Millimeter-wave voltage-controlled oscillators in 0.13-/spl mu/m CMOS technology

This paper describes the design of CMOS millimeter-wave voltage controlled oscillators. Varactor, transistor, and inductor designs are optimized to reduce the parasitic capacitances. An investigation of tradeoff between quality factor and tuning range for MOS varactors at 24 GHz has shown that the polysilicon gate lengths between 0.18 and 0.24 /spl mu/m result both good quality factor (>12) and C/sub max//C/sub min/ ratio (/spl sim/3) in the 0.13-/spl mu/m CMOS process used for the study. The components were utilized to realize a VCO operating around 60 GHz with a tuning range of 5.8 GHz. A 99-GHz VCO with a tuning range of 2.5 GHz, phase noise of -102.7 dBc/Hz at 10-MHz offset and power consumption of 7-15mW from a 1.5-V supply and a 105-GHz VCO are also demonstrated. This is the CMOS circuit with the highest fundamental operating frequency. The lumped element approach can be used even for VCOs operating near 100-GHz and it results a smaller circuit area.     

RF noise in 0.18-/spl mu/m and 0.13-/spl mu/m MOSFETs

Studied the gate finger number and gate length dependence on minimum noise figure (NF/sub min/) in deep submicrometer MOSFETs. A lowest NF/sub min/ of 0.93 dB is measured in 0.18-/spl mu/m MOSFET at 5.8 GHz as increasing finger number to 50 fingers, but increases abnormally when above 50. The scaling gate length to 0.13 /spl mu/m shows larger NFmin than the 0.18-/spl mu/m case at the same finger number. From the analysis of a well-calibrated device model, the abnormal finger number dependence is due to the combined effect of reducing gate resistance and increasing substrate loss as increasing finger number. The scaling to 0.13-/spl mu/m MOSFET gives higher NF/sub min/ due to the higher gate resistance and a modified T-gate structure proposed to optimize the NF/sub min/ for further scaling down of the MOSFET.     

A 9-50-GHz Gilbert-cell down-conversion mixer in 0.13-/spl mu/m CMOS technology

A broadband microwave/millimeter-wave (MMW) Gilbert-cellmixer using standard 1P8M 0.13-/spl mu/m complementary metal oxide semiconductor (CMOS) technology is presented in this letter. Two radio frequency (RF) transformer baluns are used in RF-and local oscillator (LO)-ports to convert single-ended signals to differential signals. Thin film microstrip line is employed for the matching networks and transformer design. This mixer has a conversion gain of better than 5dB from 9 to 50GHz. Between 5 and 50GHz,the RF- and LO-to-intermediate frequency (IF) isolations are better than 40dB. The RF-to-LO and LO-to-RF isolations are all better than 20dB. To the authors' knowledge, this is the first CMOS Gilbert-cell mixer operating to MMW frequency to date.     

A matrix amplifier in 0.18-/spl mu/m SOI CMOS

A fully integrated matrix amplifier with two rows and four columns (2-by-4) fabricated in a three-layer metal 0.18-/spl mu/m silicon-on-insulator (SOI) CMOS process is presented. It exhibits an average pass-band gain of 15 dB and a unity-gain bandwidth of 12.5 GHz. The input and output ports are matched to 50 /spl Omega/ using m-derived half sections; the measured S/sub 11/ and S/sub 22/ values exceed -7 and -12 dB, respectively. Integrated in 2.0/spl times/2.9mm/sup 2/, it dissipates 233.4 mW total from 2.4- and 1.8-V power supplies.     

A K-band down-conversion mixer with 1.4-GHz bandwidth in 0.13-/spl mu/m CMOS technology

A low power and low voltage down conversion mixer working at K-band is designed and fabricated in a 0.13/spl mu/m CMOS logic process. The mixer down converts RF signals from 19GHz to 2.7GHz intermediate frequency. The mixer achieves a conversion gain of 1dB, a very low single side band noise figure of 9dB and third order intermodulation point of -2dBm, while consuming 6.9mW power from a 1.2V supply. The 3-dB conversion gain bandwidth is 1.4GHz, which is almost 50% of the IF. This mixer with small frequency re-tuning can be used for ultra-wide band radars operating in the 22-29GHz band.     

A 24-GHz 3.9-dB NF low-noise amplifier using 0.18 /spl mu/m CMOS technology

A 24-GHz low-noise amplifier (LNA) was designed and fabricated in a standard 0.18-/spl mu/m CMOS technology. The LNA chip achieves a peak gain of 13.1 dB at 24 GHz and a minimum noise figure of 3.9 dB at 24.3 GHz. The supply voltage and supply current are 1 V and 14 mA, respectively. To the author's knowledge, this LNA demonstrates the lowest noise figure among the reported LNAs in standard CMOS processes above 20 GHz.     

Three-stage burst-mode transimpedance amplifier in deep-sub-/spl mu/m CMOS technology

A transimpedance amplifier, designed in a digital 120-nm CMOS technology, used as preamplifier for optical burst-mode receivers in passive optical networks is presented. A wide optical input power range of 27 dB can be handled with a variable transimpedance without stability problems by varying the open-loop gain by a factor of 115. Noise and stability analysis of the optical receiver are presented. Sensitivities of - 31.3 dBm at 622 Mb/s and - 28.6 dBm at 1.25 Gb/s with a bit error ratio of 10/sup -10/ and a pseudorandom bit stream of 2/sup 31/-1 are achieved with a power consumption of 88.5 mW.     

24 GHz low-noise amplifier in 0.18 /spl mu/m CMOS technology

A 24 GHz monolithic low-noise amplifier (LNA) is implemented in a standard 0.18 /spl mu/m CMOS technology. Measurements show a gain of 12.86 dB and a noise figure of 5.6 dB at 23.5 GHz. The input and output return losses are better than 11 dB and 22 dB across the 22-29 GHz span, respectively. The operation frequency of 24 GHz is believed to be the highest reported for LNA in a standard CMOS technology.     

New miniature 15-20-GHz continuous-phase/amplitude control MMICs using 0.18-/spl mu/m CMOS technology

The design and performance of two new miniature 360/spl deg/ continuous-phase-control monolithic microwave integrated circuits (MMICs) using the vector sum method are presented. Both are implemented using commercial 0.18-/spl mu/m CMOS process. The first phase shifter demonstrates all continuous phase and an insertion loss of 8 dB with a 37-dB dynamic range from 15 to 20 GHz. The chip size is 0.95 mm /spl times/ 0.76 mm. The second phase shifter can achieve all continuous phase and an insertion loss of 16.2 dB with a 38.8-dB dynamic range at the same frequency range. The chip size is 0.71 mm /spl times/ 0.82 mm. To the best of the authors' knowledge, these circuits are the first demonstration of microwave CMOS phase shifters using the vector sum method with the smallest chip size for all MMIC phase shifters with 360/spl deg/ phase-control range above 5 GHz reported to date.     

192 GHz push-push VCO in 0.13 /spl mu/m CMOS

A 192 GHz cross-coupled push-push voltage controlled oscillator (VCO) is fabricated using the UMC 0.13 /spl mu/m CMOS logic process. The VCO can be tuned from 191.4 to 192.7 GHz. The VCO provides output power of /spl sim/-20 dBm and phase noise of /spl sim/-100 dBc/Hz at 10 MHz offset, while consuming 11 mA from a 1.5 V supply.     

A 2.4-GHz 0.18-/spl mu/m CMOS self-biased cascode power amplifier

A two-stage self-biased cascode power amplifier in 0.18-/spl mu/m CMOS process for Class-1 Bluetooth application is presented. The power amplifier provides 23-dBm output power with a power-added efficiency (PAE) of 42% at 2.4 GHz. It has a small signal gain of 38 dB and a large signal gain of 31 dB at saturation. This is the highest gain reported for a two-stage design in CMOS at the 0.8-2.4-GHz frequency range. A novel self-biasing and bootstrapping technique is presented that relaxes the restriction due to hot carrier degradation in power amplifiers and alleviates the need to use thick-oxide transistors that have poor RF performance compared with the standard transistors available in the same process. The power amplifier shows no performance degradation after ten days of continuous operation under maximum output power at 2.4-V supply. It is demonstrated that a sliding bias technique can be used to both significantly improve the PAE at mid-power range and linearize the power amplifier. By using the sliding bias technique, the PAE at 16 dBm is increased from 6% to 19%, and the gain variation over the entire power range is reduced from 7 to 0.6 dB.     

A 32-GHz non-uniform distributed amplifier in 0.18-/spl mu/m CMOS

This letter presents a fully integrated distributed amplifier in a standard 0.18-/spl mu/m CMOS technology. By employing a nonuniform architecture for the synthetic transmission lines, the proposed distributed amplifier exhibits enhanced performance in terms of gain and bandwidth. Drawing a dc current of 45mA from a 2.2-V supply voltage, the fabricated circuit exhibits 9.5-dB pass-band gain with a bandwidth of 32GHz while maintaining good input and output return losses over the entire frequency band. With a compact layout technique, the chip size of the distributed amplifier including the testing pads is 940/spl times/860/spl mu/m/sup 2/.     

Low-noise amplifier in 0.12 /spl mu/m standard CMOS technology for K-band

A K-band CMOS low-noise amplifier with a noise figure of 4.26 dB and a peak gain of 18.86 dB is presented. The low-noise amplifier has a peak gain frequency of 20.3 GHz and an input referred 1 dB compression point of -16 dBm. These are believed to be the lowest noise figure and highest gain values reported to date at these frequencies in a standard CMOS technology.     

A fully integrated 0.13-/spl mu/m CMOS mixed-signal SoC for DVD player applications

This paper describes a fully integrated single-chip CMOS mixed-signal system on a chip (SoC) for DVD player applications. It integrates one digital signal processor (DSP), two 32-bit CPUs, three dedicated processing units, a partial response maximum likelihood (PRML) read channel with an analog front end (AFE), and many other subsystems on the same die. The AFE includes a fifth-order G/sub m/-C filter and attains over 66 dB C/N overall. PR(3,4,4,3) structure is employed in the PRML read channel. Owing to the PRML signal processing and the mixed-signal system level optimization in the PRML read channel, less than 10/sup -6/ of bit-error rate (BER) is obtained for the focus offset margins over /spl plusmn/0.5 /spl mu/m. This SoC is fabricated in 0.13-/spl mu/m one-poly six-Cu CMOS technology. It contains 24 million transistors in a 63.87 mm/sup 2/ die and consumes 1.5 W at 40 MSample/s data rate, which corresponds to DVD 1.5 times playback operation mode.     

0.13-/spl mu/m low-/spl kappa/-Cu CMOS logic-based technology for 2.1-gb high data rate read-channel

High-performance analog/digital elements have been successfully fabricated by a 0.13-/spl mu/m low-/spl kappa/-Cu logic-based mixed-signal CMOS process in a single chip to enable a 2.1-Gb/s read-channel for hard disk drives that is a record-high data rate supported by fully CMOS solution. The high-performance analog devices demonstrate superior drivability, matching, noise immunity, and reliability by a unique dual-gate oxide module to support the aggressive oxide thickness scaling and maintain promisingly good reliability in all aspects.     

50 Gbit/s 2:1 multiplexer in 0.13 /spl mu/m CMOS technology

A fully integrated 2:1 multiplexer IC which operates at up to 50 Gbit/s data rate is presented. The MUX uses inductive shunt peaking and an output series inductor for higher bandwidth. The MUX directly drives the 50 /spl Omega/ load. The IC is fabricated in a 0.13 /spl mu/m bulk CMOS technology and draws 65 mA at 1.5 V supply voltage. The output voltage swing is 2/spl times/100 mV.     

K-band low-noise amplifiers using 0.18 /spl mu/m CMOS technology

Two K-Band low-noise amplifiers (LNAs) are designed and implemented in a standard 0.18 /spl mu/m CMOS technology. The 24 GHz LNA has demonstrated a 12.86 dB gain and a 5.6 dB noise figure (NF) at 23.5 GHz. The 26 GHz LNA achieves an 8.9 dB gain at the peak gain frequency of 25.7 GHz and a 6.93 dB NF at 25 GHz. The input referred third-order intercept point (IIP3) is >+2 dBm for both LNAs with a current consumption of 30 mA from a 1.8 V power supply. To our knowledge, the LNAs show the highest operation frequencies ever reported for LNAs in a standard CMOS process.     

VCO phase-noise improvement by gate-finger configuration of 0.13-/spl mu/m CMOS transistors

Using a standard logic process, 0.13-/spl mu/m RF CMOS devices with multifinger gate structure have been fabricated. The flicker noise and minimum noise figure characteristics have been investigated with different gate layout splits, where the device parasitic resistance is the determining factor in this issue. The stripe-shaped gate configuration demonstrates better noise performance, due to the reduction of device gate resistance. In addition, the MOS varactors designed with different gate layouts were used in a 5.2-GHz voltage-controlled oscillator (VCO) design, where the VCO with the stripe-shaped (2 /spl mu/m /spl times/ 36 fingers) gate varactor improved about 6 dB in phase-noise performance at 100-kHz offset frequency than that of square-shaped (8 /spl mu/m /spl times/ 9 fingers) gate varactor.     

A low-power oscillator mixer in 0.18-/spl mu/m CMOS technology

A downconversion double-balanced oscillator mixer using 0.18-/spl mu/m CMOS technology is proposed in this paper. This oscillator mixer consists of an individual mixer stacked on a voltage-controlled oscillator (VCO). The stacked structure allows entire mixer current to be reused by the VCO cross-coupled pair to reduce the total current consumption of the individual VCO and mixer. Using individual supply voltages and eliminating the tail current source, the stacked topology requires 1.0-V low supply voltage. The oscillator mixer achieves a voltage conversion gain of 10.9 dB at 4.2-GHz RF frequency. The oscillator mixer exhibits a tuning range of 11.5% and a single-sideband noise figure of 14.5 dB. The dc power consumption is 0.2 mW for the mixer and 2.94 mW for the VCO. This oscillator mixer requires a lower supply voltage and achieves a higher operating frequency among recently reported Si-based self-oscillating mixers and mixer oscillators. The mixer in this oscillator mixer also achieves a low power consumption compared with recently reported low-power mixers.