小型熔断器电压降测试时间的确定

介绍了GB 9364对小型熔断器的电压降测试的要求和影响电压降测试结果的六个因素。分析了测试时间对测试结果的影响,对不同电流的测试时间提出了建议。     

功率MOSFET器件稳态热阻测试原理及影响因素

热阻值是评判功率MOSFET器件热性能优劣的重要参数,因此热阻测试至关重要。通过对红外线扫描、液晶示温法、标准电学法3种热阻测试方法比较其优缺点,总结出标准电学法测试比较适合MOSFET热阻测试。在此基础上依据热阻测试系统Phase11,阐述功率MOSFET热阻测试原理,并着重通过实例对标准电学法测试热阻的影响因素测试电流Im、校准系数K、参考结温Tj以及测试夹具进行了具体分析,总结出减少热阻测试误差的方法,为热阻的精确测试以及器件测试标准的制定提供依据。     

汽车电子测试系统电骚扰脉冲的阐述及校准

该文阐述了汽车电子测试系统电骚扰脉冲和汽车电子测试系统（12V电气系统和24V电气系统）、各种动力测试系统的电骚扰,沿电源线及信号线电瞬态传导耦合脉冲的校准。     

一种逻辑电路自动上下电电测系统的设计

随着电子信息技术的发展,自动化设备替代人力已成为趋势,对自动化设备的可靠性要求越来越高。本文针对逻辑电路主要靠人力进行上下电测试、操作繁琐、效率低下的现状,研究了一种基于电子信息集成技术、嵌入式系统的且可实现自动循环上下电电测的测试系统,实现了上下电测试智能化。     

MCM基板电测试技术

对于复杂的ＭＣＭ多层互连基板，电测试是控制成本、确保质量的关键环节。本文简要介绍了探针电阻、电容、电子束、潜在路缺陷电测试主其测试技术的应用。     

VLSI的电迁移及其微测试技术

本文叙述了VLSI的性质,讨论了电迁移的微测试技术,包括噪声测试快速评估电迁移.标准晶片级电迁移加速试验,互连接触孔的电迁移检测以及应用标准测试结构控制金属膜的电迁移.     

红外光电成像系统MTF测试技术分析

本文对红外光电成像系统MTF测试技术进行了分析,阐述了MTF测试技术的概念和MTF倾斜目标靶测试原理,并对MTF测试受狭缝的影响进行了说明,还将红外光电成像系统MTF测试斜缝法与斜刀口进行了对比,最后总结了红外光电成像系统MTF测试技术的要点,旨在提高MTF测试技术促进红外光电系统成像的质量.     

基于TAM分组策略的SoC测试多目标优化设计

在片上系统芯片（System-on-Chip ,SoC）测试优化技术的研究中,测试时间和测试功耗是相互影响相互制约的两个因素。在基于测试访问机制（Test Access Mechanism ,TAM ）分组策略的基础上,以测试时间和测试功耗为目标建立了联合优化模型,运用多目标遗传算法对模型进行求解。以ITC’02标准电路中的p93791电路为实例进行验证,表明此方法能够在测试时间和测试功耗的优化上获得较理想的解,且能提高TAM通道的利用率。     

GIS局部放电带电测试原理研究及现场缺陷分析

气体绝缘组合电器的局部放电检测方法主要分为非电检测法和电检测法两大类。本文首先介绍了GIS局部放电检测方法,包括超声波检测方法、脉冲电流方法以及超高频法检测法,然后结合GIS局部放电带电测试实际案例,通过对盆式绝缘子的超高频测试图谱进行了分析,并且对测试现场缺陷进行了详细探究。     

Advantest：经典平台添加新模块,满足更高测试需求

成立于1954年的爱德万（Advantest）公司是一家领先的半导体自动化测试设备（ATE）制造商,提供在电子设备和系统的设计和生产过程中所需的测试测量设备。目前,公司的产品主要涵盖半导体和元件测试系统、机电一体化系统以及其他新业务（电子束光刻、SEM计量、云测试等）,专注于半导体测试、电子测试、太赫兹波测试、MEMS技术、纳米技术以及微机电技术领域。     

多芯片组件的检测方法

多芯片组件的测试分三类：基板、ＩＣ裸芯片和组件测试。各类测试都有若干种不同的测试方法，如多层基板的电学测试法，光学测试法；ＩＣ裸芯片的内建自测试法，界面扫描法；组件的全功能测试法，有限功能测试法等。本文对这些方法的优点与不足处，测试设备使用时应注意的事项，适用对象等作了详尽的介绍，还对各种类似方法的功能作了比较。     

Z900MCM综述

介绍了Z900 MCM设计和布局,可控塌陷芯片连接(C4)工艺在Z900 MCM组装中的应用。从设计上通过加入垂直电感器及去耦电容器减小其噪声。通过基板测试和功能测试,剔除有缺陷的基板和芯片。Z900 MCM采用先进的MCM—D技术和MCM返工及冷却技术。Z900 MCM平均无故障时间高达40年。     

MCM Test Strategy Synthesis from Chip Test and Board Test Approaches

Chip test practices such as functional test and Bist, and their relevance to MCM testing are summarized. Drawbacks of using these techniques, for some MCMs, are presented.Board test practices such as in-circuit test andboundary-scan, are summarized; the advantages of incorporating boardtest techniques for certain MCMs are given. Test strategies arecategorized and compared. Appropriate MCM test equipment isdiscussed. Examples of using chip, board, and hybrid test approachesare then given.     

The development of poled polyimide dielectric layers for simultaneous testing and light guiding applications in MCM-Ds

Noninvasive techniques for measuring electric field strengths in multichip module (MCM) substrates can be extremely important in determining ultimate module performance. Certain polymers such as polyimide exhibit an electro-optic response, after appropriate doping and poling, that permits direct measurement of the internal fields with a laser probe. We have built MCM circuit structures using electro-optic polyimides for the dielectric layer. We report thermal, electrical, optical, and electro-optic properties for these dielectric layers. The optical properties of doped and poled polyimides make them attractive for building optical waveguides. We report results for poled polyimide use in both multiple layer structures and optical waveguide formation, and recommend processing guidelines. Further development of doped and poled polyimides may permit optical and electrical interlayers on the same thin-film MCM-D structure.     

Fundamentals of MCM Testing and Design-for-Testability

Products motivated by performance-driven and/or density-driven goals often use Multi-Chip Module (MCM) technology, even though it still faces several challenging problems that need to be resolvedbefore it becomes a widely adopted technology. Among its mostchallenging problems is achieving acceptable MCM assembly yieldswhile meeting quality requirements. This problem can be significantlyreduced by adopting adequate MCM test strategies: to guarantee thequality of incoming bare (unpackaged) dies prior to module assembly;to ensure the structural integrity and performance of assembled modules; and to help isolate the defective parts and apply the repair process.This paper describes todays MCM test problems and presents thecorresponding test and design-for-testability (DFT) strategies usedfor bare dies, substrates, and assembled MCMs.     

MCM基板互连测试的单探针路径优化研究

针对MCM基板互连测试所采用的单探针技术,本文提出一种基于蚁群算法的单探针路径优化算法,通过设定合适的规则,引导探针的移动,缩短探针移动的距离,达到减少测试时间提高MCM生产效率的目的.从基于MCM标准电路的仿真结果看,采用蚁群算法得到的探针测试路径长度远远优于其它算法所得到的.     

Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die

The cost and quality of a multichip assembly is highly dependentupon the cost and quality of the incoming die. In the case of a baredie assembly, it is often highly desirable to use either Known Good Die(KGD) or die that have been burned-in and tested to the same level ofquality and reliability as their packaged die equivalents. However,performing full bare die burn-in and test may not always becost-effective. This paper examines the question of whether it isalways necessary to use KGD to produce a cost-effective multichipmodule (MCM) of acceptable quality. A process-flow based cost modelis used to compare the cost and quality of MCMs assembled with KGD toMCMs assembled with die that have received wafer-level test only. Inaddition to test effectiveness at the wafer, die, and module level,factors that are considered include die complexity (size and I/O), number of die per MCM, the cost of producing the KGD, andrework costs and effectiveness. The cost model captures inputs fromwafer fabrication through MCM assembly and rework. Monte Carlosimulation is used to account for uncertainty in the input data.The resulting sensitivity analyses give final MCM cost and quality asa function of the various factors for both KGD and die that havereceived wafer-level test only.     

Multichip Module Diagnosis by Product-Code Signatures

A system diagnosis technique for multichip module (MCM) ispresented. The proposed technique uses built-in probes for monitoringinternal responses and, with a signature analysis scheme based onerror correcting codes, identifies the probes where erroneous test responses have been detected. Conceptsfrom system diagnosis is used in conjunction withsignature analysis in developing the proposed MCM diagnosistechnique, where the resulting patterns of the faulty probes are usedin the identification of the faulty submodules (dies). The proposedtechnique offers a diagnostic capability in system functional test.     

一种新型MCM基板——阳极氧化多层基板

采用电化学方法,对基板上的Ａｌ膜进行选择性阳极氧化,从而制得导带、通孔和介质,重复上述工序,便可制得多层布线基板。与常用多层布线基板,如ＭＣＭ－Ｃ、ＭＣＭ－Ｄ比较,它具有制作工艺简单独特、互连密度高,线径、间距和孔径更小,平面性好,绝缘电阻高等优点。     

三维多芯片组件的散热分析

建立了一种叠层多芯片组件结构，应用计算流体动力学方法(CFD)，对金刚石基板的三维多芯片结构进行了散热分析，模拟了器件在强制空气冷却条件下的热传递过程和温度分布。此外，还探讨了各种设计参数和物性参数对3D-MCM器件温度场的影响。