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1.
层状三元碳化物Ti3SiC2及其制备研究   总被引:15,自引:2,他引:15  
三元碳化物Ti3SiC2属于层状六方晶体结构,空间群为P63/mmC;它同时具有金属和陶瓷的优良性能,有良好的导电和导热能力,在室温下可切削加工,在高温下有良好的热稳定性和塑性变形能力,还具有优异的抗氧化性能,抗热震等;应用CVD、SHS、HP/HIP等方法可制备该化合物,用HIP方法能制备高纯、致密的Ti3SiC2陶瓷。最近,以元素单质粉为原料,采用放电等离子烧结工艺成功制备了高纯Ti3SiC2材料。  相似文献   

2.
以3Ti/Si/2C粉体为原料,通过自蔓延高温合成技术合成了Ti3SiC2材料。研究了Al2O3助剂对自蔓延高温合成Ti3SiC2的影响。研究结果表明,3Ti/Si/2C粉体会发生自蔓延反应,产物的组成相为TiC、Ti3SiC2和Ti5Si3,产物中Ti3SiC2含量约为23%。添加适量的细粒度Al2O3可显著促进反应合成Ti3SiC2,3Ti/Si/2C/0.1Al2O3原料反应后得到的产物中Ti3SiC2含量达64%。  相似文献   

3.
采用3Ti/Si/2C单质粉体为原料,进行机械合金化,以合成Ti3SiC2粉体。研究了Al和过量Si对机械合金化合成Ti3SiC2的影响。研究结果表明,机械合金化单质混合粉体,会诱发自蔓延反应。反应后产生大量坚硬的颗粒状产物。机械合金化3Ti/Si/2C粉体,会产生组成相为TiC、Ti3SiC2、TiSi2和Ti5Si3的粉体与颗粒产物。添过量Si并不会促进机械合金化反应合成Ti3SiC2。添适量Al可消除硅化物,明显促进反应合成Ti3SiC2。采用3Ti/Si/2C/0.15Al粉体作原料时,颗粒产物中Ti3SiC2含量最高,为92.8wt%;而采用3Ti/Si/2C/0.20Al粉体作原料时,粉体产物中Ti3SiC2含量最高,为61.9wt%。  相似文献   

4.
The relation among electronic structure, chemical bond and property of Ti3SiC2 and Al-doped was studied by density function and discrete variation ( DFT- DVM) method. When Al element is added into Ti3 SiC2 , there is a less difference of ionic bond, which does not play a leading role to influent the properties. After adding Al, the covalent bond of Al and the near Ti becomes somewhat weaker, but the covalent bond of Al and the Si in the same layer is obviously stronger than that of Si and Si before adding. Therefore, in preparation of Ti3 SiC2 , adding a proper quantity of Al can promote the formation of Ti3 SiC2 . The density of stnte shows that there is a mixed conductor character in both of Ti3 SiC2 and adding Al element. Ti3 SiC2 is with more tendencies to form a semiconductor. The total density of state near Fermi lever after adding Al is larger than that before adding, so the electric conductivity may increase after adding Al.  相似文献   

5.
The relation among electronic structure, chemical bond and property of Ti2AlC, Ti3AlC2 and doping Si into Ti2AlC was studied by density function and the discrete variation (DFT-DVM) method. After adding Si into Ti2AlC, the interaction between Si and Ti is weaker than that between Al and Ti, and the strengths of ionic and covalent bonds decrease both. The ionic and covalent bonds in Ti3AlC2, especially in Ti-Al, are stronger than those in Ti2AlC. Therefore, in synthesis of Ti2AlC, the addition of Si enhances the Ti3AlC2 content instead of Ti2AlC. The density of state (DOS) shows that there is mixed conductor characteristic in Ti2AlC and Ti3AlC2. The DOS of Ti3AlC2 is much like that of Ti2AlC. Ti2SixAl1-xC has more obvious tendency to form a semiconductor than Ti2AlC, which is seen from the obvious difference of partial DOS between Si and Al 3p.  相似文献   

6.
通过热压法制备了Ti3SiC2/SiC复合材料,并通过扩散偶实验及组织观察,探讨了Si元素对热压制备Ti3SiC2/SiC复合材料的反应过程及组织的影响.结果表明,Si元素在反应过程中起主要作用,决定着反应进行的速度与方向.而且随着反应物中Si量的增加,更有利于Ti3SiC2/SiC复合材料的形成.  相似文献   

7.
热压烧结Ti3SiC2材料的性能   总被引:4,自引:0,他引:4  
热压烧结n(TiC)∶n(Ti)∶n(Si)∶n(Al)=2∶1∶1∶0.2的混合粉末制备了含铝Ti3SiC2材料并研究了它的力学性能、电性能、热性能和高温氧化性能。该试样的抗压强度、弯曲强度、断裂韧性和维氏硬度分别为854MPa、420MPa、5.8MPa·m1/2和3.5~5.0GPa;25℃和800℃时的电导率分别为4.3×106S/m和1.0×106S/m;热膨胀系数为9.0×10-6/K。固溶在基体中的Al改变了材料的氧化机理,氧化过程中Al的向外扩散代替了Ti的向外扩散,并在表面形成致密以αAl2O3为主要成分的氧化膜,提高了材料的抗氧化性能。  相似文献   

8.
以碳粉和蛋清作为造孔剂,利用固相法制备CaCu3Ti4O12(CCTO)多孔陶瓷.研究了造孔剂含量对CCTO多孔陶瓷体积密度、显微结构和介电性能的影响.结果表明,随着碳粉含量增加,体积密度先增加后减小;而随着蛋清含量增加,体积密度先减小后增加.和碳粉相比,蛋清加入制备的试样具有较小、较均匀的孔隙.当频率大于331.5KHz时,添加碳粉可以降低介电损耗.当频率大于4KHz时,添加碳粉介电常数有所下降.当频率大于2KHz时,添加蛋清可以增大介电损耗,但是增加幅度较小.添加蛋清可以增大介电常数.  相似文献   

9.
以2TiC/Ti/Si/0.2Al/TiB2粉为原料,采用热压烧结工艺成功制备了Ti3SiC2/TiB2复合材料。结果表明:不同TiB2含量的试样中主晶相为Ti3siC2与TiB2两相,没有发现其它杂质相;当复合材料中TiB2的体积分数为10%时,其硬度、抗压强度、弯曲强度、断裂韧性都有显著的提高。经热处理后,Ti3SiC2/10%TiB2复合材料的弯曲强度由367.5MPa  相似文献   

10.
Carbon fiber-reinforced SiC composites were prepared by precursor pyrolysis-hot pressing (PP-HP) and precursor impregnation-pyrolysis (PIP), respectively. The effect of fabrication methods on the microstructure and mechanical properties of the composites was investigated. It was found that the composite prepared by PP-HP exhibits a brittle fracture behavior, which is mainly ascribed to a strongly bonded fiber/matrix interface and the degradation of the fibers caused by a higher processing temperature. On the contrary, the composite prepared by PIP shows a tough fracture behavior, which could be rationalized on the basis of a weakly bonded fiber/matrix interface as well as a higher strength retention of the fibers. As a result, in comparison with the composite prepared by PP-HP, the composite prepared by PIP achieves better mechanical properties with a flexural strength of 573.4 MPa and a fracture toughness of 17.2 MPa.m^1/2.  相似文献   

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