共查询到19条相似文献,搜索用时 171 毫秒
1.
2.
金刚石化学镀铜工艺研究 总被引:6,自引:0,他引:6
介绍了金刚石化学镀铜工艺流程、工艺配方。研究了不同络合剂体系对镀液稳定性以及不同预处理方法对化学镀铜层表面形貌的影响。探讨了硫酸铜质量浓度、络合剂物质的量之比和不同pH下甲醛质量浓度对金刚石表面沉积铜速率的影响。结果表明:使用胶体钯敏化活化能显著提高金刚石表面镀铜质量,多元络合剂的加入可以增加镀液的稳定性。获得了化学镀铜最佳工艺条件:CuSO4·5H2O15g/L,甲醛(w(HCHO)=36%)15g/L,酒石酸钾钠14g/L,EDTA14.6g/L,NaOH适量,二联吡啶0.02g/L,亚铁氰化钾0.01g/L,温度(43±0.5)°C,pH=12.5。采用此工艺在金刚石颗粒表面获得了良好的镀铜层。 相似文献
3.
采用AgNO_3取代传统的活化剂PdCl_2,改进PET及PVC基材表面化学镀铜预处理过程,开展了PET和PVC基材表面化学镀铜的比较研究。重点考察了化学镀铜温度和pH等操作工艺条件以及化学镀铜液中主盐和还原剂含量对镀铜效果的影响。结果表明:PET和PVC的镀铜增重率均随温度升高先增大而后减小,PET和PVC的最佳镀铜温度分别为70℃和75℃,二者镀铜的最佳pH值分别为12和11;PET和PVC镀铜时化学镀铜液中硫酸铜的最佳质量浓度均为15 g/L;PET镀液中甲醛的最佳用量为15 ml/L,PVC镀液中甲醛的最佳用量为20 ml/L。采用SEM测试对比考察了PET和PVC镀铜层表面和切面的形态形貌,结果表明,在相同化学镀条件下,PET基材表面的化学镀铜效果明显优于PVC。 相似文献
4.
5.
6.
7.
8.
9.
以KBH4为还原剂、CuSO4为氧化剂,对金刚石颗粒进行化学镀铜。研究了pH、亚铁氰化钾含量、甲醇以及镀覆时间对镀液稳定性和化学镀铜沉积速率的影响。利用X射线衍射仪、场发射扫描电镜、能谱仪表征了镀铜金刚石颗粒的成分、表面形貌和晶粒大小。结果表明,采用硼氢化钾体系能够在金刚石颗粒表面镀覆晶粒细小(约35 nm)且较薄(约210 nm)的铜层。pH对镀液稳定性的影响较大:随着pH的升高,镀液稳定性显著增强;但pH过高会降低沉积速率,且不利于镀层增厚。亚铁氰化钾具有整平铜层和细化晶粒的作用,而甲醇能抑制副反应,提高沉积速率,两者联用能够保证镀液稳定性和镀层表面质量。 相似文献
10.
11.
研究了化学镀铜溶液中稳定剂对铜沉积速率的影响,着重考虑主配位剂、副反应的抑制剂、甲醛捕获剂对化学镀铜的影响。结果表明,在基本配方8 g/L CuSO4.5H2O,3 g/L HCHO2,8 g/L EDTA7,.5 g/L NaOH,工艺参数pH=12.5,温度50℃,时间40 min的基础上,各种稳定剂的适宜用量为6 mL/L CH3OH、8 mg/L K4Fe(CN)6、6 mg/L 22,’-bipy。在最佳工艺下得到的镀层外观红亮,表面平整,晶粒细致,化学镀铜液稳定。 相似文献
12.
研究了以乙醛酸为还原剂的化学镀铜工艺、镀层结构和形貌。其镀液组成和操作条件为:28.0 g/L CuSO4.5H2O,44.0 g/L EDTA-2Na,10.0 mg/Lα,α’-联吡啶,10.0 mg/L亚铁氰化钾,9.2 g/L乙醛酸,pH为11.5~12.5,θ为40~50℃。实验结果表明,化学镀铜溶液较稳定;镀液温度和硫酸铜质量浓度提高,铜沉积速率增大;较高的镀液温度下,化学镀铜反应的活化能较低,镀液稳定性下降;镀液pH在11.5~12.5可获得较好的铜镀层;随乙醛酸和络合剂质量浓度提高,铜沉积速率变化不大,但过量的乙醛酸导致镀液的稳定性降低;铜镀层为面心立方混晶结构,呈光亮的粉红色块状形貌,有较高的韧性。 相似文献
13.
Poly-vinylpyrrodione (PVP) protected Cu/Pd nanoparticles synthesized with citric complexing agent were developed as activator for electroless copper deposition in printed-circuit boards (PCBs) industry. Cu/Pd nanoparticles in different molar ratio were employed in electroless copper deposition and found that the catalytic activity was influenced not only by the amount of Pd content or particle size but also by the surface protected PVP layer. From the time-resolved electroless copper deposition, we suggested that the catalytic efficiency should be evaluated by both initial activity and the structure of deposited copper film. As a result, the Cu/Pd nanoparticles of molar ratio = 1/2 was found to have best catalytic activity which was comparable to traditional Pd/Sn or pure Pd activator. In regard to the most concerned stability issue of Cu-content system, a surprising slow galvanic corrosion of Cu was found when Cu/Pd nanoparticles were exposed to the open air. Besides, slightly oxidation of Pd was found after air-exposure. Surprisingly, these Cu/Pd colloids maintain part of activity and well suspension even after 6-month exposure, suggesting well long-term stability as activator. In short, Cu/Pd nanoparticles synthesized with citric complexing agent with high catalytic activity and long-term stability was a promising activator for electroless copper deposition. 相似文献
14.
15.
R. Touir H. Larhzil M. EbnTouhami M. Cherkaoui E. Chassaing 《Journal of Applied Electrochemistry》2006,36(1):69-75
A new bath formulation was developed, which allowed deposition of copper-rich Cu–Ni–P alloys in electroless acidic solutions
in the absence of formaldehyde. The reducing agent was sodium hypophosphite. Though cupric ions do not catalyse the oxidation
of hypophosphite, we show that, in the presence of a low concentration of Ni(II) species, it is possible, even at low pHs,
to induce the reduction of the cupric species. A very strong preferential deposition of copper was observed, which gives Cu–Ni–P
layers with copper content up to 97 wt%. The phosphorus content decreased from 13% to 1% with increasing copper content. The
plating rate decreased when the copper sulfate concentration in the solution increased. It increased with increasing pH or
temperature, but the influence was less pronounced than in alkaline solutions. Compact layers were obtained with a nodular
morphology which did not markedly changed with composition. 相似文献
16.
17.
影响化学镀铜液稳定性和镀速的因素 总被引:5,自引:0,他引:5
研究了影响化学铜镀速和镀液稳定性的诸因素,并根据实验确定了适宜的化学镀铜液配方及其工艺。硫铜,甲醛,氢氧化钠含量的增加均会提高化学镀铜的镀速,降低镀液稳定性; 相似文献
18.
M. Ramasubramanian B. N. Popov R. E. White K. S. Chen 《Journal of Applied Electrochemistry》1998,28(7):737-743
Solution equilibrium characteristics of two electroless copper baths containing EDTA and tartrate as the complexing agents were studied as functions of pH. Equilibrium diagrams were constructed for both Cu-tartrate and Cu-EDTA systems. It was determined that copper is chiefly complexed as Cu2L2 in acidic conditions and as Cu(OH)2L2–4 in alkaline conditions in the tartrate bath, and as CuA–2 in the EDTA bath, where L and A are the complexing tartrate and EDTA ligands, respectively. Electroless copper deposition rates were studied from a tartrate bath on thermally activated palladium-catalysed polyimide substrates as functions of copper and formaldehyde concentrations, and pH. 相似文献
19.
施镀工艺参数对化学镀沉积速率的影响 总被引:6,自引:0,他引:6
各种工艺参数对化学镀沉积速度影响的研究是化学镀中的关键问题之一,文献尚无系统的研究,本文全面总结研究了金属盐浓度,还原剂浓度,络合剂浓度,PH值,施镀温度与时间对化学镀沉积速度的影响和原因。 相似文献