A 3–10 GHz CMOS UWB Low-Noise Amplifier With ESD Protection Circuits

A low-power fully integrated low-noise amplifier (LNA) with an on-chip electrostatic-static discharge (ESD) protection circuit for ultra-wide band (UWB) applications is presented. With the use of a common-gate scheme with a ${rm g}_{rm m}$ -boosted technique, a simple input matching network, low noise figure (NF), and low power consumption can be achieved. Through the combination of an input matching network, an ESD clamp circuit has been designed for the proposed LNA circuit to enhance system robustness. The measured results show that the fabricated LNA can be operated over the full UWB bandwidth of 3.0 to 10.35 GHz. The input return loss $({rm S}_{11})$ and output return loss $({rm S}_{22})$ are less than ${-}8.3$ dB and ${-}9$ dB, respectively. The measured power gain $({rm S}_{21})$ is $11 pm 1.5$ dB, and the measured minimum NF is 3.3 dB at 4 GHz. The dc power dissipation is 7.2 mW from a 1.2 V supply. The chip area, including testing pads, is 1.05 mm$,times,$ 0.73 mm.      

W-Band Active Down-Conversion Mixer in Bulk CMOS

A W-band (76–77 GHz) active down-conversion mixer has been demonstrated using low leakage (higher ${rm V}_{{rm T}}$) NMOS transistors of a 65-nm digital CMOS process with 6 metal levels. It achieves conversion gain of ${-}8$ dB at 76 GHz with a local oscillation power of 4 dBm (${sim-}2$ dBm after de-embedding the on-chip balun loss), and 3 dB bandwidth of 3 GHz. The SSB noise figures are 17.8–20 dB (11.3–13.5 dB after de-embedding on-chip input balun loss) between 76 and 77 GHz. ${rm IP}_{1{rm dB}}$ is ${-}6.5$ dBm and IIP3 is 2.5 dBm (${sim-}13$ and ${sim}-4$ dBm after de-embedding the on-chip balun loss). The mixer consumes 5 mA from a 1.2 V supply.      

A 30–100 GHz Wideband Sub-Harmonic Active Mixer in 90 nm CMOS Technology

This letter presents a 30–100 GHz wideband and compact fully integrated sub-harmonic Gilbert-cell mixer using 90 nm standard CMOS technology. The sub-harmonic pumped scheme with advantages of high port isolation and low local oscillation frequency operation is selected in millimeter-wave mixer design. A distributed transconductance stage and a high impedance compensation line are introduced to achieve the flatness of conversion gain over broad bandwidth. The CMOS sub-harmonic Gilbert-cell mixer exhibits ${-}{hbox{1.5}} pm {hbox{1.5}}$ dB measured conversion gain from 30 to 100 GHz with a compact chip size of 0.35 mm$^{2}$. The OP$_{1 {rm dB}}$ of the mixer is ${-}$ 10.4 dBm and ${-}$9.6 dBm at 77 and 94 GHz, respectively. To the best of our knowledge, the monolithic microwave integrated circuit is the first CMOS Gilbert-cell mixer operating up to 100 GHz.      

A Fully Integrated 5 GHz Low-Voltage LNA Using Forward Body Bias Technology

A fully integrated 5 GHz low-voltage and low-power low noise amplifier (LNA) using forward body bias technology, implemented through a 0.18 $mu{rm m}$ RF CMOS technology, is demonstrated. By employing the current-reused and forward body bias technique, the proposed LNA can operate at a reduced supply voltage and power consumption. The proposed LNA delivers a power gain (S21) of 10.23 dB with a noise figure of 4.1 dB at 5 GHz, while consuming only 0.8 mW dc power with a low supply voltage of 0.6 V. The power consumption figure of merit $(FOM_{1})$ and the tuning-range figure of merit $(FOM_{2})$ are optimal at 12.79 dB/mW and 2.6 ${rm mW}^{-1}$, respectively. The chip area is 0.89 $,times,$0.89 ${rm mm}^{2}$.      

A 0.1–5 GHz Cryogenic SiGe MMIC LNA

In this letter, the design and measurement of the first SiGe integrated-circuit LNA specifically designed for operation at cryogenic temperatures is presented. At room temperature, the circuit provides greater than 25.8 dB of gain with an average noise temperature $(T_{e})$ of 76 K $(NF=1 {rm dB})$ and $S_{11}$ of $-$ 9 dB for frequencies in the 0.1–5 GHz band. At 15 K, the amplifier has greater than 29.6 dB of gain with an average $T_{e}$ of 4.3 K and $S_{11}$ of $-$14.6 dB for frequencies in the 0.1–5 GHz range. To the authors' knowledge, this is the lowest noise ever reported for a silicon integrated circuit operating in the low microwave range and the first matched wideband cryogenic integrated circuit LNA that covers frequencies as low as 0.1 GHz.      

A Linearization Technique for RF Receiver Front-End Using Second-Order-Intermodulation Injection

A linearization technique is proposed in which low-frequency second-order-intermodulation $({rm IM}_{2})$ is generated and injected to suppress the third-order intermodulation $({rm IM}_{3})$. The proposed linearization technique is applied to both a low-noise amplifier (LNA) and a down-conversion mixer in an RF receiver front-end (RFE) working at 900 MHz. Fabricated in a 0.18$ mu{hbox{m}}$ CMOS process and operated at 1.5 V supply with a total current of 13.1 mA, the RFE delivers 22 dB gain with 5.3 dB noise figure (NF). The linearization technique achieves around 20 dB ${rm IM}_{3}$ suppression and improves the RFE's ${rm IIP}_{3}$ from $-$ 10.4 dBm to 0.2 dBm without gain reduction and noise penalty while requiring only an extra current of 0.1 mA.      

A Biphase Modulator Circuit for Impulse Radio-UWB Applications

This letter presents a circuit to provide binary phase shift keying to ultra-wideband (UWB) impulse transmitters. The circuit is based on a Gilbert-cell multiplier and uses active on-chip balun and unbalanced-to-balanced converters for single-ended to single-ended operation. Detailed measurements of the circuit show a gain ripple of $pm 1~{rm dB}$ at an overall gain of $-2~{rm dB}$, an input reflection below $-12~{rm dB}$, an output reflection below $-18~{rm dB}$, a group delay variation below 6 ps and a $-1~{rm dB}$ input compression point of more than 1 dBm in both switching states over the full 3.1–10.6 GHz UWB frequency range. A time domain measurement verifies the switching operation using an FCC-compliant impulse generator. The circuit is fabricated in a $0.8~mu {rm m}$ Si/SiGe HBT technology, consumes 31.4 mA at a 3.2 V supply and has a size of $510 times 490~mu{rm m}^{2}$ , including pads. It can be used in UWB systems using pulse correlation reception or spectral spreading.      

Q-Band pHEMT and mHEMT Subharmonic Gilbert Upconversion Mixers

This letter makes a comparison between Q-band 0.15 $mu{rm m}$ pseudomorphic high electron mobility transistor (pHEMT) and metamorphic high electron mobility transistor (mHEMT) stacked-LO subharmonic upconversion mixers in terms of gain, isolation and linearity. In general, a 0.15 $mu{rm m}$ mHEMT device has a higher transconductance and cutoff frequency than a 0.15 $mu{rm m}$ pHEMT does. Thus, the conversion gain of the mHEMT is higher than that of the pHEMT in the active Gilbert mixer design. The Q-band stacked-LO subharmonic upconversion mixers using the pHEMT and mHEMT technologies have conversion gain of $-$7.1 dB and $-$0.2 dB, respectively. The pHEMT upconversion mixer has an ${rm OIP}_{3}$ of $-$12 dBm and an ${rm OP}_{1 {rm dB}}$ of $-$24 dBm, while the mHEMT one shows a 4 dB improvement on linearity for the difference between the ${rm OIP}_{3}$ and ${rm OP}_{1 {rm dB}}$. Both the chip sizes are the same at 1.3 mm $times$ 0.9 mm.      

A $Q$ -Band Four-Element Phased-Array Front-End Receiver With Integrated Wilkinson Power Combiners in 0.18-$mu{{hbox{m}}}$ SiGe BiCMOS Technology

A four-element phased-array front-end receiver based on 4-bit RF phase shifters is demonstrated in a standard 0.18- $mu{{hbox{m}}}$ SiGe BiCMOS technology for $Q$-band (30–50 GHz) satellite communications and radar applications. The phased-array receiver uses a corporate-feed approach with on-chip Wilkinson power combiners, and shows a power gain of 10.4 dB with an ${rm IIP}_{3}$ of $-$13.8 dBm per element at 38.5 GHz and a 3-dB gain bandwidth of 32.8–44 GHz. The rms gain and phase errors are $leq$1.2 dB and $leq {hbox{8.7}}^{circ}$ for all 4-bit phase states at 30–50 GHz. The beamformer also results in $leq$ 0.4 dB of rms gain mismatch and $leq {hbox{2}}^{circ}$ of rms phase mismatch between the four channels. The channel-to-channel isolation is better than $-$35 dB at 30–50 GHz. The chip consumes 118 mA from a 5-V supply voltage and overall chip size is ${hbox{1.4}}times {hbox{1.7}} {{hbox{mm}}}^{2}$ including all pads and CMOS control electronics.      

Improved Microwave Noise Performance by SiN Passivation in AlGaN/GaN HEMTs on Si

Effects of silicon nitride (SiN) surface passivation by plasma enhanced chemical vapor deposition (PECVD) on microwave noise characteristics of AlGaN/GaN HEMTs on high-resistivity silicon (HR-Si) substrate have been investigated. About 25% improvement in the minimum noise figure $(NF_{min})$ (0.52 dB, from 2.03 dB to 1.51 dB) and 10% in the associate gain $(G_{rm a})$ (1.0 dB, from 10.3 dB to 11.3 dB) were observed after passivation. The equivalent circuit parameters and noise source parameters (including channel noise coefficient $(P)$, gate noise coefficient $(R)$, and their correlation coefficient $(C)$ ) were extracted. $P$ , $R$ and $C$ all increased after passivation and the increase of C contributes to the decrease of the noise figure. It was found that the improved microwave small signal and noise performance is mainly due to the increase of the intrinsic transconductance $(g_{{rm m}0})$ and the decrease of the extrinsic source resistance $(R_{rm s})$.      

$N times N$ Cyclic-Frequency Router With Improved Performance Based on Arrayed-Waveguide Grating

We have developed an $N times N$ cyclic-frequency router with improved performance by employing two types of modified configuration; a uniform-loss and cyclic-frequency (ULCF) arrayed-waveguide grating (AWG) and an interconnected multiple AWG. We have demonstrated a compact 50-GHz-spacing 64 $,times,$64 ULCF-AWG router with low and uniform insertion losses of 5.4–6.8 dB and frequency deviations from the grid of less than $pm {8}~{rm GHz}$. We have also demonstrated a 100-GHz-spacing 8$,times,$8 interconnected multiple-AWG router with a practical configuration, very low and uniform insertion losses of 2.3–3.4 dB, and frequency deviations from the grid of less than $pm {6}~{rm GHz}$. We discuss the suitable or realizable scale $N$ of the two types of routers by comparison with a conventional AWG router in terms of optical and dimensional performance and productivity.      

A Single-Ended Fully Integrated SiGe 77/79 GHz Receiver for Automotive Radar

A single-ended 77/79 GHz monolithic microwave integrated circuit (MMIC) receiver has been developed in SiGe HBT technology for frequency-modulated continuous-wave (FMCW) automotive radars. The single-ended receiver chip consists of the first reported SiGe 77/79 GHz single-ended cascode low noise amplifier (LNA), the improved single-ended RF double-balanced down-conversion 77/79 GHz micromixer, and the modified differential Colpitts 77/79 GHz voltage controlled oscillator (VCO). The LNA presents 20/21.7 dB gain and mixer has 13.4/7 dB gain at 77/79 GHz, and the VCO oscillates from 79 to 82 GHz before it is tuned by cutting the transmission line ladder, and it centres around 77 GHz with a tuning range of 3.8 GHz for the whole ambient temperature variation range from $- hbox{40},^{circ}{hbox{C}}$ to $+ hbox{125},^{circ}{hbox{C}}$ after we cut the lines by tungsten-carbide needles. Phase noise is $-$90 dBc/Hz@1 MHz offset. Differential output power delivered by the VCO is 5 dBm, which is an optimum level to drive the mixer. The receiver occupies 0.5 ${hbox{mm}}^{2}$ without pads and 1.26 ${hbox{mm}}^{2}$ with pads, and consumes 595 mW. The measurement of the whole receiver at 79 GHz shows 20–26 dB gain in the linear region with stable IF output signal. The input ${rm P}_{rm 1dB}$ of the receiver is $-$35 dBm.      

Schottky Barrier Height Modulation of Nickel–Dysprosium-Alloy Germanosilicide Contacts for Strained P-FinFETs

This letter reports on the fabrication and hole Schottky barrier $(Phi_{ rm B}^{rm p})$ modulation of a novel nickel (Ni)–dysprosium (Dy)-alloy germanosilicide (NiDySiGe) on silicon–germanium (SiGe). Aluminum (Al) implant is utilized to lower the $Phi_{rm B}^{rm p}$ of NiDySiGe from $sim$0.5 to $sim$ 0.12 eV, with a correspondingly increasing Al dose in the range of $ hbox{0}$–$hbox{2}timeshbox{10}^{15} hbox{atoms}/ hbox{cm}^{2}$. When integrated as the contact silicide in p-FinFETs (with SiGe source/drain), NiDySiGe with an Al implant dose of $hbox{2}timeshbox{10}^{14} hbox{atoms}/ hbox{cm}^{2}$ leads to 32% enhancement in $I_{rm DSAT}$ over p-FinFETs with conventional NiSiGe contacts. Ni–Dy-alloy silicide is a promising single silicide solution for series-resistance reduction in CMOS FinFETs.      

Post-CMOS Compatible Micromachining Technique for On-Chip Passive RF Filter Circuits

This paper reports on a post-CMOS compatible micromachining technology for passive RF circuit integration. The micromachining technology combines the formation of high-performance microelectromechanical systems solenoid inductors and metal—insulator—metal (MIM) capacitors by using a post-CMOS process on standard CMOS substrate. Utilizing this process, novel on-chip 3-D configured RF filters for 5 GHz band are integrated on-chip. Two types of compact filters are designed and fabricated, with the layout size of the bandpass filter as 0.65 $,times,$0.67 ${rm mm}^{ 2}$ and that of the low-pass filter as 0.77$,{ times },$1.25 ${rm mm}^{ 2}$. From the measurement results, the fifth-order low-pass filter shows less than 1.06 dB insertion loss up to 5 GHz and ${-}{rm 1.5}~{rm dB}$ cutoff frequency at 5.3 GHz. The bandpass filter is a second-order coupled-resonator type, with measured 4.3 dB minimum insertion loss and better than 13 dB return loss in the pass band. Both simulation and shock testing results have shown that the filters are almost free of influence from environmental vibration and shock. From the measured results in various temperatures, the bandpass filters were found to show lower loss under low temperatures, while the passband shift is negligible in the various temperatures. Together with the fabricated filters, the developed micromachining technique has demonstrated the potential of on-chip integration and miniaturization of passive RF circuits.      

Wideband LNA Compatible for Differential and Single-Ended Inputs

This letter presents a wideband low-noise amplifier (LNA) that supports both differential and single-ended inputs, while providing differential output. The LNA is implemented in 0.13 $mu{rm m}$ CMOS technology. For sub-1 GHz wideband applications, this LNA achieves 22.5 dB voltage gain, ${+ 1}~{rm dBm}$ IIP3, and 2.5 dB NF in the differential receiving mode, while achieving 23 dB voltage gain, ${- 0.5}~{rm dBm}$ IIP3, and 2.65 dB NF in the single-ended receiving mode. The LNA core circuit draws 2.5 mA from 1.2 V supply voltage, and occupies a small chip area of 0.06 ${rm mm}^{2}$.      

A Widely-Tunable, Reconfigurable CMOS Analog Baseband IC for Software-Defined Radio

This paper describes a reconfigurable analog baseband (ABB) for a software-defined radio (SDR). A wide variety of filter characteristics needed for SDR can be obtained by a reconfigurable filter based on a newly developed duty-cycle controlled discrete-time transconductor. The ABB, implemented in a 90 nm CMOS process, provides second- and fourth-order Butterworth, Chebyshev, and elliptic responses with bandwidths from 400 kHz to 30 MHz. The chip draws only 12 mA and achieves a P$_{rm 1dB}$ of $+7~hbox{dBm}$ with a 1.0 V supply. The input-referred integrated in-band noise is $0.31~{rm m}{rm V}_{rm rms}$ and the die area is as small as $0.57~{hbox{mm}}^{2}$.      

A Low Loss High Isolation DC-60 GHz SPDT Traveling-Wave Switch With a Body Bias Technique in 90 nm CMOS Process

In this letter, a low loss high isolation broadband single-port double-throw (SPDT) traveling-wave switch using 90 nm CMOS technology is presented. A body bias technique is utilized to enhance the circuit performance of the switch, especially for the operation frequency above 30 GHz. The parasitic capacitance between the drain and source of the NMOS transistor can be further reduced using the negative body bias technique. Moreover, the insertion loss, the input 1 dB compression point (${rm P} _{{1}~{rm dB}}$), and the third-order intermodulation (IMD3) of the switch are all improved. With the technique, the switch demonstrates an insertion loss of 3 dB and an isolation of better than 48 dB from dc to 60 GHz. The chip size of the proposed switch is 0.68 $,times,$0.87 ${rm mm}^{2}$ with a core area of only 0.32$,times,$0.21 ${rm mm}^{2}$.      

A 36–80 GHz High Gain Millimeter-Wave Double-Balanced Active Frequency Doubler in SiGe BiCMOS

This letter presents a high conversion gain double-balanced active frequency doubler operating from 36 to 80 GHz. The circuit was fabricated in a 200 GHz ${rm f}_{rm T}$ and ${rm f}_{max}$ 0.18 $mu$m SiGe BiCMOS process. The frequency doubler achieves a peak conversion gain of 10.2 dB at 66 GHz. The maximum output power is 1.7 dBm at 66 GHz and ${-}3.9$ dBm at 80 GHz. The maximum fundamental suppression of 36 dB is observed at 60 GHz and is better than 20 dB from 36 to 80 GHz. The frequency doubler draws 41.6 mA from a nominal 3.3 V supply. The chip area of the active frequency doubler is 640 $mu$m $,times,$424 $mu$m (0.272 mm $^{2}$) including the pads. To the best of authors' knowledge, this active frequency doubler has demonstrated the highest operating frequency with highest conversion gain and output power among all other silicon-based active frequency doublers reported to date.      

Compact $S$ -/$Ka$-Band CMOS Quadrature Hybrids With High Phase Balance Based on Multilayer Transformer Over-Coupling Technique

This paper presents compact CMOS quadrature hybrids by using the transformer over-coupling technique to eliminate significant phase error in the presence of low-$Q$ CMOS components. The technique includes the inductive and capacitive couplings, where the former is realized by employing a tightly inductive-coupled transformer and the latter by an additional capacitor across the transformer winding. Their phase balance effects are investigated and the design methodology is presented. The measurement results show that the designed 24-GHz CMOS quadrature hybrid has excellent phase balance within ${pm}{hbox{0.6}}^{circ}$ and amplitude balance less than ${pm} {hbox{0.3}}$ dB over a 16% fractional bandwidth with extremely compact size of 0.05 mm$^{2}$. For the 2.4-GHz hybrid monolithic microwave integrated circuit, it has measured phase balance of ${pm}{hbox{0.8}}^{circ}$ and amplitude balance of ${pm} {hbox{0.3}}$ dB over a 10% fractional bandwidth with a chip area of 0.1 mm$^{2}$ .      

A Low Voltage Mixer With Improved Noise Figure

A 5.2 GHz low voltage mixer with improved noise figure using TSMC 0.18 $mu$m CMOS technology is presented in this letter. This mixer utilizes current reuse and ac-coupled folded switching to achieve low supply voltage. The noise figure of the mixer is strongly influenced by flicker noise. A resonating inductor is implemented for tuning out the parasitic components, which not only can improve noise figure but also enhance conversion gain. A low voltage mixer without resonating technique has also been fabricated and measured for comparison. Simulated results reveal that flicker corner frequency is lowered. The measured results show 4.5 dB conversion gain enhancement and 4 dB reduction of noise figure. The down-conversion mixer with resonating inductor achieves 5.8 dB conversion gain, ${-}16$ dBm ${rm P}_{{rm 1dB}},$ ${-}6$ dBm ${rm IIP}_{3}$ at power consumption of 3.8 mW and 1 V supply voltage.