亚快速凝固方法制备Te-In合金的组织与成分

采用亚快速凝固的方法制备75Te-25In(质量分数,%)合金,利用光学显微镜(OM)、X射线衍射仪(XRD)、扫描电子显微镜(SEM)以及能谱仪(EDS)等方法,考察Te-In合金的微观组织、相组成及其化学成分。结果表明,Te-In合金的微观组织均匀,平均晶粒尺寸约为5μm;合金由初晶相和共晶组织组成,其中初晶相为非平衡态的In2Te5相,共晶组织则由固溶有In的非平衡态Te相和非平衡态的In2Te5相共同组成,合金中未发现纯Te相和平衡态的In2Te5相的存在;非平衡态的Te相中Te的质量分数为84.2%,In的质量分数为15.8%。     

半固态组织对Sn-52Bi合金塑性与熔化潜热的影响

在150℃下对半固态亚共晶Sn-52Bi浆料分别进行5,10和15 min的机械搅拌,采用真空吸铸水冷制备出半固态Sn-Bi合金,测试了半固态Sn-Bi合金的组织、力学与热性能,研究剪切力对半固态浆料组织演变的影响,探索半固态合金延伸率与熔化潜热的关系。结果表明:对Sn-52Bi半固态浆料进行机械搅拌,剪切力可抑制树枝状初生Sn相的形成,真空吸铸水冷得到的合金组织由非树枝状的初生Sn相和共晶体构成;随着搅拌时间的延长,短锤状初生Sn相转变为直径约20μm的近球状,搅拌时间延长至15 min时球状初生Sn相直径变小但出现团聚。当搅拌速度为320 r/min,机械搅拌时间为10 min工艺得到半固态Sn-Bi合金延伸率为46.75%,与180℃下的合金熔液直接水冷凝固相比提高了160%;差式扫描量热分析(DSC)得出:不同机械搅拌时间半固态Sn-52Bi合金的峰值温度为140℃,随着合金延伸率升高,合金的熔化潜热减小。     

温度和加载率对Sn-58 Bi合金力学性能影响试验研究

通过不同温度和加载率下拉伸试验,获得了Sn-58％(质量分数)Bi共晶合金的弹性模量、拉伸强度、断裂应变等主要力学参数;结合断口微观组织的观测,对Sn-58％Bi共晶合金拉伸变形特性进行了研究.分析了加载率和温度对Sn-Bi合金变形行为的影响.试验结果分析表明,合金延展性随温度升高而增大,随加载率增大而显著减小.断口微...     

SCN-Cam共晶合金的定向凝固研究

采用实时观测装置和定向凝固系统研究了SCN-Cam(Succinonitrile-wt%Camphor,wt%为质量分数)模型合金的凝固过程.实验结果表明,SCN-23.6%Cam共晶合金在常规条件下形成规则的共晶组织,共晶间距随界面推移速度的增大而减小;加入超声振动时,共晶合金生长出初生相;SCN-21%Cam亚共晶...     

SnAgCu-xBi/Cu焊点界面反应及微观组织演化

本工作在Sn-3.0Ag-0.5Cu焊料中添加不同含量的Bi(0.1%,0.5%,1.0%(质量分数)),以此来研究Bi含量对Sn-3.0Ag-0.5Cu/Cu焊点的界面反应及金属间化合物微观组织演化的影响。结果发现:回流反应之后,焊点界面形成扇贝状的Cu_6Sn_5,对焊点进行时效处理后发现,在Cu_6Sn_5层与Cu基板之间又出现了一层Cu_3Sn,并且Cu_6Sn_5层的上表面及焊料中出现了颗粒状的Ag_3Sn,Ag_3Sn颗粒的数量随着时效时间的延长而增多;5d的时效处理之后,在Cu基板的上表面和Cu_3Sn层中发现了柯肯达尔孔洞,同时在大多数焊点界面的Cu_6Sn_5层的上表面和Cu_6Sn_5层中出现了裂纹,推测裂纹是由于热膨胀系数差导致的残余应力而形成的。时效过程中,焊点界面金属间化合物(IMC)层的厚度不断增加,并且IMC的平均厚度与时效时间的平方根呈线性关系。对比未添加Bi元素的Sn-3.0Ag-0.5Cu/Cu焊点发现,添加微量的Bi元素对IMC层生长有抑制作用,当Bi含量为1.0%时,抑制作用最为明显,而Bi含量为0.5%时,抑制作用最弱。Cu_6Sn_5晶粒的平均直径随着时效时间的延长而增加,且Cu_6Sn_5晶粒的平均直径与时效时间的立方根呈线性关系。     

添加Bi和P对Sn-0.7Cu无铅钎料合金性能的影响

研究了添加Bi和P对Sn-0.7Cu无铅钎料合金熔点、显微组织、在Cu上的润湿性、导电率、硬度以及蠕变抗力等性能的影响。实验结果显示,随Bi含量增加,Sn-0.7Cu合金的熔点、导电率略有降低,润湿性、抗蠕变性能和维氏硬度均提高;此外,在添加Bi的基础上加P元素,能进一步降低Sn-0.7Cu-Bi合金的熔点,提高合金的导电率和润湿能力,但合金硬度略有下降;Sn-0.7Cu-1Bi-0.05P钎料合金的抗蠕变性优于Sn-0.7Cu-1Bi,Sn-0.7Cu-3Bi-0.05P钎料合金的抗蠕变性则劣于Sn-0.7Cu-3Bi。金相显微组织观察表明,单独加Bi能细化Sn-0.7Cu合金中的Cu6Sn5金属间化合物相;P的加入使Sn-0.7Cu-1Bi合金中的β-Sn枝晶尺寸变小,且Cu6Sn5相呈规则网络状分布于枝晶间隙;而在Sn-0.7Cu-3Bi合金中加P则粗化了Cu6Sn5相,并使IMC呈无规则分布。     

电弧熔炼过程中LaFe10Si3合金的凝固组织和相形成研究

研究了电弧熔炼过程中LaFe_(10)Si_3合金的凝固行为。应用XRD和扫描电镜分析了合金组织相组成和结构。结果表明:温度梯度和成分偏析造成LaFe_(10)Si_3合金铸锭显微组织大致分成了5层,从样品四周到中部,析出1∶13相形貌依次为板条状、椭圆状、柱状、等轴晶状和羽毛状;La(Fe,Si)13合金铸锭中1∶13相析出方式应该有3种,直接析出形成等轴晶,1∶13相包裹α-Fe相形成包晶相析出,1∶13相与1∶1∶1相和1∶2∶2相共晶析出。     

CuAgAlFeNi高熵合金的微观组织和性能

利用真空电弧炉熔炼CuAgAlFeNi高熵合金。分析表明:合金由FCC+BCC相组成。合金中存在的严重的密度偏析,导致合金的铸态组织分为亚共晶层和固溶体层。亚共晶层由固溶少量Al的初晶Ag和(Cu-Ag)共晶组成。固溶体层则由Al、Fe、Ni和少量Cu形成的固溶体胞晶组成,在胞晶中还存在着与亚共晶层组织相同、成分相近的"共晶球"。固溶体的硬度为HK452.2,共晶层的熔点为805℃,硬度为HK160.4。     

激光区熔Al2O3/Er3Al5O12共晶自生复合陶瓷的组织与断裂韧性

采用激光区熔快速定向凝固技术制备出Al2O3/Er3Al5O12(EAG)共晶自生复合陶瓷,研究了不同激光扫描速率下材料的凝固组织特征及其演变规律,并对其力学性能和增韧机制进行了分析.结果表明:激光区熔Al2O3/EAG由连续的Al2O3和EAG两相组成,两相相互交错分布,形成均匀的三维网状结构;共晶间距细小,在0.2～2.1μm之间,并随着扫描速率的增加规律性地减小.在低的扫描速率下,微观组织呈现典型的层片状非规则共晶组织;当扫描速率增至800μm/s时,出现了胞状及EAG树枝晶.共晶陶瓷的硬度和断裂韧性分别为18.7GPa和2.45MPa.m1/2.微观组织高度细化以及裂纹扩展过程中沿两相界面偏转、分叉等机制提高了材料的韧性.     

激光双面区熔Al2O3/Y3Al5O12共晶自生复合陶瓷的制备与表征

采用激光区熔凝固技术制备大尺寸Al2O3/Y3Al5O12(YAG)共晶自生复合陶瓷,考察双面区熔条件下大尺寸氧化物共晶陶瓷的熔化及凝固成形规律,采用扫描电镜、能谱和X射线衍射对其凝固组织特征进行了表征和分析.研究结果表明:在优化的凝固工艺下,激光双面区熔增加了熔凝层的厚度,获得了熔凝层厚度8.2 mm,长度65.0 mm,致密度达98.5%±1%的Al2O3/YAG共晶陶瓷;共晶熔凝层厚度随激光扫描速率的减小而增加,随激光功率的增大而增大,并且致密度随着激光功率的增大呈现先增大后减小的趋势;双面区熔后的Al2O3/YAG共晶陶瓷微观组织由均一分布、相互交织的Al2O3和YAG共晶相组成,共晶层片间距较小(1.0~3.5μm),且与凝固速度满足Jackson-Hunt公式;共晶间距随扫描速率的增大逐渐减小;双面区熔界面处共晶组织生长具有连续性,界面结合良好;共晶陶瓷的Vickers硬度为(18.6±1.0)GPa.     

Characteristics on Bi-Pb Based Alloys Quenched from Melt

Three different bismuth-lead systems namely, Wood's alloy (Bi50Pb25Sn12.5Cd12.5), Newton's alloy (Bi50Pb31.2Sn18.8) and Rose's alloy (Bi50Pb28Sn22), with one used as fusible alloys were quenched from melt by melt spinning technique. Thermal analysis, structure and mechanical properties of all alloys have been studied and analyzed. From X-ray diffraction analysis, an intermetallic compound phase, designated Pb7Bi3 is detected. The formation of an intermetallic compound phase causes a pronounced increase in the electrical resistivity. The Wood's alloy containing-cadmium exhibits mechanical properties superior to both the Newton's and Rose's alloys. The presence of cadmium in Wood's alloy decreases its melting point. Wood's alloy has better properties, which make it useful in various applications such as in protection shields for radiotherapy, locking of mechanical devices and welding at low temperature.     

Characteristics Study on Bi-Pb Based Alloys Quenched from Melt

Three different bismuth-lead systems namely,Wood's alloy(Bi50Pb25Sn12.5Cd12.5),Newton's alloy(Bi50Pb31.2Sn18.8) and Rose's alloy(Bi50Pb28Sn22),with one used as fusible alloys were quenched from melt by melt spinning technique.Thermal analysis,structure and mechanical properties of all alloys have been studied and analyzed.From X-ray diffraction analysis,an intermetallic compound phase,designated Pb7Bi3 is detected.The formation of an intermetallic compound phase causes a pronounced increase in the electrica...     

Bi-Pb-Sn-Cd易熔合金的设计与性能研究

根据铋基合金的特点与合金相图,设计了不同成分的Bi Pb Sn Cd易熔合金;并利用差热分析仪、X射线衍射仪及力学检测设备等研究了成分对合金熔点、组织和抗拉强度的影响。结果表明,设计的易熔合金由Bi、Pb7Bi3、Sn和Cd等物相组成;合金的熔点均在72℃左右。随Cd、Bi元素含量的增加,液相线温度逐渐降低;Cd元素对合金熔程、抗拉强度的影响最大,Sn元素次之,Pb元素的影响最小。正交试验表明,Bi 30Pb 15Sn 9Cd合金的综合性能最佳。     

Low-cycle fatigue properties of eutectic solders at high temperatures

This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8T_m). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys.     

Sb,Bi 元素对 Sn-22 Sb 高温钎料合金组织的影响

目的研究Sb和Bi元素对Sn-22Sb钎料显微组织的影响。方法制备了(Sn-22Sb)-xBi和Sn-xSb钎料合金,并分别采用差热分析和X射线衍射仪,分析了材料的熔化特征和物相。结果结果表明:Sn-22Sb钎料合金主要由灰色的β-Sn和白色块状的Sb2Sn3构成;少量的Bi使得Sn-22Sb钎料合金中Sb2Sn3金属间化合物逐渐细化和均匀化,数量却急剧增加;大量添加Sb后,使得Sn-22Sb钎料合金几乎全部变为粗大的块状β-SnSb组织,钎料合金的开始熔化温度有所提高。结论通过添加其他合金元素,降低Sn-50Sb钎料液相线温度,使其有望应用于二次回流焊。     

Effects of 0.1 wt% Ni addition and rapid solidification process on Sn–9Zn solder

Effects of 0.1 wt% Ni addition and rapid solidification process on Sn–9Zn solder alloy were investigated. Characteristics of Sn–9Zn–0.1Ni alloy were analyzed compared with those of as-solidified Sn–9Zn alloy. Mechanical properties and interfacial microstructure of solder/Cu joints obtained using these solders were comparatively studied. By comparison with as-solidified Sn–9Zn alloy, the wettability of solder was obviously improved with 0.1 wt% Ni addition, and the melting behavior of the solder was promoted due to the rapid solidification process. The corrosion resistance of as-solidified and rapidly solidified Sn–9Zn–0.1Ni alloys was improved due to the formation of Ni–Zn intermetallic compound (IMC) and the refining of Zn-rich phases. Formation and growth of IMCs at the interface of Sn–9Zn–0.1Ni/Cu joints was significantly depressed. Rapid solidification process promoted the interfacial reaction during soldering and improved the bonding strength of joints.     

Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy

In the present study, different weight percentages of Sb nanoparticles (100–120 nm) ranging from 0 to 1.5 wt% were added to Sn–9Zn eutectic solder alloy to investigate the effect of third element addition on the microstructure, mechanical properties as well as thermal behavior of the newly developed composite solder alloys. The results indicate that the Sb nano-particle based intermetallic compounds (IMC) were found uniformly distributed, refined the microstructure and formed IMC particles in the eutectic solder alloy. After the addition of nano Sb particles in Sn–9Zn solder, fine α-Zn phase and ε-Sb₃Zn₄ IMC particles were clearly observed in the β-Sn matrix. The ε-Sb₃Zn₄ IMC particles were uniformly distributed in the β-Sn phase, which resulted in an increase in the tensile strength due to the second phase dispersion strengthening mechanism. However, in the doped Sn–9Zn/1.5Sb alloys, α-Zn phases were broken enormously, depleted and round shaped compared to the normal rod shaped α-Zn phase microstructure in plain Sn–9Zn solder. In comparison, the ε-Sb₃Zn₄ IMC particle in the doped Sn–9Zn/1.0Sb alloy were star shaped. The average tensile strength and micro-hardness of the Sb doped Sn–9Zn solder alloys were consistently higher than the plain un-doped Sn–9Zn solder. The tensile strength and the microhardness increased with increasing Sb nano-particle content, up to 1.0 wt% of Sb content, and then decreased beyond that threshold value. Consequently the percentage (%) elongation of the Sb nanoparticle doped Sn–9Zn solder decreased with increasing Sb nano-particle content, up to 1.0 wt% of Sb content, and then increased beyond that threshold value.     

Copper effects in mechanical,thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy

The Sn–3.5 wt%Ag alloy considered as a good alternative to Pb–Sn alloys. This study aims to investigate the effects of Cu or Sb additions by 3 or 5 wt% to melt-spun Sn–3.5%Ag alloy. Ternary melt-spun Sn–Ag–Cu and Sn–Ag–Sb alloys investigated using X-ray diffractions (XRD), Scanning electron microscope (SEM), Dynamic resonance technique (DRT), Instron machine, Vickers hardness tester and Differential scanning calorimetry (DSC). The results revealed that the microstructures of the β-Sn phase, Ag₃Sn and Cu₃Sn intermetallic compounds (IMCs) in the solder matrices were refined due to the effect of Cu additions and melt-spun process. Moreover, increasing Cu content promotes Ag₃Sn intermetallic compound (IMC) formation. Consequently, the addition of “3 wt%” of Cu reduced the creep rate ? from (3.79?×?10^?3) to (1.65?×?10^?3) and delayed the fracture point. The tensile results showed an improvement in Young’s modulus by 47% (30.3 GPa), ultimate tensile strength (UST) by 11.6% (23.9 MPa), and in toughness by 20.5% (952.32 J/m³) compared to the eutectic Sn–Ag alloy. Vickers hardness has improved by 3.3% (136.71 MPa) and thermal activation energy by 54% (90.40 KJ/mol) when compared with that of eutectic Sn–Ag alloy. Those improvements are related to the lack of lattice strain from 7.56?×?10^?4 without “3 wt%” of Cu to 5.26?×?10^?4 with “3 wt%” of Cu. Its melting temperature (T_m) increased by 3 °C due to Ag₃Sn IMC increased and Cu₃Sn formation, but the pasty rang (mushy zone) decreased by 4 °C with “3 wt%” of Cu. The small lattice strains resulted with “3 wt%” of Cu made the electrical resistivity of this alloy more stable at elevated temperatures. The mechanical, thermal and electrical improvements of Sn_93.5–Ag_3.5–Cu₃ alloy provide good physical performance for soldering process and electronic assembly.     

Al含量对Zn-xAl-4Sb合金平衡凝固组织的影响

利用SEM、EDS、XRD研究了不同Al含量的Zn-xAl-4Sb(x=0、0.5、1.0、2.0、4.0、6.0)合金在炉冷条件下(冷却速度0.04℃/s)的凝固组织,探讨了Al和Sb以Zn-Al-Sb三元中间合金加入锌液的可能性.结果表明:合金中的Al优先与Sb生成AlSb相;当Al含量小于1.0%时,随着Al含量的增加,合金中AlSb相的量增加,β-Sb3Zn4相逐渐减少;当Al含量为1.0%时,β-Sb3Zn4相消失,合金组织为Zn基体上分布AlSb相;当Al含量大于1.0%时,合金中出现Zn-Al共晶,且共晶的量随Al含量的增加而增多;用Zn-Al-Sb室温下等温截面的富锌角表示了Zn-xAl-4Sb体系的室温相组成.因Al和Sb形成高熔点AlSb相,很难在锌液中溶解,故Al和Sb不宜以Zn-Al-Sb三元中间合金的方式加入.     

Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow

Eutectic Sn–Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of micrometers in diameter. Electrodeposition is a reliable technique for the deposition of small volume of solder. This work focuses on the formation of eutectic Sn–Bi solder by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. The effects of layering sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a homogeneous microstructure is achieved after reflow. The microstructure of the reflowed samples is the same as that of a metallurgically processed Sn–Bi alloy. Near-eutectic alloy with the composition Sn–54.6 wt% Bi is obtained by the sequential electrodeposition method.