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回顾了Si面键合技术的历史,研究了国外此工艺技术发展过程与趋势,分析了Si面直接键合技术的特点和它在压电与声光器件中的应用。 相似文献
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Au/Sn共晶键合技术在MEMS封装中的应用 总被引:1,自引:0,他引:1
研究了Au/Sn共晶圆片键合技术在MEMS气密性封装中的应用。设计了共晶键合多层材料的结构和密封环图形,盖帽层采用Ti/Ni/Au/Sn/Au结构,器件层采用Ti/Ni/Au结构,盖帽层腔体尺寸为4.5 mm×4.5 mm×20μm,Au/Sn环的宽度为700μm,优化了键合工艺,对影响气密性的因素(如组分配比、键合前处理和键合温度等)进行了分析。两层硅片在氮气气氛中靠静态的压力实现紧密接触。在峰值温度为300℃、持续时间为2 min的条件下实现了良好的键合效果,其剪切力平均值达到16.663 kg,漏率小于2×10-3 Pa·cm3/s,满足检验标准(GJB548A)的要求,验证了Au/Sn共晶键合技术在MEMS气密封装中的适用性。 相似文献
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微米尺度下键合强度的评价方法和测试结构 总被引:1,自引:0,他引:1
在MEMS器件的设计与加工过程中,键合技术是体硅工艺的一项关键技术。由于MEMS器件的特点,其键合的面积通常是在微米到毫米量级内.传统测试键合强度的方法不再适用,该尺度下键合强度的测试与评价成为MEMS工艺测试的难点之一。文章提出了一种新型的测试结构.对面积为微米量级下键合的最大抗扭强度进行了测试。实验设计一系列的单晶硅悬臂梁结构测试键合面积在微米量级时的最大剪切力.键合面为常用的正方形.其边长从6μm到120μm,计算得出的剪力与采用实体单元有限元分析结果计算出的作用力相对误差为4.9%,这一误差在工程中是可以接受的。实验得出最大剪切扭矩和相应的键合面积的曲线。MEMS器件的设计人员可以根据结论曲线.针对所需的抗扭强度设计相应的键合面积。 相似文献
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键合强度是MEMS器件研制中一个重要的工艺质量参数,键合强度检测对器件的可靠性具有十分重要的作用。为了获得MEMS器件制造工艺中的键合强度,提出了一种键合强度在线检测方法,并基于MEMS叉指式器件工艺介绍了一种新型键合强度检测结构;借助于材料力学的相关知识,推导出了键合强度计算公式,经过工艺实验,获得了键合强度检测数据;对获得的不同键合面积的键合强度加以对比,指出这些数据的较小差异,是由刻度盘最小刻度误差和尺度效应造成的。结合叉指式器件的工作环境,认为这种方法获得的键合强度更接近实际的工作情况。 相似文献
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Cheng-Li Chuang 《Microelectronic Engineering》2007,84(4):551-559
A flip-chip assembly is an attractive scheme for use in high performance and miniaturized microelectronics packaging. Wafer bumping is essential before chips can be flip-bonded to a substrate. Wafer bumping can be used for mechanical-single point stud bump bonding (SBB), and is based on conventional thermosonic wire bonding. This work proposes depositing a titanium barrier layer between the copper film and the silver bonding layer to achieve perfect bondability and sufficiently strong thermosonic bonding between a stud bump and the copper pad.A titanium layer was deposited on the copper pads to prevent copper atoms from out-diffusing during thermosonic stud bump bonding. A silver film was then deposited on the surface of the titanium film as a bonding layer to increase the bondability and bonding strength for stud bumps onto copper pads. The integration of the silver bonding layer with a diffusion barrier layer of titanium on the copper pads yielded 100% bondability between the stud bump and pads. The strength of bonding between the gold bumps on the copper pads significantly exceeds the minimum average values in JEDEC specifications. The diffusion barrier layer of titanium effectively prevents copper atoms from out-diffusing to the silver bonding layer surface during thermosonic bonding, which fact can be interpreted with reference to the experimental results of energy dispersive spectrometry (EDS) and analyses of Auger depth profiles. This diffusion barrier layer of titanium efficiently provides perfect bondability and sufficiently strong bonding between a stud bump and copper pads with a silver bonding layer. 相似文献
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D. V. Singh L. Shi K. W. Guarini P. M. Mooney S. J. Koester A. Grill 《Journal of Electronic Materials》2003,32(11):1339-1343
We demonstrate layer transfer of 150 nm of Si from a 200-mm, silicon-on-insulator (SOI) substrate onto a sapphire substrate
using low-temperature wafer bonding (T=150°C). The crystalline quality and the thermal stability of the transferred Si layer
were characterized by x-ray diffraction (XRD). A broadening of the (004) Si peak is observed only for anneal temperatures
TA≥800°C, indicating some degradation of the crystalline quality of the transferred Si film above these temperatures. The measured
electron Hall mobility in the bonded Si layer is comparable to bulk silicon for TA≤800°C, indicating excellent material quality. 相似文献
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A silicon layer was successfully transferred from a hydrogen pattern-implanted wafer to another by a thermal or mechanical
cleavage process. The first wafer was masked with various patterns of 2.3 micron-thick poly-silicon, and was implanted at
a hydrogen dose of 4,5, or 8 1016 cm−2 with an energy of 150 keV or 180 KeV. After etching off the implantation mask, the wafer was bonded to a thermally grown
oxide wafer face-to-face by low-temperature direct bonding. The bonded pair was then either heated (thermally) or bent (mechanically)
until hydrogen-induced silicon layer cleavage occurred, resulting in the silicon layer transfer from the implanted wafer to
the other. In this experiment, it was demonstrated that mechanical cleavage can overcome the fractional implantation area
limination of thermal cleavage. 相似文献
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Cheng-Li Chuang Jong-Ning Aoh Qing-An Liao Chun-Chieh Hsu Shi-Jie Liao Guo-Shing Huang 《Journal of Electronic Materials》2008,37(11):1742-1750
The purpose of this study was to develop the thermosonic flip-chip bonding process for gold stud bumps bonded onto copper
electrodes on an alumina substrate. Copper electrodes were deposited with silver as the bonding layer and with titanium as
the diffusion barrier layer. Deposition of these layers on copper electrodes improves the bonding quality between the gold
stud bumps and copper electrodes. With appropriate bonding parameters, 100% bondability was achieved. Bonding strength between
the gold stud bumps and copper electrodes was much higher than the value converted from the standards of the Joint Electron
Device Engineering Council (JEDEC). The effects of process parameters, including bonding force, ultrasonic power, and bonding
time, on bonding strength were also investigated. Experimental results indicate that bonding strength increased as bonding
force and ultrasonic power increased and did not deteriorate after prolonged storage at elevated temperatures. Thus, the reliability
of the high-temperature storage (HTS) test for gold stud bumps flip-chip bonded onto a silver bonding layer and titanium diffusion
barrier layer is not a concern. Deposition of these two layers on copper electrodes is an effective and direct method for
thermosonic flip-chip bonding of gold stud bumps to a substrate, and ensures excellent bond quality. Applications such as
flip-chip bonding of chips with low pin counts or light-emitting diode (LED) packaging are appropriate. 相似文献
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Two experiments were performed that demonstrate an extension of the ion-cut layer transfer technique where a polymer is used
for planarization and bonding. In the first experiment hydrogen-implanted silicon wafers were deposited with two to four microns
low-temperature plasma-enhanced tetraethoxysilane (TEOS). The wafers were then bonded to a second wafer, which had been coated
with a spin-on polymer. The bonded pairs were heated to the ion-cut temperature resulting in the transfer of a 400 nm layer
silicon. The polymer enabled the bonding of an unprocessed silicon wafer to the as-deposited TEOS with a microsurface roughness
larger than 10 nm, while the TEOS provided sufficient stiffness for ion cut. In the second experiment, an intermediate transfer
wafer was patterned and vias were etched through the wafer using a 25% tetramethylammonium hydroxide (TMAH) solution and nitride
as masking material. The nitride was then stripped using dilute hydrofluoric acid (HF). The transfer wafer was then bonded
to an oxidized (100 nm) hydrogen-implanted silicon wafer. After ion-cut annealing a silicon-on-insulator (SOI) wafer was produced
on the transfer wafer. The thin silicon layer of the SOI structure was then bonded to a third wafer using a spin-on polymer
as the bonding material. The sacrificial oxide layer was then etched away in HF, freeing the thin silicon from the transfer
wafer. The result produced a thin silicon-on-polymer structure bonded to the third wafer. These results demonstrate the feasibility
of transferring a silicon layer from a wafer to a second intermediate “transfer” or “universal” reusable substrate. The second
transfer step allows the thin silicon layer to be subsequently bonded to a potential third device wafer followed by debonding
of the transfer wafer creating stacked three-dimensional structures. 相似文献
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提出一种基于SDB技术的非平面埋氧层SOI材料制备方法.其关键技术包括:通过干法刻蚀、高压氧化和淀积二氧化硅获得高质量非平面埋氧层;通过化学气相淀积多晶硅来形成键合缓冲层,并运用回刻光刻胶和化学机械抛光来实现键合面的局部和全局平坦化;通过室温真空贴合、中温预键合和高温加固键合来进行有源片和衬底片的牢固键合.基于该技术研制了有源层厚度为21μm、埋氧层厚度为0.943μm、顶面槽和底面槽槽高均为0.9μm的具有双面绝缘槽结构的非平面埋氧层新型SOI材料.测试结果表明该材料具有结合强度高、界面质量好、电学性能优良等优点. 相似文献
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Improvement of heteroepitaxial growth by the use of twist-bonded compliant substrate: Role of the surface plasticity 总被引:1,自引:0,他引:1
In a first step, we have investigated the structure and the mechanical behavior of twist-bonded GaAs-compliant substrates.
For a twist angle lower than 15°, the bonded interface was observed to contain a dense network of pure screw dislocations.
For a larger twist angle, no dislocations were observed at the bonding interface. The mechanical behavior of these compliant
substructures were investigated using nanoindentation, and the results were compared to those obtained on standard bulk GaAs.
It appears that the nature of the interface has a great influence on the mechanical properties of these compliant substrates.
In a second step, InGaAs alloys were grown on such compliant structures, and their quality was compared to that of layers
grown on standard substrates. A promising improvement was observed on compliant structures. 相似文献