硫系玻璃光纤的研究进展

硫系玻璃光纤具有超高非线性、截止波长长、折射率可调、性能稳定等优点。其红外超连续(SC)谱在传感方面的潜在应用价值,使其成为光纤通信领域的理想材料。本文介绍了硫系玻璃红外光纤的应用、结构和制备方法,并对硫系玻璃光纤研究方向和发展前景进行了展望。     

飞秒激光诱导玻璃功能微结构

玻璃是一种传统材料,通过利用外场对玻璃进行空间选择性的微结构调控,发挥微结构的协同效应、量子效应和干涉效应等,可以赋予玻璃高功能和全新性能.本文阐述了近年来发展迅速的飞秒激光与玻璃相互作用的特征,介绍了我们利用飞秒激光诱导折射率变化直写三维光波导、微光栅和光散射型光纤衰减器,进行活性离子(稀土、过渡和重金属离子)的价态操作及应用和发现的基于飞秒激光与玻璃非线性相互作用的偏振依赖的纳米光栅形成机制.     

光纤光栅智能混凝土材料与结构试验技术的研究

结合光纤光栅传感技术的优点，提出了一种光纤光栅智能混凝土材料与结构试验技术，并对该技术进行了分析，阐明了光纤光栅智能混凝土材料与结构试验的关键技术和方法，并通过原理性实验得以验证。光纤光栅智能混凝土材料与结构试验技术在结构的长期状态监测和损伤诊断方面具有良好的前景。     

碲酸盐玻璃及光纤的传感应用研究进展

碲酸盐玻璃具有较宽传输窗口、低转变温度、高非线性折射率及良好的稀土溶解能力,与其他玻璃体系相比在光纤激光器、放大器、非线性效应以及生化传感等领域表现出明显的优势。首先介绍了碲酸盐玻璃组分和制造工艺;其次分析了玻璃的热稳定性、传输限制、温黏特性及机械性能;然后总结了阶跃型和微结构型光纤预制棒的制备方法,以及碲酸盐光纤的拉制工艺;最后按照温度、磁场、应变、溶液折射率以及气体浓度等待测量分类,综述了碲酸盐玻璃及光纤在生物化学、医疗设备和电力系统等领域的传感应用,并对其应用前景进行了展望。     

光纤光栅传感器在道路测试及工程应用的研究进展

路面结构内部温度、湿度、应力和应变等参数的测试一直是道路测试领域的重点和难点,随着光纤光栅传感技术的发展,为道路测试领域提供了新方法;为了论证光纤光栅传感技术在道路测试领域的可行性,介绍了光纤光栅传感系统的基本结构,从温度和应变传感器基本原理出发,综述了光纤光栅传感器的室内探索性研究和在实际路面温度和应变测试的成果.最后介绍了光纤光栅传感器在其他工程,包括桥梁、隧道及机场跑道中的应用情况,并分析了光纤光栅在道路测试工程中推广使用所面临的困难和发展方向.     

土木工程自监测纤维复合材料

纤维复合材料(FRP)具有轻质、高强、耐腐蚀、抗疲劳及良好的自传感特性等优点.将FRP与光纤光栅传感技术相结合,即在FRP材料加工过程中埋入光纤光栅传感元件(OFBG)可制成新型自监测复合材料(OFBG-FRP).OFBG-FRP兼有FRP优良的物理力学性能及光纤光栅的智能传感特性.本文主要介绍FRP及OFBG-FRP的传感特性及其在土木工程健康监测中的应用等方面的研究进展.     

日本塑料光纤发展动向

日本塑料光纤发展动向黄汉生（武汉化工研究所，武昌４３００６４）１光纤的分类光纤按使用的主要材料分为：石英玻璃系、多成分玻璃系、塑料系、氟化物玻璃系、硫化物玻璃系、卤化物结晶系光纤。目前实用光纤以前３类为主。光纤按波导结构分为：阶跃折射率（ＳＩ）型多模...     

基于中红外光纤的倏逝波传感研究进展

基于倏逝波原理的光纤传感器因其灵敏度高、响应速度快、成本低等优点,已广泛应用于液体、气体及生物化学传感等诸多领域.与此同时,以碲酸盐玻璃、氟化物玻璃、硫系玻璃和卤化物晶体等为基质材料的中红外光纤因其具有较宽的红外透过范围,近年来在中红外波段传感领域得到了广泛关注.本文首先概述了中红外光纤倏逝波传感原理,介绍了各种中红外...     

Z941系列UV—固化胶粘剂的研制

研制出了一系列低毒、无味、稳定性高的光敏胶，这些胶对玻璃的粘接强度高、耐热性好，玻璃接头在沸水中煮沸数十小时，胶接强度无明显下降，胶接界面不剥离，几种光敏胶的折射率均符合光学玻璃胶粘剂的要求。     

信息时代的玻璃

综述了信息技术中信号传输、储存、显示所用的玻璃材料,如通讯光纤、光子晶体光纤、光纤放大器、超宽带放大器、光纤光栅、磁光盘、光盘储存(WROM)、可擦写光盘储存(DRAW-E)以及各类型平板显示器(FPD)和电纸显示(EPD)中所用玻璃材料的成分系统、性能与制备,并展望了今后的发展方向.     

Photochemistry of polymeric systems. VI. Photocrosslinking of basic polymers and copolymers dyeing

Poly(N-vinylamine) (PVAm) and methylmethacrylate/dimethylaminoethylmethacrylate copolymers (MMA/DMAEMA) were prepared and then substituted by cinnamic or cinnamylidene photosensitive groups. The photosensitivity of these materials was determined using the so-called photoresist test in various experimental conditions. A comparison was made between MMA/DMAEMA and methylmethacrylate/4-vinylpyridine (MMA/4VP) photosensitized copolymers. The best results were obtained with MMA/DMAEMA on textile support. A photosensitization study was carried out by adding some compounds such as thioxanthone (10% in bulk). It showed that the multiplicity factor can be 10 with MMA/DMAEMA copolymers and even up to 64 for photosensitive PVAm. The addition of anionic dyes on the polymers emphasized that a better fixation occured for aliphatic amines than for pyridinic ones.     

The photosensitive properties of polysiloxane acrylate resin containing tertiary amine groups

The photosensitive properties of a novel oligomer, di (N,N‐diacrylolyl)‐α, ω‐diaminopolysiloxane (ANS) with tertiary amine groups and acryloyl groups in its molecular structure were investigated using FTIR and gel yield method. It was noted that the ANS system showed a notable photosensitive property and its photosensitivity in air could be up to16.3 mJ/cm². The UV‐curing behavior of the ANS was studied by electron spin resonance (ESR). The results showed that amino‐alkyl radicals can be formed by excited BP abstracting hydrogen at a‐carbon bonded with nitrogen in the ANS molecule under UV irradiation, which can mitigate the oxygen inhibition in radical polymerization. It is proven that tertiary amine groups introduced into ANS could boost photosensitivity of the photopolymerization system. The oligomer ANS may find application in photopolymerization to improve the properties of UV‐curing coating materials. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

积层电路板制造用光敏预聚物的合成及应用研究

用丙烯酸对酚醛环氧树脂进行改性,以使其具有感光性。考察温度及催化剂用量对反应的影响,并介绍积层电路板制造用液态感光成像油墨的配方和制作工艺,分析以合成的光敏预聚物为主体配制的油墨的感光性。结果发现,合适的反应温度为90℃,反应5h,转化率达91.83%;以十六烷基三甲基溴化铵为催化剂,其质量分数以1.5%为宜;以自制的光敏预聚物配制的油墨,在曝光20s时,双键的转化率可达80%以上。     

Effect of photosensitivity in acrylic photoreactive electrode pastes on line width uniformity for large‐sized plasma display panels

Ag electrodes with line width uniformity for large‐sized plasma display panels were successfully fabricated through a photolithographic process using photosensitive Ag pastes with optimized photosensitive properties. The photosensitivity of the Ag electrode pastes in the photolithographic process was investigated as a function of the types and contents of photoinitiators, the molecular weights and acid values of acrylic binders with carboxylic acid groups, and the process variables, such as the UV‐light intensity and dose, with a step tablet. This study revealed that the photoinitiator was a major parameter for the photosensitivity of the Ag electrode pastes. With the photosensitivity of the photosensitive Ag electrode pastes optimized by the study of the photoinitiator contents, Ag electrodes with line width uniformity were achieved with an HSP‐188 photoinitiator content of 15 wt % on the basis of the reactive monomers, regardless of the variation of the light dose from 250 to 350 mJ/cm² and intensity from 15 to 25 mW/cm². © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

壳聚糖光敏改性及其胶束行为

以醋酸水溶液为溶剂,N-甲基-4-(4-甲醛基苯乙烯)吡啶甲基硫酸盐(SBQ)为光敏单体,通过支链上氨基的Schiff碱反应对壳聚糖进行接枝改性,将改性壳聚糖溶解于丙烯酸水溶液形成胶束溶液,通过聚合丙烯酸制备了壳聚糖/PAA纳米粒子。结果表明:该改性方法能够使壳聚糖有效接枝上光敏单体SBQ,接枝率为3.1%,改性壳聚糖具备良好光敏感性;胶束粒子的粒径对紫外光有很好的光响应性。     

Functionalized allyl resins. I. Photosensitivity of partially cinnamoylated allyl resins

The preparation of photosensitive allyl resins is described. The introduction of cinnamoyl groups into allyl resins is attempted for imparting successfully photosensitive functionality. Thus, the photosensitivity of cinnamoylated poly(allyl benzoate) was first examined in detail as a model photoreaction of cinnamoylated allyl resins. Cinnamoylated poly(diallyl phthalate) was then UV-irradiated to yield crosslinked resin, and its photosensitivity was compared with that of other allyl resins. The highest photosensitivity was observed for cinnamoylated poly(diallyl phthalate), although the mobility of the main polymer chain was considered to be lowest; this may be ascribed to the function of phthaloyl groups as photosensitizers.     

纳米复合在光聚合高分子固体电解质中的应用研究

将纳米级陶瓷粉末分散到含有高分子基体预聚物、高氯酸锂及光引发剂的光敏物质中 ,并通过紫外光辐射使其交联固化为导电薄膜锂聚合物电池用电解质材料 ,并对其成膜性、感光性能以及导电性能进行了研究 ;本文还介绍了近年来纳米复合材料在锂聚合物电池中的应用进展情况     

Study on properties of a novel photosensitive polysiloxane urethane acrylate for solder mask

The photosensitive and physical and mechanical properties of a novel polysiloxane urethane acrylate (PSUA) for solder mask were investigated using real‐time FTIR, DMTA and TGA. It is noted that PSUA showed a notable photosensitivity and a good compatibility with the acrylic monomers and resins. PSUA cured film exhibited excellent thermal property, tensile strength and toughness, and chemical resistance. The decomposition temperature of PSUA was 402 °C. Thermal weight losses of pure PSUA cured film at 300 °C were only 5%. Elongation percentage of PSUA cured film was up to 59%. PSUA resin can be used for solder mask materials for printed circuit. Technology performances of photosensitive imaging flexible solder mask containing PSUA answers operating requirements of the solder masker for printing circuit board. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Photoinitiation systems and thermal decomposition of photodefinable sacrificial materials

The exposure characteristics of norbornene‐based photosensitive sacrificial materials as functions of the photoinitiator have been investigated. The results show that the initiator, bis(2,4,6‐trimethylbenzoyl)‐phenylphosphine oxide, provides high photosensitivity and an adjustable contrast factor. The kinetics of the thermal decomposition of the polymers have been investigated with dynamic and isothermal thermogravimetric analysis to determine the most appropriate conditions for the thermal decomposition of the sacrificial polymers. The reaction is slightly higher than first‐order, and a single mechanism can account for the decomposition throughout the process. The dependence of the kinetic parameters on the composition of the copolymers has been studied, and the reaction order remains unchanged; however, the activation energy is lower when the alkenyl‐substituted norbornene content is increased in the copolymers. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 1186–1195, 2003     

Photochemistry of polymeric systems VII. Photo-cross-linking of liquid polysiloxanes including cinnamic groups

Cinnamoyloxymethyl dimethyl vinyl silane was synthesized and bound to a series of commercial polydimethylsiloxane-type copolymers bearing variable amounts of Si? H functions through a hydrosilylation reaction. This reaction was controlled in order to avoid side reactions between the photosensitive unsaturated moiety and the Si? H groups. The photosensitivity of polymeric films was studied by a photoresist test described in previous papers. The results emphasize the role of the molecular weight of the starting copolymer and the percentage of pendant photosensitive groups.