中国微米纳米-微纳结构对电容式柔性压力传感器性能影响的研究

设计制备出三明治结构的电容式柔性压力传感器,并对其性能进行研究.该传感器以银纳米线为电极材料,聚二甲基硅氧烷(PDMS)为柔性衬底,同时采用毛面玻璃和光面玻璃分别作为柔性衬底的制备模板,制备出微纳结构和平面结构的PDMS薄膜.然后采用喷涂法制备AgNWs/PDMS复合电极,以另外一层PDMS为介电层,将两电极面对面封装,得到电容式柔性压力传感器,最后系统研究了传感器的电极微纳结构对器件性能的影响.本文研究表明,具有微纳结构的AgNWs/PDMS复合薄膜传感器的灵敏度为1.0 kPa-1,而平面结构的AgNWs/PDMS复合薄膜传感器的灵敏度为0.6 kPa-1,由此可知具有微纳结构的柔性衬底能够显著提高器件的灵敏度.     

碳纳米管/PDMS复合材料柔性阵列压力传感器制备与实验

以碳纳米管（CNTs）作为导电填料,聚二甲基硅氧烷（PDMS）为基体材料,采用溶液法制备出CNTs/PDMS导电复合材料。研究了碳纳米管浓度对复合材料的电学特性和压阻特性的影响规律,得到碳纳米管在PDMS中的渗滤区域。通过复合材料的压力灵敏度优化碳纳米管浓度。以制备的复合材料为敏感材料,FPCB工艺加工的柔性基板为电极,设计制备了一种简单结构和工艺的柔性阵列压力传感器。用零电势法设计了阵列电阻读出电路与LabVIEW实现的上位机配合,实现信号读取和显示。最后通过一个应用实例表明,该柔性阵列压力传感器及信号处理系统可以实现压力分布与大小的实时监测,可为柔性阵列压力传感器设计与制备提供参考。     

基于 ＧＮＰｓ/ ＰＤＭＳ 复合薄膜的柔性压阻传感器制备及性能研究

目前柔性压力传感器已被用于众多领域,其中压阻薄膜是柔性压力传感器的核心。本文将石墨烯纳米片（GNPs）与聚二甲基硅氧烷（PDMS）复合,通过倒模的方法制备压阻薄膜,经测试,GNPs浓度为8%时,材料具有较好的性能。以此为基础,制备了压敏结构间距为1.2 mm,直径大小为1.0 mm的GNPs/PDMS基压阻传感器,经测试,所制备的传感器加载响应为340 ms,卸载响应速度为260 ms,并具有较好的稳定性,同时,基于该压阻式柔性压力传感器实现了人体手腕关节处压力信号的测试。     

基于PDMS海绵介质层的电容式柔性压力传感器

柔性压力传感器以其低成本和大的检测范围等优势广泛的应用于电子皮肤和可穿戴传感器领域。本文通过在PDMS中填充碳酸氢铵材料,制备了大面积高密度具有微观结构的PDMS海绵介质层,通过简易的方法完成了柔性压力传感器的制备。与以往的柔性压力传感器相比,制备的PDMS海绵介质层由于气孔的存在更容易在受到压力时发生形变,拥有高的灵敏度(0.23 kPa^-1)、大的检测范围(0～50 kPa)、稳定的重复性(>1 000循环)以及快的响应时间(<150 ms)。通过对不同厚度、不同大小的PDMS海绵介质层进行测试,利用厚度为1.5 mm,大小为8 mm×8 mm的PDMS海绵作为压力传感器的介质层实现了力的实时检测。     

基于PI衬底的柔性MEMS电容式触觉力传感器设计与制作

论述了一种可应用于机器人或医学修补技术的触觉传感器及其在旋涂的柔性聚酰亚胺衬底的新制作方法.该传感器是由多层无机和有机薄膜组成的柔性薄膜结构.结合传感器结构特点及各结构层材料的加工性能,进行工艺优化整合.尤其首次在载体硅片与PI衬底之间引进PDMS分离层,使得柔性器件的分离工艺大大简化.最后得到一种简单、低廉且与常规MEMS技术兼容的工艺.所制的传感器结构轻薄,可挠性好,且能贴附在任意形状的物体表面同时实现法向力和切向力的测量.     

MEMS压力传感器现状及其在弹药上的应用

随着MEMS技术、集成电路技术和材料制备与特性研究工作的进展,必将使得MEMS压力传感器的批量生产、在弹药中的大量应用成为可能。系统地分析MEMS压力传感器的特点、分类及国内外发展现状,包括研究现状、产品现状和MEMS压力传感器在弹药中的应用,对相关的科学研究具有重要意义。     

MEMS压力传感器批量组装设备的研制

针对当前MEMS产业化推进过程中的小批量的发展现状,研究面向批量组装的MEMS微操作实用化系统具有重要实际价值.针对MEMS高温压力传感器产业化发展过程中的批量化键合工艺需求,从分析压力传感器键合工艺入手,研究批量组装关键技术,最后进行系统集成研制MEMS压力传感器批量组装设备.批量组装实验表明该系统可实现典型MEMS传感器批量组装,对MEMS产业化发展具有重要意义.     

银纳米线柔性压阻式触觉传感器的研究

触觉传感器是智能机器人感知外界环境和与人交互的关键环节。多种物理测量和高延展性使触觉传感器得到更广泛的应用。本文介绍了一种制造工艺简单、成本低廉的柔性触觉传感器。根据电阻的变化,可以检测温度和接触压力。设计了一种由PDMS膜、纸基银纳米线和PDMS膜组成的三明治结构。制备纸基银纳米线阵列,并在阵列末端用导电银膏引出铜线。整个传感器的尺寸为3cmx3cm。在实验过程中,测量了施加压力和改变表面温度时阵列交点处的电阻。结果表明,该传感器的压力检测灵敏度为2.8?/N,温度检测灵敏度为0.18?/oC。该传感器的结构和制备工艺简单可行,在机器人电子皮肤中具有广阔的应用前景。     

可印刷柔性应变传感器的制作及其对 人体运动行为监测研究

该文主要研究了导电浆料 PS@Ag/PDMS 的流变特性与印刷性,以聚苯乙烯微球表面镀 银(PS@Ag)的核壳结构粒子为导电填料,与聚二甲基硅氧烷(PDMS)预聚物及其固化剂复合配制 PS@Ag/PDMS 导电浆料,采用丝网印刷技术与旋涂工艺制备得到 PDMS-PS@Ag/PDMS-PDMS 三明治结构柔性应变传感器。柔性应变传感器在人体运动行为中的实时监测结果显示,该传感器在手肘关节与膝盖关节的弯曲——伸展循环运动中的相对电阻变化率分别高达约 0.75 0.50,展现出较高的可拉伸柔性、灵敏度及一致性,在人体运动行为监测中具有广阔的应用前景。     

面向人体运动检测的纸基柔性压力阵列传感器

针对制备同时具有高灵敏度和大工作范围的柔性压力阵列传感器的挑战,以无尘纸作为基底,采用石墨烯—碳纳米管导电涂料和聚二甲基硅氧烷(PDMS)进行混合作为涂层,利用PDMS的粘性与涂料的导电性进行电气连接,使用激光切割进行阵列设计,高灵敏度(3.29 kPa~(-1))、大工作范围(0～45 kPa)的压力阵列传感器研制成功,同时纸基材料不易连接的问题也得到了解决。该传感器不仅可以用于检测大幅度的肢体运动,还可以用于探测细微的人体动作。由于该传感器具有柔软、灵敏度高、制造工艺简便、成本低、电气连接简便等优点,显示了其在可穿戴传感器领域和智能机器人触觉领域的应用潜力。     

Capacitive flexible pressure sensor: microfabrication process and experimental characterization

Kapton-based flexible pressure sensor arrays are fabricated using a new technology of film transfer. The sensors are dedicated to the non-invasive measurement of pressure/force in robotic, sport and medical applications. The sensors are of a capacitive type, and composed of two millimetric copper electrodes, separated by a polydimethylsiloxane (PDMS) deformable dielectric layer. On the flexible arrays, a very small curvature radius is possible without any damage to the sensors. The realized sensors are characterized in terms of fabrication quality. The inhomogeneity of the load free capacitances obtained in the same array is ±7 %. The fabrication process, which requires 14 fabrication steps, is accurate and reproducible: a 100 % transfer yield was obtained for the fabrication of 5 wafers gathering 4 sensor arrays each (215 elementary sensors). In the preliminary electro-mechanical characterization, a sensor (with a PDMS dielectric layer of 660 μm thickness and a free load capacitance of 480 fF) undergoes a capacitance change of 17 % under a 300 kPa normal stress.     

Fabrication and flow-sensor application of flexible thermal MEMS device based on Cu on polyimide substrate

A Cu on polyimide (COP) substrate was proposed as a MEMS material, and the fabrication process for a flexible thermal MEMS sensor was developed. The COP substrate application to MEMS devices has the advantage that typical MEMS structures fabricated in a SOI wafer in the past—such as a diaphragm, a beam, a heater formed on a diaphragm—can also be easily produced in the COP substrate in the flexible fashion. These structures can be used as the sensing element in various physical sensors, such as flow, acceleration, and shear stress sensors. A flexible thermal MEMS sensor was produced by using a lift-off process and sacrificial etching of a copper layer on the COP substrate. A metal film working as a flow sensing element was formed on a thin polyimide membrane produced by the sacrificial etching. The fabricated flexible thermal MEMS sensor was used as a flow sensor, and its characteristics were evaluated. The obtained sensor output versus the flow rate curve closely matched the approximate curve derived using King’s law. The rising and falling response times obtained were 0.50 and 0.67 s, respectively.

     

A flexible encapsulated MEMS pressure sensor system for biomechanical applications

 The use of pressure sensors made of conductive polymers is common in biomechanical applications. Unfortunately, hysteresis, nonlinearity, non-repeatability and creep have a significant effect on the pressure readings when such conductive polymers are used. The objective of this paper is to explore the potential of a new flexible encapsulated micro electromechanical system (MEMS) pressure sensor system as an alternative for human interface pressure measurement. A prototype has been designed, fabricated, and characterized. Testing has shown that the proposed packaging approach shows very little degradation in the performance characteristics of the original MEMS pressure sensor. The much-needed characteristics of repeatability, linearity, low hysteresis, temperature independency are preserved. Thus the flexible encapsulated MEMS pressure sensor system is very promising and shows superiority over the commercially available conductive polymer film sensors for pressure measurement in biomechanical applications. Received: 1 December 1999/Accepted: 17 August 2000     

A study on a hybrid structure flexible electro-rheological microvalve for soft microactuators

In order to realize a fluidic soft microactuator with a built-in control valve, this paper presents a cantilever type flexible electro-rheological microvalve (FERV) with a hybrid flow channel structure made from polydimethylsiloxane (PDMS) and SU-8. The hybrid structure provides high flexibility with the PDMS structure while only slight expansion occurred under high pressure with the SU-8 structure. In addition, its flexible electrodes are realized by UV-curable PEDOT:PSS (poly(3,4-ethylenedioxythiophene) polystyrene sulfonate) that is a flexible conductive polymer and can be fabricated by simple and fast fabrication process without high-cost equipment. The proposed FERV can control the flow rate of the electro-rheological fluid (ERF) through the flow channel by changing its apparent viscosity with an applied electric field. FEM simulations were conducted to demonstrate the flexural rigidity of the designed FERV and compare it with the previous FERVs. Developing micro-electro-mechanical systems (MEMS) processes using the photolithography technique, the FERV was successfully fabricated and its characteristics were experimentally clarified. The results showed the feasibility of the proposed FERV in the soft microactuator application.

     

基于MEMS压力传感器阵列的浪涌检测技术研究

提出了一种基于微机电系统(MEMS)压力传感器阵列的浪涌检测技术.通过在压力作用区域内布放MEMS压力传感器阵列,从而获取各测试点上的压力值,对这些压力值进行处理得到相应区域的压力变化趋势.经MEMS压力传感器阵列检测实验系统验证表明:此设计方案能够准确检测到浪涌信号,分辨出浪涌的方向及幅值变化.     

Fabrication of curved copper micromesh sheets using flexible PDMS molds

A unique fabrication method for a curved copper micromesh is proposed and demonstrated. A PDMS mold was fabricated using a microcasting process and then used as a flexible mold in copper electroplating. The fabricated copper micromesh was well formed and connected without any cracks within the entire mold area. The experimental results verified that the fabricated features of the copper micromesh accurately followed the shape of the microstructures and the curvature of the PDMS mold. This unique fabrication method provides an alternative means to produce curved or three-dimensional metal microstructures.     

Thermoplastic Forming of Bulk Metallic Glass— A Technology for MEMS and Microstructure Fabrication

A technology for microelectromechanical systems (MEMS) and microstructure fabrication is introduced where the bulk metallic glass (BMG) is formed at a temperature where the BMG exist as a viscous liquid under an applied pressure into a mold. This thermoplastic forming is carried out under comparable forming pressure and temperatures that are used for plastics. The range of possible sizes in all three dimensions of this technology allows the replication of high strength features ranging from about 30 nm to centimeters with aspect ratios of 20 to 1, which are homogeneous and isotropic and free of stresses and porosity. Our processing method includes a hot-cutting technique that enables a clean planar separation of the parts from the BMG reservoir. It also allows to net-shape three-dimensional parts on the micron scale. The technology can be implemented into conventional MEMS fabrication processes. The properties of BMG as well as the thermoplastic formability enable new applications and performance improvements of existing MEMS devices and nanostructures