Textured surface boron-doped ZnO transparent conductive oxides on polyethylene terephthalate substrates for Si-based thin film solar cells

Textured surface boron-doped zinc oxide (ZnO:B) thin films were directly grown via low pressure metal organic chemical vapor deposition (LP-MOCVD) on polyethylene terephthalate (PET) flexible substrates at low temperatures and high-efficiency flexible polymer silicon (Si) based thin film solar cells were obtained. High purity diethylzinc and water vapors were used as source materials, and diborane was used as an n-type dopant gas. P-i-n silicon layers were fabricated at ~ 398 K by plasma enhanced chemical vapor deposition. These textured surface ZnO:B thin films on PET substrates (PET/ZnO:B) exhibit rough pyramid-like morphology with high transparencies (T ~ 80%) and excellent electrical properties (Rs ~ 10 Ω at d ~ 1500 nm). Finally, the PET/ZnO:B thin films were applied in flexible p-i-n type silicon thin film solar cells (device structure: PET/ZnO:B/p-i-n a-Si:H/Al) with a high conversion efficiency of 6.32% (short-circuit current density J_SC = 10.62 mA/cm², open-circuit voltage V_OC = 0.93 V and fill factor = 64%).     

Natively textured surface aluminum-doped zinc oxide transparent conductive layers for thin film solar cells via pulsed direct-current reactive magnetron sputtering

Natively textured surface aluminum-doped zinc oxide (ZnO:Al) layers for thin film solar cells were directly deposited without any surface treatments via pulsed direct-current reactive magnetron sputtering on glass substrates. Such an in-situ texturing method for sputtered ZnO:Al thin films has the advantages of efficiently reducing production costs and dramatically saving time in photovoltaic industrial processing. High purity metallic Zn-Al (purity: 99.999%, Al 2.0 wt.%) target and oxygen (purity: 99.999%) were used as source materials. During the reactive sputtering process, the oxygen gas flow rate was controlled using plasma emission monitoring. The performance of the textured surface ZnO:Al transparent conductive oxides (TCOs) thin films can be modified by changing the number of deposition rounds (i.e. thin-film thicknesses). The initially milky ZnO:Al TCO thin films deposited at a substrate temperature of ~ 553 K exhibit rough crater-like surface morphology with high transparencies (T ~ 80-85% in visible range) and excellent electrical properties (ρ ~ 3.4 × 10^− 4 Ω cm). Finally, the textured-surface ZnO:Al TCO thin films were preliminarily applied in pin-type silicon thin film solar cells.     

Improving low pressure chemical vapor deposited zinc oxide contacts for thin film silicon solar cells by using rough glass substrates

Compared to zinc oxide grown (ZnO) on flat glass, rough etched glass substrates decrease the sheet resistance (R_sq) of zinc oxide layers grown on it. We explain this R_sq reduction from a higher thickness and an improved electron mobility for ZnO layers deposited on rough etched glass substrates. When using this etched glass substrate, we also obtain a large variety of surface texture by changing the thickness of the ZnO layer grown on it. This new combination of etched glass and ZnO layer shows improved light trapping potential compared to ZnO films grown on flat glass. With this new approach, Micromorph thin film silicon tandem solar cells with high total current densities (sum of the top and bottom cell current density) of up to 26.8 mA cm^− 2 were fabricated.     

Surface growth of (Ti,Al)N thin films on smooth and rough substrates

A comparative study of the surface growth of solid solution (Ti_0.48Al_0.52)N thin films sputter-deposited on both smooth Si(100) and rough high-speed-steel (HSS) substrates is presented. It was found that the substrates have a decisive impact on the surface morphology and roughness evolution during film growth. For films deposited on smooth Si(100) substrates, a self-affine surface was observed showing that the roughness increased with time. However, when (Ti_0.48Al_0.52)N films were deposited on rough HSS substrates, the film surface was no longer self-affine due to the substrate effect and experienced a continuous smoothening during growth. Scaling analyses on (Ti_0.48Al_0.52)N/Si(100) revealed that the roughness exponent α and the growth exponent β are 0.29 ± 0.03 and 0.97 ± 0.03 respectively, indicating that the growth of (Ti_0.48Al_0.52)N films can be modeled by a simple linear equation with surface diffusion as the smoothening mechanism and shot noise as the roughening effect. Based on this linear equation, our numerical simulations of the film growth using real substrates as the initial conditions indeed showed roughening on Si(100) but smoothening on HSS substrates, in good agreement with the experimental results. The observed linear surface roughening or smoothening in (Ti_0.48Al_0.52)N films on different substrates is also discussed and can be considered as a result of the competitive effect between the surface-diffusion-induced decrease in substrate roughness contribution and the noise-driven surface roughening.     

Optimization of indium tin oxide by pulsed DC power on single junction amorphous silicon solar cells

We investigated the optimal deposition conditions of a thin indium tin oxide (ITO) film on an amorphous silicon (a-Si) single-junction solar cell using pulsed DC magnetron sputtering. Thin ITO films were deposited while power, deposition time, pressure, gas flow and temperature were varied to find such conditions. The efficiency of a-Si solar cells with ITO films was 6.65% at the optimal conditions — a pulsed DC power of 40 W, a deposition time of 460 s, a pressure of 0.53 Pa, gas flow of 16 sccm and 151 °C. On the other hand, an a-SiGe tandem solar cell with the ITO films made at the optimal conditions yields an efficiency of 7.20%. We have also examined the surface morphology of ITO coated a-Si solar cells, using atomic force microscopy. Interestingly, a change in power does not alter the surface morphology at small length scales, whereas at large scales, the lower power sample had a lower surface roughness than the samples made with higher powers. We also find that for the range of deposition conditions examined, the value of the roughness exponent does not change with α ? 2/3 and a thin layer of ITO does not modify the surface morphology significantly.     

Microstructural evolution in nanostructured gold films

Thin Au films in the thickness range t = 1.5-126 nm were coated by DC sputtering on SiO_x/Si substrates at room temperature inside a vacuum chamber with a base pressure of about 1 × 10^− 2 mbar (1 Pa). The film structure, nanograin characteristics, and the surface roughness as a function of thickness were analyzed using X-ray diffraction, scanning tunneling microscopy and transmission electron microscopy. The results reflect the microstructural evolution with film thickness. They help us to understand the mode of grain growth, which is monomodal-normal columnar as well as spherical. By determination of the dynamic scaling exponent derived from power law dependence of the mean grain size and film thickness, the prevailed mechanism of grain growth is deduced to be the diffusion of mobile Au atoms in grain boundaries. The surface roughness increases with the film thickness following a power law: R_rms ~ t^b. The linear fitted value for b is 0.60.     

Bulge testing and fracture properties of plasma-enhanced chemical vapor deposited silicon nitride thin films

The mechanical properties and fracture behavior of silicon nitride (SiN_x) thin film fabricated by plasma-enhanced chemical vapor deposition is reported. Plane-strain moduli, prestresses, and fracture strengths of silicon nitride thin films deposited both on a bare Si substrate and on a thermally oxidized Si substrate were extracted using bulge testing combined with a refined load-deflection model of long rectangular membranes. The plane-strain moduli and prestresses of SiN_x thin films have little dependence on the substrates, that is, for the bare Si substrate, they are 133 ± 19 GPa and 178 ± 22 MPa, respectively, while for the thermally oxidized substrate, they are 140 ± 26 GPa and 194 ± 34 MPa, respectively. However, the fracture strength values of SiN_x films grown on the two substrates are quite different, i.e., 1.53 ± 0.33 GPa and 3.08 ± 0.79 GPa for the bare Si substrate and the oxidized Si substrate, respectively. The reference stresses were computed by integrating the local stress of the membrane at the fracture over the edge, surface, and volume of the specimens and fitted with the Weibull distribution function. For SiN_x thin film produced on the bare Si substrate, the volume integration gave a significantly better agreement between data and model, implying that the volume flaws are the dominant fracture origin. For SiN_x thin film grown on the oxidized Si substrate, the fit quality of surface and edge integration was significantly better than the volume integration, and the dominant surface and edge flaws could be caused by buffered HF attacking the SiN_x layer during SiO₂ removal.     

Effects of surface roughness of substrates on the c-axis preferred orientation of ZnO films deposited by r.f. magnetron sputtering

The c-axis preferred orientation of ZnO film is the most important factor for its successful application in piezoelectric devices. The effects of surface roughness of the substrate on the c-axis preferred orientation of ZnO thin films, deposited by radio frequency magnetron sputtering, were investigated. During sputtering, the oxygen content in the argon environment used was varied from 0 to 70% at a total sputtering pressure of 10 mTorr. Very smooth Si, smooth evaporated Au/Si, smooth evaporated-Al/Si, and rough sputtered-Al/Si were used as substrates. Their r.m.s. roughnesses, as measured by atomic force microscopy, were 1.27, 17.1, 21.1 and 65-118 Å, respectively. The crystalline structure and the angular spread of the (0 0* 2) plane normal to the ZnO films were determined using X-ray diffraction and X-ray rocking curves, respectively. The crystallinity and the preferred c-axis orientation of the ZnO films were strongly dependent on the surface roughness of the substrates rather than on the oxygen content of the working environment or on the chemical nature of the substrate.     

Characterization of vapor-deposited l-leucine nanofilm

X-ray reflective measurements (XRR), atomic force microscopy and single wavelength ellipsometry were used to investigate the optical properties of thin l-leucine films deposited onto silicon substrates. The ellipsometry data (Ψ,Δ) were fitted with a four-layer-model, and the optical refractive index of the l-leucine film measured with ellipsometry was determined to be 1.37. With the conventional effective medium approximation theory and the ellipsometry results, the density of the l-leucine nanofilm was determined to be 70% (0.81 g/cm³) of crystalline l-leucine. This value was in good agreement with the density of 69% (0.80 g/cm³) obtained with XRR measurement. The ellipsometry measurements also enabled us to estimate the surface roughness or absorption layer of the film. This procedure of combined XRR and ellipsometry measurements could be a powerful tool for the determination of the (otherwise hard-to-determine) refractive index in thin organic material films with a rough surface layer.     

High roughness Ag back reflector on a metal underlayer for thin film solar cell applications

The roughness development of Ag film was investigated for potential as a back reflector material in thin film solar cells on flexible stainless steel (STS) substrates. The influence of metal underlayers was evaluated in order to obtain a rough Ag film at a low deposition temperature (≤400 °C). By depositing Ag on a 100 nm Al underlayer to induce Ag–Al alloying, the film roughness was increased three times more than that of Ag films on bare STS at 400 °C. The Ag film deposited on an Al underlayer at 350 °C exhibited 75 nm roughness and uniformly distributed crystallites, which was effective for visible light scattering. The Ag–Al alloy phase was also controlled using the thickness ratio of Ag and Al. The present work clearly demonstrated that an Ag back reflector film with a higher roughness could be fabricated through inserting a metal underlayer at a deposition temperature much lower than the 500 °C that has been reported in earlier works.     

Plastic substrate with gas barrier layer and transparent conductive oxide thin film for flexible displays

A novel plastic substrate for flexible displays was developed. The substrate consisted of a polycarbonate (PC) base film coated with a gas barrier layer and a transparent conductive thin film. PC with ultra-low intrinsic birefringence and high temperature dimensional stability was developed for the base film. The retardation of the PC base film was less than 1 nm at a wavelength of 550 nm (film thickness, 120 µm). Even at 180 °C, the elastic modulus was 2 GPa, and thermal shrinkage was less than 0.01%. The surface roughness of the PC base film was less than 0.5 nm. A silicon oxide (SiO_x) gas barrier layer was deposited on the PC base film by a roll-to-roll DC magnetron reactive sputtering method. The water vapor transmission rate of the SiO_x film was less than 0.05 g/m²/day at 40 °C and 100% relative humidity (RH), and the permeation of oxygen was less than 0.5 cc/m² day atm at 40 °C and 90% RH. As the transparent conductive thin film, amorphous indium zinc oxide was deposited on the SiO_x by sputtering. The transmittance was 87% and the resistivity was 3.5 × 10^− 4 ohm cm.     

Enhanced deposition of cubic boron nitride films on roughened silicon and tungsten carbide-cobalt surfaces

We report the influence of substrate surface roughness on cubic boron nitride (cBN) film deposition under low-energy ion bombardment in an inductively coupled plasma. Silicon and cemented tungsten carbide-cobalt (WC-Co) surfaces are roughened by low-energy ion-assisted etching in a hydrogen plasma, followed by deposition in a fluorine-containing plasma. Infrared absorption coefficients are measured to be 22,000 cm⁻¹ and 17,000 cm⁻¹ for sp²-bonded BN and cBN phases, respectively, for our films. For the silicon substrates, the film growth rate and the cBN content in the film increase with increasing the surface roughness, while the amount of sp²BN phase in the film shows only a small increase. A larger surface roughness of the substrate results in a smaller contact angle of water, indicating that a higher surface free energy of the substrate contributes to enhancing growth of the cBN film. For the WC-Co substrates, the film growth rate and the cBN content in the film increase similarly by roughening the surface.     

Large-area SnO2: F thin films by offline APCVD

In this paper, we reported the successful preparation of fluorine-doped tin oxide (FTO) thin films on large-area glass substrates (1245 mm × 635 mm × 3 mm) by self-designed offline atmospheric pressure chemical vapor deposition (APCVD) process. The FTO thin films were achieved through a combinatorial chemistry approach using tin tetrachloride, water and oxygen as precursors and Freon (F-152, C2H4F2) as dopant. The deposited films were characterized for crystallinity, morphology (roughness) and sheet resistance to aid optimization of materials suitable for solar cells. We got the FTO thin films with sheet resistance 8-11 Ω/□ and direct transmittance more than 83%. X-ray diffraction (XRD) characterization suggested that the as-prepared FTO films were composed of multicrystal, with the average crystal size 200-300 nm and good crystallinity. Further more, the field emission scanning electron microscope (FESEM) images showed that the films were produced with good surface morphology (haze). Selected samples were used for manufacturing tandem amorphous silicon (a-Si:H) thin film solar cells and modules by plasma enhanced chemical vapor deposition (PECVD). Compared with commercially available FTO thin films coated by online chemical vapor deposition, our FTO coatings show excellent performance resulting in a high quantum efficiency yield for a-Si:H solar cells and ideal open voltage and short circuit current for a-Si:H solar modules.     

Aluminium doped zinc oxide sputtered from rotatable dual magnetrons for thin film silicon solar cells

This study addresses the electrical and optical properties as well as the surface structure after wet-chemical etching of mid-frequency magnetron sputtered aluminium doped zinc oxide (ZnO:Al) films on glass substrates from rotatable ceramic targets. Etching of an as-deposited ZnO:Al film in acid leads to rough surfaces with various feature sizes. The influence of working pressure and substrate temperature on the surface topography after etching was investigated. It was found that the growth model which Kluth et al. applied to films sputtered in radio frequency mode from planar ceramic target can be transferred to film growth from tube target. Furthermore, the influence of Ar gas flow and discharge power on the film properties was investigated. We achieved low resistivity of about 5.4 × 10^− 4 Ω·cm at high growth rates of 120 nm·m/min. Finally, surface textured ZnO:Al films were applied as substrates for microcrystalline silicon solar cells and high efficiencies of up to 8.49% were obtained.     

A detailed study of the series resistance effect on CdS/CdTe solar cells with Cu/Mo back contact

CdS/CdTe thin film solar cells with an area of 1 cm² were obtained and studied in detail. A ZnO buffer layer was deposited by reactive RF-sputtering on commercial ITO substrates. The CdS layer was grown on ZnO also by using RF-sputtering and CdTe thin film was deposited by conventional CSS technique. The chlorination of the solar cells is performed into Freon atmosphere at 400 °C. The CdTe thin film surface was chemically etched by using Br-Methanol solution. The back contact was deposited using RF-sputtering from a pure Cu and Mo targets. The procedure developed in this work led us to make systematically solar cells with good efficiency. However, the series resistance has a high value for an area of 1 cm² (22 Ω cm²). In order to make more detailed study, the solar cell with an area of 1 cm² was divided in a 3 × 3 matrix. A good homogeneity in cell properties is observed and the efficiency increases to more than 11%, fundamentally through decreasing series resistance.     

Annealing optimization of silicon nitride film for solar cell application

Hydrogenated films of silicon nitride (SiNx:H) is commonly used as an antireflection coating as well as passivation layer in crystalline silicon solar cell. SiNx:H films deposited at different conditions in Plasma Enhanced Chemical Vapor Deposition (PECVD) reactor were investigated by varying annealing condition in infrared (IR) heated belt furnace to find the optimized condition for the application in silicon solar cells. By varying the gases ratio (R = NH₃/SiH₄ + NH₃) during deposition, the SiNx:H films of refractive indices 1.85-2.45 were obtained. Despite the poor deposition rate, the silicon wafer with SiNx:H film deposited at 450 °C showed the best effective minority carrier lifetime. The film deposited with the gases ratio of 0.57 shows the best peak of carrier lifetime at the annealing temperature of 800 °C. The single crystalline silicon solar cells fabricated in conventional industrial production line applying the optimized film deposition and annealing conditions on large area substrates (125 mm × 125 mm) were found to have the conversion efficiencies as high as 17.05 %. Low cost and high efficiency single crystalline silicon solar cells fabrication sequence employed in this study has also been reported in this paper.     

Morphological study by XPS and AFM of wide band gap β-ln2S3 thin films synthesized by a dry physical process

Wide band gap -ln₂S₃ thin films have interesting properties to substitute CdS as the buffer layer in thin film solar cells. They have n-type conductivity and their optical band gap is about 2.8 eV. In this paper, -ln₂S₃ thin films deposited on smooth glass and on rough SnO₂-coated glass substrates have been morphologically studied by X-ray photoelectron spectroscopy (XPS) and by atomic force microscopy (AFM). The results obtained show that on each substrate the films are continuous without any pinholes and cracks. Films deposited on glass cover homogenously the whole surface of the substrate. In the case of SnO₂ substrates, the material deposited preferentially fills the hollows of the rough surface inducing a decrease of its roughness value. It is shown that these morphological properties are very promising for buffer layer application.     

Instantaneous cleaning of silicon substrates by mesoplasma for high-rate and low-temperature epitaxy

Homoepitaxial films having properties identical to films deposited on the conventional wet-cleaned substrates have been achieved even in the absence of any substrate pre-treatment through the mesoplasma CVD. X-ray photoelectron spectroscopy reveals that the native oxide layer is effectively removed by exposure of the bare silicon substrates to the Ar-H₂ plasma at exposure times as short as 2 s and temperatures less than 100 °C. Although an exposure to the Ar-H₂ plasma is accompanied by an anisotropic island formation resulting in an increase in rms roughness (~ 5 nm) of the surface, addition of as little as 2 sccm SiH₄ into the plasma reduces the roughness greatly. The absence of Si-H_x peaks in the FTIR spectrum and uniform concentration distribution of H and O atoms across the growth interface observed by SIMS analysis indicate that minimal damage was induced in the silicon film by the hydrogen while attaining high yield of surface cleaning. These suggest that surface interaction with Ar-H₂ plasma at the mesoplasma condition supportively facilitate lateral growth at low temperature in the way of instantaneous surface cleaning and anisotropic Si etching structure favorable for incorporation of the atoms comprising the Si nanoclusters as growth precursors.     

AFM surface analysis of ZnO layers prepared by pulsed laser deposition at different oxygen pressures

Polycrystalline thin films of zinc oxide were deposited by pulsed laser deposition onto silicon substrates at different oxygen partial pressures in the range of 1-35 Pa. For ablation of the sintered zinc oxide target a pulsed Nd:YAG laser was used. Other processing parameters such as laser pulse energy, pulse repetition rate, substrate temperature and deposition pressure were identical. The effect of oxygen pressure on the structural properties of the films was systematically studied by using atomic force microscopy. The surface morphology, average roughness S_a, root mean square S_q, and mean size of grains on selected places with 2 × 2 μm² area of prepared samples were evaluated. Detailed structural analysis confirmed that partial oxygen pressure leads to the modification of surface morphology. Mean grain size in height and lateral direction decreases with raising oxygen pressure from 1 to 5 Pa while the further increase of oxygen pressure from 5 to 35 Pa results in grain size enlargement. The zinc oxide film formed at oxygen partial pressure 5 Pa shows smallest values of evaluated parameters (S_a = 0.6 nm, S_q = 0.7 nm and mean size of grains 50 nm).     

The properties of transparent semiconductor Zn1 − xTixO thin films prepared by the sol-gel method

Transparent semiconductor thin films of Zn_1 − xTi_xO (0 ≦ x ≦ 0.12) were deposited on alkali-free glass substrates by the sol-gel method. The effects of Ti addition on the crystallization, microstructure, optical properties and resistivity of ZnO thin films were investigated. The as-coated films were preheated at 300 °C, and then annealed at 500 °C in air ambiance. X-ray diffraction results showed all polycrystalline Zn_1 − xTi_xO thin films with preferred orientation along the (002) plane. Ti incorporated within the ZnO thin films not only decreased surface roughness but also increased optical transmittance and electrical resistivity. In the present study, the Zn_0.88Ti_0.12O film exhibited the best properties, namely an average transmittance of 91.0% (an increase of ~ 12% over the pure ZnO film) and an RMS roughness value of 1.04 nm.