二氧化锡覆盖层对ITO透明导电薄膜热稳定性的改良

采用射频磁控溅射法在ITO玻璃表面沉积了一层15 nm左右的SnO2薄膜。利用霍尔效应测试仪、四探针电阻测试仪、场发射电子显微镜及紫外–可见–近红外光谱仪分析了所制薄膜的电学性质、表面形貌和光学性质。结果表明,在300~600℃退火后镀有SnO2覆盖层的ITO(SnO2/ITO)薄膜具有相对好的热学稳定性。在600℃退火后,ITO薄膜的方阻和电阻率分别为88.3Ω/□和2.5×10–3.cm,而此时,SnO2/ITO薄膜的方阻和电阻率仅为43.8Ω/□和1.2×10–3Ω.cm。最后,阐述了SnO2覆盖层提高ITO薄膜热稳定性的机制。     

La掺杂对BLT薄膜微观结构与性能的影响

采用sol-gel工艺低温制备了Si基Bi4–xLaxTi3O12(BLT)铁电薄膜。研究了La掺杂量对薄膜微观结构、介电和铁电性能的影响。结果表明,600～650℃退火处理的BLT薄膜表面平整无裂纹,晶粒均匀,无焦绿石相或其它杂相,薄膜为多晶生长;La掺杂量x在0.5～0.85的BLT薄膜介电与铁电性能优良,其εr和tanδ分别介于284～289和(1.57～1.63)×10–2,4V偏压下薄膜的漏电流密度低于10–8A/cm2,Pr可达(13.0～17.5)×10–6C/cm2,Ec低至(102.5～127.8)×103V/cm。     

厚度对TaN薄膜电性能的影响研究

采用直流反应磁控溅射法制备了TaN薄膜,研究了薄膜厚度对TaN薄膜微观结构及电性能的影响。结果表明,薄膜厚度对TaN薄膜的表面形貌和相结构都没有影响,但会显著影响TaN薄膜的电学性能。在87~424 nm的范围内,随着薄膜厚度的增大,所制TaN薄膜的电阻率从555×10–6.cm减小到285×10–6.cm,方阻从84/□减小到9/□,电阻温度系数(TCR)从–120×10–6/℃增加到+50×10–6/℃。可以通过调节薄膜的厚度调节TaN薄膜的电阻率和TCR。     

ITO透明导电薄膜的制备及光电特性研究

以氯化铟和氯化锡为前驱物,采用溶胶 凝胶法在玻璃基片上制备了ITO薄膜。研究了掺锡浓度、热处理温度和热处理时间等工艺条件对ITO薄膜光电特性的影响。制备的ITO薄膜的方阻为300Ω/□,可见光平均透过率为80%,电阻率为4×10-3Ω·cm,其光电特性已达到了TN LCD透明电极的要求。     

氮分压对磁控溅射制备TaN薄膜性能的影响

采用直流反应磁控溅射法制备了TaN薄膜,研究了φ(N2)对薄膜的结构和性能影响。研究发现,在N2分压(体积分数)为9%时,多相共存的TaN薄膜表现出TaN(200)面择优取向,方阻和αt达到最佳,其值为52Ω/□和–306×10–6/℃。薄膜的方阻、电阻温度系数αt和晶粒尺寸都随着N2分压的增大而增大:当N2分压高于11%时,薄膜的方阻和αt增长较快。     

掺杂浓度对AZO薄膜结构和性能的影响

采用溶胶–凝胶工艺在玻璃基片上制备出Al3+掺杂型的ZnO(AZO)透明导电薄膜,对薄膜进行了XRD和SEM分析,并对其光电性能作了详细的研究。结果表明薄膜为纤锌矿型结构,呈c轴方向择优生长;薄膜的可见光透过率可达80%以上;Al3+掺杂型的ZnO透明导电薄膜的电阻率为1.5×10–2~8.2×10–2?·cm。     

Nb掺杂BaTiO3薄膜的激光分子束外延及其特性

用激光分子束外延方法在SrTiO3(100)基底上外延生长了BaNbxTi 1-xO3(0.01≤x≤0.03)导电薄膜.原子力显微镜测得BaNb0.3Ti 0.7O3薄膜表面均方根粗糙度在2μm×2μm范围内为2.4*!,达到原子尺度光滑.霍 尔测量表明BaNbxTi1-xO3薄膜为n型导电薄膜;在室温下,BaNb0 .02Ti0.98O3、BaNb0.2Ti0.8O3和BaNb0.3Ti0.7O 3薄膜的电阻率分别为2.43×10-4Ω*cm、1.98×10-4Ω*cm和1.297×10 -4Ω*cm,载流子浓度分别为5.9×1021cm-1、6.37×1021cm- 1和9.9 ×1021cm-1.     

有机衬底SnO2：Sb透明导电膜的研究

采用射频磁控溅射法在有机薄膜衬底上制备出SnO2∶Sb透明导电膜,并对薄膜的结构和光电特性以及制备参数对薄膜性能的影响进行了研究.制备的样品为多晶薄膜,并且保持了纯二氧化锡的金红石结构.SnO2∶Sb薄膜中Sb2O3的最佳掺杂比例为6%.适当调节制备参数,可以获得在可见光范围内平均透过率大于85%的有机衬底SnO2∶Sb透明导电薄膜,其电阻率～3.7×10-3Ω·cm,载流子浓度～1.55×1020cm-3,霍耳迁移率～13cm2·V-1·s-1.     

采用氧化物复合底电极的BTO薄膜结构和性能

用球磨法制备Bi4Ti3O1(2BTO)靶材。用PLD法在Pt/TiO2/SiO2/Si基片上先分别以三种氧化物SrRuO(3SRO)、LaSrCoO3(LSCO)、LaNiO3(LNO)和Pt生成复合底电极,再在其上生长了外延取向的BTO薄膜。分析了薄膜的结构和性能。结果表明,这种BTO薄膜的c轴取向得到抑制,其极化强度从0.45×10–6C/cm2提高到0.9×10–6C/cm2;矫顽场强从90×103V/cm下降到50×103V/cm。     

In2O3纳米粉体的制备及其气敏性能研究

以In2(SO4)3为原料,通过sol-gel法制备了立方晶系的In2O3粉体。利用X射线衍射仪、透射电镜对材料的组成、晶粒的大小、结构进行了表征。结果表明,产物为平均粒径30 nm左右的圆球形颗粒。将前驱体分别在不同温度下进行热处理,对其气敏性能研究发现,900℃热处理的元件,在工作温度245℃时,对50×10–6 Cl2表现出较好的灵敏度(1.5×104)和选择性。600℃热处理的元件,在工作温度245℃时,对50×10–6 NO2的灵敏度高达2.5×105。最后,对其气敏机理进行了分析。     

蓝绿激光作用下沉积态Ag11In12 Sb51Te26相变薄膜的晶化性能

用反射率对比度来衡量晶化程度，分别探讨了脉宽为500ms，100ms，60ms的蓝绿激光(514nm)作用下沉积态Ag11In12Sb51Te26相变薄膜的晶化性能，表明Ag11In12Sb51Te26相变薄膜在蓝绿激光下可具有较高的晶化速度。对比分析了热致晶化后的Ag11In12Sb51Te26薄膜在514nm处的反射率对比度，结果表明激光晶化和热致晶化后薄膜的反射率对比度有明显差别，分别为8％和19．2％。     

Cr/Cu/Al/Cr薄膜电极的防氧化性能

采用Al作为Cu导电层的主要防氧化保护层,在普通浮法玻璃上利用磁控溅射和湿法刻蚀技术制备Cr/Cu/Al/Cr复合薄膜及其电极,研究不同的热处理温度对复合薄膜及其电极的结构、表面形貌和导电性能的影响。由于有Al层作为保护层,在热处理过程中,Al先与穿过Cr保护层的氧进行反应,从而可以更有效地保护Cu膜层在较高的温度下不被氧化,所制备的薄膜在经过600℃的热处理之后仍然具有较好的导电性能。而对于Cr/Cu/Al/Cr电极,侧面裸露的金属层在热处理过程中的氧化是其导电性能逐渐下降的主要原因,退火温度超过500℃之后,电极侧面裸露部分的氧化范围不断往电极的中间扩散,导致了薄膜电极导电性能显著恶化。虽然如此,Cr/Cu/Al/Cr薄膜电极在430℃附近仍然具有较好的导电性能,电阻率为7.3×10-8Ω.m,符合FED薄膜电极的要求。以此薄膜电极构建FED显示屏,通过发光亮度均匀性的测试验证了Cr/Cu/Al/Cr电极的抗氧化性。     

磁控溅射法制备Bi2Te3热电薄膜的研究

Bi2Te3薄膜是室温下热电性能最好的热电材料,利用磁控溅射在长有一薄层SiO2的n型硅样品上制备Bi/Te多层复合薄膜,经后续退火处理生成Bi2Te3。通过分析Bi2Te3薄膜的生长和退火工艺,探讨Bi/Te中Te的原子数分数对薄膜热电性能的影响。采用XRD和SEM对薄膜的结构、形貌和成分进行分析,并测量不同条件下的Seebeck系数。薄膜Seebeck系数均为负数,表明所制备样品是n型半导体薄膜,且最大值达到-76.81μV.K-1;电阻率ρ随Te的原子数分数增大而增大,其趋势先缓慢后迅速。Bi2Te3薄膜的热电性能良好,Te的原子数分数是60.52%时,功率因子最大,为1.765×10-4W.K-2.m-1。     

Determination of the Origin of Crystal Orientation for Nanocrystalline Bismuth Telluride-Based Thin Films Prepared by Use of the Flash Evaporation Method

We have investigated the origin of crystal orientation for nanocrystalline bismuth telluride-based thin films. Thin films of p-type bismuth telluride antimony (Bi–Te–Sb) and n-type bismuth telluride selenide (Bi–Te–Se) were fabricated by a flash evaporation method, with exactly the same deposition conditions except for the elemental composition of the starting powders. For p-type Bi–Te–Sb thin films the main x-ray diffraction (XRD) peaks were from the c-axis (Σ{00l}/Σ{hkl} = 0.88) whereas n-type Bi–Te–Se thin films were randomly oriented (Σ{00l}/Σ{hkl} = 0.40). Crystal orientation, crystallinity, and crystallite size were improved for both types of thin film by sintering. For p-type Bi–Te–Sb thin films, especially, high-quality structures were obtained compared with those of n-type Bi–Te–Se thin films. We also estimated the thermoelectric properties of the as-grown and sintered thin films. The power factor was enhanced by sintering; maximum values were 34.9 μW/cm K² for p-type Bi–Te–Sb thin films at a sintering temperature of 300°C and 23.9 μW/cm K² for n-type Bi–Te–Se thin films at a sintering temperature of 350°C. The exact mechanisms of film growth are not yet clear but we deduce the crystal orientation originates from the size of nano-clusters generated on the tungsten boat during flash evaporation.     

Characterization of amorphous Ni-Si binary alloy films by flash evaporation

We previously reported on an extremely small temperature coefficient of resistivity (TCR) of thin amorphous Ni-Si film resistors fabricated by new flash evaporating method, which have a wide range of resistivity.¹ In the present paper, we describe the structural and chemical properties of these films for the purpose of clarifying the cause of resistive change of films resulting from heat treatment. X-ray diffraction patterns show that Ni-Si films with greater than 20 wt.% Si remains predominantly amorphous after heat treatment. Changes in composition and binding energy of the films resulting from heat treatment are measured by means of XPS. Electrical characteristics are also investigated as a function of Si concentration and temperature. The resistance variations resulting from heat treatment are found to originate from a structural change. The activation energy needed for this change is obtained by analyzing the extent of change during isothermal heating and found to vary from 1 eV to 2.5 eV with increasing Si content from 20 wt.% to 80 wt.%.     

Influence of Pb doping on the structural,morphological and optical properties of sol–gel ZnO thin films

In this work, undoped and lead (Pb)-doped ZnO thin films were deposited on glass substrate using the sol–gel dip-coating process. The effects of different Pb doping concentrations on the structural, morphological, optical, electrical and photoluminescence properties of such films were investigated by X-ray diffraction (XRD), energy-dispersive X-rays (EDS), atomic force microscopy (AFM), UV–vis–NIR spectrophotometry, Hall effect measurement and Photoluminescence (PL) spectroscopy. XRD patterns of the synthesized films exhibited hexagonal wurtzite crystal structure with a c-axis preferred (002) orientation. AFM images showed that film morphology and surface roughness were influenced by the Pb doping level. Incorporation of Pb was confirmed from elemental analysis using EDS. The UV–vis–NIR spectroscopy characterizations demonstrated that all the films were highly transparent with average visible transmission values ranging from 75% to 85%. Electrical measurement shows that carrier concentration and resistivity are dependent on Pb content. Room temperature PL spectra clearly indicated a great dependence of the UV, green and red emissions on the Pb concentration. In particular, the red emission at 2 eV is quenched after introduction of Pb atoms.     

Effect of glow discharge on chromium thin-film resistance

The resistivity of thin vacuum-evaporated chromium films varies significantly after deposition. Glow-discharge treatment immediately after deposition slowly increases the sheet resistance, and improves its stability during exposure to air and subsequent heat aging. This treatment enables a stable chromium film to be obtained with a sheet resistivity above 400 ?/square.     

ZnO∶Ti透明导电薄膜的制备与光电性能研究

采用直流磁控溅射法,在水冷7059玻璃衬底上制备了具有高透射率和相对低电阻率的掺钛氧化锌(ZnO∶Ti)透明导电薄膜,研究了溅射偏压对ZnO∶Ti薄膜结构、形貌和光电性能的影响。结果表明,ZnO∶Ti薄膜为六角纤锌矿多晶结构,具有c轴择优取向。溅射偏压对ZnO∶Ti薄膜的结构和电阻率有重要影响。当溅射偏压为10V时,电阻率具有最小值1.90×10–4?.cm。薄膜具有良好的附着性能,可见光区平均透射率超过90%。该ZnO∶Ti薄膜可以用作薄膜太阳能电池和液晶显示器的透明电极。     

ZnO films deposited on GaAs substrates with a SiO2 thin buffer layer

Sputter deposition of ZnO films on GaAs substrates has been investigated. ZnO films were radio frequency (rf)-magnetron sputter deposited on GaAs substrates with or without SiO₂ thin buffer layers. Deposition parameters such as rf power, substrate-target distance, and gas composition/pressure were optimized to obtain highly c-axis oriented and highly resistive films. Deposited films were characterized by x-ray diffraction, scanning electron microscopy (SEM), capacitance, and resistivity measurements. Thermal stability of sputter-deposited ZnO films (0.5–2.0 μm thick) was tested with a post-deposition heat treatment at 430°C for 10 min, which is similar to a standard ohmic contact alloying condition for GaAs. The ZnO/SiO₂/GaAs films tolerated the heat treatment well while the ZnO/GaAs films disintegrated. The resistivity (10¹¹ Ω-cm) of the ZnO films on SiO₂-buffered GaAs substrates remained high during the heat treatment. The post-deposition anneal treatment also enhances c-axis orientation of the ZnO films dramatically and relieves intrinsic stress almost completely. These improvements are attributed to a reduction of grain boundaries and voids with the anneal treatment as supported by SEM and x-ray diffraction measurement results.     

Effect of post deposition heat treatment on microstructure parameters,optical constants and composition of thermally evaporated CdTe thin films

Thin film microstructure and its properties can be effectively altered with post deposition heat treatments. In this respect, CdTe thin films were deposited on glass substrates at a substrate temperature of 200 °C using thermal evaporation technique, followed by air annealing at different temperatures from 200 to 500 °C. Structural analysis reveals that CdTe thin films have a cubic zincblend structure with two oxide phases related to CdTe₂O₅ and CdTeO₃ at annealing temperature of 400 and 500 °C respectively. Regardless of the annealing temperature, the plane (111) was found to be the preferred orientation for all films. The crystallite size was observed to increase with annealing temperature. All films were found to display higher lattice parameters than the standard, and hence found to carry a compressive stress. Optical measurements suggest high uniformity of films both before and after post deposition heat treatment. Films annealed at 400 °C displayed superior optical properties due to its high refractive index, optical conductivity, relative density and low disorder. Furthermore, according to the compositional measurements, CdTe thin films were found to exhibit Te rich and Cd rich nature at regions near the substrate and center of the film respectively, for all annealing temperatures. However, composition of the regions near the substrate was found to become more Te rich with increasing annealing temperature. The study suggests that changing the annealing temperature as a post deposition treatment affects structural and optical properties of CdTe thin film as well as its composition. According to the observations, films annealed at 400 °C can be concluded to be the best films for photovoltaic applications due to its superior optical and structural properties.