锰钴镍氧浸没式探测器制备及性能

基于化学溶液法制备了尖晶石结构氧化物锰钴镍氧Mn1.56Co0.96Ni0.48O4(MCNO)薄膜材料,研究了其电学性质及红外器件的探测性能,包括器件的响应率,时间常数和探测率.制作了厚度为8μm的MCNO薄膜及红外热敏探测器件,测量了材料的阻值-温度曲线.制作了基于半球形锗透镜的浸没式MCNO薄膜探测器,具有时间常数较小(~18 ms),响应率高(~4.4×103V/W)和探测率高(~5×108cm·Hz0.5/W)的优点.     

具有绝热结构的高性能锰钴镍氧热敏探测器的制备及特性研究

通过湿法腐蚀工艺成功制备了具有绝热结构的锰钴镍氧(MCNO)热敏电阻探测器.测试表明,绝热结构使得热敏探测器的热导大幅降低,在真空环境下仅为没有绝热结构器件的1/20,典型热导率值为1.37 mW/K.通过V-I测试并结合理论曲线拟合发现,MCNO薄膜材料的热导率随温度增高而减小.绝热结构使得MCNO热敏探测器的响应率大幅提高,在30 Hz调制频率、36V偏置电压下,响应率典型值为50.5 V/W,是没有绝热结构器件的10倍.实验验证了在MCNO薄膜材料上制作绝热结构热敏探测器的可能性,为制作新型室温全波段高性能红外探测器奠定了基础.     

128×1元GaAs/AlGaAs多量子阱扫描型红外焦平面的红外成像

研制成功了128×1元GaAs/AlGaAs多量子阱扫描型红外焦平面(FPAs),器件的响应率达到RP=2.02×106V/W,截止波长为λc=8.6μm.根据常规的黑体探测率定义,得到器件的黑体探测率为Db*=2.37×109cm·Hz1/2/W,并最终获得了清晰的室温物体残留热像图.     

锰钴镍铜氧薄膜红外探测器制备与性能研究

报道了锰钴镍铜氧薄膜（Mn1.56Co0.96-xNi0.48CuxO4,MCNC,x=0,0.08,0.16,0.24）的红外探测器件的制备过程及器件性能。通过改变掺杂Cu的比例,制作了系列MCNC薄膜材料及红外探测器件。实验结果表明,对于一定厚度及尺寸的薄膜器件,铜的掺入能显著减小器件的阻值及器件噪声,弥补了负温度系数的减小的缺点。器件时间常数约为20~40ms。掺铜量为0.24的薄膜器件的探测率为0.83107cmHz1/2W-1,相比同样规格的锰钴镍器件提高了约130%。此外,对于MCNC薄膜器件的老化现象进行了初步探讨。     

64×64元GaAs／AlGaAs多量子阱长波红外焦平面研制

报道了64×64 元GaAs/AlGaAs 多量子阱凝视型红外焦平面的研制,器件的平均响应率为RP= 7.24×105V/W,器件的平均黑体探测率为Db = 5.40×108cm ·Hz1/2/W ,峰值波长为λP= 8.2μm ,不均匀性小于20% ,并应用研制成的器件获得了室温物体的热像图     

128×160元GaAs/AlGaAs多量子阱长波红外焦平面阵列

研制了128×160元GaAs/AlGaAs多量子阱红外焦平面阵列,它是目前国内报道的最大像元数的量子阱红外焦平面阵列.77K时,器件的平均黑体响应率Rv=2.81×107V/W,平均峰值探测率Dλ*=1.28×1010cm·W-1·Hz1/2,峰值波长λp=8.1μm,器件的盲元率为1.22%.     

高灵敏度室温锑化铟红外探测器研制

通过对室温工作的光导型锑化铟红外探测器的设计与工艺研究,在理论分析和工艺实验的基础上,优选制造灵敏元的材料,精心设计探测器的光学系统,改进制造工艺,实现对灵敏元精密腐蚀的有效控制等。研制成功的电压响应率达103V/W,黑体探测率达1010cm.Hz1/2.W-1左右,光谱响应范围2~8μm,响应时间≤2×10-8s的高性能、高稳定、高可靠器件。     

n-ZnO/p-GaN异质结紫外探测器及其光电性能研究

利用脉冲激光沉积(PLD)方法在p-GaN衬底上沉积了n-ZnO薄膜,构造了n-ZnO/p-GaN异质结型紫外(UV)光-电探测器原型器件,在(UV)光照条件下测试了器件的光电性能。扫描电镜(SEM)和X射线衍射(XRD)测试结果表明,ZnO薄膜具有很好的结晶质量;I-V曲线显示,器件在黑暗和光照环境下都表现出明显的整流行为;光谱响应曲线表明,器件响应度峰值出现在364nm附近,当反向电压为-5V时光电流达到饱和,此时响应度峰值达到1.19A/W。不同反向工作电压下的光谱探测率曲线表明,器件对364nm附近的UV光有较强的选择性,在-2V偏压下具有最佳的探测率,其探测率峰值达到8.9×1010 cm·Hz1/2/W。     

基于金属-半导体-金属结构的Bi2Te3室温高响应率太赫兹探测器

基于二维拓扑绝缘体Bi_2Te_3材料利用微纳工艺制备了金属-拓扑绝缘体-金属(MTM)结构的太赫兹光电探测器.器件在0. 022 THz的响应率可达2×10~3A/W,噪声等效功率(NEP)低于7. 5×10~(-15)W/Hz~(1/2),探测率D~*高于1.62×10~(11)cm·Hz~(1/2)/W;在0. 166 THz的响应率可达281. 6 A/W,NEP低于5. 18×10~(-14)W/Hz~(1/2),D~*高于2. 2×10~(10)cm·Hz~(1/2)/W;在0. 332 THz的响应率可达7. 74 A/W,NEP低于1. 75×10~(-12)W/Hz~(1/2),D~*高于6. 7×10~8cm·Hz~(1/2)/W;同时器件在太赫兹波段具有小的时间常数(7～8μs).该项工作突破了传统光子探测的带间跃迁,实现了可室温工作、高响应率、高速响应以及高灵敏度的太赫兹探测器件.     

一种用于探测太赫兹信号的测辐射热仪

基于Nb5N6薄膜在室温下具有高达-0.7％ K-1的电阻温度系数,用Nb5N6薄膜结合平面蝴蝶结天线制备了一种可在室温下进行100 GHz信号探测的测辐射热仪.该器件在偏置电流为0.4 mA的条件下,达到的最佳电压响应为-400 V/W,调制频率为200 Hz时等效噪声功率达到1.5 ×10-11 w/(√Hz),调制频率10 kHz以上时等效噪声功率优于9.5×10-12W/(√Hz).     

Monolithic Uncooled 8 × 8 Bolometer Arrays Based on Poly-SiGe Thermistor

This paper presents a monolithic uncooled 8 × 8 bolometer array with polycrystalline silicon-germanium (poly-SiGe) thermistors as active elements. The poly-SiGe films are deposited by ultrahigh vacuum vapor deposition (UHV/CVD) system and the dependence of the temperature coefficient of resistance (TCR) on annealing temperature has been investigated. To decrease the thermal conductance of the bolometer, the poly-SiGe thermistor was formed on a four leg suspended microbridge. The improved porous silicon micromachining techniques described here enable the integration of the bolometer array with the MOS readout circuitry. The measurements and calculations show that the mean responsivity is 1.07 × 10⁴ V/W with an uncorrected uniformity of 10.5% and a thermal response time of 10.5 ms, and the detectivity of 3.75 × 10⁸ cm Hz^1/2/W is achieved at a chopping frequency of 30 Hz and a bias voltage of 5 V.     

Fabricating Microbolometer Array on Unplanar Readout Integrated Circuit

In this paper, the integration of an experimental 32 × 32 uncooled IR microbolometer array with an unplanar CMOS Readout Integrated Circuit (ROIC) is presented. A vanadium oxide film fabricated by low temperature reactive ion beam sputtering is utilized as thermal-sensitive material in the bolometric detectors Before the integration, the unplanar ROIC for commercial use is first planarized by bisbenzocyclobutene film, then a electroless nickel-plating on ohmic contact areas is accomplished. Finally the bolometer array is fabricated using a micromachining process, which is completely compatible with CMOS technology. Measurements and calculations for the as-fabricated samples show that the responsivity of 1.4 × 10⁴ V/W and the detectivity of 2.1 × 10⁸cmHz^1/2W^?1 and a thermal response time of 10ms are obtained at a pulse bias of IV.     

多晶锗硅室温微测辐射热计线性阵列的研制

采用超高真空气相淀积系统 ( UHVCVD)制备了多晶锗硅薄膜 ( poly-Si0 .7Ge0 .3) ,研究了它的退火特性和电阻温度特性。将多晶锗硅薄膜电阻作为微测辐射热计的敏感元件 ,采用体硅微机械加工技术制作了 8× 1桥式微测辐射热计线性阵列 ,优化设计的微桥由两臂支撑 ,支撑臂的长和宽分别为 2 2 0 μm和 8μm,桥面面积为 80μm× 80μm。测试结果表明 ,在 773 K黑体源 8～ 1 4μm红外辐射下 ,调制频率为 3 0 Hz时 ,阵列中各单元的电压响应率为 6.2 3 k V/W～ 6.40 k V/W,探测率为 2 .2 4× 1 0 8cm Hz1 /2 W- 1～ 2 .3 3× 1 0 8cm Hz1 /2 W- 1 ,热响应时间为2 1 .2 ms～ 2 2 .1 ms,表明了器件具有较高的性能及较好的一致性。     

Micromachined Uncooled IR Bolometer Linear Array Using VO2 Thin Films

Mixed vanadium oxide thin films, as VO₂ for the main composition are materials for uncooled microbolometer due to their high temperature coefficient of resistance (TCR) at room temperature. This paper describes the design and fabrication of 8-element linear array IR uncooled microbolometers using the films and micromachining technology. The characteristics of the array is investigated in the spectral region of 8–12 μm. The fabricated detectors exhibit responsivity of up to 10 KV/W, typical detectivity of 1.89×10⁸ cmHz^1/2/W, and thermal time constant of 11 ms, at 296 K and at a frequency of 30 Hz. Furthermore, The uncorrected response uniformity of the linear array bolometers is less than 20%.     

A high-speed HEMT 1.5K gate array

A 1.5K-gate HEMT gate array has been developed, using a direct-coupled FET logic (DCFL) circuit. The chip, containing 1520 basic cells and 72 I/O cells, was 5.5 mm × 5.6 mm. The basic circuit was designed for two different threshold voltages for D-HEMT, in order to obtain high-speed performance both at room temperature and low temperature. Fully functional 8 × 8 bit parallel multipliers were fabricated on the gate-array chip. At room temperature a multiplication time of 3.7 ns including I/O buffer delay was achieved with power dissipation of 6.0 W at a supply voltage of 1.6 V, and at liquid-nitrogen temperature multiplication time was 3.1 ns where the supply voltage was 0.95 V and the power dissipation was 3.2 W.     

Seven matched bolometers for millimeter wave observations

We have fabricated a millimeter wave observation system using an array of bolometric detectors. The performance of the system depends largely on obtaining identical performance from each bolometer. We achieved a variance in the responsivity of less than 4% except for one of the seven elements. The bolometers had an electrical NEP of 1.3×10^?16 W/√Hz under radiation background loading of 30pW. We used an AC bridge readout circuit to significantly improve the stability of the array and showed that observations can be done without a mechanical beam switch. The bolometer array is now in use on the Nobeyama 45-m telescope for 150GHz observations.     

Stressed and unstressed Ge:Ga detector arrays for airborne astronomy

We have constructed and used two dimensional arrays of both unstressed and stressed Ge:Ga photoconductive detectors for far-infrared astronomy from the Kuiper Airborne Observatory (KAO). The 25 element (5×5) arrays are designed for a new cryogenically cooled spectrometer, the MPE/UCB Far-Infrared Imaging Fabry-Perot Interferometer (FIFI). All of the pixels for the stressed array performed well on the first flights with FIFI; 25% of the detectors in the array are more sensitive than our best single element detector, with background limited noise equivalent powers (NEPs)?3.0×10^?15 W Hz^?1/2 at 158 μm and 40 km s^?1 spectral resolution. The average array element performs within±15% of this value. With a bias field of 0.1 V/cm, the average detector response is 20±6 Amp/Watt at 158 μm. The cutoff wavelength and response also compare well with our single element detectors. The unstressed array delivers significantly better performance than our single element detector due to the lower thermal background in the new spectrometer. The average background limited NEp at 88 μm and 35 km s^?1 spectral resolution is ～7×10^?15 W Hz^?1/2. The least sensitive pixel is only 40% less sensitive. The unstressed array response at 88 μm with a bias field of 1 V/cm is 5±1 Amp/Watt. Twenty four of the 25 elements worked on the first flights-on subsequent flights all channels have worked. Some of the exciting new science possible with far-infrared detector arrays is also discussed.     

An ultra low noise readout integrated circuit for uncooled microbolometers

A low noise readout architecture for uncooled microbolometer focal plane arrays is described. The on-chip readout circuit contains an integration circuit in which the bolometer current is directed injected into a capacitor, and exhibits extremely low noise with no decrease in signal by using an ultra low noise capacitive transimpedance amplifier (CTIA). The simple configuration of the integration circuit makes it possible to operate more circuits in parallel, and increases the integration time and number of pixels. A 40 × 30 uncooled microbolometer focal plane array based on the low noise ROIC was implemented on silicon using a 0.5 μm CMOS technology. The total output noise voltage is 260 μV RMS. A noise at this level is so low that can loosen required TCR in the bolometer material. Experimental values of voltage responsivities of 3.98 × 10⁵ V/W on average at 1 Hz modulation frequency have been achieved.     

A batch-fabricated silicon thermopile infrared detector

A thermopile infrared detector fabricated using silicon integrated-circuit technology is described. The device uses a series-connected array of thermocouples whose hot junctions are supported an a thin silicon membrane formed using anisotropic etching and a diffused boron etch stop. The membrane size and thickness control the speed and responsivity of the structure, which can be designed for a given application. For a 2-mm × 2-mm × 1-µm silicon membrane containing sixty bismuth-antimony couples, the structure produces a responsivity of 6 V/W and a time constant of about 15 ms. The use of polysilicon-gold couples can improve the responsivity to nearly 10 V/W while maintaining the same speed, simplifying the process, and retaining compatibility with on-chip signal processing circuitry.     

Radiant-energy detection by−Ba−Cu−O thin films

High T_c superconducting films offer promise as fast sensitive detectors of microwave and infrared. A high T_c superconducting transition-edge bolometer was fabricated from Y?Ba?Cu?O thin film on a (100) SrTiO₃ substrate, and tested at about the T_c midpoint using a 500 K blackbody source. In this initial work only NEP=5×10^?8W/Hz^1/2 was achieved with a large time constant caused by rather thick substrate. The sensitive element was put in the vacuum chamber of a liquid nitrogen metal cryostat for three weeks and through ten cold-hot cycles (80 K-300 K), the sensitivity of the bolometor kept repeatable. Some future work is also discussed.