SmCo薄膜磁控溅射沉积速率的影响因素

SmCo薄膜的厚度是影响其磁性能的重要因素,而沉积速率是控制薄膜厚度的关键。采用直流磁控溅射工艺制备SmCo薄膜,设计正交实验并通过数理统计方法研究了溅射工艺参数中溅射功率、靶基距及氩气压强对SmCo薄膜沉积速率的影响,并同时考察了不同厚度SmCo薄膜的磁性能变化规律。研究结果表明:溅射功率与靶基距都对薄膜的沉积速率有较大的影响,其中在溅射功率为40~120W范围内时,随着溅射功率的增大SmCo薄膜的沉积速率逐渐提高;在靶基距为50~70mm的范围内,SmCo薄膜的沉积速率随靶基距的增大而逐渐降低;而在氩气压强处于0.7~1.5Pa范围内时,SmCo薄膜的沉积速率几乎不随氩气压强的改变而变化。在溅射功率为80W、靶基距为60mm及氩气压强为1.1Pa的工艺条件下,SmCo薄膜的沉积速率具有很好的稳定性。随膜厚从0.59μm增加到0.90μm,SmCo薄膜的矫顽力由23.4kA/m降低到8.2kA/m。     

非晶硅薄膜的沉积速率研究

利用PECVD方法在硅片上制备了非晶硅薄膜,通过正交实验得出影响薄膜沉积速率和折射率的主要参数为气体流量和射频功率,分别研究了这两个参数对沉积速率和折射率的影响.结果表明当气体流量低于240sccm时,薄膜沉积速率随气体流量增加而增加,而折射率则随之减小;当流量大于240sccm时,沉积速率出现饱和,折射率的变化并不明显.当射频功率低于120W时,薄膜沉积速率随着功率的提高而增大,而折射率则随之减小;当功率大于120W并进一步提高时,沉积速率成下降趋势,折射率则随之增大.     

工艺参数对直流反应磁控溅射ZnO:Al薄膜沉积速率的影响

实验以合金靶材在玻璃衬底上运用直流反应磁控溅射法制备了ZAO(ZnO:Al)透明导电薄膜样品.研究了O2气流量,衬底温度,以及反应气压和溅射功率等工艺参数对ZAO薄膜沉积速率的影响规律.结果表明:沉积速率随O2气流量的增加显著降低,靶面溅射模式由金属模式转变为氧化物模式,而且这种转变趋势在改变其他参数时依然明显;沉积速率随溅射功率的增大几乎成线性增加,但随衬底温度的变化并不大;在反应气压增大的情况下,沉积速率不断上升,达到最大值后,又随气压的增大不断下降.     

电源工作模式对中频磁控溅射沉积速率的影响

在中频孪生靶磁控溅射实验装置上,研究了电源恒压、恒流、恒功率工作模式下沉积速率与气压、电参数之间的关系,得出不同工作模式下电压、电流、功率及频率、占空比对沉积速率的影响:恒流模式下沉积速率稳定性最好,恒压最差;气压变化时,恒功率、恒流工作模式有稳定沉积速率作用;恒流模式下,沉积速率随占空比升高而减小,随频率升高而增大.     

ICP-CVD制备a-CHON及光学性能分析

采用外置电感耦合等离子体化学气相沉积法,以高纯CH4/N2/CO2/H2作为反应气体,制备出非晶的a-CHON薄膜.研究了放电功率对薄膜沉积速率、表面形貌及光学性能的影响.结果表明沉积速率随着放电功率的增加而增加,而非线性增加;原子力显微镜分析结果表明放电功率对薄膜粗糙度有较大的影响;红外光谱分析表明了薄膜内部存在C-O,C=O,C≡N以及C-H键;紫外-可见-近红外光分析表明,薄膜的光学带隙随放电功率的增加而减小;薄膜折射率在可见光区的色散图表明,折射率随入射光频率的增加而减小,出现反常色散关系;而在同一波长下薄膜的折射率先随放电功率的增加而减小,而后又有所增加.     

用ECRCVD方法制备优质氮化硅钝化膜

利用电子回旋共振等离子体化学气相沉积(ECR—CVD)技术，以SiH4和N2为反应气体进行了氮化硅钝化薄膜的低温沉积技术的研究。采用原子力显微镜、傅立叶变换红外光谱和椭圆偏振光检测等技术对薄膜的表面形貌、结构、厚度和折射率等性质进行了测量。结果表明，采用ECR—CVD技术能够在较低的衬底温度条件下以较高的沉积速率制备厚度均匀的氮化硅薄膜，薄膜中H含量很低。薄膜沉积速率随微波功率和混合气体中硅烷比例的增加而增大。折射率随微波功率的增大而减小，随混合气体中硅炕比例的增大而增大。在相同气体混合比和微波功率条件下，较高衬底温度条件下制备的薄膜折射率较大。     

磁控溅射法制备CdS多晶薄膜工艺研究

采用磁控法制备了CdS薄膜,研究工艺参数对样品沉积质量、沉积速率及晶体结构的影响。实验发现,在不同衬底上制备CdS薄膜时需要采取不同的后续工艺措施以获得较好的沉积质量。同时,制备样品的沉积速率随衬底类型、衬底温度、溅射功率及溅射气压的变化而变化。讨论并给出了工艺参数对上述实验结果的影响机制。X射线衍射谱显示,制备样品是六方和立方两种晶型的混合,沿(002)和(111)晶面择优取向生长。随溅射功率的增大和衬底温度的升高,两种晶型互相竞争生长并分别略微占优势。当溅射功率增大到200 W,衬底温度升高到200℃时,占优势晶型消失,薄膜择优取向特性变得更好。此外,随着溅射气压的增大,样品结晶质量下降,在0.5 Pa时呈现明显非晶化现象。     

射频磁控反应溅射制备Al2O3薄膜的工艺研究

采用射频磁控反应溅射法,以高纯Al为靶材,高纯O2为反应气体,在不锈钢和单晶Si基片上成功地制备了氧化铝(Al2O3)薄膜,并对氧化铝薄膜的沉积速率、结构和表面形貌进行了研究.结果表明,沉积速率随着射频功率的增大先几乎呈线性增大而后缓慢增大;随着溅射气压的增加,沉积速率先增大,在一定气压时达到峰值后继续随气压增大而减小,同时随着靶基距的增大而减小;随着氧气流量的不断增加,靶面溅射的物质从金属态过渡到氧化物态,沉积速率也随之不断降低.X射线衍射图谱表明薄膜结构为非晶态;用原子力显微镜对薄膜表面形貌观察,薄膜微结构为柱状.     

工作参数对平面磁控溅射系统沉积速率的影响

为了分析磁场、阴极电压、气压和靶基板间距等工作参数对沉积速率的影响,本文对磁控放电过程和沉积过程进行了讨论,并着重对沉积速率计算的无碰撞模型和碰撞模型进行了研究.靶功率是影响沉积速率的关键因素,通过对磁控放电特性分析发现,随着磁场、电压的增大,等离子体阻抗降低,放电电流和靶功率增大,随着气压的增大,放电电流和靶功率先增大后减小;采用碰撞模型对沉积速率进行模拟发现,在靶功率恒定的情况下,沉积速率随着气压和靶基板间距的增大而减小.因此,在气压和靶基板间距保持恒定的情况下,沉积速率会随着磁场和电压的增大而增大;而在磁场、电压和靶基板间距保持恒定的情况下,沉积速率随着气压的增大,先增大后减小.上述结论对于薄膜制备效率和质量的提高具有一定的理论指导意义.     

反应溅射GexC1—x薄膜的沉积速率

系统地研究了射频磁控反应溅射中工艺参数ＧｅｘＣ１－ｘ薄膜沉积率的影响，结果表明，当气体流量比过某值后，沉积速率较大的下降。沉积速率随射频率功率的增大而增大，某工作气压下有沉积速率的最大值，薄膜厚度时间增长规律在出现靶中毒及未出的靶中毒的情况下略有差别。     

Effects of methane flow rate on the optical properties and chemical bonding of germanium carbon films deposited by reactive sputtering

Amorphous hydrogenated germanium carbon (a-Ge_1−xC_x:H) films were prepared by radio frequency (RF) reactive magnetron sputtering of a pure Ge (111) target in a CH₄ + H₂+Ar mixture and their composition, optical properties, chemical bonding were investigated as a function of gas flow rate ratio of CH₄/(Ar + H₂). The results showed that the deposition rate first increased and then decreased as gas flow rate ratio of CH₄/(Ar + H₂) was increased from 0.125 to 0.625. And the optical gap of the a-Ge_1−xC_x:H films increased from 1.1 to 1.58 eV accompanied with the increase in the carbon content and the decrease in the relative content of Ge–C bonds of the films as the CH₄ flow rate ratio was increased, while refractive index of the films decreased and the absorption edge shifted to high energy. Through the analysis of X-ray photoelectron spectroscopy (XPS), Fourier transform infrared spectroscopy (FTIR) and Raman spectroscopy, it was found that the formation of Ge–C bonds in the films was promoted by low CH₄ flow rate which is connected with relatively high H₂ concentration and Ge content. Especially in low CH₄ concentration, the formation of sp²-hybridised C–C bonds was suppressed considerably both due to the etching effect on weak bonds of H and the fact that chemical bonding for germanium can be only sp³ hybridization.     

a-C:N膜的制备及结构分析

采用射频溅射法在锗衬底上沉积无定形碳氮膜 (a- C:N) ,用 X射线光电子谱 (XPS)、傅立叶变换红外光谱 (FT- IR)和喇曼光谱 (RS)分析了膜的成分与结构。结果表明 ,氮是以化学键的形式存在于膜中 ,且有三种不同的 C- N键合状态。随着反应气体中氮气分压的增加 ,a- C:N膜中氮浓度增加 ,C≡N键的含量增加。     

The deposition and optical properties of Ge1−xCx thin film and infrared multilayer antireflection coatings

The effects of deposition parameters on the deposition rate, microstructure, and composition of Ge_1−xC_x thin films prepared by plasma enhanced chemical vapor deposition were studied and the films' infrared optical properties were investigated. The results show that the carbon content of these films increases as the precursor gas flow ratio of CH₄:GeH₄ increases, while the infrared refractive index of these films decreases from 4 to 2. The deposition rate increases with the radio-frequency power and reaches a constant value when the power goes above 60 W. Ge_1−xC_x/diamond-like carbon infrared antireflection coatings were prepared, and the transmittance of the coatings in the band of 8 to 14 μm was 88%, which is superior to that of Zinc Sulfide substrate by 14%.     

锗掺杂类金刚石薄膜特性研究

为了降低类金刚石(DLC)薄膜的应力,使用脉冲真空电弧离子镀(PVAD)和电子束热蒸发相结合的复合沉积技术,在Si基底上制备了一系列不同锗含量(原子百分比)的Ge-DLC薄膜样片,研究了锗含量对DLC薄膜光学特性和力学特性的影响。研究结果表明:在1~5μm波段,当锗掺杂含量小于25%时,对DLC薄膜光学常数的影响不大;随着Ge含量的增加,DLC薄膜的折射率和消光系数都略微增大。随着DLC薄膜中Ge含量的增加,薄膜的内应力和硬度均有所降低。当DLC薄膜中Ge含量约为8%时,Ge-DLC薄膜的内应力从6.3降至3.0 GPa,而硬度仅从3875减小为3640 kgf/mm2,几乎保持不变。硅基底上单面沉积Ge的含量为8%的DLC薄膜在红外3~5μm波段的透过率峰值约为63.15%。     

Chemical bonding of a-Ge1−xCx:H films grown by RF reactive sputtering

Amorphous hydrogenated germanium-carbon (a-Ge_1−xC_x:H) films were deposited by RF reactive sputtering pure Ge (1 1 1) target at different flow rate ratios of CH₄/(CH₄+Ar) in a discharge Ar/CH₄, and their composition and chemical bonding were investigated using X-ray photoelectron spectroscopy (XPS), Raman spectroscopy, and Fourier transform infrared spectroscopy (FTIR). XPS and FTIR results showed the content of germanium in the films decreased with the increase of the flow rate ratio CH₄/(Ar+CH₄), and the Ge-C, Ge-H, C-H bonds were formed in the films. The fraction of Ge-C, Ge-H, and C-H bonds was strongly dependent on the flow rate ratio. Raman results indicated that the films also contain both Ge-Ge and C-C bonding. Based on the change of the chemical bonding of a-Ge_1−xC_x:H films with the flow rate ratio CH₄/(CH₄+Ar), an optimal experimental condition for the application of infrared windows was obtained.     

Electrical properties of evaporated polycrystalline Ge thin-films

Electrical properties of Ge thin films evaporated on Si₃N₄ CVD-coated Si substrate were improved by introducing a heat treatment after the deposition of Ge films. Evaporation conditions were optimized by changing the substrate temperature and deposition rate, and then, heat treatment was performed. At substrate temperatures during the evaporation lower than 300 °C and higher than 400 °C, deposited films were amorphous and polycrystalline, respectively. At substrate temperatures lower than 400 °C, Ge films were evaporated without degrading the surface roughness. The Hall mobility of films evaporated at room temperature increased with increasing the substrate and heating temperature and showed about 400 cm² V⁻¹ s⁻¹ for the hole concentration of 4 × 10¹⁷ cm⁻³ at the heating temperature of 900 °C. This value was almost comparable to that of p-type Ge single crystal.     

Infrared transmission properties of germanium carbon thin films deposited by reactive RF magnetron sputtering

Germanium carbon (GeC) thin films were prepared on ZnS substrates by reactive RF magnetron sputtering in Ar and CH₄ mixtures with a Ge disc as the target. H content in the films was studied as a function of the deposition parameters and low H content GeC film was obtained. RF power had a little effect on IR absorptions, hence had a little effect on H content. IR absorption of the GeC film increased a little with the increase in partial pressure of CH₄ as well as total pressure of gas mixture. Increase in substrate temperature decomposed CH₄ and CH_x in the GeC film into C and H and H was desorbed from the film, lowering the IR absorption. However, high substrate temperature prevented CH₄ or CH_x from adsorbing onto the substrate, which decreased C content in the GeC film and increased the film's refractive index. Higher annealing temperature of the GeC film reduced H content, but high annealing temperature (500 °C) caused the graphitization of the GeC film and destroyed its continuity.     

Effect of Initialization Technical Parameters on Optical Absorption of Ge2Sb2Te5 Thin Films

The optical absorption properties of phase-change optical recording thin films subjected to various initialization conditions were investigated. The effects of initialization power and velocity on optical constants of the Ge2Sb2Te5 thin films were also studied. The energy gap of Ge2Sb2Te5 thin films subjected to various initialization conditions was also obtained. It was found that the optical energy gap of the Ge2Sb2Te5 thin films increased with either increasing initialization laser power or decreasing initialization velocity, with peak of 0.908 eV at laser power of 1000 mW or initialization velocity of 4.0 m/s, but the continued increasing initialization laser power or decreasing initialization velocity resulted in the decrease of the optical energy gap. The change of the optical energy gap was discussed on the basis of amorphous crystalline transformation.     

Phase transition and optical properties of Ge doped ZnO films synthesised by sputtering

Ge doped ZnO films were deposited on Si substrates by sputtering technique. With the increasing annealing temperature, the crystal quality of samples becomes gradually better and the phase transition can be observed at annealing temperature of 600°C. X-ray photoelectron spectroscopy results show the incorporation of Ge into the ZnO films with 14·81 at-%Ge content. Fourier transform infrared spectroscopy absorption spectra of samples annealed at above 600°C display vibration mode of ν (ZnO₄) and ν (GeO₄) in Zn₂GeO₄. The enhancement of ultraviolet emission intensity should be attributed to the yielded mass holes caused by Ge doping and the rising crystal quality. The sample annealed at 800°C displays the strongest blue emission due to the native defects in Zn₂GeO₄ films or/and surface defects.     

Origin of photoluminescence peaks in Ge–SiO2 thin films

Ge–SiO₂ thin films were prepared by the RF magnetron sputtering technique on p–Si substrates from a Ge–SiO₂ composite target. The asdeposited films were annealed in the temperature range of 300–10000C under nitrogen ambience. The structure of films was evaluated by X–ray diffraction, X-ray photoemission spectroscopy and Fourier transform infrared absorption spectroscopy. Results show that the content of Ge and its oxides in thefilms change with increasing annealing temperature (Ta), the photoluminescence (PL) characteristics are closely dependent on the contents of Ge and its oxides in SiO₂ matrix. The dependence observed strongly suggests that the PL peak at 394 nm is related to the existenceof GeO and 580 nm to that of Ge nanocrystal (nc-Ge) in the films. © 2002 Elsevier Science Ltd. All rights reserved.