高剂量Ge离子注入直接形成nc-Ge的研究

报道了分别采用剂量为1×1016,1×1017,5×1017和1×1018cm-2的高剂量Ge离子注入,不需退火即可在SiO2中直接形成Ge纳米晶的新现象.采用掠入射X射线衍射和激光喇曼谱等实验手段对样品进行了物相分析.结果表明,高剂量Ge离子注入可在SiO2薄膜中直接形成Ge纳米晶(nc-Ge);非晶态Ge向晶态Ge发生相变的阈值剂量约为1×1017cm-2,离子注入直接形成的nc-Ge内部具有较大压应力,随着注入剂量的提高,nc-Ge的尺寸和含量均有提高.对纳米晶形成机理的研究认为,在Ge离子注入剂量达到阈值,此时膜中Ge非晶态团簇浓度达到饱和甚至过饱和,新入射的Ge离子把动能传递给膜中的非晶态Ge原子,使其部分析出并团聚形成能量最低且最稳定的Ge纳米晶态.     

高剂量离子注入直接形成Ge纳米晶的物理机理

研究了单束双能高剂量Ge离子注入、不经过退火在非晶态SiO2薄膜中直接形成镶嵌结构Ge纳米晶的物理机制.实验中利用不加磁分析器的离子注入机,采用Ge弧光放电离化自动形成的Ge+和Ge2+双电荷离子并存的单束双能离子注入方法,制备了1016～1018cm-2多种剂量Ge离子注入的Si基SiO2薄膜样品.用GIXRD表征了Ge纳米晶的存在,并仔细分析得到了纳米晶形成的阈值剂量.通过TEM分析了Ge纳米晶的深度分布和晶粒尺寸.用SRIM程序分别计算了双能离子在SiO2非晶层的射程和深度分布,与实验结合,得到纳米晶形成的物理机制,即纳米晶的形成与单束双能离子注入时Ge+和Ge2+相互碰撞产生的能量沉积在SiO2中形成的局域高温有关.     

高剂量离子注入直接形成Ge纳米晶的物理机理

研究了单束双能高剂量Ge离子注入、不经过退火在非晶态SiO2薄膜中直接形成镶嵌结构Ge纳米晶的物理机制．实验中利用不加磁分析器的离子注入机，采用Ge弧光放电离化自动形成的Ge+和Ge2+双电荷离子并存的单束双能离子注入方法，制备了1e16～1e18cm－2多种剂量Ge离子注入的Si基SiO2薄膜样品．用GIXRD表征了Ge纳米晶的存在，并仔细分析得到了纳米晶形成的阈值剂量．通过TEM分析了Ge纳米晶的深度分布和晶粒尺寸．用SRIM程序分别计算了双能离子在SiO2非晶层的射程和深度分布，与实验结合，得到纳米晶形成的物理机制，即纳米晶的形成与单束双能离子注入时Ge＋和Ge2＋相互碰撞产生的能量沉积在SiO2中形成的局域高温有关．     

硫系相变材料Ge1Sb2Te4和Ge2Sb2Te5薄膜相变速度及电学输运性质研究

利用磁控溅射方法制备了Ge1Sb2Te4和Ge2Sb2Te5两种相变存贮材料的薄膜.原位X射线衍射(XRD)的结果表明,随着退火温度的升高,Ge1Sb2Te4和Ge2Sb2Te5薄膜都逐步晶化,材料结构发生了从非晶态到面心立方结构、再到六角密堆结构的转变.由衍射峰的半宽高可以看出,在达到第一次相变温度后,Ge2Sb2T...     

掺杂nc-Si∶H膜的电导特性

采用常规 PECVD工艺 ,以高纯 H2 稀释的 Si H4 作为反应气体源 ,以 PH3作为 P原子的掺杂剂 ,在 P型 ( 1 0 0 )单晶硅 ( c- Si)衬底上 ,成功地生长了掺 P的纳米硅膜 ( nc- Si( P)∶ H)膜 .通过对膜层结构的 Raman谱分析和高分辨率电子显微镜 ( HREM)观测指出 :与本征 nc- Si∶H膜相比 ,nc- Si( P)∶ H膜中的 Si微晶粒尺寸更小 (～ 3nm) ,其排布更有秩序 ,呈现出类自组织生长的一些特点 .膜层电学特性的研究证实 ,nc- Si( P)∶ H膜具有比本征 nc- Si∶ H膜约高两个数量级的电导率 ,其 σ值可高达 1 0 - 1～ 1 0 - 1Ω- 1· cm- 1.这种高电导率来源于 nc-     

镶嵌在超薄SiO_2层中的纳米硅的库仑阻塞现象

采用等离子体氧化和逐层 (layer by layer)生长技术在等离子体增强化学气相沉积 (PECVD)系统中原位制备了 Si O2 /nc- Si/Si O2 的双势垒纳米结构 ,从 nc- Si薄膜的喇曼谱中观察到结晶峰 ,估算出该薄膜的晶化成分和平均晶粒尺寸分别约为 6 5 %和 6 nm.通过对该纳米结构的电容 -电压 (C- V)测量 ,研究了载流子的隧穿和库仑阻塞特性 .在不同测试频率的 C- V谱中观测到了由于载流子隧穿引起的最大电容值抬升现象 .通过低温低频 C- V谱 ,计算出该结构中 nc- Si的库仑荷电能为 5 7me V.     

氦离子注入形成980nm脊型波导激光器腔面非注入区的研究

报道了氦离子注入技术在提高 980nm半导体激光器灾变性光学损伤 (catastrophicopticaldamage,COD)阈值上的应用 .p GaAs材料经氦离子注入后可以获得高的电阻率 .在距离腔面 2 5 μm的区域内进行氦离子注入 ,由此形成腔面附近的电流非注入区 .腔面附近非注入区减少了腔面载流子的注入 ,因此减少了非辐射复合的发生 ,提高了激光器的灾变性光学损伤阈值 .应用氦离子注入形成腔面非注入区的管芯的平均最大功率达到 44 0 5mW ,没有发生COD现象 .而应用常规工艺制作的管芯的平均COD阈值功率为 40 7 5mW .同常规工艺相比 ,应用氦离子注入形成腔面非注入区技术     

4H-SiC纳米薄膜的晶化研究

采用新电极结构的PECVD技术，在高功率密度、高氢稀释比、低温、偏压及低反应气压的条件下，在SiO2玻璃表面形成双等离子流，增加了SiO2表面SiC的成核几率，增强成核作用，形成纳米晶。采用高H2等离子体刻蚀弱的、扭曲的、非晶Si-C及Si-Si和Si-H等键时，由于H等离子体对纳米SiC晶粒与非晶态键的差异刻蚀作用，产生自组织生长，发生晶化。Raman光谱和透射电子衍射（EM）的测试结果表明，纳米晶SiC是4H-SiC多型结构。实验结果指出，SiC纳米晶的形成必须经过偏压预处理成核，并且其晶化存在一个功率密度阈值；当低于这一功率密度阈值时，晶化消失；当超过这一阈值时，纳米晶含量随功率密度的提高而增加，晶粒尺寸加大。电子显微照片表明晶粒尺寸为10-28nm，形状为微柱体。随着晶化作用的加强，电导率增加，导电机理是渗流作用所致。     

C+注入a-SiNx∶H的原子化学键合的研究

常温下对低压化学气相沉积制备的纳米硅镶嵌结构的a-SiNx∶H薄膜进行C+注入，能量为30keV，剂量为2e17cm-2. 对C+注入的SiNx薄膜在800℃的温度下，进行2h的常规炉退火处理. 通过XPS,AES的测量得到，经800℃高温退火处理后的薄膜形成了部分SiCxNy结构. 用喇曼、XPS等分析手段对薄膜结构及成分进行了测量与分析，得到不同退火温度对离子注入形成SiCN薄膜结构与成分的影响，认为高温退火后薄膜中硅含量与SiCxNy薄膜的形成有重要的关系.     

氮化硼薄膜的制备和离子注入掺杂

通常人们对氮化硼薄膜的S掺杂,采用的是在氮化硼制备过程中就地掺杂的方法,文中则采用S离子注入方法.氮化硼薄膜用射频溅射法制得.实验结果表明,在氮化硼薄膜中注入S,可以实现氮化硼薄膜的n型掺杂;随着注入剂量的增加,氮化硼薄膜的电阻率降低.真空退火有利于氮化硼薄膜S离子注入掺杂效果的提高.在离子注入剂量为1×1016cm-2时,在600℃的温度下退火60min后,氮化硼薄膜的电阻率为2.20×105 Ω·cm,比离子注入前下降了6个数量级.     

Tailoring the Optical Properties of Epitaxially Grown Biaxial ZnO/Ge,and Coaxial ZnO/Ge/ZnO and Ge/ZnO/Ge Heterostructures

Heterostructures of epitaxially grown biaxial ZnO/Ge, and coaxial ZnO/Ge/ZnO and Ge/ZnO/Ge heterostructured nanowires with ideal epitaxial interfaces between the semiconductor ZnO sublayer and the Ge sublayer have been fabricated via a two‐stage chemical vapor–solid process. Structural characterization by high‐resolution transmission electron microscopy and electron diffraction indicates that both the ZnO and Ge sublayers in the heterostructures are single crystalline. A good epitaxial relationship of (100)_ZnO∥(2 0)_Ge exists at the interface between ZnO and Ge in the ZnO/Ge biaxial heterostructure. There is also an epitaxial relationship of (0 0)_ZnO∥(020)_Ge at the interface between the ZnO and Ge substructures in the coaxial ZnO/Ge/ZnO heterostructures, and a good epitaxial relationship of (0 0)_ZnO∥(0 0)_Ge at the interface between ZnO and Ge in the Ge/ZnO/Ge coaxial heterostructure. Structural models for the crystallographic relationship between the wurtzite‐ZnO and diamond‐like cubic‐Ge subcomponents in the heterostructures are given. The optical properties for the synthesized heterostructures are studied by spatially resolved cathodoluminescence spectra at low temperature (20 K). Excitingly, the unique biaxial and coaxial heterostructures display unique new luminescence properties. It is concluded that the ideal epitaxial interface between ZnO and Ge in the prepared heterostructures induces new optical properties. The group II–VI Ge‐based nanometer‐scale heterostructures and their interesting optical properties may inspire great interest in exploring related epitaxial heterostructures and their potential applications in lasers, gas sensors, solar energy conversion, and nanodevices in the future.     

Lateral photoconductivity of Ge/Si heterostructures with Ge quantum dots

The spectral dependences of the lateral photoconductivity of Ge/Si heterostructures with Ge quantum dots are studied. The photoresponse of the Ge/Si structures with Ge nanoclusters is detected in the range 1.0–1.1 eV at T = 290 K, whereas the photocurrent in the single-crystal Si substrate is found to be markedly suppressed. This result can be attributed to the effect of elastic strains induced in the structure on the optical absorption of Si. At temperatures below 120 K, the heterostructures exhibit photosensitivity in the spectral range 0.4–1.1 eV, in which the Si single crystal is transparent. The photocurrent in this range is most likely due to the transitions of holes from the ground states localized in the quantum dots to the extended states of the valence band.     

Ge／Au和Ge／Ag双层膜中非晶Ge加热晶化的动态观测

本文在JEM—1000高压电镜中对Ge/Au和Ge/Ag双层膜进行了加热动态观测,并与真空退火的结果进行了比较。结果表明,双层膜中非晶Ge的晶化不仅取决于加热温度,而且取决于加热时间。加热条件的不同引起不同的晶化机制。本文讨论了非晶Ge晶化时等轴状缩聚区的形成与长大,并提出了这类区域内的能量平衡条件。     

Lateral photoconductivity of multilayer Ge/Si structures with Ge quantum dots

Spectra of lateral photoconductivity of multilayer Ge/Si structures with Ge quantum dots, fabricated by molecular-beam epitaxy are studied. The photoresponse caused by optical transitions between hole levels of quantum dots and Si electronic states was observed in the energy range of 1.1–0.3 eV at T = 78 K. It was shown that the electronic states localized in the region of Si band bending near the Ge/Si interface mainly contribute to lateral photoconductivity. The use of the quantum box model for describing hole levels of quantum dots made it possible to understand the origin of peaks observed in the photoconductivity spectra. A detailed energy-level diagram of hole levels of quantum dots and optical transitions in Ge/Si structures with strained Ge quantum dots was constructed.     

Nanosecond-Pulse Annealing of Heavily Doped Ge:Sb Layers on Ge Substrates

To produce heavily doped epitaxial layers, amorphous Ge:Sb films with a thickness of 150 and 300 nm are vacuum-deposited on Ge substrates and are exposed to pulsed nanosecond irradiation of high-power laser (λ = 0.69 μm) or ion (C⁺ or H⁺) beams. In the course of laser processing, the irradiated region is optically probed with the registration of the reflection of the probe beam R(t) to control the aggregate state of the film. As a result of rapid crystallization, polycrystalline or epitaxial Ge:Sb layers of different thicknesses are formed from the melt. Computer simulation of the heating and phase transitions of an amorphous Ge film on a crystalline Ge substrate is carried out, as well as the diffusive redistribution of the impurity (Sb) under pulsed treatments. We showed that, due to the volumetric release of the energy of ion beams, it is possible to control the distribution of the Sb impurity up to a depth of 1.5 μm. The simulation results are in good agreement with the experiment.     

Laser annealed Ta/Ge and Ni/Ge ohmic contacts to GaAs

Refractory metal ohmic contacts to n-type GaAs have been developed using epitaxial Ge films and pulsed laser annealing. Laser annealing was carried out with a 22 ns pulse from a Q-switched ruby laser operating in the TEM00mode. The specific contact resistivity of the contacts Ta/Ge and Ni/Ge on 2 × 10¹⁷cm^-3dopes GaAs exhibited sharp minima as a function of laser energy density at 1 × 10^-6Ω-cm²and 2 × 10^-6Ω-cm², respectively, which occurred near the melting point of the layered contacts. Auger electron sputter profiles revealed Ge migration into the GaAs surface after laser annealing at sufficient energy density to form ohmic contact. The contacts have applications to high temperature devices and to devices which experience high channel or contact temperatures, such as power FETs and TEDs.     

Shallow acceptors in strained multiquantum-well Ge/Ge1−x Six heterostructures

Far infrared photoconductivity spectra due to excitation of shallow acceptors in strained multiquantum well Ge/Ge_1?x Si_x (x≈0.1) heterostuctures are investigated. It is shown that these spectra are shifted toward longer wavelengths in the far infrared region compared with those of bulk p-Ge, owing to “built-in” strain and size quantization, which lead to splitting of the light-and heavy-hole subbands in the Ge layers. Shallow acceptor spectra are calculated variationally for bulk germanium under uniaxial tension, which is “equivalent” to the strained Ge layers in the heterostructures. Although this method is only appropriate for wide quantum wells (d _Ge≈800 Å), the calculations are shown to qualitatively account for photoconductivity spectra obtained from narrower wells (d _Ge≈200 Å) as well.     

Thermal desorption of Ge native oxides and loss of Ge from the surface

The authors have identified oxidation and desorption processes of Ge native oxide by chemical bonding states measured by X-ray photoemission spectroscopy. Ge oxidation occurs at the temperatures of 450–500 °C in an oxidizing ambient. Ge desorption in nitrogen ambient is observed at the temperatures of 500–550 °C, which is higher than the oxidation temperature by 50 °C. Combined oxidation and desorption processes proceed subsequently and cause a loss of Ge from the surface when Ge is annealed in oxidizing ambient at a temperature higher than desorption temperature. The surface loss is avoided when Ge is annealed with SiO₂ cap layer in an identical annealing condition.