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随着半导体及电子业技术的发展和消费市场无止境的需求,传统的划片(Dicing)技术,在许多方面已经无法满足业者的需求,代之而起的是激光划片(Laser Dicing)技术。而激光固然有某些优势,却亦有其缺陷。无论如何,激光引领划片的潮流,来势汹汹,难以抵檔。 相似文献
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等离子划片是近年来兴起的一项新型圆片划片工艺。与传统的刀片划片、激光划片等工艺不同,该工艺技术可以同步完成一张圆片上所有芯片的划片,生产效率明显提升,是对现有划片工艺的一个颠覆。介绍了圆片划片工艺的工作原理、技术特点及其优势,并对其在解决圆片划片应用中的典型问题和不足之处进行了讨论。 相似文献
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针对激光划片机中提出的双面图形加工要求,设计了双面对准光路系统.满足图形双面识别和激光划片的要求。介绍了正反面光路结构的设计、光源配置以及图像识别算法的应用,通过试验验证了该技术的可行性。 相似文献
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高功率、低成本晶硅太阳能光伏组件是目前光伏行业发展的主流方向,半片电池组件技术因其能够显著提高组件测试功率而被广泛关注,本文研究了不同波长激光划片对电池片的损伤原因与影响,并首次采用红绿双激光划片技术,既避免了常规单波长激光划片时微隐裂的出现,又可以保证划片效率,通过与常规整片组件和红外激光划片组件对比,发现红绿双 激光划片组件的连续 100d的发电量分别提升了 4.06%和0.33%,该双激光划片技术可以为半片电池组件技术全面推广应用提供强力的支持。 相似文献
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研制了一台CO2激光陶瓷划片,切割,打孔机,确定了不同厚度陶瓷片的划片、切割、打孔工艺。 相似文献
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《Microelectronics Reliability》2014,54(9-10):1735-1740
Synchrotron white beam X-ray topography (SXRT) and photoelastic stress measurements were used to characterize resulting strain fields after mechanical dicing and laser grooving of bare silicon wafers. The distribution and propagation of the strain fields can be characterized by both methods. In contrast to mechanical dicing, the laser grooving process creates an inhomogeneous strain field. The influenced area is three times larger compared to mechanical dicing. The effect of the dicing procedure on the resulting mechanical fracture strength of the silicon chips was investigated by 3-point bending tests. The fracture strength of samples with an additional laser grooving process was significantly reduced under tensile load. The fracture pattern of the samples indicated that the strain field generated by the separation process causes initial points for μ-cracks propagation under mechanical load. This analysis can help to optimize dicing processes in order to attain a better reliability of chips with regard to process yields. 相似文献
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介绍了超高亮度发光二极管(UHB-LED)芯片切割工艺中砂轮切割、金刚刀划片及激光切割的应用情况、工艺原理、工艺特点和发展前景.结合生产实践,对比和分析了不同切割工艺的优缺点,针对不同切割生产工艺中存在的芯片正崩、芯片背崩、芯片脱落以及划片裂片不良等问题进行了探讨并提出了解决方法.指出激光切割技术是LED芯片切割工艺发展的必然趋势. 相似文献
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Kean Chern Fong Andrew Blakers 《Progress in Photovoltaics: Research and Applications》2011,19(6):740-746
This work uses a variety of tools to investigate damage caused by laser and dicing saw grooving in silicon. The tools comprise quasi steady state photoconductance decay, photoluminescence imaging, measurement of silicon etch rate in anisotropic etch solution, and visual microscopy. Shallow grooves were formed using a 532 nm Q‐switched Nd:YLF frequency doubled solid state laser and a high speed spindle dicing saw. Combined analysis of the characterization tools enabled determination of the damage radius of the grooves within the bulk of the wafer, the radius of damage in the dielectric layer laterally along the surface of the wafer, as well as the groove etching requirements to fully recover the minority carrier lifetime in the vicinity of the groove. Copyright © 2011 John Wiley & Sons, Ltd. 相似文献