空心玻璃微珠偶联化学镀银的研究

使用氨丙基三乙氧基硅烷偶联剂改性空心玻璃微珠表面,然后直接实施化学镀银,借助红外光谱、扫描电镜和X-射线衍射测试手段对偶联改性效果、镀层表面形貌和结构进行了表征.测试结果表明,与胶体钯活化法和硝酸银活化法化学镀银相比,空心玻璃微珠偶联表面改性直接化学镀银的镀层更为致密、均匀,银利用率高,导电性好,结合力强.     

碳纤维无钯化学镀银工艺研究

为了替代传统的含钯敏化活化工艺，实现碳纤维表面无钯化学镀银，选择安全环保的多巴胺溶液来活化碳纤维。利用多巴胺溶液独特的自氧化聚合功能，首先采用浸泡法在碳纤维表面形成聚多巴胺活化层，然后以硝酸银为主盐，葡萄糖为还原剂，直接在碳纤维表面化学镀银。文中研究了硝酸银质量浓度、葡萄糖质量浓度、装载量对银的利用率和导电性的影响，并采用SEM和EDS对镀层表面形貌和成分进行分析。结果表明：多巴胺溶液活化碳纤维后，可以直接在碳纤维表面化学镀银。在固定反应温度50℃,反应时间1 h条件下，硝酸银质量浓度为15 g/L,葡萄糖质量浓度为30 g/L,装载量为4 g/L时溶液中银利用率最高，利用率可高达71.5%。所制备的镀银碳纤维的体积电阻率为0.74 mΩ·cm,银镀层致密均匀、无脱落现象。     

活化工艺对铝合金化学镀镍的影响

通过开路电位测量分析了浸锌、钯活化、银活化和增强银活化对铝合金化学镀镍引发过程造成的差异.采用扫描电镜、能谱仪和结合力测试比较了上述4种活化方式对化学镀镍层表面形貌、元素组分和结合力的影响.结果表明,浸锌、钯活化、银活化和增强银活化引发铝合金化学镀镍的诱导时间分别约为50、5、10和2 s,钯活化和银活化的引发效率比浸锌高,所有活化方法下制得的镍镀层都有良好的结合力.采用增强银活化时镍镀层的表面形貌最佳.     

一种ABS塑料非钯活化化学镀镍工艺研究

研究开发了一种在ABS塑料表面进行非钯活化的化学镀镍工艺,并对活化工艺条件进行了探究,得到最佳工艺条件。并通过结合力测定,显微微观形貌对镀层的结合力和形貌进行了表征。实验结果表明,采用最佳活化工艺活化后,ABS塑料能够进行施镀,且镀层完整,镍镀层呈现银白色,表面没有明显的缺陷,镀层与基底结合力良好,具有化学镀镍典型的花椰菜微观结构特征。说明该活化方式能够在一定范围内替代钯活化,降低成本。     

我国电子电镀技术现状及发展动态(续)

四、镀银和银层防变色处理。介绍了银-氧化镧复合电镀工艺代替镀银;另外还介绍了一种新的防银变色工艺,据称在H_2S 100 PPM和SO_2 700 PPM中72小时不变色,室内暴露3个月亦不变色。五、可焊性镀层。介绍了酸性光亮镀锡、酸性光亮镀锡铈合金,酸性光亮镀锡锑合金、光亮镀锡铅合金等4种工艺。六、化学镀。介绍了化学镀镍,包括镍磷合金和镍硼合金以及含SiC的复合镀层;化学镀铜和非金属材料化学镀的活化新工艺,包括酸性胶体钯和盐基型胶体钯以及代银活化剂。     

SiC_p/Al复合材料化学镀镍-磷的工艺研究

采用钯盐对SiCp/Al复合材料表面进行活化,化学镀后在复合材料表面获得Ni-P镀层。利用扫描电镜(SEM)、能谱成分分析仪(EDS)、极化曲线、X射线衍射仪(XRD)以及热震测试等手段对镀层的性能进行了研究,并观察了镀覆过程中镀层表面形貌的变化。结果表明:钯盐的活化作用较好,钯原子优先在复合材料的基体晶界、SiCp/Al界面及SiCp表面粗糙处形成催化活化中心;铝合金基体与SiCp增强相表面均被镀覆,且镀层光亮、致密、连续,耐蚀性好,结合力高,属于中磷镀层。     

ABS塑料化学镀镍无钯活化工艺

以NaBH4为还原剂,KH.550为偶联剂,在ABS塑料表面沉积纳米镍金属微粒,并以其为活化中心进行化学镀镍.研究了偶联剂、NaBH.和NaOH含量对镀层覆盖率的影响.结果表明:以镍取代钯活化的方法可行.无钯活化工艺的最佳条件为:偶联剂KH.550,NaBH4 15g/L,NaOH 15 g/L.所得镀层致密,平整光亮...     

活化工艺对化学镀镍的影响

研究了一种以塑料为基材进行导电化处理的高稳定性离子钯活化工艺,并将其与胶体钯活化工艺进行比较。结果表明:与胶体钯活化工艺相比,离子钯活化工艺能有效提高化学镀镍层的形貌质量、硬度及光泽度。     

光纤表面金属化工艺的研究

提出了光通讯领域中镀金光纤的化学镀制备工艺,通过前处理及钯银活化、化学镀镍,再电镀金,获得了表面光滑、高锡焊接性能以及高附着力的镀金光纤,满足光通讯的要求.研究探讨了前处理以及活化工艺对镀金光纤性能的影响.     

玻璃微球表面化学镀银

研究了玻璃微球表面镀银过程中还原剂对镀层结合紧密程度、产品导电性的影响,并对银镀层的性能进行了测试。结果表明,用葡萄糖和酒石酸钾钠混合作还原剂改进了镀层的均匀度和结合强度。镀银玻璃微球有望用作高导电性聚合材料的导电填料。     

玻璃表面无钯活化化学镀镍的研究

利用热还原方法制备活性镍,取代了玻璃表面化学镀镍用钯活化的方法;探索了活化液的组成和制取活性镍的工艺条件,同时获得了在玻璃表面进行化学镀镍的镀液配方;通过ＳＥＭ对镀层的形貌和组成进行了观测。实验结果表明：所得镀液稳定、镀速好,镀制的镍层均匀、光亮;这说明玻璃表面用镍活化以取代用钯活化是一种可行的方法。     

日本表面处理技术近期动向第一部分贵金属电镀

分别介绍了日本的镀金种类和用途,酸性金电镀和高速还原型化学镀金、化学镀硬质金的工艺配方,中性金电镀和置换型镀金的工艺特点,pH对酸性金合金电镀的影响以及影响化学镀硬质金镀层硬度的因素。对无氰光亮镀银和无氰冲击镀银、化学镀钯、酸性白金电镀和碱性白金电镀的工艺配方以及化学镀白金的工艺特点也进行了相应地介绍。     

On the Use of Silver Plated Nano Aluminum Nitride and Silver Plated Chopped Carbon Fiber to Prepare Electrically Conductive Adhesives with High Thermal Conductivity

To satisfy the high electrical and thermal conductivity required for the development of microelectronic products, silver plated aluminum nitride (Ag/AlN) and silver plated chopped carbon fiber (Ag/CF) were added into an acrylate resin to prepare electrically conductive adhesives (ECAs) with high thermal conductivity. The Ag/AlN was prepared by subjecting AlN to an electroless silver plating using a Pb-free activation method. The Ag/AlN has good electrical and thermal conductivity compared to the AlN without treatment. When the weight fraction of Ag/AlN is 45 ωt%, the electrical conductivity of ECAs based on acrylate resin filled with Ag/AlN is 1.5 S/cm, and the thermal conductivity reaches 2.1 W/(m · K). With the addition of 3 ωt% Ag/CF as supplement filler, the electrical conductivity has a sharp increase to 17.8 S/cm because of the formation of conductive networks in the ECAs. However, the shear strength has an apparent loss, falling from 4.2 to 1.1 MPa.     

碳纤维布化学镀铜工艺的研究

采用以甲醛为还原剂的化学镀铜液,用硝酸银作活化剂,在碳纤维布表面沉积出连续、均匀、有光泽的化学镀铜层。研究了不同前处理工艺对碳纤维布化学镀铜的影响。采用扫描电子显微镜表征了化学镀铜层的表面形貌,并用数字电压表测试了碳纤维布化学镀铜前后的导电性。     

水合肼和次磷酸钠为还原剂的化学镀Ni-P合金研究

铜上化学镀Ni-P合金通常需要用钯催化剂或其它无钯催化剂催化后才能施镀,研究了利用水合肼为引发剂,以水合肼和次磷酸钠为还原剂的化学镀Ni-P合金液,在铜箔上直接施镀,铜箔无须镀前催化。利用扫描电镜和X-射线衍射仪研究了镀层的表面形貌,利用能谱仪测定了镀层中P含量,同时研究了水合肼和次磷酸钠的浓度对镀速和P含量的影响,探讨了无催化铜箔化学镀Ni-P合金的反应机理。     

镁合金化学镀的研究进展

综述了镁合金化学镀的预处理工艺的研究现状;介绍了镁合金化学镀镍及镍基合金、复合镀层以及化学镀铜和银等方面的研究进展,并指出了镁合金化学镀的发展趋势。     

Electroless copper plating on acrylonitrile butadiene styrene material surfaces without chromic acid etching and a palladium catalyst

Hydrolysis modification of nitrile groups on acrylonitrile butadiene styrene (ABS) plate surfaces into carboxylic acid groups was investigated to find a new recipe for electroless copper plating of ABS plate surfaces without etching reactions using chromic acid and also without a palladium catalyst. Hydrolysis modification of nitrile groups was successfully conducted in an aqueous sodium hydroxide (NaOH) solution (70 wt %) at 80°C for more than 72 h, and nitrile groups were modified into carboxylic acid groups. The hydrolysis modification was accelerated by the addition of dioxane as a supplement to the aqueous NaOH solution. The modification, when an aqueous mixture solution of NaOH (35 wt %) and dioxane (10 wt %) was used as a reagent, was accomplished at 65°C in 30 min. The hydrolyzed ABS plate surfaces were successfully metalized by electroless copper plating. A silver catalyst, instead of a palladium catalyst, was usable in the electroless copper‐plating process. Adhesion between the deposited copper metal and ABS plate surface was perfect for the Scotch tape test. Consequently, we propose a new recipe for an electroless copper‐plating process without an etching process using chromic acid and without a palladium catalyst. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Gold wire bondability of electroless gold plating using disulfiteaurate complex

Generally, contact or terminal areas are coated with nickel as a barrier layer; subsequently, gold plating is performed to maintain reliability of electrical interconnection. Treatment using dilute solutions of palladium ions have been applied to initiate electroless nickel plating on copper substrates because copper has no catalytic action for the oxidation of hypophosphite. However, trace amounts of palladium ions may remain on the unwanted areas and extraneous nickel deposits are often observed. We confirmed that nickel films without extraneous deposits can be formed using the activation solutions containing dimethyl amine borane (DMAB). Bondability on the electrolessly deposited gold was greatly influenced by the phosphorus contents of the deposited nickel films as the underlayer. Bonding strength after electroless gold plating was increased with increasing phosphorus contents in the nickel films. Stabilizers in the electroless gold plating also influenced the bonding strength. Baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. Gold deposits having strong orientation with Au(220) and Au(311) indicated high bond strength.     

A new electroless Ni plating procedure of iodine-treated aramid fiber

A new, durable, etchant- and tin-free catalyzation process was studied for electroless nickel metallization of aramid fiber via iodine pretreatment. Firstly, iodine components were selectively doped onto the inner part of the fiber using vapor iodine exposure followed by treatment with a tin-free acidic palladium chloride solution to form palladium iodide (PdI₂) on the fiber surface. After subsequent reduction of PdI₂ into metal palladium (Pd), electroless plating was carried out. A uniform Ni plating layer was formed on the fiber surface, which exhibited high durability against resistance tests of ultrasonic exposure, tape peel-off, and corrosion in NaCl solution. Here, Pd particles that formed at the inner part near the fiber surface functioned as an anchor of the plated layer as well as a catalyst of electroless plating. Investigation of the plate bath composition shows that the use of anionic surfactant enhances the adhesion of the plated layer with fiber matrix, while a reducing agent in the plate bath reduces the smoothness of the plated surface. Also, the plate bath pH and the temperature of the plating solution control the layer deposition rate noticeably more than does the plating time. The proposed method retained good tensile strength in the plated fiber. Ni-plated aramid fiber exhibited durable electrical conductivity and magnetic properties.