共查询到18条相似文献,搜索用时 109 毫秒
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Cu镀Au腔体是微波器件常用封装载体之一。在目前应用中,Cu镀Au腔体微波器件的气密性封装一直是工程化技术难题,大幅影响了微波器件的可靠性和使用寿命。对基于Cu镀Au腔体的微波器件进行了气密性封装研究,探讨了Cu镀Au腔体实现气密性封装可能的工艺路线。通过比较激光封焊和真空钎焊等传统气密性封装工艺方法,提出了"小孔密封... 相似文献
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总结了微波器件金属陶瓷外壳的电性能设计理论和实践成果,给出了研制微波器件金属陶瓷外壳的基本流程及设计要素;详细介绍了用于微波器件外壳设计时电容、电感、特性阻抗、延迟等参数的计算公式;根据多年的实践经验,给出了几种行之有效的改善外壳电性能的结构和模式;最后就技改项目、研究装备、外壳所需的基础材料的研究开发和生产、高新技术产业化等问题提出了建议. 相似文献
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微电子器件的封装密度不断增长,导致其功率密度也相应提高,单位体积发热量也有所增加。为此,文章综述了封装外壳散热技术的基本原理、最新发展及其应用,并简要讨论了封装外壳散热技术的未来发展趋势及面临的挑战 相似文献
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微波高频外壳的设计与制造工艺研究 总被引:1,自引:0,他引:1
外壳对于电路而言,在起到机械支撑和环境保护作用的同时,需要将输入/输出信号和电源/地通过封装上的引线实现芯片与外部电子系统的互连。外壳设计与工艺往往影响着被封装系统的微波性能,例如50Ω阻抗的设计、外壳的谐振频率、微波传输线的状态等都是需要在外壳设计与工艺中加以重视的。同时,外壳的可靠性也直接影响到整个封装系统的可靠性,例如外壳的气密可靠性、抗盐雾能力、金属化的强度、引线的抗疲劳弯曲能力等指标决定了外壳的总体可靠性水平。文章以理论分析为基础,结合生产制造的实际情况,以微波高频外壳为例对其设计与制造中应该注意的问题进行了比较详细的阐述。 相似文献
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(上接第2002.11期54页)3实践微波器件外壳电性能设计目标,就是如何降低外壳的电容、电感和电阻,控制特性阻抗,以满足器件要求。但是这些参数往往是相互制约的,如电容和电感、电阻和电容,反馈电容和输入、输出电容等等。因此需要折衷考虑,最终对各参数进行优化。另一方面,由于我们多年来已经成功开发了上百种微波器件外壳,积累了相当多的经验和模式,借鉴这些经验和模式,应用于外壳设计中,无疑是一个捷径。以下是几种行之有效的改善外壳电性能的结构和模式。瓷件外形尺寸/mm13×11×2.37×输入输出电容/pF0.80.71工作频率/GHz3… 相似文献
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《Microelectronics Journal》2015,46(3):231-236
Devices that are compact in design and fabrication continue to draw attention for specific applications that require high performance. A compact elliptic bandpass filter using a cross-coupled topological structure with a hairpin resonator optimised for radar applications is presented in this paper. This work presents the design theory and corresponding semiconductor fabrication processes and describes the chip-on-board packaging method in detail. The proposed design of the bandpass filter can not only reduce the size of the device and result in good RF performance, but the accurate semiconductor fabrication process can also ensure high performance further. In addition, the presented chip-on-board packaging method can greatly enhance the reliability and long-term stability of a microwave device, which rarely introduces RF characteristic interference. The simulated, bare-chip measured and final chip-on-board measured results agreed well, which validated the correctness of the proposed approach. 相似文献
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设计并研制成功了实用型5GHz带宽InGaAs/InP PIN光电探测器,介绍了限制探测器响应速度的主要因素,微波封装的理论依据,以及所研制器件频率响应的测试结果。 相似文献
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电子元器件封装技术发展趋势 总被引:1,自引:1,他引:0
晶圆级封装、多芯片封装、系统封装和三维叠层封装是近几年来迅速发展的新型封装方式,在推动更高性能、更低功耗、更低成本和更小形状因子的产品上,先进封装技术发挥着至关重要的作用。晶圆级芯片尺寸封装(WCSP)应用范围在不断扩展,无源器件、分立器件、RF和存储器的比例不断提高。随着芯片尺寸和引脚数目的增加,板级可靠性成为一大挑战。系统封装(SIP)已经开始集成MEMS器件、逻辑电路和特定应用电路。使用TSV的三维封装技术可以为MEMS器件与其他芯片的叠层提供解决方案。 相似文献
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低温共烧陶瓷基板及其封装应用 总被引:5,自引:1,他引:4
低温共烧陶瓷LTCC基板是实现小型化、高可靠微波多芯片组件MMCM的一种理想的封装技术一文章对LTCC技术的特点及应用做出了评述,主要介绍国内外LTCC的现状、发展趋势与问题,同时突出强调了LTCC的飞速发展及对微波器件的重要性。 相似文献
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气密封装工艺技术是混合电路制造的关键技术。在可靠性要求较高的场合,对混合电路产品提出了水汽含量、漏气率和粒子碰撞噪声检测(PIND)合格率的指标要求。封装内部的多余物对电子器件的可靠性带来严重影响。主要从盒体的表面镀层方面进行讨论,分析了不同的金属化结构和不同的镀层厚度对气密封装的影响。实验表明,当封装使用的压力较大时,化学镀镍外壳的镀层容易出现裂纹,造成外壳锈蚀。外壳使用化学镀镍、电镀金结构时,其PIND不合格率较高。当镀层厚度超标时,不仅PIND不合格率较高,也会出现漏气问题。 相似文献
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《Microwave Theory and Techniques》1965,13(6):777-781
As a result of both a larger number of microwave functions performed by semiconductor devices and a larger number of functions required in modern systems, it has become highly desirable from both the system and the device standpoint to fabricate multiple microwave semiconductor devices on a common substrate. The use of multiple devices in a single package has system and reliability advantages, but there is also offered the possibility of improved performance of the microwave components. This results from the elimination of packaging of each individual element and the ability to place the package interface in a more advantageous position in the circuit. To effect such an improvement, an efficient means of microwave interconnection must be available. The interconnections must have not only low dissipative losses through the microwave region, but be capable of providing the impedances necessary for transformations by the various microwave functions and for circuit resonating elements. The range of impedance commonly required is of the order of 20 /spl Omega/ to 80/spl Omega/. To be compatible with semiconductor materials and processing, the choice of dielectric material was limited to film dielectrics, possibly SiO/sub 2/, or the use of the semiconductor material itself as a dielectric. For both semi-insulating gallium arsenide and silicon of resistivity greater than 1000 /spl Omega/-cm, the loss is sufficiently low to perform efficient interconnection of devices on a common substrate and is considered even suitable for other components such as directional couplers and hybrids where extremely high Q is not required. 相似文献
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An understanding of the parasitic and packaging effects of passive surface-mounted devices (SMDs), including characterization of the pertinent interconnects, is required for developing robust equivalent-circuit models that are useful in RF and microwave computer-aided design. In this paper, we develop a procedure for modeling SMD inductors and capacitors, which incorporates the nonideal behavior associated with frequency dispersion, board layout, component parasitics, and device packaging. The equivalent-circuit parameters are extracted in closed-form from accurate in-situ measurement of the component's S-parameters, without the necessity for cumbersome optimization procedures normally followed in RF equivalent-circuit synthesis. 相似文献