共查询到18条相似文献,搜索用时 187 毫秒
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《智能电网》2017,(8)
碳化硅(SiC)作为近年来备受关注的一种宽禁带半导体材料,具有宽禁带、高临界击穿电场、高热导率以及高电子饱和漂移速度等良好的物理和电学特性。宽禁带半导体SiC电力电子器件,突破了传统硅基器件在耐压、工作频率以及转换效率等方面的性能极限,从而使电力系统功耗降低30%以上,在"大容量柔性直流输电"、"高效高体积功率密度电力电子变压器"等未来新一代智能电网领域具有非常广泛的应用前景。首先介绍超高压碳化硅电力电子器件在智能电网中应用的重要性,对近年来国内外超高压碳化硅电力电子器件(10 kV)的结构设计、研制水平、最新进展以及其面临的挑战进行分析总结,并对超高压碳化硅电力电子器件在智能电网中的应用及未来的发展前景做出概述与展望。 相似文献
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随着电力电子技术的发展,射频电源由电子管电源发展成现在的晶体管射频电源。氮化镓GaN(gallium nitride)作为第三代宽禁带半导体材料的典型代表,具有宽禁带、高临界击穿场强、高电子饱和漂移速度以及高导通的AlGaN/GaN异质结二维电子气2DEG(two-dimensional electrons gas)等优点。GaN功率器件与硅(Si)功率器件相比,具有导通阻抗低,输入、输出电容小等特性,这些特性使得GaN功率器件高开关速度、低损耗。在E类功率射频电源的基础上,采用GaN功率器件设计制作了一款开关频率为4 MHz、功率可调的全固态射频电源实验样机。通过电路的设计和优化,样机的输出功率为21.4 W时,效率达到了96.7%;同时,采用专为射频电源生产的Si功率器件替换掉样机上的GaN器件,实验数据验证了GaN器件开关速度快、损耗低,可大幅度提高射频电源的效率。 相似文献
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近20年来,以碳化硅和氮化镓为代表的宽禁带半导体功率器件具有电气性能和热性能等方面的优势,正在成为硅器件的强力替代品。业界成功研制出SiC MOSFET、GaN HEMT等先进器件,已在能源汽车、轨道交通、能源互联等行业展示出高开关能力和高温能力。基于功率器件设计、封装、实验方法、栅极驱动等方面的最新研究进展,《电源学报》特别推出"宽禁带器件应用技术"专辑,以期推进宽禁带器件前沿技术与应用难点和热点问题的探讨。 相似文献
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Lijuan Li Canbing Li Yijia Cao Feng Wang 《IEEJ Transactions on Electrical and Electronic Engineering》2013,8(5):515-521
Devices made of the wide‐bandgap semiconductor silicon carbide are capable of not only providing excellent performance for higher voltages, higher switching frequencies, higher junction temperatures, and higher power than silicon devices, but also leading to drastic reduction in system complexity, volume, and weight, as well as higher efficiency and better reliability of power electronics systems. The newly emerged technology has made rapid progress during the past decade, and we can expect even greater advantages and potential for energy savings and emission reduction in the coming years. In this paper, the research on SiC material and device technologies, the benefits, and some remaining issues are discussed. Recent progress (since 2007) in applications such as DC–DC, AC–DC, DC–AC, and AC–AC converters is discussed. Also, future applications and perspectives are analyzed. © 2013 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc. 相似文献
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Explores the RF power performance of microwave amplifiers fabricated from wide bandgap semiconductor transistors and demonstrates that microwave power amplifiers fabricated from 4H-SiC and AlGaN/GaN transistors offer superior RF power performance, particularly at elevated temperatures. Theoretical models predict room temperature RF output power on the order of 4-6 W/mm and 10-12 W/mm, with power-added efficiency (PAE) approaching the ideal values for class A and B operation, available from 4H-SiC MESFETs and AlGaN/GaN HFETs, respectively. All calculations were thoroughly calibrated against dc and RF experimental data. The simulations indicate operation at elevated temperature at least up to 5000°C is possible. The RF output power capability of these devices compares very favorably with the 1 W/mm available from GaAs MESFETs. The wide bandgap semiconductor devices will find application in power amplifiers for base station transmitters for wireless telephone systems, HDTV transmitters, power modules for phased-array radars, and other applications. The devices are particularly attractive for applications that require operation at elevated temperature 相似文献
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变电站直流电源系统从20世纪90年代开始采用高频开关电源装置,距今已经20多年历史,虽然目前已经有发展较为成熟的成套系统如GZDW系列高频开关直流电源,但是仍存在谐波含量大、充电模块故障率高和智能化程度不高等问题。而且目前半导体器件已经发展到第三代的宽禁带半导体器件,变电站直流电源系统却仍停留于第一代硅器件的应用阶段,总体发展进程缓慢。针对变电站直流电源系统及其各模块现状进行研究,具体分析了诸如高性能充电模块、均流技术、谐波与功率因数校正等关键部分所存在的问题,并结合当今技术的潮流提出了对新一代变电站直流电源系统的展望。 相似文献
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电力电子器件又称为功率半导体器件,是电力电子技术的核心。基于文献计量的方法对我国功率器件领域的理论创新情况进行可视化研究。以知网数据库2010~2019年间发表的科技论文作为数据源,借助Ucinet软件对我国功率器件在热点领域、研究机构、基金分布等方面进行分析。得知我国在该领域的发展状况主要为:1)研究重点大多集中在如何提高Si基IGBT和SiC基MOSFET的可靠性、工作效率等性能;2)应用领域多集中于电动汽车、电力电子器件、光伏逆变器、微波和开关电源;3)研究机构以科研院所和高校为主;4)基金项目主要以国家基金为主,诸多省市对于功率器件领域的基金项目尚是空白。分析结果旨在为政府部门及国家相关机构把控功率器件领域的知识创新情况和技术发展趋势提供参考。 相似文献
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Leo Lorenz 《电源世界》2008,(1):21-27
Power Semiconductors are still the driving force for many power electronic systems.In this paper the development of the key power semiconductors devices for power supplies are shown,and their electrical performance discussed.Future directions of the major power semiconductor devices like the IGBT,Super Junction technology and SiC device will be explained. 相似文献