热冲击下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头组织与性能

借助于SEM、EDS、XRD等检测手段对Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头进行观察分析,研究了钎焊工艺参数及热冲击条件对Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头界面金属间化合物和力学性能的影响。结果表明:添加0.05%(质量分数)Ni能细化Sn2.5Ag0.7Cu0.1RE钎料合金的初生β-Sn相和共晶组织;钎焊温度270℃和钎焊时间240 s时,钎焊接头抗剪切强度最大达26.9 MPa,较未添加Ni的钎焊接头提高8.9%;随着热冲击周期的增加,钎焊接头界面金属间化合物层平均厚度增加,界面粗糙度先增大后减小,钎焊接头强度降低;添加0.05%Ni能够抑制接头界面金属间化合物的成长、钎焊接头强度的降低,有利于改善接头可靠性。     

93.3Sn3.1Ag0.5Cu3.1Bi钎料熔体结构转变及其对凝固的影响

本文采用直流四电极法研究了93.3Sn3.1Ag0.5Cu3.1Bi无铅钎料合金熔体在连续两轮的升降温过程中电阻率随温度的变化关系,探讨了温度诱导的液-液结构转变;以此为基础进一步研究了该合金在结构转变前后的凝固。结果表明,93.3Sn3.1Ag0.5Cu3.1Bi合金中存在液-液结构转变,并且该结构转变在第一轮升温后的转变过程是可逆的。结合实验结果及分析可知,在首轮升温过程中,结构转变包括不可逆的和可逆的两种不同类型的结构转变。     

Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient

A novel solid-liquid interdiffusion(SLID) bonding method with the assistance of temperature gradient(TG) was carried out to bonding Cu and Ni substrates with Sn as interlayer.The element distribution and grain morphology of interfacial intermetallic compound(IMC) in Cu/Sn/Ni micro-joints during both SLID and TG-SLID bonding and in the final Cu/(Cu,Ni)₆ Sn₅/Ni full IMC micro-joints were analyzed.Under the effect of Cu-Ni cross-interaction,interfacial(Cu,Ni)₆ Sn