely structural modifications in variously composed Hg_1−xCd_xTe layers which were fabricated by different growth techniques and subjected to boron implantation to form p-n junctions. Analysis of implantation-induced features in the diffraction profiles allowed us to deduce the interstitials concentration remaining in the sample interior and, thus, to obtain important information on post-implantation defect migration. As a result, a percolation problem in the migration of Cd interstitials was discovered in samples with x<x_c (x_c=0.265 is the percolation threshold). Due to the percolation problem, the implanted samples having Cd content below and above x_c exhibited very different surface recovery, which was visualized by high resolution scanning electron microscopy. It was found that additional annealing at 250–300°C stimulates diffusion of formerly locked Cd interstitials and leads to the change in the conductivity type (n-p) at the expense of remaining non-compensated vacancies. The percolation problem in samples with x < x_c seems to be responsible for limited mobility of implanted boron and difficulties in boron activation in Hg_1−xCd_xTe-based devices for 8–12 μm atmospheric transparency window.     

Imaging one-dimensional and two-dimensional planar photodiode detectors fabricated by ion milling molecular beam epitaxy CdHgTe

Imaging one-dimensional (1-D) and two-dimensional (2-D) arrays of mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) planar photodiodes were fabricated by ion milling of vacancy-doped molecular beam epitaxy Cd_xHg_1−xTe layers. Sixty-four-element 1-D arrays of 26×26 μm² or 26×56 μm² diodes were processed. Zero-bias resistance-area values (R₀A) at 77 K of 4×10⁶ Θcm² at cutoff wavelength λ_CO=4.5 μm were measured, as well as high quantum efficiencies. To avoid creating a leakage current during ball bonding to the 1-D array diodes, a ZnS layer was deposited on top of the CdTe passivation layer, as well as extra electroplated Au on the bonding pads. The best measured noise equivalent temperature difference (NETD) on a LWIR array was 8 mK, with a median of 14 mK for the 42 operable diodes. The best measured NETD on a MWIR array was 18 mK. Two-D arrays showed reasonably good uniformity of R₀A and zero-bias current (I₀) values. The first 64×64 element 2-D array of 16×16 μm² MWIR diodes has been hybridized to read-out electronics and gave median NETD of 60 mK.     

In situ sensors for monitoring and control in molecular beam epitaxial growth of Hg1−xCdxTe

The current status of the implementation and refinement of two wafer state sensors forin situ monitoring and control during molecular beam epitaxial (MBE) growth of Hg_1−xCd_xTe will be reported. First a rapid scan spectral ellipsometer has been developed and employed for precisely measuring compositions of Hg_1−xCd_xTe alloys during growth. MBE films in the composition range x = 0.20 to 0.30 have been grown andin situ spectra taken at the growth temperature (180°C) and at room temperature. The MBE films were treated as single layers without the need to invoke any surface film (due to surface roughness, oxide, or of any different composition) as required for exsitu data. The least squares fit over the whole spectral range was used as a measure of the precision. The film composition was also determinedex situ by wavelength dispersive analysis of x-rays and by Fourier transform infrared (FTIR) spectrometry after verifying that there was no lateral variation. A precision of better than ±0.0015 has so far been demonstrated usingin situ spectral ellipsometry for Cd composition or CdTe mole fraction, x, measurements. This compares with ±0.003 for single wavelength ellipsometry. The composition of Hg_1−xCd_xTe films were also monitored during growth. A spectral pyrometer based on a FTIR spectrometer has also been developed for substrate temperature measurements during growth. The spectral pyrometer measures both the emission and reflectance to give the emissivity of a growing sample over a range of wavelengths spanning the peak of the grey body emission. From the reflectivity measurements, the thickness (in excess of 1 μm) of the growing film is also determined from the interference fringes. The spectral ellipsometer is only capable of measuring thicknesses up to C.a 5000°A (i.e. optically thin). Excellent agreement is obtained between thein situ (at growth temperature) andex situ (at room temperature) thickness measurements. The small discrepancy can be explained by the refractive index of Hg_1−xCd_xTe being 5% higher at the growth temperature than at room temperature. The combination ofin situ sensors now provides a means of continuously monitoring the composition and thickness of the growing Hg_1−xCd_xTe film.     

Characterization of HgCdTe Diodes on Si Substrates Using Temperature-Dependent Current-Voltage Measurements and Deep Level Transient Spectroscopy

Reverse current in diodes can be dominated by generation processes, depending exponentially on temperature according to the rate-limiting step in the generation process. In this report, the current-voltage-temperature (IVT) relationship is analyzed for several midwave infrared and long-wave infrared (MWIR x = 0.295, LWIR x = 0.233) Hg_1−x Cd _x Te (MCT) diodes. The energy varied from diode to diode. At high reverse biases, the energy tends toward the band gap energy. Close to zero bias, the energy ranged from 0.06 to 0.1 eV. Deep level transient spectroscopy (DLTS) showed a broad peak centered at 55–80 K for the MWIR MCT. Comparison of the DLTS spectrum to a simulation based on the energy and capture cross section from a rate window analysis shows that the peak is a band of traps. The capacitance transient amplitude increased as the filling pulse increased from 1 μs to 0.1 s, consistent with capture at a dislocation. A shift to lower temperatures for the peak was also observed when the diodes are cooled under forward bias. The shift is reversible, indicating that the traps consist at least partially of a bistable defect.     

Mid-wavelength infrared p-on-n Hg1−xCdxTe heterostructure detectors: 30–120 kelvin state-of-the-Art performance

We report on Hg_1−xCd_xTe mid-wavelength infrared (MWIR) detectors grown by molecular-beam epitaxy (MBE) on CdZnTe substrates. Current-voltage (I-V) characteristics of HgCdTe-MWIR devices and temperature dependence of focal-plane array (FPA) dark current have been investigated and compared with the most recent InSb published data. These MWIR p-on-n Hg_1−xCd_xTe/CdZnTe heterostructure detectors give outstanding performance, and at 68 K, they are limited by diffusion currents. For temperatures lower than 68 K, in the near small-bias region, another current is dominant. This current has lower sensitivity to temperature and most likely is of tunneling origin. High-performance MWIR devices and arrays were fabricated with median R_oA values of 3.96 × 10¹⁰ Ω-cm² at 78 K and 1.27 × 10¹² Ω-cm² at 60 K; the quantum efficiency (QE) without an antireflection (AR) coating was 73% for a cutoff wavelength of 5.3 μm at 78 K. The QE measurement was performed with a narrow pass filter centered at 3.5 μm. Many large-format MWIR 1024 × 1024 FPAs were fabricated and tested as a function of temperature to confirm the ultra-low dark currents observed in individual devices. For these MWIR FPAs, dark current as low as 0.01 e⁻/pixel/sec at 58 K for 18 × 18 μm pixels was measured. The 1024 × 1024 array operability and AR-coated QE at 78 K were 99.48% and 88.3%, respectively. A comparison of these results with the state-of-the-art InSb-detector data suggests MWIR-HgCdTe devices have significantly higher performance in the 30–120 K temperature range. The InSb detectors are dominated by generation-recombination (G-R) currents in the 60–120 K temperature range because of a defect center in the energy gap, whereas MWIR-HgCdTe detectors do not exhibit G-R-type currents in this temperature range and are limited by diffusion currents.     

Stacked multijunction photodetectors of long-wavelength radiation

Uncooled, long-wavelength photovoltaic detectors suffer from poor quantum efficiency and low differential resistance. The problem can be solved by the use of stacked, multiple heterojunction-photovoltaic cells with thin absorber regions. We report here numerical simulation and optimization of the stacked, multiple Hg_1−xCd_xTe heterojunction cells used for detection of 10.6-μm infrared (IR) radiation, operating as zero-bias photovoltaic devices or Auger-suppressed photodiodes. It is shown that the devices can be used as high-performance and fast-response detectors of long-wavelength radiation operating at ambient temperature with detectivities larger by more than one order of magnitude than that of the present practical devices.     

Status of MBE technology for the flexible manufacturing of HgCdTe focal plane arrays

A robust process has been developed for the reproducible growth of in-situ doped Hg_1−xCd_xTe:As alloys by molecular beam epitaxy. Net hole concentrations in excess of 5 x 10¹⁷ cm⁻³, with peak mobilities >200 cm2/Vs were measured in Hg_0.74Cd_0.26Te:As films. The p-type layers were twin-free and consistently exhibit narrow x-ray rocking curves (<40 arc sec). The reproducible growth of small lots of p-on-n LWIR detector structures has been established. For a typical lot consisting of 13 layers, the average x-value of the n-type base layer was 0.226 with a standard deviation of 0.003. The lateral compositional uniformity across a 2.5 cm × 2.5 cm wafer was × = +- 0.0006. High performance p-on-n LWIR diodes were fabricated that exhibited R_oA_o values (0-fov at 78K) as large as 350 Q cm2 at 10.4 μm.     

Ten-inch molecular beam epitaxy production system for HgCdTe growth

Growth of Hg_1−xCd_xTe by molecular beam epitaxy (MBE) has been under development since the early 1980s at Rockwell Scientific Company (RSC), formerly the Rockwell Science Center; and we have shown that high-performance and highly reproducible MBE HgCdTe double heterostructure planar p-on-n devices can be produced with high throughput for various single- and multiplecolor infrared applications. In this paper, we present data on Hg_1−xCd_xTe epitaxial layers grown in a ten-inch production MBE system. For growth of HgCdTe, standard effusion cells containing CdTe and Te were used, in addition to a Hg source. The system is equipped with reflection high energy electron diffraction (RHEED) and spectral ellipsometry in addition to other fully automated electrical and optical monitoring systems. The HgCdTe heterostructures grown in our large ten-inch Riber 49 MBE system have outstanding structural characteristics with etch-pit densities (EPDs) in the low 10⁴ cm⁻² range, Hall carrier concentration in low 10¹⁴ cm⁻³, and void density <1000 cm². The epilayers were grown on near lattice-matched (211)B Cd_0.96Zn_0.04Te substrates. High-performance mid wavelength infrared (MWIR) devices were fabricated with R₀A values of 7.2×10⁶ Ω-cm² at 110 K, and the quantum efficiency without an antireflection coating was 71.5% for cutoff wavelength of 5.21 μm at 37 K. For short wavelength infrared (SWIR) devices, an R₀A value of 9.4×10⁵ Ω-cm² at 200 K was obtained and quantum efficiency without an antireflection coating was 64% for cutoff wavelength of 2.61 μm at 37 K. These R₀A values are comparable to our trend line values in this temperature range.     

Determination of individual layer composition and thickness in multilayer HgCdTe structures

The reproducible molecular-beam epitaxy (MBE) growth of dual-band Hg_1−xCd_xTe (MCT) heterostructures requires routine post-growth wafer analysis for constituent layer thickness and alloy composition, therefore, demanding nondestructive characterization techniques that offer quick data feedback. This paper reports a multilayer structure model, which can be least-square fit directly to either Fourier transform infrared (FTIR) transmission or reflection spectra to provide individual layer thickness, alloy composition, and grading information for various complex structures. The model, we developed, is based on an accurate representation of both the real and imaginary parts of the MCT dielectric function across and above E _g as a function of alloy composition. The parametric, MCT optical-dielectric function for compositions varying between x=0.17 to x=0.5 was developed in the range from 400 cm⁻¹ to 4,000 cm⁻¹, based on a semi-empirical model for the absorption coefficient and extrapolation of the refractive index across E _g . The model parameters were refined through simultaneous fits to multiple reflection and transmission data sets from as-grown, double-layer planar heterostructure (DLPH) structures of variable thickness. The multilayer model was tested on a variety of simple DLPH structures with thick absorber layers (>8 μm) and was compared against traditional FTIR analysis and cross-section optical microscopy and showed good agreement in both composition and thickness. Model fits to dual-color MCT data and subsequent analysis of the internal parameter correlation have demonstrated that error bars on absorber layer composition and thickness could be as low as ∼0.0005 and ∼0.02 μm, correspondingly.     

Microscopic defects on MBE grown LWIR Hg1−xCdxTe material and their impact on device performance

Long wavelength infrared molecular beam epitaxy (MBE) grown p-on-n Hg_1−xCd_xTe double layer planar heterostructure (DLPH) detectors have been characterized to determine the dominant mechanisms limiting their performance. Material defects have been identified as critical factors that limit 40K performance operability. This effort has concentrated on identifying microscopic defects, etch pit density (EPD) and relating these defects to the device performance. Visual inspection indicates defect densities as high as 10⁵ per cm² with a spatial extent as observed by atomic force microscope in the range of micrometers extending several micrometers beneath the surface. At high EPD values (greater than low 10⁶ cm⁻²) zero bias resistance (R₀) at 40K decreases as roughly as the square of the EPD. At 78K, however, measured R₀ is not affected by the EPD up to densities as high as mid-10⁶ cm⁻². Visual defects greater than 2–3 μm than ∼2 μm in size (micro-void defects) result in either a single etch pit or a cluster of etch pits. Large variations in a cross-wafer etch pit distribution are most likely a major contributor to the observed large spreads in 40K R₀. This study gives some insight to the present limitation to achieve higher performance and high operability for low temperature infrared applications on MBE grown HgCdTe material.